DE69908638D1 - Lithographische kontaktstrukturen - Google Patents

Lithographische kontaktstrukturen

Info

Publication number
DE69908638D1
DE69908638D1 DE69908638T DE69908638T DE69908638D1 DE 69908638 D1 DE69908638 D1 DE 69908638D1 DE 69908638 T DE69908638 T DE 69908638T DE 69908638 T DE69908638 T DE 69908638T DE 69908638 D1 DE69908638 D1 DE 69908638D1
Authority
DE
Germany
Prior art keywords
contact structures
lithographic contact
lithographic
structures
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69908638T
Other languages
English (en)
Other versions
DE69908638T2 (de
Inventor
L Mathieu
N Eldridge
W Grube
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/205,022 external-priority patent/US6268015B1/en
Priority claimed from US09/205,023 external-priority patent/US6255126B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE69908638D1 publication Critical patent/DE69908638D1/de
Publication of DE69908638T2 publication Critical patent/DE69908638T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
DE69908638T 1998-12-02 1999-12-01 Lithographische kontaktstrukturen Expired - Lifetime DE69908638T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/205,022 US6268015B1 (en) 1998-12-02 1998-12-02 Method of making and using lithographic contact springs
US09/205,023 US6255126B1 (en) 1998-12-02 1998-12-02 Lithographic contact elements
US205023 1998-12-02
US205022 1998-12-02
PCT/US1999/028597 WO2000033089A2 (en) 1998-12-02 1999-12-01 Lithographic contact elements

Publications (2)

Publication Number Publication Date
DE69908638D1 true DE69908638D1 (de) 2003-07-10
DE69908638T2 DE69908638T2 (de) 2004-04-29

Family

ID=26900020

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69908638T Expired - Lifetime DE69908638T2 (de) 1998-12-02 1999-12-01 Lithographische kontaktstrukturen

Country Status (9)

Country Link
US (2) US7553165B2 (de)
EP (2) EP1135690B1 (de)
JP (3) JP2002531915A (de)
KR (6) KR20070087060A (de)
CN (1) CN1276259C (de)
AU (1) AU2038000A (de)
DE (1) DE69908638T2 (de)
TW (1) TW589453B (de)
WO (1) WO2000033089A2 (de)

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DE69908638T2 (de) 2004-04-29
TW589453B (en) 2004-06-01
WO2000033089A2 (en) 2000-06-08
EP1316803A2 (de) 2003-06-04
JP2002531915A (ja) 2002-09-24
EP1135690A2 (de) 2001-09-26
WO2000033089A3 (en) 2001-03-08
US20090263986A1 (en) 2009-10-22
KR100841127B1 (ko) 2008-06-24
KR20010078403A (ko) 2001-08-20
US7841863B2 (en) 2010-11-30
KR20070087060A (ko) 2007-08-27
CN1276259C (zh) 2006-09-20
US20080254651A1 (en) 2008-10-16
US7553165B2 (en) 2009-06-30
KR20080047629A (ko) 2008-05-29
EP1316803A3 (de) 2005-11-09
EP1135690B1 (de) 2003-06-04
JP2004186670A (ja) 2004-07-02
JP2010266465A (ja) 2010-11-25
AU2038000A (en) 2000-06-19
KR20080024236A (ko) 2008-03-17
KR20070010205A (ko) 2007-01-22
CN1329721A (zh) 2002-01-02

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