DE69835988D1 - Doppelseitenreinigungsmaschine für ein Substrat - Google Patents

Doppelseitenreinigungsmaschine für ein Substrat

Info

Publication number
DE69835988D1
DE69835988D1 DE69835988T DE69835988T DE69835988D1 DE 69835988 D1 DE69835988 D1 DE 69835988D1 DE 69835988 T DE69835988 T DE 69835988T DE 69835988 T DE69835988 T DE 69835988T DE 69835988 D1 DE69835988 D1 DE 69835988D1
Authority
DE
Germany
Prior art keywords
substrate
cleaning machine
double side
side cleaning
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69835988T
Other languages
English (en)
Other versions
DE69835988T2 (de
Inventor
Satoshi Nakashima
Takanori Miyazaki
Hiroki Taniyama
Toshikazu Arihisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23653197A external-priority patent/JP3377414B2/ja
Priority claimed from JP08491998A external-priority patent/JP3401428B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69835988D1 publication Critical patent/DE69835988D1/de
Application granted granted Critical
Publication of DE69835988T2 publication Critical patent/DE69835988T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE69835988T 1997-08-18 1998-08-17 Doppelseitenreinigungsmaschine für ein Substrat Expired - Lifetime DE69835988T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP23653197A JP3377414B2 (ja) 1997-08-18 1997-08-18 処理装置
JP23653197 1997-08-18
JP8491998 1998-03-16
JP08491998A JP3401428B2 (ja) 1998-03-16 1998-03-16 処理装置

Publications (2)

Publication Number Publication Date
DE69835988D1 true DE69835988D1 (de) 2006-11-09
DE69835988T2 DE69835988T2 (de) 2007-06-21

Family

ID=26425881

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69835988T Expired - Lifetime DE69835988T2 (de) 1997-08-18 1998-08-17 Doppelseitenreinigungsmaschine für ein Substrat

Country Status (4)

Country Link
US (2) US6115867A (de)
EP (1) EP0898301B1 (de)
KR (2) KR100530700B1 (de)
DE (1) DE69835988T2 (de)

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JP5091687B2 (ja) * 2008-01-08 2012-12-05 株式会社Ｓｏｋｕｄｏ 基板処理装置
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US10250097B2 (en) * 2015-04-17 2019-04-02 Harmonic Drive Systems Inc. Static pressure seal-equipped motor
US11094548B2 (en) * 2016-06-27 2021-08-17 Ebara Corporation Apparatus for cleaning substrate and substrate cleaning method
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
JP7056969B2 (ja) * 2017-03-30 2022-04-19 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板洗浄装置
JP7041011B2 (ja) 2018-06-22 2022-03-23 株式会社スギノマシン 乾燥機
KR102085941B1 (ko) * 2018-08-14 2020-03-06 (주)아이케이텍 반도체 웨이퍼용 에칭 장치
KR102245294B1 (ko) 2019-06-21 2021-04-28 세메스 주식회사 기판 지지 유닛 및 이를 갖는 기판 처리 장치
CN111958493B (zh) * 2020-07-28 2022-06-21 天津市通洁高压泵制造有限公司 一种高稳定性水射流清洗盘
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Also Published As

Publication number Publication date
US6115867A (en) 2000-09-12
KR20050054493A (ko) 2005-06-10
KR100530700B1 (ko) 2006-04-06
KR100513438B1 (ko) 2005-09-07
DE69835988T2 (de) 2007-06-21
EP0898301B1 (de) 2006-09-27
KR19990023678A (ko) 1999-03-25
EP0898301A2 (de) 1999-02-24
US6276378B1 (en) 2001-08-21
EP0898301A3 (de) 2000-11-22

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