DE69807676T2 - Selbstinterstitiell dominiertes silizium mit niedriger defektdichte - Google Patents

Selbstinterstitiell dominiertes silizium mit niedriger defektdichte

Info

Publication number
DE69807676T2
DE69807676T2 DE69807676T DE69807676T DE69807676T2 DE 69807676 T2 DE69807676 T2 DE 69807676T2 DE 69807676 T DE69807676 T DE 69807676T DE 69807676 T DE69807676 T DE 69807676T DE 69807676 T2 DE69807676 T2 DE 69807676T2
Authority
DE
Germany
Prior art keywords
interinitially
self
defect density
low defect
dominated silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69807676T
Other languages
English (en)
Other versions
DE69807676D1 (de
Inventor
Robert Falster
A Markgraf
A Mcquaid
C Holzer
Paolo Mutti
K Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21918645&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69807676(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of DE69807676D1 publication Critical patent/DE69807676D1/de
Application granted granted Critical
Publication of DE69807676T2 publication Critical patent/DE69807676T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/14Heating of the melt or the crystallised materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • C30B15/203Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • C30B15/206Controlling or regulating the thermal history of growing the ingot
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1004Apparatus with means for measuring, testing, or sensing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/21Circular sheet or circular blank

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE69807676T 1997-04-09 1998-04-09 Selbstinterstitiell dominiertes silizium mit niedriger defektdichte Expired - Lifetime DE69807676T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4184597P 1997-04-09 1997-04-09
PCT/US1998/007365 WO1998045510A1 (en) 1997-04-09 1998-04-09 Low defect density, self-interstitial dominated silicon

Publications (2)

Publication Number Publication Date
DE69807676D1 DE69807676D1 (de) 2002-10-10
DE69807676T2 true DE69807676T2 (de) 2003-04-24

Family

ID=21918645

Family Applications (7)

Application Number Title Priority Date Filing Date
DE69806137T Expired - Lifetime DE69806137T2 (de) 1997-04-09 1998-04-09 Silizium mit niedriger defektdichte
DE69831618T Expired - Lifetime DE69831618T2 (de) 1997-04-09 1998-04-09 Freistellenbeherrschendes Silizium mit niedriger Fehlerdichte
DE69840690T Expired - Lifetime DE69840690D1 (de) 1997-04-09 1998-04-09 Selbst-zwischengitterdominiertes Silizium mit niedriger Fehlerdichte
DE69813041T Expired - Lifetime DE69813041T2 (de) 1997-04-09 1998-04-09 Freistellenbeherrschendes Silizium mit niedriger Fehlerdichte
DE69801903T Expired - Lifetime DE69801903T2 (de) 1997-04-09 1998-04-09 Freistellenbeherrschendes silicium mit niedriger fehlerdichte
DE69807676T Expired - Lifetime DE69807676T2 (de) 1997-04-09 1998-04-09 Selbstinterstitiell dominiertes silizium mit niedriger defektdichte
DE69824647T Expired - Lifetime DE69824647T2 (de) 1997-04-09 1998-04-09 Silicium mit niedriger Fehlerdichte

Family Applications Before (5)

Application Number Title Priority Date Filing Date
DE69806137T Expired - Lifetime DE69806137T2 (de) 1997-04-09 1998-04-09 Silizium mit niedriger defektdichte
DE69831618T Expired - Lifetime DE69831618T2 (de) 1997-04-09 1998-04-09 Freistellenbeherrschendes Silizium mit niedriger Fehlerdichte
DE69840690T Expired - Lifetime DE69840690D1 (de) 1997-04-09 1998-04-09 Selbst-zwischengitterdominiertes Silizium mit niedriger Fehlerdichte
DE69813041T Expired - Lifetime DE69813041T2 (de) 1997-04-09 1998-04-09 Freistellenbeherrschendes Silizium mit niedriger Fehlerdichte
DE69801903T Expired - Lifetime DE69801903T2 (de) 1997-04-09 1998-04-09 Freistellenbeherrschendes silicium mit niedriger fehlerdichte

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69824647T Expired - Lifetime DE69824647T2 (de) 1997-04-09 1998-04-09 Silicium mit niedriger Fehlerdichte

Country Status (10)

Country Link
US (11) US6254672B1 (de)
EP (7) EP1118697B1 (de)
JP (9) JP3449730B2 (de)
KR (6) KR20010006227A (de)
CN (7) CN101070621B (de)
DE (7) DE69806137T2 (de)
MY (6) MY120036A (de)
SG (3) SG165151A1 (de)
TW (3) TW494146B (de)
WO (3) WO1998045510A1 (de)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
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US6485807B1 (en) 1997-02-13 2002-11-26 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects, and methods of preparing the same
US6503594B2 (en) 1997-02-13 2003-01-07 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects and slip
SG64470A1 (en) 1997-02-13 1999-04-27 Samsung Electronics Co Ltd Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby
US6045610A (en) * 1997-02-13 2000-04-04 Samsung Electronics Co., Ltd. Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnance
US5994761A (en) * 1997-02-26 1999-11-30 Memc Electronic Materials Spa Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
CN101070621B (zh) * 1997-04-09 2012-09-05 Memc电子材料有限公司 低缺陷密度、理想氧沉淀的硅
MY137778A (en) * 1997-04-09 2009-03-31 Memc Electronic Materials Low defect density, ideal oxygen precipitating silicon
US6379642B1 (en) * 1997-04-09 2002-04-30 Memc Electronic Materials, Inc. Vacancy dominated, defect-free silicon
JPH1179889A (ja) * 1997-07-09 1999-03-23 Shin Etsu Handotai Co Ltd 結晶欠陥が少ないシリコン単結晶の製造方法、製造装置並びにこの方法、装置で製造されたシリコン単結晶とシリコンウエーハ
EP1035234A4 (de) * 1997-08-26 2003-05-28 Sumitomo Mitsubishi Silicon Hochqualitativer silikoneinkristall und verfahren zu dessen herstellung
US6340392B1 (en) 1997-10-24 2002-01-22 Samsung Electronics Co., Ltd. Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface
JP3346249B2 (ja) * 1997-10-30 2002-11-18 信越半導体株式会社 シリコンウエーハの熱処理方法及びシリコンウエーハ
JP3407629B2 (ja) * 1997-12-17 2003-05-19 信越半導体株式会社 シリコン単結晶ウエーハの熱処理方法ならびにシリコン単結晶ウエーハ
JP3955375B2 (ja) * 1998-01-19 2007-08-08 信越半導体株式会社 シリコン単結晶の製造方法およびシリコン単結晶ウエーハ
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JP2003517412A (ja) 1998-06-26 2003-05-27 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 任意に大きい直径を有する無欠陥シリコン結晶の成長方法
US6361619B1 (en) 1998-09-02 2002-03-26 Memc Electronic Materials, Inc. Thermally annealed wafers having improved internal gettering
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JP2002524845A (ja) * 1998-09-02 2002-08-06 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 欠陥密度が低い単結晶シリコンから得られるシリコン・オン・インシュレーター構造体
US6312516B2 (en) 1998-10-14 2001-11-06 Memc Electronic Materials, Inc. Process for preparing defect free silicon crystals which allows for variability in process conditions
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JP3782387B2 (ja) 2006-06-07
US6409826B2 (en) 2002-06-25
JP2003192490A (ja) 2003-07-09
EP0973964B1 (de) 2002-09-04
KR20040065306A (ko) 2004-07-21
MY127383A (en) 2006-11-30
DE69801903D1 (de) 2001-11-08
US20050205000A1 (en) 2005-09-22
DE69806137D1 (de) 2002-07-25
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JP4291559B2 (ja) 2009-07-08
EP0973964A1 (de) 2000-01-26
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CN1280455C (zh) 2006-10-18
CN1257556A (zh) 2000-06-21
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JP2006062960A (ja) 2006-03-09
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US20040070012A1 (en) 2004-04-15
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JP4477569B2 (ja) 2010-06-09
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US20010020437A1 (en) 2001-09-13
US20010025597A1 (en) 2001-10-04
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