DE69802132T2 - Aufbau zum Kühlen einer integrierten Schaltung - Google Patents
Aufbau zum Kühlen einer integrierten SchaltungInfo
- Publication number
- DE69802132T2 DE69802132T2 DE69802132T DE69802132T DE69802132T2 DE 69802132 T2 DE69802132 T2 DE 69802132T2 DE 69802132 T DE69802132 T DE 69802132T DE 69802132 T DE69802132 T DE 69802132T DE 69802132 T2 DE69802132 T2 DE 69802132T2
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- integrated circuit
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9078171A JP2914342B2 (ja) | 1997-03-28 | 1997-03-28 | 集積回路装置の冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69802132D1 DE69802132D1 (de) | 2001-11-29 |
DE69802132T2 true DE69802132T2 (de) | 2002-07-18 |
Family
ID=13654507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69802132T Expired - Fee Related DE69802132T2 (de) | 1997-03-28 | 1998-03-27 | Aufbau zum Kühlen einer integrierten Schaltung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5990550A (de) |
EP (1) | EP0871352B1 (de) |
JP (1) | JP2914342B2 (de) |
AU (1) | AU729475B2 (de) |
CA (1) | CA2233481C (de) |
DE (1) | DE69802132T2 (de) |
Families Citing this family (71)
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US6586835B1 (en) * | 1998-08-31 | 2003-07-01 | Micron Technology, Inc. | Compact system module with built-in thermoelectric cooling |
US6392296B1 (en) | 1998-08-31 | 2002-05-21 | Micron Technology, Inc. | Silicon interposer with optical connections |
TW399309B (en) * | 1998-09-30 | 2000-07-21 | World Wiser Electronics Inc | Cavity-down package structure with thermal via |
FR2786656B1 (fr) | 1998-11-27 | 2001-01-26 | Alstom Technology | Composant electronique de puissance comportant des moyens de refroidissement |
US6255852B1 (en) | 1999-02-09 | 2001-07-03 | Micron Technology, Inc. | Current mode signal interconnects and CMOS amplifier |
US6856013B1 (en) * | 1999-02-19 | 2005-02-15 | Micron Technology, Inc. | Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit |
US6268660B1 (en) * | 1999-03-05 | 2001-07-31 | International Business Machines Corporation | Silicon packaging with through wafer interconnects |
DE19919781A1 (de) * | 1999-04-30 | 2000-11-09 | Wuerth Elektronik Gmbh | Leiterplatte und Verfahren zu ihrer Anbringung |
US7554829B2 (en) | 1999-07-30 | 2009-06-30 | Micron Technology, Inc. | Transmission lines for CMOS integrated circuits |
US6825550B2 (en) * | 1999-09-02 | 2004-11-30 | Micron Technology, Inc. | Board-on-chip packages with conductive foil on the chip surface |
JP4673949B2 (ja) * | 1999-11-12 | 2011-04-20 | 富士通株式会社 | 半導体ユニットおよびその製造方法 |
US6703707B1 (en) * | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
US6219243B1 (en) * | 1999-12-14 | 2001-04-17 | Intel Corporation | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
DE10033352B4 (de) * | 2000-07-08 | 2010-08-19 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe |
TW462121B (en) * | 2000-09-19 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Heat sink type ball grid array package |
US20030064542A1 (en) * | 2001-10-02 | 2003-04-03 | Corisis David J. | Methods of packaging an integrated circuit |
US6580611B1 (en) * | 2001-12-21 | 2003-06-17 | Intel Corporation | Dual-sided heat removal system |
US7101770B2 (en) | 2002-01-30 | 2006-09-05 | Micron Technology, Inc. | Capacitive techniques to reduce noise in high speed interconnections |
US6762939B2 (en) * | 2002-02-20 | 2004-07-13 | Intel Corporation | Thermal solution for a mezzanine card |
US7235457B2 (en) | 2002-03-13 | 2007-06-26 | Micron Technology, Inc. | High permeability layered films to reduce noise in high speed interconnects |
JP2003324214A (ja) * | 2002-04-30 | 2003-11-14 | Omron Corp | 発光モジュール |
TWM245730U (en) * | 2003-03-19 | 2004-10-01 | Power Mate Technology Co Ltd | Heat dissipating coating layer of object under heat dissipation |
JP2004288834A (ja) * | 2003-03-20 | 2004-10-14 | Fujitsu Ltd | 電子部品の実装方法、実装構造及びパッケージ基板 |
US20040184236A1 (en) * | 2003-03-20 | 2004-09-23 | Kuang-Yao Lee | Central processing unit (CPU) heat sink module |
US20040188811A1 (en) * | 2003-03-24 | 2004-09-30 | Intel Corporation | Circuit package apparatus, systems, and methods |
US6821816B1 (en) * | 2003-06-13 | 2004-11-23 | Delphi Technologies, Inc. | Relaxed tolerance flip chip assembly |
KR100534968B1 (ko) * | 2003-09-16 | 2005-12-08 | 현대자동차주식회사 | 전자소자의 냉각구조 |
US20050077614A1 (en) * | 2003-10-10 | 2005-04-14 | Chengalva Suresh K. | Semiconductor device heat sink package and method |
CN100362654C (zh) * | 2003-12-12 | 2008-01-16 | 矽统科技股份有限公司 | 具有散热装置的球栅阵列封装 |
FR2864419B1 (fr) * | 2003-12-19 | 2006-04-28 | Hispano Suiza Sa | Procede pour braser un composant electronique sur une carte electronique, procede de reparation de la carte et installation pour la mise en oeuvre du procede |
CN100389492C (zh) * | 2003-12-24 | 2008-05-21 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及其制备方法 |
CN100358130C (zh) * | 2004-04-08 | 2007-12-26 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及其制备方法 |
KR100669768B1 (ko) | 2004-11-17 | 2007-01-16 | 삼성에스디아이 주식회사 | 지능형 전원 모듈의 방열 구조 및 이를 구비한 디스플레이모듈 |
US7269017B2 (en) | 2004-11-19 | 2007-09-11 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices on laminate ceramic substrate |
KR100708659B1 (ko) | 2005-01-15 | 2007-04-17 | 삼성에스디아이 주식회사 | 지능형 전원 모듈의 방열 구조, 이를 구비한 디스플레이모듈 및 지능형 전원 모듈의 방열판 설치 방법 |
JP2006287080A (ja) | 2005-04-04 | 2006-10-19 | Hitachi Ltd | メモリモジュール |
US20060266475A1 (en) * | 2005-05-24 | 2006-11-30 | American Standard Circuits, Inc. | Thermally conductive interface |
US20070076377A1 (en) * | 2005-10-03 | 2007-04-05 | Matteo Gravina | Bi-Polar Thermal Managment |
TWI292300B (en) * | 2005-11-21 | 2008-01-01 | Delta Electronics Inc | Electronic device with dual heat dissipating structures |
US7629683B1 (en) | 2006-02-28 | 2009-12-08 | Juniper Networks, Inc. | Thermal management of electronic devices |
CN101039566A (zh) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | 散热装置及应用该散热装置的电子装置 |
US8952524B2 (en) * | 2006-04-28 | 2015-02-10 | Juniper Networks, Inc. | Re-workable heat sink attachment assembly |
JP2008140924A (ja) * | 2006-11-30 | 2008-06-19 | Toshiba Corp | 電子機器 |
US7863189B2 (en) * | 2007-01-05 | 2011-01-04 | International Business Machines Corporation | Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density |
US20080284037A1 (en) | 2007-05-15 | 2008-11-20 | Andry Paul S | Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers |
JP5188120B2 (ja) * | 2007-08-10 | 2013-04-24 | 新光電気工業株式会社 | 半導体装置 |
TW200921516A (en) * | 2007-09-21 | 2009-05-16 | Silverbrook Res Pty Ltd | Coding pattern comprising reed-solomon codewords encoded by mixed multi-pulse position modulation |
US7706144B2 (en) * | 2007-12-17 | 2010-04-27 | Lynch Thomas W | Heat dissipation system and related method |
CN102522380B (zh) * | 2011-12-21 | 2014-12-03 | 华为技术有限公司 | 一种PoP封装结构 |
US9337123B2 (en) * | 2012-07-11 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal structure for integrated circuit package |
US10269676B2 (en) | 2012-10-04 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermally enhanced package-on-package (PoP) |
TWI508238B (zh) | 2012-12-17 | 2015-11-11 | Princo Corp | 晶片散熱系統 |
CN104269386A (zh) * | 2014-08-28 | 2015-01-07 | 西安电子科技大学 | 一种多芯片封装粘结层导热齿结构 |
JP6198068B2 (ja) * | 2014-11-19 | 2017-09-20 | 株式会社デンソー | 電子装置 |
BR112018010875B1 (pt) * | 2015-11-30 | 2022-09-06 | Nsk Ltd. | Unidade de controle e dispositivo de direção de potência elétrica |
US10782316B2 (en) * | 2017-01-09 | 2020-09-22 | Delta Design, Inc. | Socket side thermal system |
JP6715818B2 (ja) | 2017-03-22 | 2020-07-01 | ベジ 佐々木 | 冷却構造体、冷却システム、発熱装置および構造物 |
WO2018173942A1 (ja) | 2017-03-22 | 2018-09-27 | フリージア・マクロス株式会社 | 冷却構造体、冷却システム、発熱装置および構造物 |
US10153261B2 (en) * | 2017-04-03 | 2018-12-11 | Cisco Technology, Inc. | Cooling system for high power application specific integrated circuit with embedded high bandwidth memory |
KR20190018812A (ko) | 2017-08-16 | 2019-02-26 | 삼성전기주식회사 | 반도체 패키지와 이를 구비하는 전자 기기 |
US10553517B2 (en) * | 2018-01-18 | 2020-02-04 | Semiconductor Components Industries, Llc | High power module semiconductor package with multiple submodules |
WO2020062253A1 (zh) * | 2018-09-30 | 2020-04-02 | 北京比特大陆科技有限公司 | 电路板、计算设备及散热机箱 |
CN109643705A (zh) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | 电路板及芯片布局方法、计算设备 |
WO2020102983A1 (zh) * | 2018-11-20 | 2020-05-28 | 北京比特大陆科技有限公司 | 电路板及超算服务器 |
US11227846B2 (en) | 2019-01-30 | 2022-01-18 | Mediatek Inc. | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure |
JP7173278B2 (ja) * | 2019-03-05 | 2022-11-16 | 株式会社アイシン | 半導体装置 |
US11621211B2 (en) | 2019-06-14 | 2023-04-04 | Mediatek Inc. | Semiconductor package structure |
US11183449B1 (en) * | 2020-05-22 | 2021-11-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cryogenic integrated circuits |
EP4113594A1 (de) * | 2021-06-28 | 2023-01-04 | Aptiv Technologies Limited | Durchgangsplatte mittels wärmesenke |
US11825593B2 (en) | 2021-06-28 | 2023-11-21 | Aptiv Technologies Limited | Through board via heat sink |
KR20240027784A (ko) | 2021-06-30 | 2024-03-04 | 델타 디자인, 인코포레이티드 | 접촉기 어셈블리를 포함하는 온도 제어 시스템 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
JP2828358B2 (ja) * | 1991-09-20 | 1998-11-25 | 沖電気工業株式会社 | 半導体放熱構造 |
DE9308842U1 (de) * | 1993-06-14 | 1993-07-22 | Blaupunkt-Werke Gmbh, 31139 Hildesheim, De | |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
US5523260A (en) * | 1993-08-02 | 1996-06-04 | Motorola, Inc. | Method for heatsinking a controlled collapse chip connection device |
JP2828385B2 (ja) * | 1993-08-11 | 1998-11-25 | 沖電気工業株式会社 | Icパッケージの構造 |
JP2646994B2 (ja) * | 1993-12-29 | 1997-08-27 | 日本電気株式会社 | ヒートシンク付ピングリッドアレイ |
JPH07321258A (ja) * | 1994-05-24 | 1995-12-08 | Fujitsu Ltd | 半導体装置 |
MY112145A (en) * | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
EP0709883B1 (de) * | 1994-10-04 | 2001-10-04 | Nec Corporation | Mittels automatischer Bandmontage hergestelltes Halbleitergehäuse |
US5585671A (en) * | 1994-10-07 | 1996-12-17 | Nagesh; Voddarahalli K. | Reliable low thermal resistance package for high power flip clip ICs |
JP2926537B2 (ja) * | 1994-12-15 | 1999-07-28 | 株式会社日立製作所 | マルチチップモジュ−ルの冷却装置 |
-
1997
- 1997-03-28 JP JP9078171A patent/JP2914342B2/ja not_active Expired - Fee Related
-
1998
- 1998-03-27 DE DE69802132T patent/DE69802132T2/de not_active Expired - Fee Related
- 1998-03-27 CA CA002233481A patent/CA2233481C/en not_active Expired - Fee Related
- 1998-03-27 AU AU59693/98A patent/AU729475B2/en not_active Ceased
- 1998-03-27 EP EP98250111A patent/EP0871352B1/de not_active Expired - Lifetime
- 1998-03-27 US US09/049,123 patent/US5990550A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5990550A (en) | 1999-11-23 |
DE69802132D1 (de) | 2001-11-29 |
EP0871352A1 (de) | 1998-10-14 |
CA2233481A1 (en) | 1998-09-28 |
JPH10275883A (ja) | 1998-10-13 |
JP2914342B2 (ja) | 1999-06-28 |
EP0871352B1 (de) | 2001-10-24 |
AU5969398A (en) | 1998-10-01 |
AU729475B2 (en) | 2001-02-01 |
CA2233481C (en) | 2002-01-15 |
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