DE69734564D1 - Verfahren zur erzeugung einer monoschicht von teilchen und damit hergestellte produkte - Google Patents
Verfahren zur erzeugung einer monoschicht von teilchen und damit hergestellte produkteInfo
- Publication number
- DE69734564D1 DE69734564D1 DE69734564T DE69734564T DE69734564D1 DE 69734564 D1 DE69734564 D1 DE 69734564D1 DE 69734564 T DE69734564 T DE 69734564T DE 69734564 T DE69734564 T DE 69734564T DE 69734564 D1 DE69734564 D1 DE 69734564D1
- Authority
- DE
- Germany
- Prior art keywords
- particles
- arrays
- monochicht
- producing
- products manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US693833 | 1996-08-01 | ||
US08/693,833 US5916641A (en) | 1996-08-01 | 1996-08-01 | Method of forming a monolayer of particles |
PCT/US1997/013677 WO1998006007A1 (en) | 1996-08-01 | 1997-08-01 | A method of forming a monolayer of particles, and products formed thereby |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69734564D1 true DE69734564D1 (de) | 2005-12-15 |
DE69734564T2 DE69734564T2 (de) | 2006-08-10 |
Family
ID=26792685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69734564T Expired - Fee Related DE69734564T2 (de) | 1996-08-01 | 1997-08-01 | Verfahren zur erzeugung einer monoschicht von teilchen und damit hergestellte produkte |
Country Status (9)
Country | Link |
---|---|
US (1) | US6180226B1 (de) |
EP (1) | EP0855049B1 (de) |
JP (1) | JP3878677B2 (de) |
KR (1) | KR100583053B1 (de) |
AT (1) | ATE309556T1 (de) |
AU (1) | AU734452B2 (de) |
BR (1) | BR9706597A (de) |
DE (1) | DE69734564T2 (de) |
WO (1) | WO1998006007A1 (de) |
Families Citing this family (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69737883T2 (de) | 1996-04-25 | 2008-03-06 | Bioarray Solutions Ltd. | Licht-regulierte, elektrokinetische zusammensetzung von partikeln an oberflächen |
US6387707B1 (en) | 1996-04-25 | 2002-05-14 | Bioarray Solutions | Array Cytometry |
US7622294B2 (en) | 1997-03-14 | 2009-11-24 | Trustees Of Tufts College | Methods for detecting target analytes and enzymatic reactions |
US20030027126A1 (en) | 1997-03-14 | 2003-02-06 | Walt David R. | Methods for detecting target analytes and enzymatic reactions |
AU756945B2 (en) | 1997-05-23 | 2003-01-30 | Bioarray Solutions Ltd | Color-encoding and in-situ interrogation of matrix-coupled chemical compounds |
JPH10338860A (ja) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
JP4275237B2 (ja) * | 1998-03-17 | 2009-06-10 | 大日本印刷株式会社 | 低反射帯電防止性ハードコートフイルム |
US6274939B1 (en) * | 1998-09-11 | 2001-08-14 | American Electronic Components | Resin ceramic compositions having magnetic properties |
JP2000133836A (ja) * | 1998-10-22 | 2000-05-12 | Japan Science & Technology Corp | 波長可変発光素子及びその製造方法 |
US6475555B2 (en) * | 1999-10-29 | 2002-11-05 | International Business Machines Corporation | Process for screening features on an electronic substrate with a low viscosity paste |
US6488405B1 (en) * | 2000-03-08 | 2002-12-03 | Advanced Micro Devices, Inc. | Flip chip defect analysis using liquid crystal |
US20050288458A1 (en) | 2002-07-29 | 2005-12-29 | Klemarczyk Philip T | Reworkable thermosetting resin composition |
US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
JP4744778B2 (ja) * | 2000-06-21 | 2011-08-10 | バイオアレイ ソルーションズ リミテッド | 特定のランダム粒子アレイを適用した複数の被検体分子の分析方法 |
US9709559B2 (en) * | 2000-06-21 | 2017-07-18 | Bioarray Solutions, Ltd. | Multianalyte molecular analysis using application-specific random particle arrays |
ITVE20010026A1 (it) * | 2001-05-18 | 2002-11-18 | Giorgio Trani | Film flessibile strutturalmente modificabile, per realizzare oggetti dimensionalmente e strutturalmente stabili, in particolare contenitori |
US6487002B1 (en) * | 2001-06-11 | 2002-11-26 | Xerox Corporation | Large area micro-structure template for creation of closely packed arrays |
US7262063B2 (en) | 2001-06-21 | 2007-08-28 | Bio Array Solutions, Ltd. | Directed assembly of functional heterostructures |
US6603080B2 (en) | 2001-09-27 | 2003-08-05 | Andrew Corporation | Circuit board having ferrite powder containing layer |
JP4377689B2 (ja) | 2001-10-15 | 2009-12-02 | バイオアレイ ソリューションズ リミテッド | 同時尋問及び酵素仲介検出による多型遺伝子座の複合分析 |
US6548189B1 (en) | 2001-10-26 | 2003-04-15 | General Electric Company | Epoxy adhesive |
NL1019349C2 (nl) * | 2001-11-12 | 2003-05-13 | Univ Delft Tech | Werkwijze voor het laten uitharden van een vloeibare massa. |
US6887737B1 (en) | 2001-12-13 | 2005-05-03 | Henkel Corporation | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
WO2003061949A1 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Sheet having microsized architecture |
WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
AU2003210425A1 (en) * | 2002-03-06 | 2003-09-16 | Akzo Nobel Coatings International B.V. | Water borne coating composition for film transfer and casting process |
US20030183332A1 (en) * | 2002-03-26 | 2003-10-02 | Simila Charles E. | Screen printed thermal expansion standoff |
US7704321B2 (en) * | 2002-05-13 | 2010-04-27 | Rutgers, The State University | Polycrystalline material having a plurality of single crystal particles |
US7022303B2 (en) * | 2002-05-13 | 2006-04-04 | Rutgers, The State University | Single-crystal-like materials |
ITTO20020772A1 (it) * | 2002-09-06 | 2004-03-07 | Fiat Ricerche | Metodo per la realizzazione di strutture tridimensionali |
US6737364B2 (en) * | 2002-10-07 | 2004-05-18 | International Business Machines Corporation | Method for fabricating crystalline-dielectric thin films and devices formed using same |
AU2003298655A1 (en) | 2002-11-15 | 2004-06-15 | Bioarray Solutions, Ltd. | Analysis, secure access to, and transmission of array images |
WO2004051678A1 (ja) * | 2002-11-29 | 2004-06-17 | Neomax Co., Ltd. | 耐食性希土類系永久磁石の製造方法、耐食性希土類系永久磁石、ワークのディップスピンコーティング法およびワークの塗膜形成方法 |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
JP4657916B2 (ja) * | 2003-05-14 | 2011-03-23 | ラトガース,ザ ステート ユニバーシティ | 単結晶様物質 |
WO2005029705A2 (en) * | 2003-09-18 | 2005-03-31 | Bioarray Solutions, Ltd. | Number coding for identification of subtypes of coded types of solid phase carriers |
NZ546072A (en) * | 2003-09-22 | 2009-08-28 | Bioarray Solutions Ltd | Surface immobilized polyelectrolyte with multiple functional groups capable of covalently bonding to biomolecules |
WO2005045059A2 (en) * | 2003-10-28 | 2005-05-19 | Bioarray Solutions Ltd. | Allele assignment and probe selection in multiplexed assays of polymorphic targets |
WO2005042763A2 (en) * | 2003-10-28 | 2005-05-12 | Bioarray Solutions Ltd. | Optimization of gene expression analysis using immobilized capture probes |
EP1694859B1 (de) | 2003-10-29 | 2015-01-07 | Bioarray Solutions Ltd | Multiplex-nukleinsäureanalyse mittels fragmentierung doppelsträngiger dna |
TWI299502B (en) * | 2004-01-05 | 2008-08-01 | Au Optronics Corp | Conductive material with a laminated structure |
KR100809568B1 (ko) * | 2004-04-23 | 2008-03-04 | 마츠시다 덴코 가부시키가이샤 | 정전 무화기를 구비한 가열 송풍 장치 |
JP2005315767A (ja) * | 2004-04-30 | 2005-11-10 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープ用絶縁フィルムの検査方法、検査装置、該フィルムの打ち抜き加工装置及び該加工装置の制御方法 |
US7078095B2 (en) * | 2004-07-07 | 2006-07-18 | Xerox Corporation | Adhesive film exhibiting anisotropic electrical conductivity |
US7363170B2 (en) * | 2004-07-09 | 2008-04-22 | Bio Array Solutions Ltd. | Transfusion registry network providing real-time interaction between users and providers of genetically characterized blood products |
US7848889B2 (en) | 2004-08-02 | 2010-12-07 | Bioarray Solutions, Ltd. | Automated analysis of multiplexed probe-target interaction patterns: pattern matching and allele identification |
US8859680B2 (en) * | 2004-09-01 | 2014-10-14 | Ppg Industries Ohio, Inc | Poly(ureaurethane)s, articles and coatings prepared therefrom and methods of making the same |
US20090280329A1 (en) | 2004-09-01 | 2009-11-12 | Ppg Industries Ohio, Inc. | Polyurethanes, Articles and Coatings Prepared Therefrom and Methods of Making the Same |
US20070225468A1 (en) * | 2004-09-01 | 2007-09-27 | Rukavina Thomas G | Polyurethanes prepared from polyester polyols and/or polycaprolactone polyols, articles and coatings prepared therefrom and methods of making the same |
US20070148471A1 (en) * | 2004-09-01 | 2007-06-28 | Rukavina Thomas G | Impact resistant polyurethane and poly(ureaurethane) articles and methods of making the same |
US11248083B2 (en) | 2004-09-01 | 2022-02-15 | Ppg Industries Ohio, Inc. | Aircraft windows |
US11591436B2 (en) | 2004-09-01 | 2023-02-28 | Ppg Industries Ohio, Inc. | Polyurethane article and methods of making the same |
US8207286B2 (en) * | 2004-09-01 | 2012-06-26 | Ppg Industries Ohio, Inc | Methods for preparing polyurethanes |
US8399559B2 (en) | 2004-09-01 | 2013-03-19 | Ppg Industries Ohio, Inc. | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
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US9598527B2 (en) | 2004-09-01 | 2017-03-21 | Ppg Industries Ohio, Inc. | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
US8933166B2 (en) | 2004-09-01 | 2015-01-13 | Ppg Industries Ohio, Inc. | Poly(ureaurethane)s, articles and coatings prepared therefrom and methods of making the same |
US8889815B2 (en) | 2004-09-01 | 2014-11-18 | Ppg Industries Ohio, Inc. | Reinforced polyurethanes and poly(ureaurethane)s, methods of making the same and articles prepared therefrom |
US8399094B2 (en) | 2004-09-01 | 2013-03-19 | Ppg Industries Ohio, Inc. | Multilayer laminated articles including polyurethane and/or poly(ureaurethane) layers and methods of making the same |
US11149107B2 (en) | 2004-09-01 | 2021-10-19 | Ppg Industries Ohio, Inc. | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
US20090280709A1 (en) | 2004-09-01 | 2009-11-12 | Ppg Industries Ohio, Inc. | Polyurethanes, Articles and Coatings Prepared Therefrom and Methods of Making the Same |
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US8349986B2 (en) | 2004-09-01 | 2013-01-08 | Ppg Industries Ohio, Inc. | Poly(ureaurethane)s, articles and coatings prepared therefrom and methods of making the same |
US8734951B2 (en) | 2004-09-01 | 2014-05-27 | Ppg Industries Ohio, Inc. | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
US8927675B2 (en) | 2004-09-01 | 2015-01-06 | Ppg Industries Ohio, Inc. | Poly(ureaurethane)s, articles and coatings prepared therefrom and methods of making the same |
US9464169B2 (en) | 2004-09-01 | 2016-10-11 | Ppg Industries Ohio, Inc. | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
JP4677749B2 (ja) * | 2004-09-21 | 2011-04-27 | 富士ゼロックス株式会社 | 磁性素子を有する情報媒体の情報検知装置 |
US8486629B2 (en) | 2005-06-01 | 2013-07-16 | Bioarray Solutions, Ltd. | Creation of functionalized microparticle libraries by oligonucleotide ligation or elongation |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US8802214B2 (en) | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
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-
1997
- 1997-08-01 AT AT97938107T patent/ATE309556T1/de not_active IP Right Cessation
- 1997-08-01 AU AU40511/97A patent/AU734452B2/en not_active Ceased
- 1997-08-01 EP EP97938107A patent/EP0855049B1/de not_active Expired - Lifetime
- 1997-08-01 WO PCT/US1997/013677 patent/WO1998006007A1/en active IP Right Grant
- 1997-08-01 DE DE69734564T patent/DE69734564T2/de not_active Expired - Fee Related
- 1997-08-01 KR KR1019980702395A patent/KR100583053B1/ko not_active IP Right Cessation
- 1997-08-01 JP JP50814598A patent/JP3878677B2/ja not_active Expired - Fee Related
- 1997-08-01 US US09/043,879 patent/US6180226B1/en not_active Expired - Fee Related
- 1997-08-01 BR BR9706597A patent/BR9706597A/pt not_active IP Right Cessation
Also Published As
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KR100583053B1 (ko) | 2006-09-22 |
JPH11514755A (ja) | 1999-12-14 |
ATE309556T1 (de) | 2005-11-15 |
JP3878677B2 (ja) | 2007-02-07 |
BR9706597A (pt) | 1999-07-20 |
DE69734564T2 (de) | 2006-08-10 |
AU734452B2 (en) | 2001-06-14 |
US6180226B1 (en) | 2001-01-30 |
EP0855049B1 (de) | 2005-11-09 |
KR19990063922A (ko) | 1999-07-26 |
WO1998006007A1 (en) | 1998-02-12 |
AU4051197A (en) | 1998-02-25 |
EP0855049A1 (de) | 1998-07-29 |
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