DE69911078D1 - Elektronische Komponenten - Google Patents

Elektronische Komponenten

Info

Publication number
DE69911078D1
DE69911078D1 DE69911078T DE69911078T DE69911078D1 DE 69911078 D1 DE69911078 D1 DE 69911078D1 DE 69911078 T DE69911078 T DE 69911078T DE 69911078 T DE69911078 T DE 69911078T DE 69911078 D1 DE69911078 D1 DE 69911078D1
Authority
DE
Germany
Prior art keywords
electronic components
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69911078T
Other languages
English (en)
Inventor
Hidemi Iwao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Application granted granted Critical
Publication of DE69911078D1 publication Critical patent/DE69911078D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F2005/006—Coils with conical spiral form
DE69911078T 1998-01-08 1999-01-08 Elektronische Komponenten Expired - Lifetime DE69911078D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP247298 1998-01-08

Publications (1)

Publication Number Publication Date
DE69911078D1 true DE69911078D1 (de) 2003-10-16

Family

ID=11530276

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69911078T Expired - Lifetime DE69911078D1 (de) 1998-01-08 1999-01-08 Elektronische Komponenten

Country Status (7)

Country Link
US (1) US6218925B1 (de)
EP (1) EP0929085B1 (de)
JP (1) JP3500319B2 (de)
CN (1) CN1196146C (de)
DE (1) DE69911078D1 (de)
HK (1) HK1019815A1 (de)
MY (1) MY123300A (de)

Families Citing this family (71)

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US6675462B1 (en) * 1998-05-01 2004-01-13 Taiyo Yuden Co., Ltd. Method of manufacturing a multi-laminated inductor
US6413340B1 (en) * 1998-10-20 2002-07-02 Tdk Corporation Method for the preparation of laminated inductor device
DE10002377A1 (de) * 2000-01-20 2001-08-02 Infineon Technologies Ag Spule und Spulensystem zur Integration in eine mikroelektronische Schaltung sowie mikroelektronische Schaltung
JP2002324714A (ja) * 2001-02-21 2002-11-08 Tdk Corp コイル封入圧粉磁芯およびその製造方法
JP2003229311A (ja) * 2002-01-31 2003-08-15 Tdk Corp コイル封入圧粉磁芯およびその製造方法、コイルおよびその製造方法
JP3779243B2 (ja) 2002-07-31 2006-05-24 富士通株式会社 半導体装置及びその製造方法
JP4492540B2 (ja) * 2003-10-10 2010-06-30 株式会社村田製作所 積層コイル部品およびその製造方法
JP4211591B2 (ja) * 2003-12-05 2009-01-21 株式会社村田製作所 積層型電子部品の製造方法および積層型電子部品
JP2007134555A (ja) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd 電子部品及びその製造方法
JP5008926B2 (ja) * 2006-08-23 2012-08-22 Ｔｄｋ株式会社 積層型インダクタ及び積層型インダクタのインダクタンス調整方法
JP4028884B1 (ja) * 2006-11-01 2007-12-26 Ｔｄｋ株式会社 コイル部品
JP2008192673A (ja) * 2007-02-01 2008-08-21 Matsushita Electric Ind Co Ltd インダクタンス部品
US8004792B2 (en) * 2007-04-12 2011-08-23 International Business Machines Corporation Magnetic write transducer
EP2214181B1 (de) * 2007-12-26 2016-04-13 Murata Manufacturing Co. Ltd. Geschichtete elektronische komponente und elektronisches komponentenmodul damit
US9001527B2 (en) * 2008-02-18 2015-04-07 Cyntec Co., Ltd. Electronic package structure
JP4780175B2 (ja) * 2008-10-30 2011-09-28 株式会社村田製作所 電子部品
CN101521087B (zh) * 2008-11-17 2012-12-05 深圳振华富电子有限公司 一种电感器及其制造方法
SE534510C2 (sv) * 2008-11-19 2011-09-13 Silex Microsystems Ab Funktionell inkapsling
CN102308344B (zh) * 2009-02-10 2013-10-16 株式会社村田制作所 电子元器件
WO2010100997A1 (ja) * 2009-03-02 2010-09-10 株式会社村田製作所 電子部品及び電子装置
DE102009022992A1 (de) * 2009-03-02 2010-10-07 Micro-Epsilon Messtechnik Gmbh & Co. Kg Positionssensor
JP2011029520A (ja) * 2009-07-29 2011-02-10 Murata Mfg Co Ltd 電子部品
JP5223821B2 (ja) * 2009-08-28 2013-06-26 Ｔｄｋ株式会社 積層型電子部品
JP5365420B2 (ja) * 2009-08-28 2013-12-11 Ｔｄｋ株式会社 積層型電子部品
US8254142B2 (en) 2009-09-22 2012-08-28 Wintec Industries, Inc. Method of using conductive elastomer for electrical contacts in an assembly
US8593825B2 (en) * 2009-10-14 2013-11-26 Wintec Industries, Inc. Apparatus and method for vertically-structured passive components
US8519575B2 (en) 2009-11-09 2013-08-27 Nucleus Scientific, Inc. Linear electric machine with linear-to-rotary converter
US8624699B2 (en) * 2009-11-09 2014-01-07 Nucleus Scientific, Inc. Electric coil and method of manufacture
CN101789307A (zh) * 2010-03-15 2010-07-28 深圳顺络电子股份有限公司 一种叠层片式元器件内电极的螺形线圈的结构
WO2011145517A1 (ja) * 2010-05-19 2011-11-24 株式会社村田製作所 電子部品
WO2012023315A1 (ja) * 2010-08-18 2012-02-23 株式会社村田製作所 電子部品及びその製造方法
KR101218985B1 (ko) * 2011-05-31 2013-01-04 삼성전기주식회사 칩형 코일 부품
US8766493B2 (en) 2011-07-01 2014-07-01 Nucleus Scientific, Inc. Magnetic stator assembly
JP5962754B2 (ja) 2012-03-27 2016-08-03 株式会社村田製作所 電子部品
JP5288025B2 (ja) * 2012-04-27 2013-09-11 Ｔｄｋ株式会社 積層型インダクタ及び積層型インダクタのインダクタンス調整方法
KR20140023141A (ko) * 2012-08-17 2014-02-26 삼성전기주식회사 인덕터 및 인덕터 제조방법
JP2014107513A (ja) * 2012-11-29 2014-06-09 Taiyo Yuden Co Ltd 積層インダクタ
WO2015016079A1 (ja) 2013-07-29 2015-02-05 株式会社村田製作所 積層コイル
CN105408972B (zh) * 2013-08-13 2018-04-13 株式会社村田制作所 电子部件
KR101642578B1 (ko) * 2013-10-16 2016-08-10 삼성전기주식회사 코일부품, 그 실장기판 및 포장체
US20150102891A1 (en) * 2013-10-16 2015-04-16 Samsung Electro-Mechanics Co., Ltd. Chip electronic component, board having the same, and packaging unit thereof
KR20150114747A (ko) * 2014-04-02 2015-10-13 삼성전기주식회사 칩형 코일 부품 및 그 실장 기판
KR102004791B1 (ko) 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR101686989B1 (ko) 2014-08-07 2016-12-19 주식회사 모다이노칩 파워 인덕터
KR20160019265A (ko) * 2014-08-11 2016-02-19 삼성전기주식회사 칩형 코일 부품 및 그 제조방법
KR101662209B1 (ko) 2014-09-11 2016-10-06 주식회사 모다이노칩 파워 인덕터 및 그 제조 방법
KR101580411B1 (ko) * 2014-09-22 2015-12-23 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
KR101832546B1 (ko) * 2014-10-16 2018-02-26 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
KR101607027B1 (ko) * 2014-11-19 2016-03-28 삼성전기주식회사 칩 전자 부품 및 칩 전자 부품의 실장 기판
KR101709841B1 (ko) * 2014-12-30 2017-02-23 삼성전기주식회사 칩 전자부품 및 그 제조방법
JP6544080B2 (ja) * 2015-06-30 2019-07-17 株式会社村田製作所 コイル部品
JP6534880B2 (ja) * 2015-07-14 2019-06-26 太陽誘電株式会社 インダクタ及びプリント基板
JP6465046B2 (ja) * 2016-02-09 2019-02-06 株式会社村田製作所 電子部品
JP6536437B2 (ja) * 2016-03-04 2019-07-03 株式会社村田製作所 電子部品
CN109716630B (zh) 2016-09-13 2021-01-22 核科学股份有限公司 多连杆电传动系统
JP6594837B2 (ja) 2016-09-30 2019-10-23 太陽誘電株式会社 コイル部品
JP6380716B1 (ja) * 2016-11-28 2018-08-29 株式会社村田製作所 多層基板、多層基板の回路基板への実装構造、および多層基板の製造方法
JP6569654B2 (ja) * 2016-12-14 2019-09-04 株式会社村田製作所 チップインダクタ
KR102597150B1 (ko) * 2016-12-20 2023-11-02 삼성전기주식회사 인덕터 및 그 실장기판
KR101952866B1 (ko) 2017-02-22 2019-02-27 삼성전기주식회사 파워 인덕터, 그 실장 기판, 및 파워 인덕터를 이용한 전류 측정 방법
KR101892849B1 (ko) * 2017-03-02 2018-08-28 삼성전기주식회사 전자 부품
KR101952873B1 (ko) * 2017-07-05 2019-02-27 삼성전기주식회사 박막형 인덕터
JP6780629B2 (ja) * 2017-11-27 2020-11-04 株式会社村田製作所 積層型コイル部品
JP2019096818A (ja) * 2017-11-27 2019-06-20 株式会社村田製作所 積層型コイル部品
JP6954217B2 (ja) * 2018-04-02 2021-10-27 株式会社村田製作所 積層型コイル部品
JP6954216B2 (ja) * 2018-04-02 2021-10-27 株式会社村田製作所 積層型コイル部品
KR102064072B1 (ko) * 2018-04-26 2020-01-08 삼성전기주식회사 인덕터
KR102609134B1 (ko) * 2018-05-14 2023-12-05 삼성전기주식회사 인덕터 및 이를 구비하는 인덕터 모듈
JP7088083B2 (ja) * 2019-03-04 2022-06-21 株式会社村田製作所 積層型コイル部品
JP7151655B2 (ja) * 2019-07-27 2022-10-12 株式会社村田製作所 インダクタ
JP7167971B2 (ja) * 2020-10-14 2022-11-09 株式会社村田製作所 積層型コイル部品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812442A (en) * 1972-02-29 1974-05-21 W Muckelroy Ceramic inductor
US3765082A (en) * 1972-09-20 1973-10-16 San Fernando Electric Mfg Method of making an inductor chip
JPS59189212U (ja) * 1983-05-18 1984-12-15 株式会社村田製作所 チツプ型インダクタ
JPH02172207A (ja) * 1988-12-23 1990-07-03 Murata Mfg Co Ltd 積層型インダクター
US5302932A (en) * 1992-05-12 1994-04-12 Dale Electronics, Inc. Monolythic multilayer chip inductor and method for making same
JPH07320936A (ja) * 1994-05-24 1995-12-08 Taiyo Yuden Co Ltd 積層形チップインダクタ
JPH0855726A (ja) 1994-08-10 1996-02-27 Taiyo Yuden Co Ltd 積層型電子部品及びその製造方法
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5945902A (en) * 1997-09-22 1999-08-31 Zefv Lipkes Core and coil structure and method of making the same

Also Published As

Publication number Publication date
CN1222745A (zh) 1999-07-14
EP0929085A3 (de) 2000-02-23
JP3500319B2 (ja) 2004-02-23
JPH11260644A (ja) 1999-09-24
MY123300A (en) 2006-05-31
US6218925B1 (en) 2001-04-17
EP0929085A2 (de) 1999-07-14
CN1196146C (zh) 2005-04-06
EP0929085B1 (de) 2003-09-10
HK1019815A1 (en) 2000-02-25

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Legal Events

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8332 No legal effect for de