DE69824133D1 - Verfahren zur Herstellung von mehrschichtigen Leiterplatten - Google Patents
Verfahren zur Herstellung von mehrschichtigen LeiterplattenInfo
- Publication number
- DE69824133D1 DE69824133D1 DE69824133T DE69824133T DE69824133D1 DE 69824133 D1 DE69824133 D1 DE 69824133D1 DE 69824133 T DE69824133 T DE 69824133T DE 69824133 T DE69824133 T DE 69824133T DE 69824133 D1 DE69824133 D1 DE 69824133D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- printed circuit
- circuit boards
- multilayer printed
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US972213 | 1997-11-17 | ||
US08/972,213 US6120639A (en) | 1997-11-17 | 1997-11-17 | Method for the manufacture of printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69824133D1 true DE69824133D1 (de) | 2004-07-01 |
DE69824133T2 DE69824133T2 (de) | 2004-09-16 |
Family
ID=25519351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69824133T Expired - Lifetime DE69824133T2 (de) | 1997-11-17 | 1998-11-10 | Verfahren zur Herstellung von mehrschichtigen Leiterplatten |
Country Status (5)
Country | Link |
---|---|
US (1) | US6120639A (de) |
EP (1) | EP0926263B1 (de) |
JP (1) | JP3605520B2 (de) |
DE (1) | DE69824133T2 (de) |
ES (1) | ES2221701T3 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6506314B1 (en) * | 2000-07-27 | 2003-01-14 | Atotech Deutschland Gmbh | Adhesion of polymeric materials to metal surfaces |
US6787462B2 (en) * | 2001-03-28 | 2004-09-07 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor device having buried metal wiring |
US6459047B1 (en) * | 2001-09-05 | 2002-10-01 | International Business Machines Corporation | Laminate circuit structure and method of fabricating |
US6746547B2 (en) | 2002-03-05 | 2004-06-08 | Rd Chemical Company | Methods and compositions for oxide production on copper |
US6806182B2 (en) | 2002-05-01 | 2004-10-19 | International Business Machines Corporation | Method for eliminating via resistance shift in organic ILD |
JP3566269B2 (ja) * | 2002-06-07 | 2004-09-15 | 富士通株式会社 | リードフレーム及びその製造方法、及び半導体装置。 |
US8349393B2 (en) | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
JP4033237B2 (ja) * | 2005-03-11 | 2008-01-16 | 日立化成工業株式会社 | 銅の表面処理方法及び銅 |
US7704562B2 (en) * | 2006-08-14 | 2010-04-27 | Cordani Jr John L | Process for improving the adhesion of polymeric materials to metal surfaces |
US7682431B1 (en) * | 2008-11-12 | 2010-03-23 | Lam Research Corporation | Plating solutions for electroless deposition of ruthenium |
US20140072706A1 (en) * | 2012-09-11 | 2014-03-13 | Ernest Long | Direct Electroless Palladium Plating on Copper |
KR102427122B1 (ko) * | 2014-08-15 | 2022-07-28 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 구리 및 구리 합금 회로의 광학 반사율을 감소시키는 방법 및 터치 스크린 디바이스 |
JP6474860B2 (ja) * | 2017-06-28 | 2019-02-27 | 小島化学薬品株式会社 | 無電解ニッケルストライクめっき液及びニッケルめっき皮膜の成膜方法 |
WO2020046429A1 (en) * | 2018-08-28 | 2020-03-05 | Ploof Lloyd | Process for producing nanostructured metal substrates for use in surface enhanced raman spectroscopy or similar applications |
US10829846B2 (en) | 2018-08-28 | 2020-11-10 | Lloyd Ploof | Process for producing nanostructured metal substrates for use in Surface Enhanced Raman Spectroscopy or similar applications |
JPWO2021193470A1 (de) * | 2020-03-24 | 2021-09-30 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4409037A (en) * | 1982-04-05 | 1983-10-11 | Macdermid Incorporated | Adhesion promoter for printed circuits |
US4844981A (en) * | 1982-04-05 | 1989-07-04 | Macdermid, Incorporated | Adhesion promoter for printed circuits |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
US4786528A (en) * | 1986-05-20 | 1988-11-22 | International Business Machines Corporation | Process for treating reinforced polymer composite |
US4775444A (en) * | 1987-08-26 | 1988-10-04 | Macdermid, Incorporated | Process for fabricating multilayer circuit boards |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
DE3800682A1 (de) * | 1988-01-13 | 1989-07-27 | Bayer Ag | Verfahren zur herstellung von elektrischen leiterplatten |
JPH01246393A (ja) * | 1988-03-25 | 1989-10-02 | Fukuda Metal Foil & Powder Co Ltd | 内層用銅箔または銅張積層板の表面処理方法 |
FI95816C (fi) * | 1989-05-04 | 1996-03-25 | Ad Tech Holdings Ltd | Antimikrobinen esine ja menetelmä sen valmistamiseksi |
US4997516A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Method for improving adherence of copper foil to resinous substrates |
US4997722A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Composition and method for improving adherence of copper foil to resinous substrates |
JPH069309B2 (ja) * | 1989-09-22 | 1994-02-02 | 株式会社日立製作所 | プリント回路板、その製造方法および製造装置 |
US5289630A (en) * | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
US5827604A (en) * | 1994-12-01 | 1998-10-27 | Ibiden Co., Ltd. | Multilayer printed circuit board and method of producing the same |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
US5843517A (en) * | 1997-04-30 | 1998-12-01 | Macdermid, Incorporated | Composition and method for selective plating |
-
1997
- 1997-11-17 US US08/972,213 patent/US6120639A/en not_active Expired - Lifetime
-
1998
- 1998-11-10 ES ES98309198T patent/ES2221701T3/es not_active Expired - Lifetime
- 1998-11-10 DE DE69824133T patent/DE69824133T2/de not_active Expired - Lifetime
- 1998-11-10 EP EP98309198A patent/EP0926263B1/de not_active Expired - Lifetime
- 1998-11-17 JP JP32631798A patent/JP3605520B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH11220255A (ja) | 1999-08-10 |
DE69824133T2 (de) | 2004-09-16 |
JP3605520B2 (ja) | 2004-12-22 |
EP0926263A2 (de) | 1999-06-30 |
US6120639A (en) | 2000-09-19 |
EP0926263B1 (de) | 2004-05-26 |
ES2221701T3 (es) | 2005-01-01 |
EP0926263A3 (de) | 2002-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |