DE69814833D1 - Zweispur-schabloniersystem mit lotsammelkopf - Google Patents
Zweispur-schabloniersystem mit lotsammelkopfInfo
- Publication number
- DE69814833D1 DE69814833D1 DE69814833T DE69814833T DE69814833D1 DE 69814833 D1 DE69814833 D1 DE 69814833D1 DE 69814833 T DE69814833 T DE 69814833T DE 69814833 T DE69814833 T DE 69814833T DE 69814833 D1 DE69814833 D1 DE 69814833D1
- Authority
- DE
- Germany
- Prior art keywords
- stencil
- conveyor rails
- track
- pairs
- working area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US802934 | 1997-02-21 | ||
US08/802,934 US5873939A (en) | 1997-02-21 | 1997-02-21 | Dual track stencil/screen printer |
US920121 | 1997-08-26 | ||
US08/920,121 US6066206A (en) | 1997-02-21 | 1997-08-26 | Dual track stenciling system with solder gathering head |
PCT/US1998/003121 WO1998037741A1 (en) | 1997-02-19 | 1998-02-18 | Dual track stenciling system with solder gathering head |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69814833D1 true DE69814833D1 (de) | 2003-06-26 |
DE69814833T2 DE69814833T2 (de) | 2004-03-11 |
Family
ID=27122520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69814833T Expired - Lifetime DE69814833T2 (de) | 1997-02-21 | 1998-02-18 | Zweispur-schabloniersystem mit lotsammelkopf |
Country Status (9)
Country | Link |
---|---|
US (3) | US6066206A (de) |
EP (1) | EP0968630B1 (de) |
JP (2) | JP4201352B2 (de) |
KR (1) | KR100484995B1 (de) |
AT (1) | ATE241258T1 (de) |
AU (1) | AU6173398A (de) |
CA (1) | CA2281624A1 (de) |
DE (1) | DE69814833T2 (de) |
WO (1) | WO1998037741A1 (de) |
Families Citing this family (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6609652B2 (en) * | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US6032788A (en) * | 1998-02-26 | 2000-03-07 | Dek Printing Machines Limited | Multi-rail board transport system |
JP2000263752A (ja) * | 1999-01-11 | 2000-09-26 | Micro Tekku Kk | スクリーン印刷機及びスクリーン印刷方法 |
US6738505B1 (en) * | 1999-05-04 | 2004-05-18 | Speedline Technologies, Inc. | Method and apparatus for detecting solder paste deposits on substrates |
US6891967B2 (en) | 1999-05-04 | 2005-05-10 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
US7072503B2 (en) * | 1999-05-04 | 2006-07-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
WO2001026440A1 (fr) | 1999-05-21 | 2001-04-12 | Matsushita Electric Industrial Co., Ltd. | Dispositif et procede destines a transferer/maintenir des elements en forme de feuille |
US6631798B1 (en) * | 2000-11-01 | 2003-10-14 | Micron Technology, Inc. | Printed circuit board support |
KR100716875B1 (ko) * | 2000-12-29 | 2007-05-09 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지용 회로기판의 솔더 프린팅 장치 |
JP2003046299A (ja) * | 2001-08-02 | 2003-02-14 | Fuji Mach Mfg Co Ltd | 回路基板作業システムおよび状態設定方法 |
CA2409577A1 (en) * | 2001-10-22 | 2003-04-22 | Hallmark Cards, Incorporated | Multi-frame screen printing |
KR100412273B1 (ko) * | 2001-11-22 | 2003-12-31 | 미래산업 주식회사 | 인쇄회로기판 이송장치 |
US7093746B2 (en) * | 2002-05-17 | 2006-08-22 | Fry's Metals, Inc. | Coated stencil with reduced surface tension |
TW542819B (en) * | 2002-07-26 | 2003-07-21 | Hannstar Display Corp | Half-square welding processing system with multiple feeding lines |
KR100618576B1 (ko) * | 2002-11-13 | 2006-08-31 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 디스펜서 및 이를 이용한 디스펜싱 방법 |
FR2858253A1 (fr) * | 2003-07-30 | 2005-02-04 | Novatec | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime |
JP2005094477A (ja) * | 2003-09-18 | 2005-04-07 | Seiko Epson Corp | 透過原稿搬送装置及び画像読み取り装置 |
US7614341B1 (en) | 2004-03-12 | 2009-11-10 | General Dynamics Advanced Information Systems, Inc. | Apparatus and method for a segmented squeegee for stenciling |
US7093704B2 (en) * | 2004-08-17 | 2006-08-22 | Micron Technology, Inc. | Printed circuit board support |
US7291226B2 (en) * | 2004-09-30 | 2007-11-06 | Lexmark International, Inc. | Progressive stencil printing |
US7121199B2 (en) * | 2004-10-18 | 2006-10-17 | Speedline Technologies, Inc. | Method and apparatus for supporting and clamping a substrate |
JP2008546542A (ja) * | 2005-05-18 | 2008-12-25 | プレジデント・アンド・フエローズ・オブ・ハーバード・カレツジ | マイクロ流体ネットワークにおける伝導通路、マイクロ回路、マイクロ構造の製造 |
TWM303781U (en) * | 2005-12-16 | 2007-01-01 | Inventec Corp | Automation coating and applying apparatus |
KR100736117B1 (ko) * | 2006-05-15 | 2007-07-06 | (주) 라모스테크놀러지 | 금속 스텐실과 이를 이용한 스크린 프린터 및 메모리모듈의 복구 방법 |
KR101164595B1 (ko) * | 2006-12-28 | 2012-07-11 | 삼성테크윈 주식회사 | 부품실장기용 인쇄회로기판 이송장치 및 이를 이용한인쇄회로기판 이송방법 |
DE102007003224A1 (de) * | 2007-01-15 | 2008-07-17 | Thieme Gmbh & Co. Kg | Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen |
US7861650B2 (en) * | 2007-04-13 | 2011-01-04 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
US7827909B2 (en) * | 2007-04-17 | 2010-11-09 | Illinois Tool Works Inc. | Stencil printer with multiplexed control of multi-axis machine having distributed control motor amplifier |
JP5100194B2 (ja) * | 2007-04-26 | 2012-12-19 | 富士機械製造株式会社 | スクリーン印刷機 |
JP4356769B2 (ja) * | 2007-05-22 | 2009-11-04 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
JP5023904B2 (ja) * | 2007-09-11 | 2012-09-12 | パナソニック株式会社 | スクリーン印刷装置 |
US7980445B2 (en) * | 2008-01-23 | 2011-07-19 | International Business Machines Corporation | Fill head for full-field solder coverage with a rotatable member |
US20090217830A1 (en) * | 2008-02-29 | 2009-09-03 | Reefdale Pty Ltd | Screen printer print carriage |
JP5415011B2 (ja) | 2008-04-02 | 2014-02-12 | パナソニック株式会社 | スクリーン印刷装置 |
US8096408B2 (en) * | 2008-04-07 | 2012-01-17 | Muratec Automation Co., Ltd. | Segmented material conveyor system, threshold assembly and method for making and using the same |
JP2010046843A (ja) * | 2008-08-20 | 2010-03-04 | Hitachi High-Tech Instruments Co Ltd | スクリーン印刷機 |
DE102008041471B3 (de) * | 2008-08-22 | 2010-03-04 | Q-Cells Ag | Verfahren und Vorrichtung zum Transportieren eines Substrates |
JP5276396B2 (ja) * | 2008-09-25 | 2013-08-28 | 富士機械製造株式会社 | スクリーン印刷装置 |
GB2464969A (en) * | 2008-10-31 | 2010-05-05 | Dek Int Gmbh | Screen printing apparatus and cleaning method |
US8413577B2 (en) | 2008-11-19 | 2013-04-09 | Illinois Tool Works Inc. | Vertically separated pass through conveyor system and method in surface mount technology process equipment |
JP5679399B2 (ja) | 2008-11-25 | 2015-03-04 | 富士機械製造株式会社 | スクリーン印刷機および印刷ユニット |
CN102239752A (zh) * | 2008-12-02 | 2011-11-09 | 千住金属工业株式会社 | 回流熔炉 |
KR101022704B1 (ko) * | 2009-10-07 | 2011-03-22 | 이재인 | 듀얼 스크린프린터 |
JP5476139B2 (ja) * | 2010-01-22 | 2014-04-23 | ヤマハ発動機株式会社 | 印刷装置および印刷方法 |
KR101025129B1 (ko) * | 2010-07-06 | 2011-03-25 | 주식회사이에스이 | 듀얼 레인 스크린 프린터 |
US8141766B1 (en) * | 2010-09-06 | 2012-03-27 | Cheng Uei Precision Industry Co., Ltd. | Automatic soldering system |
JP5723221B2 (ja) * | 2011-05-31 | 2015-05-27 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
JP5662875B2 (ja) * | 2011-05-31 | 2015-02-04 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
JP5597595B2 (ja) | 2011-05-31 | 2014-10-01 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
JP5316609B2 (ja) * | 2011-07-29 | 2013-10-16 | パナソニック株式会社 | 部品実装ラインおよび部品実装方法 |
JP5131368B2 (ja) * | 2011-07-29 | 2013-01-30 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
US9974220B2 (en) * | 2012-07-06 | 2018-05-15 | Siemens Aktiengesellschaft | Method for fitting printed circuit boards with components |
JP5662975B2 (ja) * | 2012-07-23 | 2015-02-04 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
JP5873928B2 (ja) * | 2012-08-29 | 2016-03-01 | ヤマハ発動機株式会社 | 印刷機 |
EP2873526B1 (de) | 2012-08-29 | 2017-04-19 | Yamaha Hatsudoki Kabushiki Kaisha | Druckmaschine |
JP5350529B2 (ja) * | 2012-11-30 | 2013-11-27 | パナソニック株式会社 | 部品実装ラインおよび部品実装方法 |
JP5574032B2 (ja) * | 2013-08-21 | 2014-08-20 | パナソニック株式会社 | 部品実装ラインおよび部品実装方法ならびにスクリーン印刷装置 |
JP6232965B2 (ja) * | 2013-11-20 | 2017-11-22 | セイコーエプソン株式会社 | 記録装置 |
JP6570542B2 (ja) | 2014-01-16 | 2019-09-04 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 三次元物体の生成 |
DK3094469T3 (da) | 2014-01-16 | 2019-12-16 | Hewlett Packard Development Co | Generering af en tredimensional genstand |
JP6298169B2 (ja) | 2014-01-16 | 2018-03-20 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 構築材料プロファイル |
RU2650155C2 (ru) | 2014-01-16 | 2018-04-09 | Хьюлетт-Паккард Дивелопмент Компани, Л.П. | Формирование трехмерных объектов |
EP3018081B1 (de) | 2014-11-06 | 2017-08-02 | Hewlett-Packard Industrial Printing Ltd. | Palettenförderer für Drucker |
JP6424334B2 (ja) * | 2014-12-01 | 2018-11-21 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及び部品実装ライン |
US9370925B1 (en) * | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
JP6603475B2 (ja) * | 2015-04-23 | 2019-11-06 | Juki株式会社 | 基板搬送装置及び電子部品実装装置 |
JP6824880B2 (ja) * | 2015-05-19 | 2021-02-03 | 株式会社Fuji | 印刷装置 |
JP6679265B2 (ja) * | 2015-10-05 | 2020-04-15 | 株式会社Fuji | 印刷装置 |
KR101908915B1 (ko) * | 2016-06-10 | 2018-10-18 | 크루셜머신즈 주식회사 | 릴-투-릴 레이저 리플로우 방법 |
WO2019159309A1 (ja) * | 2018-02-16 | 2019-08-22 | 株式会社Fuji | スクリーン印刷方法、スクリーン印刷機 |
CN109107842B (zh) * | 2018-10-18 | 2020-08-21 | 无锡奥特维科技股份有限公司 | 电池片涂胶装置及方法 |
KR102003265B1 (ko) * | 2019-02-28 | 2019-07-24 | 제일유리 주식회사 | 판유리의 인쇄장치 |
US11318549B2 (en) * | 2019-06-13 | 2022-05-03 | Illinois Tool Works Inc. | Solder paste bead recovery system and method |
US11247286B2 (en) | 2019-06-13 | 2022-02-15 | Illinois Tool Works Inc. | Paste dispensing transfer system and method for a stencil printer |
US20200396843A1 (en) * | 2019-06-13 | 2020-12-17 | Illinois Tool Works Inc. | Method and system for automated single changeover within a stencil printer |
US20200391530A1 (en) | 2019-06-13 | 2020-12-17 | Illinois Tool Works Inc. | Multi-functional print head for a stencil printer |
US20200391499A1 (en) * | 2019-06-13 | 2020-12-17 | Illinois Tool Works Inc. | Automated printer robotic arm |
CN110369223A (zh) * | 2019-07-29 | 2019-10-25 | Tcl王牌电器(惠州)有限公司 | Pcb点胶机 |
KR102233573B1 (ko) * | 2020-03-04 | 2021-03-30 | 주식회사 에스제이이노테크 | 스크린 프린터용 사이드 컨베이어장치 |
JP7001729B2 (ja) * | 2020-03-18 | 2022-01-20 | 株式会社Fuji | 印刷装置 |
GB2596517A (en) * | 2020-06-22 | 2022-01-05 | Asm Assembly Systems Singapore Pte Ltd | Workpiece alignment and printing |
KR102304292B1 (ko) * | 2021-05-13 | 2021-09-17 | 신용팔 | 잉크 포집부가 구비된 자동 스크린 인쇄장치 |
KR102304298B1 (ko) * | 2021-05-13 | 2021-09-17 | 신용팔 | 자동 스크린 인쇄장치 |
DE102021205984A1 (de) * | 2021-06-11 | 2022-12-15 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung und Verfahren zum Bedrucken von Substraten |
KR102606828B1 (ko) * | 2021-08-30 | 2023-11-29 | 에스케이하이닉스 주식회사 | 검사 및 리페어 장치를 포함하는 반도체 제조 시스템, 그 구동 방법 및 이를 이용한 반도체 패키지의 제조방법 |
US11778750B2 (en) * | 2021-09-09 | 2023-10-03 | Illinois Tool Works Inc. | Stencil printer with component loading verification system and method |
DE102021129079B3 (de) | 2021-11-09 | 2022-11-24 | Ersa Gmbh | Transportsystem zum Transportieren von Lötgut durch eine Lötanlage und Lötanlage |
DE102021129127A1 (de) | 2021-11-09 | 2023-05-11 | Ersa Gmbh | Transportsystem zum Transportieren von Lötgut durch eine Lötanlage und Lötanlage |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4268545A (en) | 1979-07-30 | 1981-05-19 | Libbey-Owens-Ford Company | Method of and apparatus for printing a pattern on a substrate |
SE8405803D0 (sv) | 1984-11-19 | 1984-11-19 | Mydata Automation Ab | Anordning for centrering/uppmetning av komponenter |
JPS61168446A (ja) | 1985-01-21 | 1986-07-30 | Fuji Kikai Seizo Kk | プリント基板位置決め装置 |
SE460779B (sv) * | 1985-02-27 | 1989-11-20 | Svecia Silkscreen Maskiner Ab | Rakelarrangemang foer en stenciltryckmaskin |
JPS61259927A (ja) | 1985-05-08 | 1986-11-18 | 株式会社フジキカイ | 包装機の駆動系制御装置 |
US4622239A (en) * | 1986-02-18 | 1986-11-11 | At&T Technologies, Inc. | Method and apparatus for dispensing viscous materials |
EP0280022A1 (de) | 1987-01-28 | 1988-08-31 | Epm Ag | Verfahren und Anlage zum Löten von bestückten Leiterplatten |
KR910002998B1 (ko) | 1987-02-09 | 1991-05-11 | 산요덴끼 가부시끼가이샤 | 접착제 도포장치 |
US4890241A (en) * | 1987-10-26 | 1989-12-26 | Megamation Incorporated | Robotic system |
JPH01114098A (ja) * | 1987-10-28 | 1989-05-02 | Nec Corp | ハンダ印刷装置 |
US4924304A (en) | 1987-11-02 | 1990-05-08 | Mpm Corporation | Video probe aligning of object to be acted upon |
JPH01232047A (ja) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | 厚膜印刷装置 |
US4946021A (en) | 1988-10-17 | 1990-08-07 | Simplimatic Engineering Company | Multiple position, conveyor mountable workpiece carrier |
US5151132A (en) * | 1989-01-09 | 1992-09-29 | Johannes Zimmer | Arrangement for applying substances to a web of material |
US5032426A (en) | 1989-05-15 | 1991-07-16 | Enthone, Incorporated | Method and apparatus for applying liquid coatings on the surface of printed circuit boards |
US5009306A (en) | 1989-06-19 | 1991-04-23 | Simplimatic Engineering Company | Printed circuit board conveyor and method |
US5029697A (en) | 1989-07-19 | 1991-07-09 | Simplimatic Engineering Company | Clean room conveyor |
US5044306A (en) * | 1990-06-11 | 1991-09-03 | Gunter Erdmann | Solder applying mechanism |
US5060063A (en) | 1990-07-30 | 1991-10-22 | Mpm Corporation | Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis |
JPH04317392A (ja) * | 1991-04-17 | 1992-11-09 | Fujitsu Ltd | プリント配線板の製造方法 |
US5309837A (en) * | 1991-06-24 | 1994-05-10 | Tani Denkikogyo Co., Ltd. | Method for screen printing of paste |
US5240104A (en) | 1992-01-31 | 1993-08-31 | Douglas John J | Printed circuit board belt conveyor |
US5436028A (en) * | 1992-07-27 | 1995-07-25 | Motorola, Inc. | Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards |
SE9400077D0 (sv) | 1994-01-10 | 1994-01-14 | Mytronic Ab | Maskinkoncept |
JPH082085A (ja) * | 1994-06-20 | 1996-01-09 | Fujitsu Ltd | ペーストの塗布方法 |
DE4447701C2 (de) * | 1994-09-20 | 1997-06-26 | Blaupunkt Werke Gmbh | Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen |
US5483884A (en) * | 1994-10-31 | 1996-01-16 | At&T Corp. | Method and apparatus for setting up a stencil printer |
CN1077845C (zh) * | 1994-12-27 | 2002-01-16 | 福特汽车公司 | 布施粘性材料的装置 |
US5823316A (en) * | 1995-10-04 | 1998-10-20 | Motorola, Inc. | Method for automatic conveyor width adjustment |
US5925187A (en) | 1996-02-08 | 1999-07-20 | Speedline Technologies, Inc. | Apparatus for dispensing flowable material |
US5873939A (en) * | 1997-02-21 | 1999-02-23 | Doyle; Dennis G. | Dual track stencil/screen printer |
US6032577A (en) * | 1998-03-02 | 2000-03-07 | Mpm Corporation | Method and apparatus for transporting substrates |
-
1997
- 1997-08-26 US US08/920,121 patent/US6066206A/en not_active Expired - Lifetime
-
1998
- 1998-02-18 WO PCT/US1998/003121 patent/WO1998037741A1/en active IP Right Grant
- 1998-02-18 EP EP98906533A patent/EP0968630B1/de not_active Expired - Lifetime
- 1998-02-18 DE DE69814833T patent/DE69814833T2/de not_active Expired - Lifetime
- 1998-02-18 JP JP53682698A patent/JP4201352B2/ja not_active Expired - Lifetime
- 1998-02-18 KR KR10-1999-7007513A patent/KR100484995B1/ko not_active IP Right Cessation
- 1998-02-18 AT AT98906533T patent/ATE241258T1/de not_active IP Right Cessation
- 1998-02-18 CA CA002281624A patent/CA2281624A1/en not_active Abandoned
- 1998-02-18 AU AU61733/98A patent/AU6173398A/en not_active Abandoned
-
2000
- 2000-02-03 US US09/498,239 patent/US6267819B1/en not_active Expired - Lifetime
-
2001
- 2001-07-31 US US09/918,698 patent/US6663712B2/en not_active Expired - Lifetime
-
2008
- 2008-01-04 JP JP2008000060A patent/JP4387436B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0968630A1 (de) | 2000-01-05 |
DE69814833T2 (de) | 2004-03-11 |
KR100484995B1 (ko) | 2005-04-25 |
JP4387436B2 (ja) | 2009-12-16 |
JP2002503161A (ja) | 2002-01-29 |
US6066206A (en) | 2000-05-23 |
US6663712B2 (en) | 2003-12-16 |
CA2281624A1 (en) | 1998-08-27 |
ATE241258T1 (de) | 2003-06-15 |
US20020020346A1 (en) | 2002-02-21 |
KR20000071222A (ko) | 2000-11-25 |
WO1998037741A1 (en) | 1998-08-27 |
US6267819B1 (en) | 2001-07-31 |
JP4201352B2 (ja) | 2008-12-24 |
EP0968630B1 (de) | 2003-05-21 |
JP2008109159A (ja) | 2008-05-08 |
AU6173398A (en) | 1998-09-09 |
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