DE69914507D1 - Verfahren zur herstellung eines innenschicht-kontaktlochs und ein dazu verwendbarer laminatvorläufer - Google Patents

Verfahren zur herstellung eines innenschicht-kontaktlochs und ein dazu verwendbarer laminatvorläufer

Info

Publication number
DE69914507D1
DE69914507D1 DE69914507T DE69914507T DE69914507D1 DE 69914507 D1 DE69914507 D1 DE 69914507D1 DE 69914507 T DE69914507 T DE 69914507T DE 69914507 T DE69914507 T DE 69914507T DE 69914507 D1 DE69914507 D1 DE 69914507D1
Authority
DE
Germany
Prior art keywords
precurrent
laminate
producing
contact hole
inner layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69914507T
Other languages
English (en)
Other versions
DE69914507T2 (de
Inventor
C Smith
Michael Petti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE69914507D1 publication Critical patent/DE69914507D1/de
Application granted granted Critical
Publication of DE69914507T2 publication Critical patent/DE69914507T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
DE1999614507 1998-11-06 1999-11-05 Verfahren zur herstellung eines innenschicht-kontaktlochs und ein dazu verwendbarer laminatvorläufer Expired - Fee Related DE69914507T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US187642 1998-11-06
US09/187,642 US6120693A (en) 1998-11-06 1998-11-06 Method of manufacturing an interlayer via and a laminate precursor useful for same
PCT/US1999/026255 WO2000028798A1 (en) 1998-11-06 1999-11-05 Method of manufacturing an interlayer via and a laminate precursor useful for same

Publications (2)

Publication Number Publication Date
DE69914507D1 true DE69914507D1 (de) 2004-03-04
DE69914507T2 DE69914507T2 (de) 2004-11-18

Family

ID=22689843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999614507 Expired - Fee Related DE69914507T2 (de) 1998-11-06 1999-11-05 Verfahren zur herstellung eines innenschicht-kontaktlochs und ein dazu verwendbarer laminatvorläufer

Country Status (10)

Country Link
US (2) US6120693A (de)
EP (1) EP1135977B1 (de)
JP (1) JP2002529281A (de)
KR (1) KR20010075688A (de)
CN (1) CN1333999A (de)
AU (1) AU1470900A (de)
CA (1) CA2350075A1 (de)
DE (1) DE69914507T2 (de)
ES (1) ES2214916T3 (de)
WO (1) WO2000028798A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6120693A (en) * 1998-11-06 2000-09-19 Alliedsignal Inc. Method of manufacturing an interlayer via and a laminate precursor useful for same
JP3344363B2 (ja) * 1999-05-18 2002-11-11 松下電器産業株式会社 マスクフィルムとその製造方法およびそれを用いた回路基板の製造方法
EP1333708A4 (de) * 2001-07-19 2008-08-13 Toray Industries Leiterplatte, leiterplatten-benutzungselement und herstellungsverfahren dafür und verfahren zum laminieren einer flexiblen folie
WO2003098984A1 (fr) * 2002-05-21 2003-11-27 Daiwa Co., Ltd. Structure d'interconnexion entre couches et procede de fabrication associe
JP2004119729A (ja) * 2002-09-26 2004-04-15 Sanyo Electric Co Ltd 回路装置の製造方法
US6982022B2 (en) * 2003-05-21 2006-01-03 Xerox Corporation Formation of photopatterned ink jet nozzle plates by transfer methods
US7146086B2 (en) * 2003-06-30 2006-12-05 Intel Corporation Constructing well structures for hybrid optical waveguides
US7407712B2 (en) 2003-12-26 2008-08-05 Sekisui Chemical Co., Ltd. Release film
US7079373B2 (en) * 2004-04-30 2006-07-18 Motorola, Inc. Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
US7565738B2 (en) * 2004-05-31 2009-07-28 Sanyo Electric Co., Ltd. Method for manufacturing circuit device
US20110127879A1 (en) * 2009-12-01 2011-06-02 Kita Ronald J Chiral gravitational shielding material
US10099462B2 (en) * 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
US9630385B2 (en) 2012-11-08 2017-04-25 Toray Plastics (America), Inc. Releasable polyester metal transfer film
CN203072250U (zh) * 2012-12-20 2013-07-17 奥特斯(中国)有限公司 用于生产印制电路板的半成品及印制电路板
EP3075006A1 (de) 2013-11-27 2016-10-05 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenstruktur
AT515101B1 (de) 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
AT515447B1 (de) 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte
WO2018088754A1 (ko) * 2016-11-11 2018-05-17 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
JP2023514253A (ja) * 2020-02-13 2023-04-05 アヴェラテック・コーポレイション 触媒化金属箔およびその用途
US11877404B2 (en) * 2020-02-13 2024-01-16 Averatek Corporation Catalyzed metal foil and uses thereof

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778900A (en) * 1970-09-04 1973-12-18 Ibm Method for forming interconnections between circuit layers of a multi-layer package
US4024030A (en) * 1971-07-30 1977-05-17 Institute Po Phisikohimia Pri Bulgarska Akademia Na Naukite Radiation sensitive elements and photographic processes using the same
US3773514A (en) * 1971-08-12 1973-11-20 Fromson H A Light-sensitive structure
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
US4448636A (en) * 1982-06-02 1984-05-15 Texas Instruments Incorporated Laser assisted lift-off
US4621019A (en) * 1985-02-19 1986-11-04 Minnesota Mining And Manufacturing Company Non-photosensitive transfer resist
US5302494A (en) * 1985-06-10 1994-04-12 The Foxboro Company Multilayer circuit board having microporous layers and process for making same
US4911785A (en) * 1987-02-04 1990-03-27 Andus Corporation The method of forming a thin film artwork compounds
US4780177A (en) * 1988-02-05 1988-10-25 General Electric Company Excimer laser patterning of a novel resist
JP2773366B2 (ja) * 1990-03-19 1998-07-09 富士通株式会社 多層配線基板の形成方法
JP2739726B2 (ja) * 1990-09-27 1998-04-15 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層プリント回路板
US5334487A (en) * 1992-07-23 1994-08-02 International Business Machines Corporation Method for forming a patterned layer on a substrate
US5464690A (en) * 1994-04-04 1995-11-07 Novavision, Inc. Holographic document and method for forming
US5705570A (en) * 1995-06-07 1998-01-06 International Business Machines Corporation Ablatively photodecomposable compositions
KR100222752B1 (ko) * 1996-06-27 1999-10-01 이형도 레이저를 이용한 다층 인쇄회로기판의 제조방법
WO1998047332A1 (en) * 1997-04-16 1998-10-22 Alliedsignal Inc. Positive working photodefinable resin coated metal for mass production of microvias in multilayer printed wiring boards
US6255039B1 (en) * 1997-04-16 2001-07-03 Isola Laminate Systems Corp. Fabrication of high density multilayer interconnect printed circuit boards
US6120693A (en) * 1998-11-06 2000-09-19 Alliedsignal Inc. Method of manufacturing an interlayer via and a laminate precursor useful for same

Also Published As

Publication number Publication date
EP1135977B1 (de) 2004-01-28
JP2002529281A (ja) 2002-09-10
WO2000028798A1 (en) 2000-05-18
AU1470900A (en) 2000-05-29
US6368697B1 (en) 2002-04-09
DE69914507T2 (de) 2004-11-18
KR20010075688A (ko) 2001-08-09
CN1333999A (zh) 2002-01-30
EP1135977A1 (de) 2001-09-26
CA2350075A1 (en) 2000-05-18
US6120693A (en) 2000-09-19
ES2214916T3 (es) 2004-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee