DE69900629T2 - Temperaturgeregelte Mikrochip-Laservorrichtung und dazugehörige Trägerbaugruppe - Google Patents

Temperaturgeregelte Mikrochip-Laservorrichtung und dazugehörige Trägerbaugruppe

Info

Publication number
DE69900629T2
DE69900629T2 DE69900629T DE69900629T DE69900629T2 DE 69900629 T2 DE69900629 T2 DE 69900629T2 DE 69900629 T DE69900629 T DE 69900629T DE 69900629 T DE69900629 T DE 69900629T DE 69900629 T2 DE69900629 T2 DE 69900629T2
Authority
DE
Germany
Prior art keywords
microchip laser
temperature
laser device
temperature controlled
carrier assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69900629T
Other languages
English (en)
Other versions
DE69900629D1 (de
Inventor
Brian L Peterson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Guidance and Electronics Co Inc
Original Assignee
Litton Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litton Systems Inc filed Critical Litton Systems Inc
Publication of DE69900629D1 publication Critical patent/DE69900629D1/de
Application granted granted Critical
Publication of DE69900629T2 publication Critical patent/DE69900629T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/0627—Construction or shape of active medium the resonator being monolithic, e.g. microlaser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/0602—Crystal lasers or glass lasers
    • H01S3/0604—Crystal lasers or glass lasers in the form of a plate or disc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
DE69900629T 1998-10-30 1999-10-29 Temperaturgeregelte Mikrochip-Laservorrichtung und dazugehörige Trägerbaugruppe Expired - Fee Related DE69900629T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/183,227 US6055815A (en) 1998-10-30 1998-10-30 Temperature-controlled microchip laser assembly and associated submount assembly

Publications (2)

Publication Number Publication Date
DE69900629D1 DE69900629D1 (de) 2002-01-31
DE69900629T2 true DE69900629T2 (de) 2002-06-13

Family

ID=22671983

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69900629T Expired - Fee Related DE69900629T2 (de) 1998-10-30 1999-10-29 Temperaturgeregelte Mikrochip-Laservorrichtung und dazugehörige Trägerbaugruppe

Country Status (8)

Country Link
US (1) US6055815A (de)
EP (1) EP0997991B1 (de)
JP (1) JP2000156538A (de)
AT (1) ATE211314T1 (de)
AU (1) AU758016B2 (de)
CA (1) CA2287945A1 (de)
DE (1) DE69900629T2 (de)
IL (1) IL132626A (de)

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US6549550B2 (en) 2001-02-14 2003-04-15 Triquint Technology Holding Co. Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
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US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
US20070126312A1 (en) * 2002-03-08 2007-06-07 Chien-Min Sung DLC field emission with nano-diamond impregnated metals
US6806629B2 (en) 2002-03-08 2004-10-19 Chien-Min Sung Amorphous diamond materials and associated methods for the use and manufacture thereof
US6949873B2 (en) * 2002-03-08 2005-09-27 Chien-Min Sung Amorphous diamond materials and associated methods for the use and manufacture thereof
US7358658B2 (en) * 2002-03-08 2008-04-15 Chien-Min Sung Amorphous diamond materials and associated methods for the use and manufacture thereof
US7235912B2 (en) * 2002-03-08 2007-06-26 Chien-Min Sung Diamond-like carbon thermoelectric conversion devices and methods for the use and manufacture thereof
US7085125B2 (en) * 2002-03-21 2006-08-01 Chien-Min Sung Carbon nanotube devices and uses therefor
US6621841B1 (en) * 2002-04-23 2003-09-16 The United States Of America As Represented By The Secretary Of The Air Force Phonon-pumped semiconductor lasers
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US7308008B2 (en) * 2002-11-08 2007-12-11 Finisar Corporation Magnetically controlled heat sink
US6981380B2 (en) * 2002-12-20 2006-01-03 Intel Corporation Thermoelectric cooling for microelectronic packages and dice
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US7290395B2 (en) * 2005-10-06 2007-11-06 Gentcorp Ltd High power thermoelectric controller
US7808636B2 (en) * 2007-01-11 2010-10-05 Rensselaer Polytechnic Institute Systems, methods, and devices for handling terahertz radiation
US20080168775A1 (en) * 2007-01-11 2008-07-17 Nextreme Thermal Solutions, Inc. Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and Systems
US8267984B2 (en) * 2007-08-03 2012-09-18 Scion Neurostim, Llc. Neurophysiological activation by vestibular or cranial nerve stimulation
US20080264464A1 (en) * 2007-01-11 2008-10-30 Nextreme Thermal Solutions, Inc. Temperature Control Including Integrated Thermoelectric Sensing and Heat Pumping Devices and Related Methods and Systems
US8696724B2 (en) * 2007-01-11 2014-04-15 Scion Neurostim, Llc. Devices for vestibular or cranial nerve stimulation
US8267983B2 (en) 2007-01-11 2012-09-18 Scion Neurostim, Llc. Medical devices incorporating thermoelectric transducer and controller
KR100953441B1 (ko) 2009-06-25 2010-04-20 충북대학교 산학협력단 온도 제어 장치 및 그 구동 방법
WO2012083126A1 (en) 2010-12-16 2012-06-21 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
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JP5388913B2 (ja) * 2010-03-15 2014-01-15 三菱電機株式会社 画像表示装置
US9744074B2 (en) 2010-12-16 2017-08-29 Scion Neurostim, Llc Combination treatments
US10537467B2 (en) 2010-12-16 2020-01-21 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
US10512564B2 (en) 2010-12-16 2019-12-24 Scion Neurostim, Llc Combination treatments
US9001862B2 (en) * 2012-03-09 2015-04-07 Raytheon Company Miniaturized solid-state lasing device, system and method
US10502463B2 (en) 2014-11-26 2019-12-10 Hoffman Enclosures, Inc. Thermoelectric cooler controller and angled mounting thereof
US10072881B2 (en) 2014-11-26 2018-09-11 Hoffman Enclosures, Inc. Reduced footprint thermoelectric cooler controller
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Also Published As

Publication number Publication date
AU5714099A (en) 2000-05-04
DE69900629D1 (de) 2002-01-31
JP2000156538A (ja) 2000-06-06
IL132626A (en) 2002-11-10
AU758016B2 (en) 2003-03-13
CA2287945A1 (en) 2000-04-30
IL132626A0 (en) 2001-03-19
EP0997991B1 (de) 2001-12-19
US6055815A (en) 2000-05-02
EP0997991A2 (de) 2000-05-03
ATE211314T1 (de) 2002-01-15
EP0997991A3 (de) 2000-11-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee