DE69839937D1 - Plasmabehandlungsvorrichtung mit kombinierter anoden/ionen quelle - Google Patents

Plasmabehandlungsvorrichtung mit kombinierter anoden/ionen quelle

Info

Publication number
DE69839937D1
DE69839937D1 DE69839937T DE69839937T DE69839937D1 DE 69839937 D1 DE69839937 D1 DE 69839937D1 DE 69839937 T DE69839937 T DE 69839937T DE 69839937 T DE69839937 T DE 69839937T DE 69839937 D1 DE69839937 D1 DE 69839937D1
Authority
DE
Germany
Prior art keywords
electrode member
process chamber
central aperture
active surface
ion source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69839937T
Other languages
English (en)
Inventor
Barry W Manley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Applied Sciences Inc
Original Assignee
Sierra Applied Sciences Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sierra Applied Sciences Inc filed Critical Sierra Applied Sciences Inc
Application granted granted Critical
Publication of DE69839937D1 publication Critical patent/DE69839937D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0047—Activation or excitation of reactive gases outside the coating chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
DE69839937T 1997-04-23 1998-03-27 Plasmabehandlungsvorrichtung mit kombinierter anoden/ionen quelle Expired - Fee Related DE69839937D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/842,480 US5855745A (en) 1997-04-23 1997-04-23 Plasma processing system utilizing combined anode/ ion source
PCT/US1998/006084 WO1998048073A1 (en) 1997-04-23 1998-03-27 Plasma processing system utilizing combined anode/ion source

Publications (1)

Publication Number Publication Date
DE69839937D1 true DE69839937D1 (de) 2008-10-09

Family

ID=25287417

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69839937T Expired - Fee Related DE69839937D1 (de) 1997-04-23 1998-03-27 Plasmabehandlungsvorrichtung mit kombinierter anoden/ionen quelle

Country Status (7)

Country Link
US (1) US5855745A (de)
EP (1) EP0977904B1 (de)
JP (1) JP2001522509A (de)
AT (1) ATE406467T1 (de)
AU (1) AU6589398A (de)
DE (1) DE69839937D1 (de)
WO (1) WO1998048073A1 (de)

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DE60005137T2 (de) * 1999-11-18 2004-07-22 Tokyo Electron Ltd. Magnetische anordnung zur effizienten verwendung eines targets beim zerstäuben eines kegelstumpfförmigen targets
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US7659209B2 (en) * 2001-11-14 2010-02-09 Canon Anelva Corporation Barrier metal film production method
US6707051B2 (en) * 2002-07-10 2004-03-16 Wintek Corporation RF loaded line type capacitive plasma source for broad range of operating gas pressure
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US7514935B2 (en) * 2006-09-13 2009-04-07 Advanced Energy Industries, Inc. System and method for managing power supplied to a plasma chamber
US7850828B2 (en) * 2006-09-15 2010-12-14 Cardinal Cg Company Enhanced virtual anode
US7920369B2 (en) * 2006-10-18 2011-04-05 Metascape, LLC. Apparatus and method for nano plasma deposition
EP2092544A2 (de) * 2006-10-19 2009-08-26 Applied Process Technologies, Inc. Ionenquelle mit geschlossener streuung
JP5172135B2 (ja) * 2006-11-10 2013-03-27 オリジン電気株式会社 真空装置
US8133359B2 (en) 2007-11-16 2012-03-13 Advanced Energy Industries, Inc. Methods and apparatus for sputtering deposition using direct current
US9039871B2 (en) 2007-11-16 2015-05-26 Advanced Energy Industries, Inc. Methods and apparatus for applying periodic voltage using direct current
US8044594B2 (en) * 2008-07-31 2011-10-25 Advanced Energy Industries, Inc. Power supply ignition system and method
US8395078B2 (en) * 2008-12-05 2013-03-12 Advanced Energy Industries, Inc Arc recovery with over-voltage protection for plasma-chamber power supplies
EP2219205B1 (de) 2009-02-17 2014-06-04 Solvix GmbH Energieversorgungsvorrichtung zur Plasmaverarbeitung
JP5363177B2 (ja) * 2009-04-16 2013-12-11 オリジン電気株式会社 真空負荷用電源
JP4932942B2 (ja) * 2009-08-07 2012-05-16 株式会社京三製作所 パルス変調高周波電力制御方法およびパルス変調高周波電源装置
US9502222B2 (en) * 2010-04-16 2016-11-22 Viavi Solutions Inc. Integrated anode and activated reactive gas source for use in magnetron sputtering device
DE102010031568B4 (de) * 2010-07-20 2014-12-11 TRUMPF Hüttinger GmbH + Co. KG Arclöschanordnung und Verfahren zum Löschen von Arcs
US8552665B2 (en) 2010-08-20 2013-10-08 Advanced Energy Industries, Inc. Proactive arc management of a plasma load
DK2509100T3 (da) * 2011-04-06 2019-11-04 Viavi Solutions Inc Integreret anode og aktiveret reaktiv gaskilde til anvendelse i en magnetron-sputtering-enhed
JP6244103B2 (ja) * 2012-05-04 2017-12-06 ヴァイアヴィ・ソリューションズ・インコーポレイテッドＶｉａｖｉ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 反応性スパッタ堆積のための方法および反応性スパッタ堆積システム
RU2555692C2 (ru) * 2013-06-17 2015-07-10 Владислав Викторович Сагалович Способ ионно-плазменного прецизионного азотирования поверхностей металлических изделий
RU2528537C1 (ru) * 2013-07-18 2014-09-20 Открытое акционерное общество "Ижевский завод нефтяного машиностроения" (ОАО "Ижнефтемаш") Способ ионно-плазменного азотирования длинномерной стальной детали
US9812296B2 (en) 2015-02-03 2017-11-07 Cardinal Cg Company Sputtering apparatus including gas distribution system
EP3285278A1 (de) * 2016-08-16 2018-02-21 FEI Company Mit einem plasmareiniger verwendeter magnet
US10490396B1 (en) 2017-03-28 2019-11-26 Thermo Finnigan Llc Ion source with mixed magnets
RU2752334C1 (ru) * 2020-05-08 2021-07-26 Федеральное государственное бюджетное учреждение науки Институт физического материаловедения Сибирского отделения Российской академии наук Газоразрядное распылительное устройство на основе планарного магнетрона с ионным источником
RU2754915C1 (ru) * 2020-10-27 2021-09-08 федеральное государственное автономное образовательное учреждение высшего образования "Пермский национальный исследовательский политехнический университет" Способ плазменной обработки металлических изделий

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Also Published As

Publication number Publication date
AU6589398A (en) 1998-11-13
US5855745A (en) 1999-01-05
EP0977904A1 (de) 2000-02-09
EP0977904A4 (de) 2005-12-21
ATE406467T1 (de) 2008-09-15
JP2001522509A (ja) 2001-11-13
EP0977904B1 (de) 2008-08-27
WO1998048073A1 (en) 1998-10-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee