DE69903978D1 - Wärmeempfindliches übertragungselement für die herstellung von mehrlagenanordnungen - Google Patents

Wärmeempfindliches übertragungselement für die herstellung von mehrlagenanordnungen

Info

Publication number
DE69903978D1
DE69903978D1 DE69903978T DE69903978T DE69903978D1 DE 69903978 D1 DE69903978 D1 DE 69903978D1 DE 69903978 T DE69903978 T DE 69903978T DE 69903978 T DE69903978 T DE 69903978T DE 69903978 D1 DE69903978 D1 DE 69903978D1
Authority
DE
Germany
Prior art keywords
manufacture
heat
transmission element
layer arrangements
sensitive transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69903978T
Other languages
English (en)
Other versions
DE69903978T2 (de
Inventor
B Wolk
F Baude
M Florczak
B Mccormick
Yong Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE69903978D1 publication Critical patent/DE69903978D1/de
Application granted granted Critical
Publication of DE69903978T2 publication Critical patent/DE69903978T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/265Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used for the production of optical filters or electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • B41M5/38207Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • B41M5/38207Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • B41M5/38214Structural details, e.g. multilayer systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • B41M5/392Additives, other than colour forming substances, dyes or pigments, e.g. sensitisers, transfer promoting agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • B41M5/392Additives, other than colour forming substances, dyes or pigments, e.g. sensitisers, transfer promoting agents
    • B41M5/395Macromolecular additives, e.g. binders
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1221Basic optical elements, e.g. light-guiding paths made from organic materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • G02B6/138Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/18Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/40Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
    • B41M5/42Intermediate, backcoat, or covering layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/165Thermal imaging composition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
DE69903978T 1999-01-15 1999-05-24 Wärmeempfindliches übertragungselement für die herstellung von mehrlagenanordnungen Expired - Fee Related DE69903978T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/231,723 US6114088A (en) 1999-01-15 1999-01-15 Thermal transfer element for forming multilayer devices
PCT/US1999/011425 WO2000041892A1 (en) 1999-01-15 1999-05-24 Thermal transfer element for forming multilayer devices

Publications (2)

Publication Number Publication Date
DE69903978D1 true DE69903978D1 (de) 2002-12-19
DE69903978T2 DE69903978T2 (de) 2003-07-17

Family

ID=22870411

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69903978T Expired - Fee Related DE69903978T2 (de) 1999-01-15 1999-05-24 Wärmeempfindliches übertragungselement für die herstellung von mehrlagenanordnungen

Country Status (10)

Country Link
US (8) US6114088A (de)
EP (3) EP1144198B1 (de)
JP (2) JP2002534782A (de)
KR (1) KR100654649B1 (de)
CN (1) CN1196602C (de)
AU (2) AU4199799A (de)
DE (1) DE69903978T2 (de)
HK (1) HK1042454A1 (de)
MY (2) MY128213A (de)
WO (1) WO2000041892A1 (de)

Families Citing this family (446)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7534543B2 (en) * 1996-04-15 2009-05-19 3M Innovative Properties Company Texture control of thin film layers prepared via laser induced thermal imaging
US6194167B1 (en) * 1997-02-18 2001-02-27 Washington State University Research Foundation ω-3 fatty acid desaturase
US7625420B1 (en) * 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
DE19826658A1 (de) * 1998-06-16 1999-12-30 Siemens Ag Schaltungsträger mit integrierten, aktiven, optischen Funktionen
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US6566153B1 (en) * 1998-10-14 2003-05-20 The Regents Of The University Of California Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
WO2000041893A1 (en) 1999-01-15 2000-07-20 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
TW465119B (en) * 1999-07-23 2001-11-21 Semiconductor Energy Lab EL display device and a method of manufacturing the same
JP4472056B2 (ja) * 1999-07-23 2010-06-02 株式会社半導体エネルギー研究所 エレクトロルミネッセンス表示装置及びその作製方法
US6214151B1 (en) * 1999-11-05 2001-04-10 International Business Machines Corporation Thermal dye transfer process for preparing opto-electronic devices
US6284425B1 (en) * 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
JP3456461B2 (ja) * 2000-02-21 2003-10-14 Tdk株式会社 パターニング方法、薄膜デバイスの製造方法及び薄膜磁気ヘッドの製造方法
US6936485B2 (en) * 2000-03-27 2005-08-30 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light emitting device
JP2001341296A (ja) * 2000-03-31 2001-12-11 Seiko Epson Corp インクジェット法による薄膜形成方法、インクジェット装置、有機el素子の製造方法、有機el素子
KR100436303B1 (ko) * 2000-03-31 2004-06-19 세이코 엡슨 가부시키가이샤 유기 이엘소자 및 유기 이엘소자의 제조방법
US6692845B2 (en) * 2000-05-12 2004-02-17 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
DE10033112C2 (de) * 2000-07-07 2002-11-14 Siemens Ag Verfahren zur Herstellung und Strukturierung organischer Feldeffekt-Transistoren (OFET), hiernach gefertigter OFET und seine Verwendung
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6906458B2 (en) * 2000-08-11 2005-06-14 Seiko Epson Corporation Method for manufacturing organic EL device, organic EL device and electronic apparatus
EP1309994A2 (de) * 2000-08-18 2003-05-14 Siemens Aktiengesellschaft Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung
US20040029310A1 (en) * 2000-08-18 2004-02-12 Adoft Bernds Organic field-effect transistor (ofet), a production method therefor, an integrated circut constructed from the same and their uses
KR20030042454A (ko) * 2000-08-22 2003-05-28 제온 코포레이션 필름 적층 방법
KR100342653B1 (ko) * 2000-08-24 2002-07-03 김순택 유기 전계발광소자의 제조 방법
US7588795B2 (en) * 2000-08-24 2009-09-15 Samsung Mobile Display Co., Ltd. Manufacturing method of OLED display and apparatus for manufacturing the OLED display
DE10043204A1 (de) * 2000-09-01 2002-04-04 Siemens Ag Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung
US6699728B2 (en) * 2000-09-06 2004-03-02 Osram Opto Semiconductors Gmbh Patterning of electrodes in oled devices
DE10044842A1 (de) * 2000-09-11 2002-04-04 Siemens Ag Organischer Gleichrichter, Schaltung, RFID-Tag und Verwendung eines organischen Gleichrichters
DE10045192A1 (de) * 2000-09-13 2002-04-04 Siemens Ag Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers
US6358664B1 (en) 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6855384B1 (en) * 2000-09-15 2005-02-15 3M Innovative Properties Company Selective thermal transfer of light emitting polymer blends
EP1323195A1 (de) * 2000-09-22 2003-07-02 Siemens Aktiengesellschaft Elektrode und/oder leiterbahn für organische bauelemente und herstellungsverfahren dazu
JP2005032735A (ja) * 2000-09-25 2005-02-03 Dainippon Printing Co Ltd エレクトロルミネッセント素子
JP3906020B2 (ja) * 2000-09-27 2007-04-18 株式会社東芝 半導体装置及びその製造方法
US20020192576A1 (en) * 2000-10-12 2002-12-19 Hideki Matsuoka Method for forming color filter, method for forming light emitting element layer, method for manufacturing color display device comprising them, or color display device
DE10152655B4 (de) * 2000-10-17 2013-10-02 Samsung Display Co., Ltd. Verfahren zur Herstellung einer organischen Elektrolumineszenz-Vorrichtung
US7507453B2 (en) * 2000-10-31 2009-03-24 International Imaging Materials, Inc Digital decoration and marking of glass and ceramic substrates
US6990904B2 (en) 2000-10-31 2006-01-31 International Imaging Materials, Inc Thermal transfer assembly for ceramic imaging
US6796733B2 (en) 2000-10-31 2004-09-28 International Imaging Materials Inc. Thermal transfer ribbon with frosting ink layer
WO2002037568A1 (en) * 2000-11-02 2002-05-10 3M Innovative Properties Company Brightness and contrast enhancement of direct view emissive displays
JP2002158089A (ja) * 2000-11-21 2002-05-31 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示素子及びその製造方法
DE10061297C2 (de) * 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
DE10061299A1 (de) 2000-12-08 2002-06-27 Siemens Ag Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu
EP1341672B1 (de) * 2000-12-15 2007-07-25 E. I. du Pont de Nemours and Company Aufnahmeelement zur einstellung des brennpunktes eines bilderzeugungslasers
DE10063721A1 (de) * 2000-12-20 2002-07-11 Merck Patent Gmbh Organischer Halbleiter, Herstellungsverfahren dazu und Verwendungen
JP2002252082A (ja) * 2000-12-21 2002-09-06 Sony Corp 表示装置及び表示装置の製造方法
JP2002222694A (ja) * 2001-01-25 2002-08-09 Sharp Corp レーザー加工装置及びそれを用いた有機エレクトロルミネッセンス表示パネル
DE10105914C1 (de) 2001-02-09 2002-10-10 Siemens Ag Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung
WO2002080195A1 (en) * 2001-02-16 2002-10-10 E.I. Dupont De Nemours And Company High conductivity polyaniline compositions and uses therefor
US6852355B2 (en) 2001-03-01 2005-02-08 E. I. Du Pont De Nemours And Company Thermal imaging processes and products of electroactive organic material
US6767807B2 (en) 2001-03-02 2004-07-27 Fuji Photo Film Co., Ltd. Method for producing organic thin film device and transfer material used therein
JP2005509200A (ja) * 2001-03-26 2005-04-07 シーメンス アクチエンゲゼルシヤフト 少なくとも2つの有機電子構成エレメントを有する装置、および該装置のための製造方法
JP2003017264A (ja) * 2001-04-27 2003-01-17 Canon Inc 電界発光素子及び画像表示装置
US6485884B2 (en) 2001-04-27 2002-11-26 3M Innovative Properties Company Method for patterning oriented materials for organic electronic displays and devices
JP2002343565A (ja) 2001-05-18 2002-11-29 Sharp Corp 有機led表示パネルの製造方法、その方法により製造された有機led表示パネル、並びに、その方法に用いられるベースフィルム及び基板
JP2002343564A (ja) 2001-05-18 2002-11-29 Sharp Corp 転写用フィルムおよびそれを用いた有機エレクトロルミネッセンス素子の製造方法
JP3969698B2 (ja) 2001-05-21 2007-09-05 株式会社半導体エネルギー研究所 発光装置の作製方法
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
DE10126860C2 (de) * 2001-06-01 2003-05-28 Siemens Ag Organischer Feldeffekt-Transistor, Verfahren zu seiner Herstellung und Verwendung zum Aufbau integrierter Schaltungen
US20020197393A1 (en) * 2001-06-08 2002-12-26 Hideaki Kuwabara Process of manufacturing luminescent device
TW548860B (en) 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
US7211828B2 (en) 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6727970B2 (en) 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US20030011108A1 (en) * 2001-07-12 2003-01-16 Matthies Dennis L. Assembly display modules
US20030030371A1 (en) * 2001-08-13 2003-02-13 Industrial Technology Research Institute Organic light emitting backlight device for liquid crystal display
MXPA04001412A (es) * 2001-08-16 2004-07-15 3M Innovative Properties Co Metodo y materiales para moldear matriz amorfa, polimerizable con material electricamente activo dispuesto en la misma.
US6699597B2 (en) * 2001-08-16 2004-03-02 3M Innovative Properties Company Method and materials for patterning of an amorphous, non-polymeric, organic matrix with electrically active material disposed therein
JP4004254B2 (ja) * 2001-08-28 2007-11-07 シャープ株式会社 有機el素子の製造方法
JP2003077651A (ja) * 2001-08-30 2003-03-14 Sharp Corp 有機エレクトロルミネッセンス素子の製造方法
JP4345278B2 (ja) * 2001-09-14 2009-10-14 セイコーエプソン株式会社 パターニング方法、膜形成方法、パターニング装置、有機エレクトロルミネッセンス素子の製造方法、カラーフィルタの製造方法、電気光学装置の製造方法、及び電子装置の製造方法
SG111968A1 (en) * 2001-09-28 2005-06-29 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
JP2003115377A (ja) * 2001-10-03 2003-04-18 Nec Corp 発光素子、その製造方法およびこれを用いた表示装置
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7524528B2 (en) * 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
GB0124595D0 (en) * 2001-10-12 2001-12-05 Savair & Aro Ltd Pressure sensor
DE10151036A1 (de) * 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
DE10151440C1 (de) * 2001-10-18 2003-02-06 Siemens Ag Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung
KR20040077655A (ko) * 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
JP4009817B2 (ja) * 2001-10-24 2007-11-21 セイコーエプソン株式会社 発光装置および電子機器
KR100478521B1 (ko) * 2001-10-29 2005-03-28 삼성에스디아이 주식회사 유기 전계 발광 소자용 고분자 발광 혼합 조성물 및 그를이용한 유기 전계 발광 소자
US7553512B2 (en) * 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US6946676B2 (en) * 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
US6737177B2 (en) * 2001-11-08 2004-05-18 Xerox Corporation Red organic light emitting devices
US8153184B2 (en) * 2001-11-26 2012-04-10 Samsung Mobile Display Co., Ltd. Organic EL display device and method of manufacturing the same
KR100656490B1 (ko) * 2001-11-26 2006-12-12 삼성에스디아이 주식회사 풀칼라 유기전계 발광표시소자 및 그의 제조방법
US20030124265A1 (en) * 2001-12-04 2003-07-03 3M Innovative Properties Company Method and materials for transferring a material onto a plasma treated surface according to a pattern
DE10160732A1 (de) * 2001-12-11 2003-06-26 Siemens Ag Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu
US6695029B2 (en) 2001-12-12 2004-02-24 Eastman Kodak Company Apparatus for permitting transfer of organic material from a donor to form a layer in an OLED device
US6688365B2 (en) 2001-12-19 2004-02-10 Eastman Kodak Company Method for transferring of organic material from a donor to form a layer in an OLED device
JP2003187972A (ja) * 2001-12-20 2003-07-04 Dainippon Printing Co Ltd 有機el素子の製造方法および有機el転写体と被転写体
US6555284B1 (en) 2001-12-27 2003-04-29 Eastman Kodak Company In situ vacuum method for making OLED devices
US6603141B2 (en) * 2001-12-28 2003-08-05 Motorola, Inc. Organic semiconductor and method
US20030180447A1 (en) * 2002-01-18 2003-09-25 Meth Jeffery Scott Process for forming a multicolor display
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6582875B1 (en) 2002-01-23 2003-06-24 Eastman Kodak Company Using a multichannel linear laser light beam in making OLED devices by thermal transfer
US6541300B1 (en) * 2002-01-28 2003-04-01 Motorola, Inc. Semiconductor film and process for its preparation
US6610455B1 (en) 2002-01-30 2003-08-26 Eastman Kodak Company Making electroluminscent display devices
DE10203674A1 (de) * 2002-01-30 2003-08-14 Infineon Technologies Ag Halbleiterbaustein mit einer Isolationsschicht und Verfahren zur Herstellung eines Halbleiterbausteins mit Isolationsschicht
US6687274B2 (en) * 2002-02-04 2004-02-03 Eastman Kodak Company Organic vertical cavity phase-locked laser array device
US6674776B2 (en) 2002-02-04 2004-01-06 Eastman Kodak Company Organic vertical cavity lasing devices containing periodic gain regions
US6841320B2 (en) * 2002-02-06 2005-01-11 Optiva, Inc. Method of fabricating anisotropic crystal film on a receptor plate via transfer from the donor plate, the donor plate and the method of its fabrication
US7157142B2 (en) * 2002-02-06 2007-01-02 Fuji Photo Film Co., Ltd. Method for producing organic, thin-film device and transfer material used therein
US6649436B2 (en) * 2002-02-11 2003-11-18 Eastman Kodak Company Using organic materials in making an organic light-emitting device
EP1483320A2 (de) 2002-03-01 2004-12-08 E.I. Du Pont De Nemours And Company Drucken von leitfähigen organischen polymeren, die zusatzmittel enthalten
JP4098536B2 (ja) * 2002-03-07 2008-06-11 大日本印刷株式会社 パターン転写層を設けた有機el転写体、有機el被転写体および有機el素子の製造方法
US6703179B2 (en) 2002-03-13 2004-03-09 Eastman Kodak Company Transfer of organic material from a donor to form a layer in an OLED device
US7204425B2 (en) * 2002-03-18 2007-04-17 Precision Dynamics Corporation Enhanced identification appliance
AU2003217480A1 (en) * 2002-03-20 2003-09-29 Fuji Photo Film Co., Ltd. Organic thin-film device and its production method
DE10212640B4 (de) * 2002-03-21 2004-02-05 Siemens Ag Logische Bauteile aus organischen Feldeffekttransistoren
DE10212639A1 (de) * 2002-03-21 2003-10-16 Siemens Ag Vorrichtung und Verfahren zur Laserstrukturierung von Funktionspolymeren und Verwendungen
DE10310341A1 (de) * 2002-03-29 2003-10-23 Ritek Corp Mehrschicht-Spiegel für eine Leuchtvorrichtung und Herstellungsverfahren hierfür
EP1354638A3 (de) * 2002-04-15 2004-11-03 Fuji Photo Film Co., Ltd. Verfahren und Vorrichtung zur Herstellung von Musterteilen aus beschichteten Bahnen
AU2003221969A1 (en) * 2002-04-19 2003-11-03 3M Innovative Properties Company Materials for organic electronic devices
US7241512B2 (en) * 2002-04-19 2007-07-10 3M Innovative Properties Company Electroluminescent materials and methods of manufacture and use
JP3787839B2 (ja) * 2002-04-22 2006-06-21 セイコーエプソン株式会社 デバイスの製造方法、デバイス及び電子機器
US6879306B2 (en) 2002-05-02 2005-04-12 Eastman Kodak Company Scanned display systems using color laser light sources
US6566032B1 (en) 2002-05-08 2003-05-20 Eastman Kodak Company In-situ method for making OLED devices that are moisture or oxygen-sensitive
JP2004031933A (ja) * 2002-05-09 2004-01-29 Konica Minolta Holdings Inc 有機薄膜トランジスタの製造方法及び、それにより製造された有機薄膜トランジスタと有機薄膜トランジスタシート
US6728278B2 (en) * 2002-05-23 2004-04-27 Eastman Kodak Company Organic vertical cavity laser array device
US6923881B2 (en) * 2002-05-27 2005-08-02 Fuji Photo Film Co., Ltd. Method for producing organic electroluminescent device and transfer material used therein
CN1703773B (zh) * 2002-06-03 2011-11-16 3M创新有限公司 层压体以及用该层压体制造超薄基片的方法和设备
US7326303B2 (en) * 2002-06-03 2008-02-05 Optoelectronics Systems Consulting Inc. Single-pass growth of multilayer patterned electronic and photonic devices using a scanning localized evaporation methodology (SLEM)
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
DE10226370B4 (de) * 2002-06-13 2008-12-11 Polyic Gmbh & Co. Kg Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET)
US6811815B2 (en) 2002-06-14 2004-11-02 Avery Dennison Corporation Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films
US20040004433A1 (en) * 2002-06-26 2004-01-08 3M Innovative Properties Company Buffer layers for organic electroluminescent devices and methods of manufacture and use
US6682863B2 (en) 2002-06-27 2004-01-27 Eastman Kodak Company Depositing an emissive layer for use in an organic light-emitting display device (OLED)
KR100478524B1 (ko) * 2002-06-28 2005-03-28 삼성에스디아이 주식회사 고분자 및 저분자 발광 재료의 혼합물을 발광 재료로사용하는 유기 전계 발광 소자
US8044517B2 (en) 2002-07-29 2011-10-25 Polyic Gmbh & Co. Kg Electronic component comprising predominantly organic functional materials and a method for the production thereof
US6890627B2 (en) 2002-08-02 2005-05-10 Eastman Kodak Company Laser thermal transfer from a donor element containing a hole-transporting layer
US6939660B2 (en) * 2002-08-02 2005-09-06 Eastman Kodak Company Laser thermal transfer donor including a separate dopant layer
EP1526902B1 (de) * 2002-08-08 2008-05-21 PolyIC GmbH & Co. KG Elektronisches gerät
US6784017B2 (en) * 2002-08-12 2004-08-31 Precision Dynamics Corporation Method of creating a high performance organic semiconductor device
US20040031965A1 (en) * 2002-08-16 2004-02-19 Forrest Stephen R. Organic photonic integrated circuit using an organic photodetector and a transparent organic light emitting device
KR100480442B1 (ko) * 2002-08-17 2005-04-06 한국과학기술연구원 미량도핑에 의한 고효율 백색 유기 발광 물질 및 이를이용한 전기발광소자
EP1548833A4 (de) * 2002-08-19 2007-03-21 Seiko Epson Corp Ferroelektrischer speicher und verfahren zu seiner herstellung
US6695030B1 (en) 2002-08-20 2004-02-24 Eastman Kodak Company Apparatus for permitting transfer of organic material from a donor web to form a layer in an OLED device
US6690697B1 (en) 2002-08-20 2004-02-10 Eastman Kodak Company Vertical cavity light-producing device with improved power conversion
JP2005537637A (ja) 2002-08-23 2005-12-08 ジーメンス アクツィエンゲゼルシャフト 過電圧保護用の有機構成部品および関連する回路
US6811938B2 (en) * 2002-08-29 2004-11-02 Eastman Kodak Company Using fiducial marks on a substrate for laser transfer of organic material from a donor to a substrate
JP4208526B2 (ja) * 2002-09-12 2009-01-14 キヤノン株式会社 有機elディスプレイ装置及び該ディスプレイ装置を有する電子機器
US7094902B2 (en) * 2002-09-25 2006-08-22 3M Innovative Properties Company Electroactive polymers
US20040062947A1 (en) * 2002-09-25 2004-04-01 Lamansky Sergey A. Organic electroluminescent compositions
DE10245628A1 (de) * 2002-09-30 2004-04-15 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierender Halbleiterchip und Verfahren zu dessen Herstellung
DE10393887D2 (de) * 2002-10-02 2005-08-25 Kurz Leonhard Fa Folie mit organischen Halbleitern
US20040067302A1 (en) * 2002-10-08 2004-04-08 Eastman Kodak Company Laser thermal transfer gap control for oled manufacturing
US6963594B2 (en) 2002-10-16 2005-11-08 Eastman Kodak Company Organic laser cavity device having incoherent light as a pumping source
US6970488B2 (en) * 2002-10-16 2005-11-29 Eastman Kodak Company Tunable organic VCSEL system
US6853660B2 (en) * 2002-10-16 2005-02-08 Eastman Kodak Company Organic laser cavity arrays
US6845114B2 (en) 2002-10-16 2005-01-18 Eastman Kodak Company Organic laser that is attachable to an external pump beam light source
US6869185B2 (en) * 2002-10-16 2005-03-22 Eastman Kodak Company Display systems using organic laser light sources
JP2004152958A (ja) * 2002-10-30 2004-05-27 Pioneer Electronic Corp 有機半導体装置
US6855636B2 (en) * 2002-10-31 2005-02-15 3M Innovative Properties Company Electrode fabrication methods for organic electroluminscent devices
US7195036B2 (en) * 2002-11-04 2007-03-27 The Regents Of The University Of Michigan Thermal micro-valves for micro-integrated devices
WO2004042837A2 (de) * 2002-11-05 2004-05-21 Siemens Aktiengesellschaft Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu
JP2005005245A (ja) * 2002-11-08 2005-01-06 Fuji Photo Film Co Ltd 転写素材の転写方法、形状転写方法及び転写装置
DE10253154A1 (de) * 2002-11-14 2004-05-27 Siemens Ag Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe
US6947459B2 (en) * 2002-11-25 2005-09-20 Eastman Kodak Company Organic vertical cavity laser and imaging system
US6918982B2 (en) * 2002-12-09 2005-07-19 International Business Machines Corporation System and method of transfer printing an organic semiconductor
US7176484B2 (en) * 2002-12-09 2007-02-13 International Business Machines Corporation Use of an energy source to convert precursors into patterned semiconductors
JP2004200221A (ja) * 2002-12-16 2004-07-15 Toray Eng Co Ltd レーザマーキング方法及び装置
US20040191564A1 (en) * 2002-12-17 2004-09-30 Samsung Sdi Co., Ltd. Donor film for low molecular weight full color organic electroluminescent device using laser induced thermal imaging method and method for fabricating low molecular weight full color organic electroluminescent device using the film
CN1298551C (zh) * 2002-12-17 2007-02-07 乐金电子(天津)电器有限公司 粘贴在家电产品表面的印刷胶片的印刷层的构造
US6975067B2 (en) * 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US6777025B2 (en) 2002-12-20 2004-08-17 Eastman Kodak Company Tensioning unrolled donor substrate to facilitate transfer of organic material
WO2004058850A1 (ja) * 2002-12-25 2004-07-15 Semiconductor Energy Laboratory Co., Ltd. 高分子化合物、電界発光素子及び発光装置
US7052351B2 (en) * 2002-12-31 2006-05-30 Eastman Kodak Company Using hole- or electron-blocking layers in color OLEDS
WO2004063806A1 (de) * 2003-01-09 2004-07-29 Polyic Gmbh & Co. Kg Platine oder substrat für ein organisches elektronikgerät, sowie verwendung dazu
KR100908234B1 (ko) * 2003-02-13 2009-07-20 삼성모바일디스플레이주식회사 전계 발광 표시 장치 및 이의 제조방법
US6870868B2 (en) * 2003-02-18 2005-03-22 Eastman Kodak Company Organic laser having improved linearity
US7297460B2 (en) * 2003-02-26 2007-11-20 Agfa-Gevaert Radiation curable ink compositions suitable for ink-jet printing
US6781056B1 (en) * 2003-02-28 2004-08-24 Motorola, Inc. Heater for temperature control integrated in circuit board and method of manufacture
US7064748B2 (en) * 2003-03-11 2006-06-20 Eastman Kodak Company Resistive touch screen with variable resistivity layer
US6999484B2 (en) 2003-03-18 2006-02-14 Eastman Kodak Company Parallel access data storage system using a combination of VCSEL arrays and an integrated solid immersion lens array
US6790594B1 (en) * 2003-03-20 2004-09-14 Eastman Kodak Company High absorption donor substrate coatable with organic layer(s) transferrable in response to incident laser light
US7082147B2 (en) * 2003-03-24 2006-07-25 Eastman Kodak Company Organic fiber laser system and method
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US6950454B2 (en) * 2003-03-24 2005-09-27 Eastman Kodak Company Electronic imaging system using organic laser array illuminating an area light valve
US7271406B2 (en) * 2003-04-15 2007-09-18 3M Innovative Properties Company Electron transport agents for organic electronic devices
US7192657B2 (en) * 2003-04-15 2007-03-20 3M Innovative Properties Company Ethynyl containing electron transport dyes and compositions
US6703180B1 (en) 2003-04-16 2004-03-09 Eastman Kodak Company Forming an improved stability emissive layer from a donor element in an OLED device
US20040206307A1 (en) * 2003-04-16 2004-10-21 Eastman Kodak Company Method and system having at least one thermal transfer station for making OLED displays
JP4578065B2 (ja) * 2003-05-07 2010-11-10 大日本印刷株式会社 有機薄膜太陽電池の製造方法および転写シート
TW594358B (en) * 2003-05-13 2004-06-21 Ind Tech Res Inst Method for manufacturing electrophoretic display
US6703184B1 (en) 2003-05-22 2004-03-09 Eastman Kodak Company Low moisture donor substrate coatable with organic layers transferrable in response in incident radiation
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US7141348B2 (en) * 2003-05-23 2006-11-28 Intelleflex Corporation Lamination and delamination technique for thin film processing
US20040235267A1 (en) * 2003-05-23 2004-11-25 James Sheats Lamination and delamination technique for thin film processing
DE10323889A1 (de) * 2003-05-27 2004-12-16 Ehrfeld Mikrotechnik Ag Wälzlager mit Polymerelektronik
US7494896B2 (en) * 2003-06-12 2009-02-24 International Business Machines Corporation Method of forming magnetic random access memory (MRAM) devices on thermally-sensitive substrates using laser transfer
WO2005004205A2 (en) * 2003-06-26 2005-01-13 E.I. Dupont De Nemours And Company Methods for forming patterns of a filled dielectric material on substrates
US7053412B2 (en) * 2003-06-27 2006-05-30 The Trustees Of Princeton University And Universal Display Corporation Grey scale bistable display
GB0316395D0 (en) * 2003-07-12 2003-08-13 Hewlett Packard Development Co A transistor device with metallic electrodes and a method for use in forming such a device
DE10334921A1 (de) * 2003-07-24 2005-02-17 Technische Universität Dresden Disyplay aus organischen Leuchtdioden und Verfahren zu dessen Herstellung
JP2005064143A (ja) * 2003-08-08 2005-03-10 Seiko Epson Corp レジストパターンの形成方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置及び電子機器
KR100543000B1 (ko) * 2003-08-18 2006-01-20 삼성에스디아이 주식회사 풀칼라 유기 전계 발광 소자용 도너 필름, 도너 필름의제조 방법 및 이 도너 필름을 사용한 풀칼라 유기 전계발광 소자
US7180089B2 (en) * 2003-08-19 2007-02-20 National Taiwan University Reconfigurable organic light-emitting device and display apparatus employing the same
DE10338277A1 (de) * 2003-08-20 2005-03-17 Siemens Ag Organischer Kondensator mit spannungsgesteuerter Kapazität
US7275972B2 (en) * 2003-08-22 2007-10-02 3M Innovative Properties Company Method of making an electroluminescent device having a patterned emitter layer and non-patterned emitter layer
DE10339036A1 (de) 2003-08-25 2005-03-31 Siemens Ag Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu
KR100552964B1 (ko) * 2003-08-28 2006-02-15 삼성에스디아이 주식회사 평판표시소자용 도너필름 및 그를 이용한유기전계발광소자의 제조방법
TW589506B (en) * 2003-08-28 2004-06-01 Ind Tech Res Inst The manufacturing method for an electrophoretic display
KR100973811B1 (ko) * 2003-08-28 2010-08-03 삼성전자주식회사 유기 반도체를 사용한 박막 트랜지스터 표시판 및 그 제조방법
DE10340644B4 (de) * 2003-09-03 2010-10-07 Polyic Gmbh & Co. Kg Mechanische Steuerelemente für organische Polymerelektronik
DE10340643B4 (de) * 2003-09-03 2009-04-16 Polyic Gmbh & Co. Kg Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht
US6929048B2 (en) * 2003-09-05 2005-08-16 Eastman Kodak Company Laser transfer of organic material from a donor to form a layer in an OLED device
US20080081105A1 (en) * 2003-09-22 2008-04-03 Samsung Sdi Co., Ltd. Method of fabricating full color organic light-emtting device having color modulation layer using liti method
US7294372B2 (en) * 2003-10-01 2007-11-13 Eastman Kodak Company Conductive color filters
JP2005150235A (ja) * 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
WO2005051048A1 (en) * 2003-11-18 2005-06-02 3M Innovative Properties Company A method of making an electroluminescent device including a color filter
US7892382B2 (en) * 2003-11-18 2011-02-22 Samsung Mobile Display Co., Ltd. Electroluminescent devices and methods of making electroluminescent devices including a color conversion element
KR100611145B1 (ko) * 2003-11-25 2006-08-09 삼성에스디아이 주식회사 풀칼라 유기 전계 발광 소자용 도너 필름, 도너 필름의제조 방법 및 이 도너 필름을 사용한 풀칼라 유기 전계발광 소자
JP4405246B2 (ja) * 2003-11-27 2010-01-27 スリーエム イノベイティブ プロパティズ カンパニー 半導体チップの製造方法
US7682590B2 (en) * 2003-11-27 2010-03-23 National Institute Of Advanced Industrial Science And Technology Carbon nanotube dispersed polar organic solvent and method for producing the same
KR100563059B1 (ko) 2003-11-28 2006-03-24 삼성에스디아이 주식회사 유기 전계 발광 디스플레이 장치 및 이의 제조에 사용되는레이저 열전사용 도너 필름
KR100635051B1 (ko) * 2003-11-29 2006-10-17 삼성에스디아이 주식회사 레이저를 이용한 열전사법에 따른 풀칼라유기전계발광소자 및 이의 제조방법
KR100686342B1 (ko) * 2003-11-29 2007-02-22 삼성에스디아이 주식회사 농도구배를 갖는 광전변환층을 구비한 열전사 소자
KR100611156B1 (ko) * 2003-11-29 2006-08-09 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 그 기판을 사용하여 제조되는유기 전계 발광 소자
KR100667062B1 (ko) * 2003-11-29 2007-01-10 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 그 기판을 사용하여 제조되는유기 전계 발광 소자
US7229726B2 (en) * 2003-12-02 2007-06-12 E. I. Du Pont De Nemours And Company Thermal imaging process and products made therefrom
US6908240B1 (en) * 2003-12-16 2005-06-21 International Imaging Materials, Inc Thermal printing and cleaning assembly
KR100579174B1 (ko) * 2003-12-22 2006-05-11 삼성에스디아이 주식회사 레이저 전사용 도너 필름 및 그 필름을 사용하여 제조되는유기 전계 발광 소자
US20050156512A1 (en) * 2003-12-30 2005-07-21 Vadim Savvateev Electroluminescent devices with at least one electrode having apertures and methods of using such devices
US20050145326A1 (en) * 2004-01-05 2005-07-07 Eastman Kodak Company Method of making an OLED device
DE102004002024A1 (de) * 2004-01-14 2005-08-11 Siemens Ag Organischer Transistor mit selbstjustierender Gate-Elektrode und Verfahren zu dessen Herstellung
US20050165148A1 (en) * 2004-01-28 2005-07-28 Bogerd Jos V.D. Infra-red radiation absorption articles and method of manufacture thereof
KR100712096B1 (ko) * 2004-02-19 2007-04-27 삼성에스디아이 주식회사 유기전계 발광표시장치의 제조방법
KR100635056B1 (ko) 2004-02-19 2006-10-16 삼성에스디아이 주식회사 유기전계 발광표시장치의 제조방법
KR100570978B1 (ko) * 2004-02-20 2006-04-13 삼성에스디아이 주식회사 표면이 개질된 유기막층을 사용하는 유기 전계 발광디스플레이 디바이스 및 이의 제조 방법
KR100579191B1 (ko) * 2004-02-24 2006-05-11 삼성에스디아이 주식회사 열전사 소자
US7032285B2 (en) * 2004-03-02 2006-04-25 Eastman Kodak Company Mounting an OLED donor sheet to frames
US7238252B2 (en) * 2004-03-02 2007-07-03 Eastman Kodak Company Method of forming a OLED donor sheet having rigid edge frame
US7316874B2 (en) * 2004-03-23 2008-01-08 E. I. Du Pont De Nemours And Company Process and donor elements for transferring thermally sensitive materials to substrates by thermal imaging
US7193291B2 (en) * 2004-03-25 2007-03-20 3M Innovative Properties Company Organic Schottky diode
KR100571006B1 (ko) 2004-05-19 2006-04-13 삼성에스디아이 주식회사 유기 전계 발광 소자 및 그 제조 방법
US7485337B2 (en) * 2004-05-27 2009-02-03 Eastman Kodak Company Depositing an organic layer for use in OLEDs
US7291365B2 (en) * 2004-05-27 2007-11-06 Eastman Kodak Company Linear laser light beam for making OLEDS
US7132140B2 (en) * 2004-05-27 2006-11-07 Eastman Kodak Company Plural metallic layers in OLED donor
US7148957B2 (en) * 2004-06-09 2006-12-12 3M Innovative Properties Company, Imaging system for thermal transfer
US20070178658A1 (en) * 2004-06-21 2007-08-02 Kelley Tommie W Patterning and aligning semiconducting nanoparticles
US7375701B2 (en) * 2004-07-01 2008-05-20 Carestream Health, Inc. Scanless virtual retinal display system
US20060019116A1 (en) * 2004-07-22 2006-01-26 Eastman Kodak Company White electroluminescent device with anthracene derivative host
US7316756B2 (en) 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
KR20060017414A (ko) * 2004-08-20 2006-02-23 삼성에스디아이 주식회사 유기 전계 발광 소자의 제조 방법
DE102004040831A1 (de) * 2004-08-23 2006-03-09 Polyic Gmbh & Co. Kg Funketikettfähige Umverpackung
KR100731728B1 (ko) 2004-08-27 2007-06-22 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 이를 이용한 유기 전계 발광소자의 제조 방법
KR100611767B1 (ko) 2004-08-30 2006-08-10 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 그 필름을 사용하여 제조되는유기 전계 발광 소자의 제조 방법
KR20060020045A (ko) * 2004-08-30 2006-03-06 삼성에스디아이 주식회사 유기전계발광표시장치의 제조방법
KR100623694B1 (ko) 2004-08-30 2006-09-19 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 그 기판을 사용하여 제조되는유기 전계 발광 소자의 제조 방법
KR20060021210A (ko) * 2004-09-02 2006-03-07 삼성에스디아이 주식회사 레이저 전사용 도너 기판의 제조 장치와 도너 기판의 제조방법 및 그를 이용한 유기 전계 발광 소자의 제조 방법
KR100667067B1 (ko) * 2004-09-08 2007-01-10 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 그 기판을 사용하여 제조되는유기 전계 발광 소자
US7427441B2 (en) * 2004-09-17 2008-09-23 Eastman Kodak Co Transparent polymeric coated conductor
US20060062983A1 (en) * 2004-09-17 2006-03-23 Irvin Glen C Jr Coatable conductive polyethylenedioxythiophene with carbon nanotubes
JP2006086069A (ja) 2004-09-17 2006-03-30 Three M Innovative Properties Co 有機エレクトロルミネッセンス素子及びその製造方法
US7501152B2 (en) 2004-09-21 2009-03-10 Eastman Kodak Company Delivering particulate material to a vaporization zone
US20060060839A1 (en) * 2004-09-22 2006-03-23 Chandross Edwin A Organic semiconductor composition
KR20060027750A (ko) * 2004-09-23 2006-03-28 삼성에스디아이 주식회사 유기 전계 발광 소자의 제조 방법
KR100731729B1 (ko) * 2004-09-23 2007-06-22 삼성에스디아이 주식회사 유기 전계 발광 소자의 제조 방법
KR100793355B1 (ko) * 2004-10-05 2008-01-11 삼성에스디아이 주식회사 도너 기판의 제조방법 및 유기전계발광표시장치의 제조방법
KR100579186B1 (ko) * 2004-10-15 2006-05-11 삼성에스디아이 주식회사 유기 전계 발광 소자
KR20060033554A (ko) * 2004-10-15 2006-04-19 삼성에스디아이 주식회사 레이저 열전사 장치 및 이를 이용한 유기전계 발광 소자의제조 방법
KR100667069B1 (ko) * 2004-10-19 2007-01-10 삼성에스디아이 주식회사 도너 기판 및 그를 사용한 유기전계발광표시장치의 제조방법
KR100721564B1 (ko) * 2004-10-19 2007-05-23 삼성에스디아이 주식회사 기판지지 프레임, 상기 프레임을 구비하는 기판지지프레임 조립체, 상기 프레임을 사용한 기판 프레이밍방법, 상기 기판지지 프레임 조립체를 사용한 도너기판제조방법 및 상기 도너기판을 사용한유기전계발광표시장치 제조방법
KR100600881B1 (ko) * 2004-10-20 2006-07-18 삼성에스디아이 주식회사 레이저 열전사 장치, 라미네이터 및 상기 장치를 사용하는레이저 열전사 방법
US7781047B2 (en) 2004-10-21 2010-08-24 Eastman Kodak Company Polymeric conductor donor and transfer method
US20060088656A1 (en) * 2004-10-25 2006-04-27 Eastman Kodak Company Manufacturing donor substrates for making OLED displays
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7408187B2 (en) * 2004-11-19 2008-08-05 Massachusetts Institute Of Technology Low-voltage organic transistors on flexible substrates using high-gate dielectric insulators by room temperature process
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
DE102004059464A1 (de) * 2004-12-10 2006-06-29 Polyic Gmbh & Co. Kg Elektronikbauteil mit Modulator
DE102004059467A1 (de) * 2004-12-10 2006-07-20 Polyic Gmbh & Co. Kg Gatter aus organischen Feldeffekttransistoren
DE102004059465A1 (de) * 2004-12-10 2006-06-14 Polyic Gmbh & Co. Kg Erkennungssystem
KR100635579B1 (ko) * 2004-12-20 2006-10-17 삼성에스디아이 주식회사 레이저 열 전사장치, 상기 장치를 사용하는 레이저 열전사법 및 상기 장치를 사용하는 유기전계발광표시장치제조방법
US7414313B2 (en) * 2004-12-22 2008-08-19 Eastman Kodak Company Polymeric conductor donor and transfer method
DE102004063435A1 (de) 2004-12-23 2006-07-27 Polyic Gmbh & Co. Kg Organischer Gleichrichter
US8569948B2 (en) * 2004-12-28 2013-10-29 Samsung Display Co., Ltd. Electroluminescent devices and methods of making electroluminescent devices including an optical spacer
WO2006076614A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
US7533361B2 (en) * 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US8334464B2 (en) * 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
WO2006076609A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
AU2006204813A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Security features, their use, and processes for making them
TW200640596A (en) * 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
WO2006076610A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
US20060177646A1 (en) * 2005-02-09 2006-08-10 Detlef Burgard Method for producing shatterproof glass panels and casting resin molding
US20060175959A1 (en) * 2005-02-09 2006-08-10 Osram Opto Semiconductors Gmbh Green enhancement filter to improve yield of white displays
US20060181600A1 (en) * 2005-02-15 2006-08-17 Eastman Kodak Company Patterns formed by transfer of conductive particles
US7630029B2 (en) * 2005-02-16 2009-12-08 Industrial Technology Research Institute Conductive absorption layer for flexible displays
KR100700654B1 (ko) * 2005-02-22 2007-03-27 삼성에스디아이 주식회사 레이저 조사 장치 및 레이저 열 전사법
US20060188721A1 (en) * 2005-02-22 2006-08-24 Eastman Kodak Company Adhesive transfer method of carbon nanotube layer
DE102005009819A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe
DE102005009820A1 (de) * 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe mit organischen Logik-Schaltelementen
JP4814539B2 (ja) * 2005-03-10 2011-11-16 株式会社日立製作所 ネットブート方法
US7371605B2 (en) * 2005-03-25 2008-05-13 Lucent Technologies Inc. Active organic semiconductor devices and methods for making the same
US20060216408A1 (en) * 2005-03-28 2006-09-28 Eastman Kodak Company Performance of radiation transfered electronic devices
US7645478B2 (en) * 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US7113663B1 (en) 2005-03-31 2006-09-26 Eastman Kodak Company Visual display with electro-optical individual pixel addressing architecture
DE102005017655B4 (de) * 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
TWI361018B (en) * 2005-04-18 2012-03-21 Sony Corp Display device and a method of manufacturing the s
TWI259027B (en) * 2005-04-29 2006-07-21 Univision Technology Inc Organic electroluminescence device capable of preventing long-distance short circuit
US7399571B2 (en) * 2005-05-06 2008-07-15 General Electric Company Multilayered articles and method of manufacture thereof
US20060291769A1 (en) * 2005-05-27 2006-12-28 Eastman Kodak Company Light emitting source incorporating vertical cavity lasers and other MEMS devices within an electro-optical addressing architecture
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
US8900693B2 (en) * 2005-07-13 2014-12-02 Sabic Global Technologies B.V. Polycarbonate compositions having infrared absorbance, method of manufacture, and articles prepared therefrom
US20070013765A1 (en) * 2005-07-18 2007-01-18 Eastman Kodak Company Flexible organic laser printer
DE102005035589A1 (de) 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines elektronischen Bauelements
DE102005035590A1 (de) * 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Elektronisches Bauelement
US20080305287A1 (en) * 2005-08-01 2008-12-11 Pioneer Corporation Producing Method of Transfer Body with Organic Film Thermal-Transferred Thereon and Transfer Body with Organic Film Thermal-Transferred Thereon
US20070045540A1 (en) * 2005-08-30 2007-03-01 Kang Tae M Laser induced thermal imaging apparatus with contact frame
US20070048545A1 (en) * 2005-08-31 2007-03-01 Eastman Kodak Company Electron-transporting layer for white OLED device
DE102005042166A1 (de) * 2005-09-06 2007-03-15 Polyic Gmbh & Co.Kg Organisches Bauelement und ein solches umfassende elektrische Schaltung
KR100759685B1 (ko) 2005-09-08 2007-09-17 삼성에스디아이 주식회사 레이저 전사용 전사부재 및 이를 이용한 발광소자 및발광소자의 제조방법
US7410825B2 (en) * 2005-09-15 2008-08-12 Eastman Kodak Company Metal and electronically conductive polymer transfer
DE102005044306A1 (de) * 2005-09-16 2007-03-22 Polyic Gmbh & Co. Kg Elektronische Schaltung und Verfahren zur Herstellung einer solchen
US20070077349A1 (en) * 2005-09-30 2007-04-05 Eastman Kodak Company Patterning OLED device electrodes and optical material
US7396631B2 (en) * 2005-10-07 2008-07-08 3M Innovative Properties Company Radiation curable thermal transfer elements
US7678526B2 (en) * 2005-10-07 2010-03-16 3M Innovative Properties Company Radiation curable thermal transfer elements
KR100873071B1 (ko) * 2005-11-07 2008-12-09 삼성모바일디스플레이주식회사 표면 균일도 향상을 위한 도너 필름 가공방법
KR100700831B1 (ko) * 2005-11-16 2007-03-28 삼성에스디아이 주식회사 레이저 열 전사법 및 이를 이용한 유기 발광소자의제조방법
JP2007173145A (ja) * 2005-12-26 2007-07-05 Sony Corp 転写用基板、転写方法、および有機電界発光素子の製造方法
KR100753569B1 (ko) * 2005-12-30 2007-08-30 엘지.필립스 엘시디 주식회사 유기전계발광표시소자의 제조방법
KR20070073457A (ko) * 2006-01-05 2007-07-10 삼성에스디아이 주식회사 유기 전계 발광소자용 도너 필름의 제조 방법 및 이를이용한 유기 전계 발광소자의 제조 방법
JP2007201031A (ja) * 2006-01-25 2007-08-09 Mitsubishi Electric Corp 半導体レーザ装置
JP4977391B2 (ja) * 2006-03-27 2012-07-18 日本電気株式会社 レーザ切断方法、表示装置の製造方法、および表示装置
US20070242719A1 (en) * 2006-04-12 2007-10-18 Eastman Kodak Company Optical manipulator illuminated by patterned organic microcavity lasers
KR100731755B1 (ko) * 2006-05-03 2007-06-22 삼성에스디아이 주식회사 평판표시소자용 도너 기판 및 그를 이용한유기전계발광소자의 제조방법
US7223515B1 (en) 2006-05-30 2007-05-29 3M Innovative Properties Company Thermal mass transfer substrate films, donor elements, and methods of making and using same
US20080007518A1 (en) * 2006-06-23 2008-01-10 Debasis Majumdar Conductive polymer coating with improved aging stability
US8062824B2 (en) 2006-07-17 2011-11-22 E. I. Du Pont De Nemours And Company Thermally imageable dielectric layers, thermal transfer donors and receivers
US7744717B2 (en) * 2006-07-17 2010-06-29 E. I. Du Pont De Nemours And Company Process for enhancing the resolution of a thermally transferred pattern
US7582403B2 (en) 2006-07-17 2009-09-01 E. I. Du Pont De Nemours And Company Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
US7670450B2 (en) * 2006-07-31 2010-03-02 3M Innovative Properties Company Patterning and treatment methods for organic light emitting diode devices
US7588656B2 (en) * 2006-08-17 2009-09-15 E. I. Du Pont De Nemours And Company Thermal transfer imaging element and method of using same
US7829162B2 (en) 2006-08-29 2010-11-09 international imagining materials, inc Thermal transfer ribbon
US7419757B2 (en) * 2006-10-20 2008-09-02 3M Innovative Properties Company Structured thermal transfer donors
US7604916B2 (en) 2006-11-06 2009-10-20 3M Innovative Properties Company Donor films with pattern-directing layers
US20080117362A1 (en) * 2006-11-21 2008-05-22 3M Innovative Properties Company Organic Light Emitting Diode Devices With Optical Microstructures
KR100796605B1 (ko) * 2006-12-15 2008-01-21 삼성에스디아이 주식회사 도너 기판 및 그를 이용한 유기전계발광소자의 제조방법
KR100867924B1 (ko) * 2007-03-07 2008-11-10 삼성에스디아이 주식회사 도너기판, 그의 제조방법 및 유기전계발광소자
US20080233404A1 (en) * 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
JP4450006B2 (ja) * 2007-04-02 2010-04-14 ソニー株式会社 転写用基板および有機電界発光素子の製造方法
US20080264682A1 (en) * 2007-04-24 2008-10-30 John Catron Substrate and negative imaging method for providing transparent conducting patterns
US8431432B2 (en) * 2007-04-27 2013-04-30 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device
US8367152B2 (en) * 2007-04-27 2013-02-05 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device
EP2164709B1 (de) * 2007-06-28 2012-03-28 Cabot Corporation Leuchte zur erwärmung einer konversionsschicht mit einem modifizierten pigment
JP5325471B2 (ja) * 2007-07-06 2013-10-23 株式会社半導体エネルギー研究所 発光装置の作製方法
US7927454B2 (en) 2007-07-17 2011-04-19 Samsung Mobile Display Co., Ltd. Method of patterning a substrate
US7812531B2 (en) 2007-07-25 2010-10-12 Global Oled Technology Llc Preventing stress transfer in OLED display components
DE102007045518B4 (de) * 2007-09-24 2010-12-16 Siemens Ag Lösungsprozessiertes organisches elektronisches Bauelement mit verbesserter Elektrodenschicht
WO2009060717A1 (ja) * 2007-11-07 2009-05-14 Konica Minolta Holdings, Inc. 透明電極及び透明電極の製造方法
US8016631B2 (en) * 2007-11-16 2011-09-13 Global Oled Technology Llc Desiccant sealing arrangement for OLED devices
US8021726B2 (en) * 2007-12-06 2011-09-20 E. I. Du Pont De Nemours And Company Compositions and processes for preparing color filter elements using alkali metal fluorides
US20090155963A1 (en) * 2007-12-12 2009-06-18 Hawkins Gilbert A Forming thin film transistors using ablative films
US8080811B2 (en) * 2007-12-28 2011-12-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing evaporation donor substrate and light-emitting device
JP2009295313A (ja) * 2008-06-03 2009-12-17 Canon Inc スペーサの形成方法
JP2010044118A (ja) 2008-08-08 2010-02-25 Sony Corp 表示装置およびその製造方法
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
JP5337637B2 (ja) * 2008-09-19 2013-11-06 パナソニック株式会社 光モジュール及びその製造方法
US8162022B2 (en) * 2008-10-03 2012-04-24 Nike, Inc. Method of customizing an article and apparatus
BRPI0924191A2 (pt) * 2009-01-07 2016-02-10 Sharp Kk dispositivo de vídeo de eletroluminescência orgânica e método para a produção do mesmo
US8093080B2 (en) * 2009-02-19 2012-01-10 Kotusa, Inc. Optical device having light sensor employing horizontal electrical field
US8053790B2 (en) * 2009-02-19 2011-11-08 Kotusa, Inc. Optical device having light sensor employing horizontal electrical field
US8389057B2 (en) * 2009-04-06 2013-03-05 Douglas Knox Systems and methods for printing electronic device assembly
JP5493473B2 (ja) * 2009-05-29 2014-05-14 ソニー株式会社 熱転写シートおよびインクリボン
DE102009029903A1 (de) * 2009-06-19 2010-12-23 Tesa Se Verfahren zum Aufbringen einer dauerhaften Prozessmarke auf einem Produkt, insbesondere Glas
US20110014739A1 (en) * 2009-07-16 2011-01-20 Kondakov Denis Y Making an emissive layer for multicolored oleds
KR101073559B1 (ko) * 2009-10-13 2011-10-17 삼성모바일디스플레이주식회사 도너 기판 및 그를 이용한 유기전계발광소자의 제조방법
US8242432B2 (en) * 2009-10-23 2012-08-14 Kotura, Inc. System having light sensor with enhanced sensitivity including a multiplication layer for generating additional electrons
US20110151153A1 (en) * 2009-12-23 2011-06-23 E.I. Du Pont De Nemours And Company Polymeric conductive donor
US8536087B2 (en) 2010-04-08 2013-09-17 International Imaging Materials, Inc. Thermographic imaging element
JP5440439B2 (ja) * 2010-08-05 2014-03-12 三菱電機株式会社 薄膜光電変換装置の製造方法
DE102010044985B4 (de) 2010-09-10 2022-02-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Aufbringen eines Konversionsmittels auf einen optoelektronischen Halbleiterchip und optoelektronisches Bauteil
US9429742B1 (en) 2011-01-04 2016-08-30 Nlight, Inc. High power laser imaging systems
US10095016B2 (en) 2011-01-04 2018-10-09 Nlight, Inc. High power laser system
US9409255B1 (en) 2011-01-04 2016-08-09 Nlight, Inc. High power laser imaging systems
US9105860B2 (en) 2011-06-30 2015-08-11 Samsung Display Co., Ltd. Organic light emitting diode
US8410566B2 (en) 2011-07-21 2013-04-02 Kotura, Inc. Application of electrical field power to light-transmitting medium
KR102050029B1 (ko) * 2011-08-26 2019-11-29 삼성디스플레이 주식회사 도너 기판, 도너 기판의 제조 방법, 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
US9720244B1 (en) 2011-09-30 2017-08-01 Nlight, Inc. Intensity distribution management system and method in pixel imaging
US9490658B2 (en) * 2011-12-09 2016-11-08 Nokia Technologies Oy Apparatus and a method of manufacturing an apparatus
KR101422665B1 (ko) * 2011-12-30 2014-07-24 제일모직주식회사 열전사 필름
KR101459131B1 (ko) * 2011-12-30 2014-11-10 제일모직주식회사 열전사 필름
JP5263460B1 (ja) 2012-06-12 2013-08-14 東洋インキScホールディングス株式会社 光散乱層用樹脂組成物、光散乱層、および有機エレクトロルミネッセンス装置
US8946052B2 (en) * 2012-09-26 2015-02-03 Sandia Corporation Processes for multi-layer devices utilizing layer transfer
KR101977992B1 (ko) 2012-12-14 2019-05-13 도레이첨단소재 주식회사 레이저 열전사용 도너 필름
KR101985978B1 (ko) 2012-12-14 2019-06-04 도레이첨단소재 주식회사 우수한 레이저 전사 특성을 가진 레이저 열전사용 도너 필름 및 이를 이용한 유기 전계 발광 소자의 제조방법
KR101608116B1 (ko) 2012-12-18 2016-03-31 제일모직주식회사 열전사 필름, 그의 제조방법 및 이로부터 제조된 유기전계발광소자
ITTO20130087A1 (it) * 2013-02-04 2013-05-06 K4B S R L Procedimento di marchiatura laser e realizzazione di connessioni elettriche / elettroniche per superfici trasparenti
US9310248B2 (en) 2013-03-14 2016-04-12 Nlight, Inc. Active monitoring of multi-laser systems
KR102065763B1 (ko) 2013-03-27 2020-01-14 삼성디스플레이 주식회사 승화형 열전사 방법을 이용하는 유기 전계 발광 표시 장치의 유기 발광 패턴 형성 방법 및 유기 발광 패턴 형성 장치
JP5880611B2 (ja) * 2013-03-29 2016-03-09 大日本印刷株式会社 素子製造方法および素子製造装置
KR20140124940A (ko) 2013-04-16 2014-10-28 삼성디스플레이 주식회사 도너기판, 도너기판을 이용한 유기발광표시장치 제조방법 및 이에 의해 제조된 유기발광표시장치
US9377581B2 (en) 2013-05-08 2016-06-28 Mellanox Technologies Silicon Photonics Inc. Enhancing the performance of light sensors that receive light signals from an integrated waveguide
KR20140140189A (ko) 2013-05-28 2014-12-09 삼성디스플레이 주식회사 도너기판 및 이를 이용한 전사패턴 형성방법
KR20140140188A (ko) * 2013-05-28 2014-12-09 삼성디스플레이 주식회사 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법
KR20140140190A (ko) 2013-05-28 2014-12-09 삼성디스플레이 주식회사 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법
KR20140139853A (ko) * 2013-05-28 2014-12-08 삼성디스플레이 주식회사 도너기판 및 이를 이용한 전사패턴 형성방법
US10046550B2 (en) 2013-08-22 2018-08-14 Massachusetts Institute Of Technology Carrier-substrate adhesive system
US9359198B2 (en) 2013-08-22 2016-06-07 Massachusetts Institute Of Technology Carrier-substrate adhesive system
JP6282094B2 (ja) * 2013-11-27 2018-02-21 キヤノン株式会社 面発光レーザ、およびそれを用いた光干渉断層計
US9709810B2 (en) 2014-02-05 2017-07-18 Nlight, Inc. Single-emitter line beam system
JP2016009634A (ja) 2014-06-25 2016-01-18 住友金属鉱山株式会社 光熱変換層、ドナーシート
JP6287627B2 (ja) * 2014-06-25 2018-03-07 住友金属鉱山株式会社 光熱変換層、ドナーシート
CN105655369A (zh) * 2014-08-28 2016-06-08 汤宝林 串行热转印电致发光显示器
JP6497128B2 (ja) 2015-02-26 2019-04-10 住友金属鉱山株式会社 ドナーシート
KR102352406B1 (ko) 2015-03-02 2022-01-19 삼성디스플레이 주식회사 표시 장치의 제조 방법 및 표시 장치
CN104762599A (zh) 2015-04-15 2015-07-08 京东方科技集团股份有限公司 蒸镀方法和蒸镀装置
CN107024789A (zh) * 2016-01-29 2017-08-08 富泰华工业(深圳)有限公司 液晶面板及其制造方法
US10056020B2 (en) * 2016-02-11 2018-08-21 Oculus Vr, Llc Waveguide display with two-dimensional scanner
US11089690B2 (en) * 2016-03-16 2021-08-10 Ncc Nano, Llc Method for depositing a functional material on a substrate
KR102632428B1 (ko) 2016-06-06 2024-01-31 엔씨씨 나노, 엘엘씨 중합체 필름의 박리를 수행하기 위한 방법
US11060193B2 (en) 2016-11-23 2021-07-13 Institut National De La Recherche Scientifique Method and system of laser-driven impact acceleration
US10690919B1 (en) 2017-02-17 2020-06-23 Facebook Technologies, Llc Superluminous LED array for waveguide display
US11320267B2 (en) 2017-03-23 2022-05-03 Kvh Industries, Inc. Integrated optic wavemeter and method for fiber optic gyroscopes scale factor stabilization
KR102600382B1 (ko) 2017-06-19 2023-11-10 스미토모 긴조쿠 고잔 가부시키가이샤 광열 변환층과 그의 제조 방법, 및 당해 광열 변환층을 사용한 도너 시트
TWI758543B (zh) 2017-09-14 2022-03-21 日商住友金屬礦山股份有限公司 光熱轉換層、使用該光熱轉換層之施體片材及其等之製造方法
KR20200060718A (ko) 2017-09-15 2020-06-01 케이브이에이치 인더스트리즈, 인코포레이티드 광자 집적 회로의 도파관에 광섬유의 자기 정렬 연결을 위한 방법 및 장치
CN110431251A (zh) 2017-12-14 2019-11-08 京东方科技集团股份有限公司 用于将沉积材料沉积在受体基板上的供体基板、用于沉积沉积材料的方法、以及制造供体基板的方法
TWI662730B (zh) * 2018-03-09 2019-06-11 謙華科技股份有限公司 製備有機發光二極體之熱轉印膜及其製備方法
TWI671931B (zh) * 2018-03-19 2019-09-11 謙華科技股份有限公司 使用熱轉印膜製備有機發光二極體之方法
TW201943114A (zh) * 2018-03-31 2019-11-01 謙華科技股份有限公司 使用熱轉印膜連續製備有機發光二極體之方法
EP3814132A4 (de) * 2018-06-28 2022-03-23 Nelumbo Inc. Gleichzeitige oberflächenmodifikationen und verfahren zur herstellung davon
TWI826477B (zh) * 2018-06-28 2023-12-21 美商3M新設資產公司 在可撓性基材上製造金屬圖案的方法
EP3864373A1 (de) 2018-10-11 2021-08-18 KVH Industries, Inc. Photonische integrierte schaltungen, faseroptische gyroskope und verfahren zur herstellung davon
CN109733082B (zh) * 2019-02-21 2021-04-06 界首市兴华渔具有限公司 一种仿生鱼饵水转印上色工艺
CN110148678A (zh) 2019-04-29 2019-08-20 深圳市华星光电半导体显示技术有限公司 辅助电极转移结构及显示面板的制作方法
US11353655B2 (en) * 2019-05-22 2022-06-07 Kvh Industries, Inc. Integrated optical polarizer and method of making same
US20210045477A1 (en) 2019-08-12 2021-02-18 Nike, Inc. Apparel with cling reduction features
CN110649180B (zh) * 2019-09-30 2021-10-26 武汉天马微电子有限公司 一种显示面板的制作方法、显示面板和显示装置
EP3911130A1 (de) * 2020-05-12 2021-11-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transfer von viskosen materialien
EP4037442A1 (de) * 2021-02-01 2022-08-03 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Donorplatte, abscheidungsvorrichtung und abscheidungsverfahren
WO2022271595A1 (en) 2021-06-23 2022-12-29 International Imaging Materials, Inc. Thermographic imaging element

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4252671A (en) * 1979-12-04 1981-02-24 Xerox Corporation Preparation of colloidal iron dispersions by the polymer-catalyzed decomposition of iron carbonyl and iron organocarbonyl compounds
JPS58195498U (ja) * 1982-06-22 1983-12-26 凸版印刷株式会社 電磁波シ−ルド用転写箔
US4539507A (en) 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
GB2170016B (en) * 1984-12-19 1989-04-05 Plessey Co Plc Improvements in or relating to modulators
CA1268808A (en) * 1985-07-23 1990-05-08 Alan G. Macdiarmid High capacity polyaniline electrodes
DE3781067T2 (de) * 1986-09-01 1993-01-21 Tomoegawa Paper Mfg Co Ltd Uebertragungsaufzeichnungsmittel und ihre verwendung fuer uebertragungsaufzeichnungsverfahren.
US4833124A (en) * 1987-12-04 1989-05-23 Eastman Kodak Company Process for increasing the density of images obtained by thermal dye transfer
EP0321923B1 (de) * 1987-12-21 1992-07-15 EASTMAN KODAK COMPANY (a New Jersey corporation) Infrarot absorbierende Cyaninfarbstoffe für Farbstoff-Donorelemente zur Verwendung bei de laserinduzierten thermischen Farbstoffübertragung
JPH01290495A (ja) * 1988-05-18 1989-11-22 Konica Corp 感熱転写記録媒体
US5171650A (en) * 1990-10-04 1992-12-15 Graphics Technology International, Inc. Ablation-transfer imaging/recording
US5156938A (en) * 1989-03-30 1992-10-20 Graphics Technology International, Inc. Ablation-transfer imaging/recording
US5256506A (en) * 1990-10-04 1993-10-26 Graphics Technology International Inc. Ablation-transfer imaging/recording
US5501938A (en) * 1989-03-30 1996-03-26 Rexham Graphics Inc. Ablation-transfer imaging/recording
US4942141A (en) * 1989-06-16 1990-07-17 Eastman Kodak Company Infrared absorbing squarylium dyes for dye-donor element used in laser-induced thermal dye transfer
US4948776A (en) * 1989-06-16 1990-08-14 Eastman Kodak Company Infrared absorbing chalcogenopyrylo-arylidene dyes for dye-donor element used in laser-induced thermal dye transfer
US4950639A (en) * 1989-06-16 1990-08-21 Eastman Kodak Company Infrared absorbing bis(aminoaryl)polymethine dyes for dye-donor element used in laser-induced thermal dye transfer
US4948778A (en) * 1989-06-20 1990-08-14 Eastman Kodak Company Infrared absorbing oxyindolizine dyes for dye-donor element used in laser-induced thermal dye transfer
US4952552A (en) * 1989-06-20 1990-08-28 Eastman Kodak Company Infrared absorbing quinoid dyes for dye-donor element used in laser-induced thermal dye transfer
US4912083A (en) * 1989-06-20 1990-03-27 Eastman Kodak Company Infrared absorbing ferrous complexes for dye-donor element used in laser-induced thermal dye transfer
US5061569A (en) 1990-07-26 1991-10-29 Eastman Kodak Company Electroluminescent device with organic electroluminescent medium
US5023229A (en) * 1990-10-31 1991-06-11 Eastman Kodak Company Mixture of dyes for magenta dye donor for thermal color proofing
US5024990A (en) * 1990-10-31 1991-06-18 Eastman Kodak Company Mixture of dyes for cyan dye donor for thermal color proofing
US5166024A (en) * 1990-12-21 1992-11-24 Eastman Kodak Company Photoelectrographic imaging with near-infrared sensitizing pigments
US5401607A (en) * 1991-04-17 1995-03-28 Polaroid Corporation Processes and compositions for photogeneration of acid
US5141671A (en) 1991-08-01 1992-08-25 Eastman Kodak Company Mixed ligand 8-quinolinolato aluminum chelate luminophors
US5244770A (en) * 1991-10-23 1993-09-14 Eastman Kodak Company Donor element for laser color transfer
EP0568993B1 (de) * 1992-05-06 1998-08-12 Kyowa Hakko Kogyo Co., Ltd. Chemisch amplifizierte Resistzusammensetzung
US5351617A (en) * 1992-07-20 1994-10-04 Presstek, Inc. Method for laser-discharge imaging a printing plate
EP0678200B1 (de) * 1992-11-18 2002-02-27 PGI Graphics Imaging LLC Nach-bedarf herstellung von filmen für laserablationsverfahren
US5286604A (en) * 1992-11-25 1994-02-15 E. I. Du Pont De Nemours And Company Single layer dry processible photothermal-sensitive element
JPH06258537A (ja) * 1993-03-08 1994-09-16 Mitsubishi Rayon Co Ltd ドライフィルムレジストおよびそれを用いたプリント配線板
WO1994020974A1 (en) 1993-03-11 1994-09-15 Sony Corporation Method for forming fluorescent film, and transfer material for formation of the fluorescent film
US5372915A (en) * 1993-05-19 1994-12-13 Eastman Kodak Company Method of making a lithographic printing plate containing a resole resin and a novolac resin in the radiation sensitive layer
US5387496A (en) * 1993-07-30 1995-02-07 Eastman Kodak Company Interlayer for laser ablative imaging
EP0713586B1 (de) * 1993-08-13 2001-07-18 PGI Graphics Imaging LLC Ablationsübertragung auf zwischenprodukte
JPH0757871A (ja) * 1993-08-19 1995-03-03 Hitachi Ltd 電場発光表示装置
US5360694A (en) * 1993-10-18 1994-11-01 Minnesota Mining And Manufacturing Company Thermal dye transfer
JPH07248557A (ja) 1994-03-10 1995-09-26 Konica Corp 放射線画像の処理方法
JPH07248508A (ja) * 1994-03-14 1995-09-26 Toshiba Corp 液晶表示装置
US5521035A (en) * 1994-07-11 1996-05-28 Minnesota Mining And Manufacturing Company Methods for preparing color filter elements using laser induced transfer of colorants with associated liquid crystal display device
US5707745A (en) * 1994-12-13 1998-01-13 The Trustees Of Princeton University Multicolor organic light emitting devices
KR960026673A (ko) * 1994-12-28 1996-07-22 윤종용 집적회로 칩의 실장 구조체 및 그 실장방법
US5685939A (en) * 1995-03-10 1997-11-11 Minnesota Mining And Manufacturing Company Process for making a Z-axis adhesive and establishing electrical interconnection therewith
US5725981A (en) * 1995-08-09 1998-03-10 Fuji Photo Film Co., Ltd. Method of forming color images by electrophotographic process employing a peelable transfer layer having a stratified structure
JP2780681B2 (ja) * 1995-08-11 1998-07-30 日本電気株式会社 アクティブマトリクス液晶表示パネル及びその製造方法
AU7256496A (en) * 1995-10-17 1997-05-07 Minnesota Mining And Manufacturing Company Method for radiation-induced thermal transfer of resist for flexible printed circuitry
US5688551A (en) * 1995-11-13 1997-11-18 Eastman Kodak Company Method of forming an organic electroluminescent display panel
US6010817A (en) * 1995-12-14 2000-01-04 Agfa-Gevaert, N.V. Heat sensitive imaging element and a method for producing lithographic plates therewith
JPH09237898A (ja) * 1996-02-29 1997-09-09 A G Technol Kk 多結晶半導体tft、その製造方法、及びtft基板
US5691114A (en) * 1996-03-12 1997-11-25 Eastman Kodak Company Method of imaging of lithographic printing plates using laser ablation
US5605780A (en) * 1996-03-12 1997-02-25 Eastman Kodak Company Lithographic printing plate adapted to be imaged by ablation
US5695907A (en) * 1996-03-14 1997-12-09 Minnesota Mining And Manufacturing Company Laser addressable thermal transfer imaging element and method
JPH09258050A (ja) * 1996-03-21 1997-10-03 Toyo Commun Equip Co Ltd 光導波路の作製方法
US5747217A (en) * 1996-04-03 1998-05-05 Minnesota Mining And Manufacturing Company Laser-induced mass transfer imaging materials and methods utilizing colorless sublimable compounds
US5725989A (en) 1996-04-15 1998-03-10 Chang; Jeffrey C. Laser addressable thermal transfer imaging element with an interlayer
US5693446A (en) * 1996-04-17 1997-12-02 Minnesota Mining And Manufacturing Company Polarizing mass transfer donor element and method of transferring a polarizing mass transfer layer
US5710097A (en) * 1996-06-27 1998-01-20 Minnesota Mining And Manufacturing Company Process and materials for imagewise placement of uniform spacers in flat panel displays
US5998085A (en) * 1996-07-23 1999-12-07 3M Innovative Properties Process for preparing high resolution emissive arrays and corresponding articles
KR100195175B1 (ko) * 1996-12-23 1999-06-15 손욱 유기전자발광소자 유기박막용 도너필름, 이를 이용한 유기전자발광소자의 제조방법 및 그 방법에 따라 제조된 유기전자발광소자
US5756240A (en) * 1997-01-24 1998-05-26 Eastman Kodak Company Method of making color filter arrays by transferring colorant material
US5904961A (en) * 1997-01-24 1999-05-18 Eastman Kodak Company Method of depositing organic layers in organic light emitting devices
JP3268993B2 (ja) * 1997-01-31 2002-03-25 三洋電機株式会社 表示装置
JPH10288965A (ja) * 1997-04-14 1998-10-27 Casio Comput Co Ltd 表示装置
US5937272A (en) * 1997-06-06 1999-08-10 Eastman Kodak Company Patterned organic layers in a full-color organic electroluminescent display array on a thin film transistor array substrate
JP3466876B2 (ja) * 1997-06-16 2003-11-17 キヤノン株式会社 エレクトロ・ルミネセンス素子の製造法
US5777070A (en) 1997-10-23 1998-07-07 The Dow Chemical Company Process for preparing conjugated polymers
JP4547723B2 (ja) 1998-03-09 2010-09-22 セイコーエプソン株式会社 有機el表示装置の製造方法
WO2000014777A1 (en) 1998-09-04 2000-03-16 Fed Corporation Fabrication method for high resolution full color organic led displays
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices

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EP1657074A1 (de) 2006-05-17
JP2002534782A (ja) 2002-10-15
US20010036561A1 (en) 2001-11-01
EP1144198A1 (de) 2001-10-17
CN1337905A (zh) 2002-02-27
EP1342585B1 (de) 2006-04-19
HK1042454A1 (zh) 2002-08-16
AU4199799A (en) 2000-08-01
KR100654649B1 (ko) 2006-12-07
EP1144198B1 (de) 2002-11-13
EP1657074B1 (de) 2007-05-30
US6586153B2 (en) 2003-07-01
MY126938A (en) 2006-11-30
CN1196602C (zh) 2005-04-13
JP2011093322A (ja) 2011-05-12
EP1342585A1 (de) 2003-09-10
MY128213A (en) 2007-01-31
WO2000041892A1 (en) 2000-07-20
KR20010108097A (ko) 2001-12-07
US6114088A (en) 2000-09-05
US6140009A (en) 2000-10-31
DE69903978T2 (de) 2003-07-17
US6214520B1 (en) 2001-04-10
US20020172887A1 (en) 2002-11-21
AU2723700A (en) 2000-08-01
US6221553B1 (en) 2001-04-24
US6270944B1 (en) 2001-08-07
US6194119B1 (en) 2001-02-27
JP5050103B2 (ja) 2012-10-17

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