DE69841150D1 - Wärmeabstrahlende Kühlrippen - Google Patents

Wärmeabstrahlende Kühlrippen

Info

Publication number
DE69841150D1
DE69841150D1 DE69841150T DE69841150T DE69841150D1 DE 69841150 D1 DE69841150 D1 DE 69841150D1 DE 69841150 T DE69841150 T DE 69841150T DE 69841150 T DE69841150 T DE 69841150T DE 69841150 D1 DE69841150 D1 DE 69841150D1
Authority
DE
Germany
Prior art keywords
heat radiating
radiating fins
fins
heat
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69841150T
Other languages
English (en)
Inventor
Eiji Kogure
Tadashi Fukushima
Hiroaki Tsukahara
Toshihisa Imai
Takao Oshima
Kunihiko Kaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Home Appliance Co Ltd
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Home Appliance Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Home Appliance Co Ltd, Mitsubishi Electric Corp filed Critical Mitsubishi Electric Home Appliance Co Ltd
Application granted granted Critical
Publication of DE69841150D1 publication Critical patent/DE69841150D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE69841150T 1997-07-14 1998-07-02 Wärmeabstrahlende Kühlrippen Expired - Lifetime DE69841150D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18799797A JP3352362B2 (ja) 1997-07-14 1997-07-14 放熱板

Publications (1)

Publication Number Publication Date
DE69841150D1 true DE69841150D1 (de) 2009-10-29

Family

ID=16215837

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69841150T Expired - Lifetime DE69841150D1 (de) 1997-07-14 1998-07-02 Wärmeabstrahlende Kühlrippen

Country Status (7)

Country Link
US (1) US6015008A (de)
EP (1) EP0892431B1 (de)
JP (1) JP3352362B2 (de)
KR (1) KR100377652B1 (de)
CN (1) CN1127762C (de)
DE (1) DE69841150D1 (de)
TW (1) TW390005B (de)

Families Citing this family (56)

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US7393864B2 (en) 1999-02-26 2008-07-01 University Of Iowa Research Foundation Use of ClC3 chloride channel blockers to modulate vascular tone
US7220782B1 (en) 1999-02-26 2007-05-22 University Of Iowa Research Foundation Methods to reduce the sensitivity of endothelially-compromised vascular smooth muscle
DE19934554A1 (de) * 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6349760B1 (en) 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
US6269864B1 (en) * 2000-02-18 2001-08-07 Intel Corporation Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
KR100688235B1 (ko) * 2000-05-31 2007-02-28 한라공조주식회사 열전 소자의 방열판 구조
KR20020019743A (ko) * 2000-09-06 2002-03-13 김봉기, 김선기 전자상거래를 위한 카드결제 장치
US6796370B1 (en) * 2000-11-03 2004-09-28 Cray Inc. Semiconductor circular and radial flow cooler
JP3686005B2 (ja) * 2001-03-30 2005-08-24 山洋電気株式会社 ヒートシンクを備えた冷却装置
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
KR100450326B1 (ko) * 2002-01-22 2004-09-30 성이제 방열면적을 크게한 씨피유냉각용 히트싱크구조
US6847525B1 (en) * 2002-05-24 2005-01-25 Unisys Corporation Forced convection heat sink system with fluid vector control
US6830097B2 (en) 2002-09-27 2004-12-14 Modine Manufacturing Company Combination tower and serpentine fin heat sink device
US20040200608A1 (en) * 2003-04-11 2004-10-14 Baldassarre Gregg J. Plate fins with vanes for redirecting airflow
US6937473B2 (en) * 2003-06-30 2005-08-30 Intel Corporation Heatsink device and method
GB2406442A (en) * 2003-09-24 2005-03-30 Giga Byte Tech Co Ltd Heat sink
US7290598B2 (en) * 2004-02-26 2007-11-06 University Of Rochester Heat exchange device
US20060011324A1 (en) * 2004-07-13 2006-01-19 Rogers C J Wound, louvered fin heat sink device
US20060021736A1 (en) * 2004-07-29 2006-02-02 International Rectifier Corporation Pin type heat sink for channeling air flow
TWI274538B (en) * 2004-11-12 2007-02-21 Asustek Comp Inc Heat sink structure
US7269011B2 (en) * 2005-08-04 2007-09-11 Delphi Technologies, Inc. Impingement cooled heat sink with uniformly spaced curved channels
US7278468B2 (en) * 2005-10-04 2007-10-09 Delphi Technologies, Inc. Heat sink with multiple coolant inlets
CN100453823C (zh) * 2006-03-06 2009-01-21 张炜 微型集热泵
US7896611B2 (en) * 2007-01-03 2011-03-01 International Business Machines Corporation Heat transfer device in a rotating structure
US7760506B1 (en) * 2007-06-06 2010-07-20 Hewlett-Packard Development Company, L.P. Electronic components, systems and apparatus with air flow devices
US8033325B2 (en) * 2007-07-24 2011-10-11 Asia Vital Components Co., Ltd. Heat dissipation apparatus with coarse surface capable of intensifying heat transfer
US20090321046A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Flow diverters to enhance heat sink performance
US8248809B2 (en) * 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
KR101000020B1 (ko) 2008-10-31 2010-12-10 한국과학기술원 히트싱크
US20100108292A1 (en) * 2008-10-31 2010-05-06 Teledyne Scientific & Imaging, Llc Heat sink system with fin structure
US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
US8068338B1 (en) 2009-03-24 2011-11-29 Qlogic, Corporation Network device with baffle for redirecting cooling air and associated methods
KR100938290B1 (ko) * 2009-07-31 2010-01-22 (주) 이노밴 조명기구용 방열판
US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
TWI400420B (zh) * 2010-01-20 2013-07-01 Asia Vital Components Co Ltd Spiral heat exchanger
US10103089B2 (en) 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
US10041745B2 (en) 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
US8295046B2 (en) * 2010-07-19 2012-10-23 Hamilton Sundstrand Corporation Non-circular radial heat sink
US20220120517A1 (en) * 2011-05-12 2022-04-21 Fractal Heatsink Technologies LLC Fractal heat transfer device
AT515828B1 (de) * 2014-05-23 2022-02-15 Fronius Int Gmbh Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung
US10506735B2 (en) 2014-08-25 2019-12-10 Hamilton Sundstrand Corporation Heat exchange device in directed flow system
JP6176263B2 (ja) 2015-01-19 2017-08-09 トヨタ自動車株式会社 自動運転装置
JP6781553B2 (ja) * 2015-03-25 2020-11-04 エルジー イノテック カンパニー リミテッド ホルダーおよびこれを具備する照明装置
US10486232B2 (en) 2015-04-21 2019-11-26 Varian Semiconductor Equipment Associates, Inc. Semiconductor manufacturing device with embedded fluid conduits
CN106594692A (zh) * 2015-10-20 2017-04-26 王信懿 散热装置
WO2018013668A1 (en) 2016-07-12 2018-01-18 Alexander Poltorak System and method for maintaining efficiency of a heat sink
US11031312B2 (en) 2017-07-17 2021-06-08 Fractal Heatsink Technologies, LLC Multi-fractal heatsink system and method
CN109548381B (zh) * 2018-12-21 2020-07-10 华中科技大学 一种放射状肋片表面有凸起的散热器
CN109671690B (zh) * 2018-12-28 2020-12-04 国网江苏省电力有限公司无锡供电分公司 一种电子元器件散热用多头螺旋流道液体冷却器
DE102019127203A1 (de) * 2019-10-09 2021-04-15 Danfoss Silicon Power Gmbh Kühlsystem mit einem serpentinenförmigen Durchgang
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
US11686536B2 (en) * 2021-02-09 2023-06-27 Raytheon Technologies Corporation Three-dimensional diffuser-fin heat sink with integrated blower

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3163207A (en) * 1961-07-26 1964-12-29 Robert T Schultz Heat dissipating mount for electric components
DE2508727A1 (de) * 1975-02-28 1976-09-09 John Edward Randell Waermetauscher
US4838041A (en) * 1987-02-05 1989-06-13 Gte Laboratories Incorporated Expansion/evaporation cooling system for microelectronic devices
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
JP2720072B2 (ja) * 1988-09-09 1998-02-25 株式会社日立製作所 電子機器の冷却装置
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
JPH0629148A (ja) * 1992-07-09 1994-02-04 Murata Mfg Co Ltd コンデンサ素子の製造方法
JP2765801B2 (ja) * 1993-08-20 1998-06-18 山洋電気株式会社 電子部品冷却装置
JPH07234035A (ja) * 1994-02-23 1995-09-05 Aisin Seiki Co Ltd 放熱器
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
JPH08195453A (ja) * 1995-01-12 1996-07-30 Rokuro Shimada 放熱板
JPH08195456A (ja) * 1995-01-17 1996-07-30 Toto Ltd 電子機器冷却装置
JP3458527B2 (ja) * 1995-05-26 2003-10-20 松下電器産業株式会社 ヒートシンク装置
GB2303970A (en) * 1995-07-31 1997-03-05 Ming Der Chiou CPU heat dissipating apparatus
US5661638A (en) * 1995-11-03 1997-08-26 Silicon Graphics, Inc. High performance spiral heat sink

Also Published As

Publication number Publication date
EP0892431A3 (de) 2000-08-02
JPH1131769A (ja) 1999-02-02
EP0892431A2 (de) 1999-01-20
KR100377652B1 (ko) 2005-01-31
CN1205549A (zh) 1999-01-20
US6015008A (en) 2000-01-18
EP0892431B1 (de) 2009-09-16
KR19990013502A (ko) 1999-02-25
CN1127762C (zh) 2003-11-12
TW390005B (en) 2000-05-11
JP3352362B2 (ja) 2002-12-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition