DE69737742D1 - Herstellungsmethode einer hybriden integrierten schaltung - Google Patents

Herstellungsmethode einer hybriden integrierten schaltung

Info

Publication number
DE69737742D1
DE69737742D1 DE69737742T DE69737742T DE69737742D1 DE 69737742 D1 DE69737742 D1 DE 69737742D1 DE 69737742 T DE69737742 T DE 69737742T DE 69737742 T DE69737742 T DE 69737742T DE 69737742 D1 DE69737742 D1 DE 69737742D1
Authority
DE
Germany
Prior art keywords
manufacturing
integrated circuit
hybrid integrated
hybrid
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69737742T
Other languages
English (en)
Other versions
DE69737742T2 (de
Inventor
Ronald Dekker
Henricus Godefridus Maas
Den Einden Wilhelmus Theod Van
Deurzen Maria Henrica Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeia Semiconductor Technologies LLC
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69737742D1 publication Critical patent/DE69737742D1/de
Application granted granted Critical
Publication of DE69737742T2 publication Critical patent/DE69737742T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
DE69737742T 1996-03-12 1997-02-07 Herstellungsmethode einer hybriden integrierten schaltung Expired - Lifetime DE69737742T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP96200674 1996-03-12
EP96200674 1996-03-12
PCT/IB1997/000091 WO1997034317A1 (en) 1996-03-12 1997-02-07 Method of manufacturing a hybrid integrated circuit

Publications (2)

Publication Number Publication Date
DE69737742D1 true DE69737742D1 (de) 2007-07-05
DE69737742T2 DE69737742T2 (de) 2008-01-31

Family

ID=8223774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69737742T Expired - Lifetime DE69737742T2 (de) 1996-03-12 1997-02-07 Herstellungsmethode einer hybriden integrierten schaltung

Country Status (6)

Country Link
US (1) US5736452A (de)
EP (1) EP0826234B1 (de)
JP (1) JPH11505671A (de)
KR (1) KR100632136B1 (de)
DE (1) DE69737742T2 (de)
WO (1) WO1997034317A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW492103B (en) 2000-06-02 2002-06-21 Koninkl Philips Electronics Nv Electronic device, and method of patterning a first layer
SE0100875D0 (sv) * 2001-03-14 2001-03-14 Biacore Ab Method of preparing supported lipid film membranes and use thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329551B2 (de) * 1974-08-19 1978-08-22
JPH0691227B2 (ja) * 1984-02-09 1994-11-14 松下電子工業株式会社 半導体装置の製造方法
JPH061778B2 (ja) * 1985-11-01 1994-01-05 日本電気株式会社 半導体装置およびその製造方法
US4870475A (en) * 1985-11-01 1989-09-26 Nec Corporation Semiconductor device and method of manufacturing the same
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
JPS63308386A (ja) * 1987-01-30 1988-12-15 Sony Corp 半導体装置とその製造方法
JP3092761B2 (ja) * 1991-12-02 2000-09-25 キヤノン株式会社 画像表示装置及びその製造方法
JP3014012B2 (ja) * 1992-03-19 2000-02-28 日本電気株式会社 半導体装置の製造方法
JP3036233B2 (ja) * 1992-06-22 2000-04-24 松下電器産業株式会社 半導体装置およびその製造方法
JP3340177B2 (ja) * 1993-03-12 2002-11-05 株式会社東芝 電界効果型トランジスタ
JP2526786B2 (ja) * 1993-05-22 1996-08-21 日本電気株式会社 半導体装置及びその製造方法
JP3278296B2 (ja) * 1994-07-13 2002-04-30 三菱電機株式会社 液晶表示アレイの製造方法
JP2571546B2 (ja) * 1994-09-14 1997-01-16 松下電器産業株式会社 液晶画像表示装置の製造方法
KR0150998B1 (ko) * 1994-10-27 1998-12-01 김광호 이중 스토퍼를 이용한 소이 웨이퍼 제조방법
JPH09509792A (ja) * 1994-12-23 1997-09-30 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 支持ウェーハ上に接着した半導体物質の層中に半導体素子が形成した半導体装置の製造方法

Also Published As

Publication number Publication date
US5736452A (en) 1998-04-07
KR19990014741A (ko) 1999-02-25
EP0826234B1 (de) 2007-05-23
WO1997034317A1 (en) 1997-09-18
JPH11505671A (ja) 1999-05-21
KR100632136B1 (ko) 2006-11-30
DE69737742T2 (de) 2008-01-31
EP0826234A1 (de) 1998-03-04

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Owner name: NXP B.V., EINDHOVEN, NL

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