DE69727207D1 - Hoch warmeleitendes magnetisches mischmaterial - Google Patents

Hoch warmeleitendes magnetisches mischmaterial

Info

Publication number
DE69727207D1
DE69727207D1 DE69727207T DE69727207T DE69727207D1 DE 69727207 D1 DE69727207 D1 DE 69727207D1 DE 69727207 T DE69727207 T DE 69727207T DE 69727207 T DE69727207 T DE 69727207T DE 69727207 D1 DE69727207 D1 DE 69727207D1
Authority
DE
Germany
Prior art keywords
mixing material
conducting magnetic
highly conducting
magnetic mixing
highly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69727207T
Other languages
English (en)
Other versions
DE69727207T2 (de
Inventor
Shigeyoshi Yoshida
Mitsuharu Sato
Norihiko Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
NEC Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23772496A external-priority patent/JP3528455B2/ja
Priority claimed from JP26543896A external-priority patent/JP3881730B2/ja
Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp
Publication of DE69727207D1 publication Critical patent/DE69727207D1/de
Application granted granted Critical
Publication of DE69727207T2 publication Critical patent/DE69727207T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/29076—Plural core members being mutually engaged together, e.g. through inserts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/2908—Plural core members being stacked
    • H01L2224/29083—Three-layer arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/2936—Iron [Fe] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/90—Magnetic feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
DE1997627207 1996-09-09 1997-09-09 Hoch warmeleitendes magnetisches mischmaterial Expired - Lifetime DE69727207T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP23772496A JP3528455B2 (ja) 1996-09-09 1996-09-09 電磁干渉抑制体
JP23772496 1996-09-09
JP26543896A JP3881730B2 (ja) 1996-09-12 1996-09-12 ヒートシンク及び放熱シート
JP26543896 1996-09-12
PCT/JP1997/003175 WO1998010632A1 (en) 1996-09-09 1997-09-09 Highly heat-conductive composite magnetic material

Publications (2)

Publication Number Publication Date
DE69727207D1 true DE69727207D1 (de) 2004-02-19
DE69727207T2 DE69727207T2 (de) 2004-11-25

Family

ID=26533335

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997627207 Expired - Lifetime DE69727207T2 (de) 1996-09-09 1997-09-09 Hoch warmeleitendes magnetisches mischmaterial

Country Status (7)

Country Link
US (1) US6962753B1 (de)
EP (1) EP0866649B1 (de)
KR (1) KR100510921B1 (de)
CN (1) CN1179619C (de)
DE (1) DE69727207T2 (de)
TW (1) TW345667B (de)
WO (1) WO1998010632A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001069693A (ja) * 1999-08-26 2001-03-16 Honda Motor Co Ltd 回転電機
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
NZ515116A (en) * 2000-03-03 2002-12-20 Sony Computer Entertainment Inc Electronic device and shield
JP4165045B2 (ja) * 2000-09-19 2008-10-15 松下電器産業株式会社 電子機器
US6498558B1 (en) 2001-05-08 2002-12-24 Kelsey-Hayes Company Solenoid valve coil having an integrated bobbin and flux ring assembly
JP2002374092A (ja) 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
KR100627114B1 (ko) * 2001-11-09 2006-09-25 티디케이가부시기가이샤 복합자성체, 전자파 흡수시트, 시트형상 물품의 제조방법,및 전자파 흡수시트의 제조방법
GB2382469A (en) * 2001-11-23 2003-05-28 Marconi Optical Components Ltd Shielding for electromagnetic interference
US6903647B2 (en) 2002-05-08 2005-06-07 Kelsey-Hayes Company Solenoid valve coil having an integrated bobbin and flux ring assembly
JP2004079824A (ja) * 2002-08-20 2004-03-11 Fuji Xerox Co Ltd 磁心および磁場遮蔽部材、並びにこれらを用いた励磁コイル、トランス、電気機器、および電子写真装置
US20060182948A1 (en) * 2003-07-07 2006-08-17 Kabushiki Kaisha Kobe Seiko Sho Resin-coated metal sheet
US7371471B2 (en) * 2004-03-08 2008-05-13 Nec Tokin Corporation Electromagnetic noise suppressing thin film
GB2454837A (en) * 2006-07-13 2009-05-27 Parker Hannifin Corp Emi absorbing gap filling material
JP5140302B2 (ja) 2007-03-29 2013-02-06 ポリマテック株式会社 熱伝導性シート
JP5324105B2 (ja) * 2008-01-29 2013-10-23 スリーエム イノベイティブ プロパティズ カンパニー 構造化表面を有する感圧接着層を含む電磁干渉抑制シート
US20110245413A1 (en) 2010-03-31 2011-10-06 Sumitomo Chemical Company, Limited Liquid-crystalline polymer composition and molded article thereof
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
KR101503967B1 (ko) * 2011-12-08 2015-03-19 삼성전기주식회사 적층형 인덕터 및 그 제조방법
KR20130090121A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기능성 시트
CN104694086A (zh) * 2013-12-04 2015-06-10 苏州环明电子科技有限公司 一种新型散热材料的配方及其制备方法
KR101878352B1 (ko) * 2013-12-31 2018-07-16 주식회사 아모그린텍 복합 시트 및 그를 구비한 휴대용 단말
KR101755327B1 (ko) * 2013-12-31 2017-07-10 주식회사 아모그린텍 복합 시트 및 그를 구비한 휴대용 단말
KR20150111469A (ko) * 2014-03-25 2015-10-06 (주)엘지하우시스 전자기파 차폐시트, 및 이의 제조방법
BR112017003619A2 (pt) * 2014-09-08 2017-12-05 Baker Hughes Inc sistemas e métodos para construir laminações para motores elétricos
US11229147B2 (en) 2015-02-06 2022-01-18 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
CN105989988B (zh) * 2015-02-11 2018-10-30 华为技术有限公司 一种一体成型电感
KR101681409B1 (ko) * 2015-04-16 2016-12-12 삼성전기주식회사 코일 전자부품
CN107484400A (zh) * 2017-03-03 2017-12-15 倪进焕 一种具有高导热散热及吸波功能的复合材料及其制备方法和用途
JP6645487B2 (ja) 2017-10-30 2020-02-14 セイコーエプソン株式会社 プリント回路板
CN108242312B (zh) * 2017-12-15 2020-11-06 郑州轻工业学院 一种铁基软磁复合材料及其制备方法
JP2020009974A (ja) * 2018-07-11 2020-01-16 北川工業株式会社 熱伝導組成物
CN109550668B (zh) * 2018-10-19 2021-12-28 苏州铂韬新材料科技有限公司 一种导热吸波屏蔽三合一功能的复合薄膜及其制备方法
CN110911114B (zh) * 2019-11-29 2020-12-22 横店集团东磁股份有限公司 一种高导热无线充电接收端用复合隔磁片及其制备方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4538151A (en) * 1982-03-31 1985-08-27 Nippon Electric Co., Ltd. Electro-magnetic wave absorbing material
JPS5927596A (ja) * 1982-08-04 1984-02-14 日本特殊陶業株式会社 マイクロ波吸収体
US4543208A (en) * 1982-12-27 1985-09-24 Tokyo Shibaura Denki Kabushiki Kaisha Magnetic core and method of producing the same
JPS59132196A (ja) 1983-01-18 1984-07-30 日立金属株式会社 電子回路
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPS61284089A (ja) * 1985-06-07 1986-12-15 内藤　喜之 マイクロ波加熱装置用電磁波漏洩防止装置
JPH0640382B2 (ja) * 1986-10-20 1994-05-25 富士写真フイルム株式会社 磁気記録媒体
JPH0210800A (ja) 1988-06-29 1990-01-16 Fujitsu Ltd 放熱体
US5275880A (en) 1989-05-17 1994-01-04 Minnesota Mining And Manufacturing Company Microwave absorber for direct surface application
DE3932882A1 (de) 1989-10-02 1991-04-11 Siemens Ag Gut waermeleitender verbundwerkstoff
JPH03292625A (ja) * 1990-04-10 1991-12-24 Fuji Photo Film Co Ltd 磁気記録媒体の製造方法
JPH04188861A (ja) 1990-11-22 1992-07-07 Nippon Telegr & Teleph Corp <Ntt> 電子回路パッケージ
US5188907A (en) * 1991-01-03 1993-02-23 Konica Corporation Magnetic recording medium
JPH04266658A (ja) 1991-02-21 1992-09-22 Nissan Motor Co Ltd 自動変速機の変速制御装置
JPH056851U (ja) 1991-07-10 1993-01-29 沖電気工業株式会社 ヒートシンク
JPH0531294U (ja) 1991-09-30 1993-04-23 日本電気株式会社 プリント基板用ヒートシンク
CA2080177C (en) * 1992-01-02 1997-02-25 Edward Allan Highum Electro-magnetic shield and method for making the same
US5512363A (en) * 1992-02-13 1996-04-30 Konica Corporation Magnetic recording medium having a magnetic layer containing magnetic powder and an underlayer containing two kinds of non magnetic powder
JPH069195U (ja) 1992-07-03 1994-02-04 富士通株式会社 放熱構造
JPH0722600U (ja) 1992-12-11 1995-04-21 日本ケミコン株式会社 シールドケース
JPH0810730B2 (ja) 1993-02-24 1996-01-31 日本電気株式会社 パッケージのシールド構造
JPH0745758A (ja) 1993-08-03 1995-02-14 Akuteii:Kk ヒートシンクおよびその製造方法
DE4329155A1 (de) * 1993-08-30 1995-03-02 Bloesch W Ag Magnetfeldkathode
JPH07122824A (ja) 1993-10-22 1995-05-12 Mitsui Toatsu Chem Inc 電子回路パッケージ
JPH07153877A (ja) 1993-11-29 1995-06-16 Hitachi Ltd 発熱体の冷却装置
JP3401650B2 (ja) * 1994-01-20 2003-04-28 エヌイーシートーキン株式会社 電磁波干渉抑制体
JP3528255B2 (ja) 1994-08-16 2004-05-17 Ｎｅｃトーキン株式会社 混成集積回路素子及びその製造方法
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
JPH07335793A (ja) 1994-06-06 1995-12-22 Fuji Electric Co Ltd ヒートシンク
JP3505825B2 (ja) 1994-11-28 2004-03-15 三菱アルミニウム株式会社 ろう付け後に高い疲労強度を保持するＡｌ合金製熱交換器フィン材
JP3401107B2 (ja) 1995-01-23 2003-04-28 松下電器産業株式会社 パッケージｉｃのモジュール
JPH0951190A (ja) 1995-08-07 1997-02-18 Nippon Paint Co Ltd 広帯域電磁波吸収材

Also Published As

Publication number Publication date
EP0866649B1 (de) 2004-01-14
KR20000064349A (ko) 2000-11-06
CN1179619C (zh) 2004-12-08
WO1998010632A1 (en) 1998-03-12
EP0866649A4 (de) 1999-12-15
TW345667B (en) 1998-11-21
EP0866649A1 (de) 1998-09-23
US6962753B1 (en) 2005-11-08
KR100510921B1 (ko) 2005-10-25
CN1200867A (zh) 1998-12-02
DE69727207T2 (de) 2004-11-25

Similar Documents

Publication Publication Date Title
DE69727207D1 (de) Hoch warmeleitendes magnetisches mischmaterial
DE69626695D1 (de) Bildempfangsmaterial
DE69827818T2 (de) Magnetische kodiereinrichtung
FI972210A (fi) Hiostamaton materiaali
DE69707369T2 (de) Elektromagnetischer Schalter
DE69712362D1 (de) Innenmaterial
DE9411193U1 (de) Dämmaterial
DE69811320T2 (de) Dauermagnetisches Material
DE69710113D1 (de) Supraleitendes Materialgemisch
DE69708766T2 (de) Reibungsmaterial
NO972753L (no) Oppdriftsmateriale
ATA112096A (de) Isoliermaterial isoliermaterial
DE29617781U1 (de) Magnetschalter
IT241193Y1 (it) Condizionatore magnetico anticalcare
DE29613790U1 (de) Mikroschalter
DE29611004U1 (de) Elektromagnetischer Schalter
DE29606914U1 (de) Magnetischer Zettelordner
DE9422053U1 (de) Isolierstoff
KR970054919U (ko) 자성체가 함유된 바닥장식재
DE29619710U1 (de) Werbemittel
DE69703386D1 (de) Härtbares folienmaterial
KR970050230U (ko) 회전식 깃발 광고장치
DE59711538D1 (de) Drehknopf
DE59505232D1 (de) Schalter zur strombegrenzung
GB9705987D0 (en) Superparamagnetic material

Legal Events

Date Code Title Description
8364 No opposition during term of opposition