DE69728234D1 - Verfahren zur herstellung von erhöhten metallischen kontakten auf elektrischen schaltungen - Google Patents

Verfahren zur herstellung von erhöhten metallischen kontakten auf elektrischen schaltungen

Info

Publication number
DE69728234D1
DE69728234D1 DE69728234T DE69728234T DE69728234D1 DE 69728234 D1 DE69728234 D1 DE 69728234D1 DE 69728234 T DE69728234 T DE 69728234T DE 69728234 T DE69728234 T DE 69728234T DE 69728234 D1 DE69728234 D1 DE 69728234D1
Authority
DE
Germany
Prior art keywords
electrical circuits
metal contacts
increased metal
producing increased
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69728234T
Other languages
English (en)
Other versions
DE69728234T2 (de
Inventor
E Gorrell
J Fisher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of DE69728234D1 publication Critical patent/DE69728234D1/de
Application granted granted Critical
Publication of DE69728234T2 publication Critical patent/DE69728234T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69728234T 1996-05-29 1997-05-08 Verfahren zur herstellung von erhöhten metallischen kontakten auf elektrischen schaltungen Expired - Lifetime DE69728234T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US655017 1996-05-29
US08/655,017 US5747358A (en) 1996-05-29 1996-05-29 Method of forming raised metallic contacts on electrical circuits
PCT/US1997/008011 WO1997046061A1 (en) 1996-05-29 1997-05-08 Method of forming raised metallic contacts on electrical circuits

Publications (2)

Publication Number Publication Date
DE69728234D1 true DE69728234D1 (de) 2004-04-29
DE69728234T2 DE69728234T2 (de) 2005-03-10

Family

ID=24627163

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69728234T Expired - Lifetime DE69728234T2 (de) 1996-05-29 1997-05-08 Verfahren zur herstellung von erhöhten metallischen kontakten auf elektrischen schaltungen

Country Status (7)

Country Link
US (2) US5747358A (de)
EP (1) EP0843955B1 (de)
JP (1) JP3759754B2 (de)
KR (2) KR100304317B1 (de)
AU (1) AU2940097A (de)
DE (1) DE69728234T2 (de)
WO (1) WO1997046061A1 (de)

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US7579269B2 (en) * 1993-11-16 2009-08-25 Formfactor, Inc. Microelectronic spring contact elements
US6727580B1 (en) 1993-11-16 2004-04-27 Formfactor, Inc. Microelectronic spring contact elements
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5918153A (en) * 1996-09-18 1999-06-29 Sandia Corporation High density electronic circuit and process for making
US6809421B1 (en) 1996-12-02 2004-10-26 Kabushiki Kaisha Toshiba Multichip semiconductor device, chip therefor and method of formation thereof
US6520778B1 (en) 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6246548B1 (en) 1997-03-24 2001-06-12 Maxtor Corporation Mechanically formed standoffs in a circuit interconnect
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US6807734B2 (en) 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
JP3553791B2 (ja) * 1998-04-03 2004-08-11 株式会社ルネサステクノロジ 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法
US6299456B1 (en) * 1998-04-10 2001-10-09 Micron Technology, Inc. Interposer with contact structures for electrical testing
US6278185B1 (en) * 1998-05-27 2001-08-21 Intel Corporation Semi-additive process (SAP) architecture for organic leadless grid array packages
US6136689A (en) * 1998-08-14 2000-10-24 Micron Technology, Inc. Method of forming a micro solder ball for use in C4 bonding process
US6998711B1 (en) 1998-08-14 2006-02-14 Micron Technology, Inc. Method of forming a micro solder ball for use in C4 bonding process
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
JP2002531915A (ja) * 1998-12-02 2002-09-24 フォームファクター，インコーポレイテッド リソグラフィ接触要素
US6268015B1 (en) 1998-12-02 2001-07-31 Formfactor Method of making and using lithographic contact springs
US6672875B1 (en) 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6181569B1 (en) * 1999-06-07 2001-01-30 Kishore K. Chakravorty Low cost chip size package and method of fabricating the same
US6569604B1 (en) * 1999-06-30 2003-05-27 International Business Machines Corporation Blind via formation in a photoimageable dielectric material
JP2001053438A (ja) * 1999-08-16 2001-02-23 Sony Corp 多層プリント配線板の製造方法
DE10007414B4 (de) * 2000-02-18 2006-07-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Verfahren zur Durchkontaktierung eines Substrats für Leistungshalbleitermodule durch Lot und mit dem Verfahren hergestelltes Substrat
US6548224B1 (en) * 2000-03-07 2003-04-15 Kulicke & Soffa Holdings, Inc. Wiring substrate features having controlled sidewall profiles
US6878396B2 (en) * 2000-04-10 2005-04-12 Micron Technology, Inc. Micro C-4 semiconductor die and method for depositing connection sites thereon
JP2002026515A (ja) * 2000-07-07 2002-01-25 Toshiba Corp プリント配線板およびその製造方法
US6498381B2 (en) * 2001-02-22 2002-12-24 Tru-Si Technologies, Inc. Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
US6574863B2 (en) * 2001-04-20 2003-06-10 Phoenix Precision Technology Corporation Thin core substrate for fabricating a build-up circuit board
KR20020087328A (ko) * 2001-05-15 2002-11-22 조수제 전주 구조물 제조를 위한 맨드렐의 제조방법
JP2003023067A (ja) * 2001-07-09 2003-01-24 Tokyo Electron Ltd ビアメタル層の形成方法およびビアメタル層形成基板
US6759311B2 (en) 2001-10-31 2004-07-06 Formfactor, Inc. Fan out of interconnect elements attached to semiconductor wafer
US6599778B2 (en) * 2001-12-19 2003-07-29 International Business Machines Corporation Chip and wafer integration process using vertical connections
TW583395B (en) * 2002-03-13 2004-04-11 Scs Hightech Inc Method for producing micro probe tips
US20050142739A1 (en) * 2002-05-07 2005-06-30 Microfabrica Inc. Probe arrays and method for making
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US8328564B2 (en) * 2003-06-13 2012-12-11 Molex Incoporated Electrical connector solder terminal
JP3990347B2 (ja) * 2003-12-04 2007-10-10 ローム株式会社 半導体チップおよびその製造方法、ならびに半導体装置
JP2007517410A (ja) * 2003-12-30 2007-06-28 スリーエム イノベイティブ プロパティズ カンパニー パターン回路およびその製造方法
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
JP2006119024A (ja) * 2004-10-22 2006-05-11 Tokyo Electron Ltd プローブおよびその製造方法
JP4619223B2 (ja) * 2004-12-16 2011-01-26 新光電気工業株式会社 半導体パッケージ及びその製造方法
US20090032285A1 (en) * 2005-01-27 2009-02-05 Matsushita Electric Industrial Co., Ltd. Multi-layer circuit substrate manufacturing method and multi-layer circuit substrate
US20070023387A1 (en) * 2005-07-28 2007-02-01 Litton Systems, Inc. Printed circuit board interconnection and method
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TWI420607B (zh) * 2007-05-09 2013-12-21 Method of manufacturing electrical contact device
CN101809735B (zh) * 2007-08-15 2012-06-20 泰塞拉公司 具有通过镀敷形成的接线柱的互连元件
US8276269B2 (en) * 2008-06-20 2012-10-02 Intel Corporation Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same
TWI411368B (zh) * 2009-12-22 2013-10-01 Unimicron Technology Corp 線路板的線路結構的製造方法
DE102013203799A1 (de) * 2013-03-06 2014-09-11 Robert Bosch Gmbh Batteriezellengehäuse mit integrierter Elektronik
US9105288B1 (en) * 2014-03-11 2015-08-11 Magnecomp Corporation Formed electrical contact pad for use in a dual stage actuated suspension
US10448517B2 (en) * 2016-11-04 2019-10-15 Jabil Inc. Method and apparatus for flexible circuit cable attachment
US11018024B2 (en) * 2018-08-02 2021-05-25 Nxp Usa, Inc. Method of fabricating embedded traces
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
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Also Published As

Publication number Publication date
KR19990035857A (ko) 1999-05-25
KR100279036B1 (ko) 2001-02-01
KR100304317B1 (ko) 2001-11-02
US5786270A (en) 1998-07-28
EP0843955A1 (de) 1998-05-27
DE69728234T2 (de) 2005-03-10
WO1997046061A1 (en) 1997-12-04
AU2940097A (en) 1998-01-05
EP0843955B1 (de) 2004-03-24
US5747358A (en) 1998-05-05
KR19990035858A (ko) 1999-05-25
JP3759754B2 (ja) 2006-03-29
JPH11509990A (ja) 1999-08-31

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