DE69906155D1 - Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern - Google Patents

Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern

Info

Publication number
DE69906155D1
DE69906155D1 DE69906155T DE69906155T DE69906155D1 DE 69906155 D1 DE69906155 D1 DE 69906155D1 DE 69906155 T DE69906155 T DE 69906155T DE 69906155 T DE69906155 T DE 69906155T DE 69906155 D1 DE69906155 D1 DE 69906155D1
Authority
DE
Germany
Prior art keywords
wafer
modifying
exposed
wafers
strutured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69906155T
Other languages
English (en)
Other versions
DE69906155T2 (de
Inventor
Charles Hardy
L Trice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE69906155D1 publication Critical patent/DE69906155D1/de
Application granted granted Critical
Publication of DE69906155T2 publication Critical patent/DE69906155T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
DE69906155T 1999-03-10 1999-06-08 Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern Expired - Lifetime DE69906155T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US266208 1999-03-10
US09/266,208 US6238592B1 (en) 1999-03-10 1999-03-10 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
PCT/US1999/012762 WO2000053691A1 (en) 1999-03-10 1999-06-08 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Publications (2)

Publication Number Publication Date
DE69906155D1 true DE69906155D1 (de) 2003-04-24
DE69906155T2 DE69906155T2 (de) 2004-02-12

Family

ID=23013625

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69906155T Expired - Lifetime DE69906155T2 (de) 1999-03-10 1999-06-08 Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern

Country Status (13)

Country Link
US (1) US6238592B1 (de)
EP (1) EP1163311B1 (de)
JP (1) JP4074434B2 (de)
KR (1) KR100577127B1 (de)
CN (1) CN1141353C (de)
AT (1) ATE234906T1 (de)
AU (1) AU4336399A (de)
BR (1) BR9917199A (de)
DE (1) DE69906155T2 (de)
HK (1) HK1043807B (de)
MY (1) MY117212A (de)
TW (1) TWI260342B (de)
WO (1) WO2000053691A1 (de)

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Also Published As

Publication number Publication date
KR100577127B1 (ko) 2006-05-10
CN1141353C (zh) 2004-03-10
HK1043807A1 (en) 2002-09-27
JP2002538284A (ja) 2002-11-12
AU4336399A (en) 2000-09-28
CN1337983A (zh) 2002-02-27
JP4074434B2 (ja) 2008-04-09
HK1043807B (zh) 2004-03-05
US6238592B1 (en) 2001-05-29
ATE234906T1 (de) 2003-04-15
WO2000053691A1 (en) 2000-09-14
EP1163311A1 (de) 2001-12-19
KR20010110655A (ko) 2001-12-13
DE69906155T2 (de) 2004-02-12
TWI260342B (en) 2006-08-21
BR9917199A (pt) 2002-01-08
MY117212A (en) 2004-05-31
EP1163311B1 (de) 2003-03-19

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