DE69916970D1 - Innenverkleidungsteil mit nuten zur integrierten formgebung von elektrischen schaltungen - Google Patents
Innenverkleidungsteil mit nuten zur integrierten formgebung von elektrischen schaltungenInfo
- Publication number
- DE69916970D1 DE69916970D1 DE69916970T DE69916970T DE69916970D1 DE 69916970 D1 DE69916970 D1 DE 69916970D1 DE 69916970 T DE69916970 T DE 69916970T DE 69916970 T DE69916970 T DE 69916970T DE 69916970 D1 DE69916970 D1 DE 69916970D1
- Authority
- DE
- Germany
- Prior art keywords
- grooves
- covering part
- electrical circuits
- interior covering
- integrated shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B60R13/02—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B60R13/02—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners
- B60R13/0237—Side or rear panels
- B60R13/0243—Doors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B60R13/02—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners
- B60R2013/0287—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners integrating other functions or accessories
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/085,986 US6106303A (en) | 1998-05-27 | 1998-05-27 | Trim panel having grooves with integrally formed electrical circuits |
US85986 | 1998-05-27 | ||
PCT/US1999/011505 WO1999061282A1 (en) | 1998-05-27 | 1999-05-25 | Trim panel having grooves with integrally formed electrical circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69916970D1 true DE69916970D1 (de) | 2004-06-09 |
DE69916970T2 DE69916970T2 (de) | 2004-10-28 |
Family
ID=22195240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69916970T Expired - Fee Related DE69916970T2 (de) | 1998-05-27 | 1999-05-25 | Innenverkleidungsteil mit nuten zur integrierten formgebung von elektrischen schaltungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US6106303A (de) |
EP (1) | EP0999950B1 (de) |
JP (1) | JP2002516209A (de) |
KR (1) | KR20010021715A (de) |
DE (1) | DE69916970T2 (de) |
WO (1) | WO1999061282A1 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3489665B2 (ja) * | 1999-04-13 | 2004-01-26 | 矢崎総業株式会社 | インパネ用ワイヤハーネス装置 |
DE19931189A1 (de) * | 1999-07-07 | 2001-01-25 | Meritor Automotive Gmbh | Verfahren zur Herstellung von Bauteilen mit darin angeordneten elektrischen Leiterbahnen sowie danach hergestellte Bauteile, insbesondere als Türmodule für Kraftfahrzeuge |
GB9928485D0 (en) * | 1999-12-03 | 2000-02-02 | New Transducers Ltd | Vehicle trim panels |
US6640434B1 (en) | 2000-04-11 | 2003-11-04 | Lear Corporation | Method of forming an electrical circuit on a substrate |
US20020104668A1 (en) * | 2000-05-01 | 2002-08-08 | Lear Corporation | Method and apparatus for making an electrical distribution conductor and resultant product |
DE10196327T1 (de) * | 2000-06-08 | 2003-05-22 | Lear Corp | Modulare Dachhimmel-Baueinheit und Verfahren für ihre Herstellung |
MXPA03003695A (es) * | 2000-10-25 | 2005-01-25 | Velcro Ind | Aseguramiento de conductores electricos. |
DE10109087A1 (de) * | 2001-02-24 | 2002-10-24 | Leoni Bordnetz Sys Gmbh & Co | Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn |
DE10109086C2 (de) * | 2001-02-24 | 2003-04-30 | Leoni Bordnetz Sys Gmbh & Co | Formbauteil |
US6565142B1 (en) * | 2001-10-31 | 2003-05-20 | Lear Corporation | Vehicle door inner trim panel assembly including electrical control panel |
DE10154110A1 (de) * | 2001-11-03 | 2003-05-22 | Leoni Ag | Verfahren zum Herstellen eines Trägermaterials mit einer integrierten Leiterbahn |
DE10207589A1 (de) * | 2002-02-22 | 2003-10-16 | Leoni Ag | Verfahren zum Erzeugen einer Leiterbahn auf einem Trägerbauteil sowie Trägerbauteil |
US20050218170A1 (en) * | 2004-04-01 | 2005-10-06 | Allmond Neal R | Pocket liner for a motor vehicle door panel |
CN101277805A (zh) * | 2005-07-28 | 2008-10-01 | 维尔克工业有限公司 | 形成具有可与环接合的触碰固紧件的导电带 |
WO2007016224A1 (en) * | 2005-07-28 | 2007-02-08 | Velcro Industries B.V. | Mounting electrical components |
US20080098655A1 (en) * | 2006-10-31 | 2008-05-01 | Jeffrey Valentage | Integrated bracket for mounting pulley |
DE602006011851D1 (de) * | 2006-04-07 | 2010-03-11 | Antolin Grupo Ing Sa | Verfahren zur Montage und Montagemodul für Heckklappe eines Motorfahrzeuges, und Heckklappe |
PL2183130T3 (pl) | 2007-07-27 | 2013-08-30 | Johnson Controls Tech Co | Podsufitka kompozytowa z udoskonaloną skutecznością akustyczną |
US7641264B2 (en) * | 2007-10-05 | 2010-01-05 | Sika Technology, AG | Reinforcement device |
US20090096251A1 (en) * | 2007-10-16 | 2009-04-16 | Sika Technology Ag | Securing mechanism |
US8061886B1 (en) | 2008-04-30 | 2011-11-22 | Velcro Industries B.V. | Securing electrical devices |
DE102008056120A1 (de) | 2008-11-06 | 2010-05-12 | Johnson Controls Interiors Gmbh & Co. Kg | Aggregatträger einer Fahrzeugtür mit einem Kabelkanal |
KR20110117139A (ko) | 2009-01-06 | 2011-10-26 | 존슨 컨트롤스 테크놀러지 컴퍼니 | 일체형 와이어 하니스를 구비한 헤드라이너 |
JP6335571B2 (ja) * | 2014-03-24 | 2018-05-30 | 矢崎総業株式会社 | ワイヤハーネスのアーシング構造、及び、アース機能付きピラーガーニッシュ |
JP6530699B2 (ja) * | 2015-11-27 | 2019-06-12 | 矢崎総業株式会社 | 車両用パネル及び車両用配線構造 |
JP2017147269A (ja) * | 2016-02-15 | 2017-08-24 | 株式会社デンソー | 車両用電装部品の製造方法 |
DE102017208482A1 (de) * | 2017-05-19 | 2018-11-22 | Volkswagen Aktiengesellschaft | Multifunktionsmodul |
JP2019099053A (ja) * | 2017-12-06 | 2019-06-24 | トヨタ自動車株式会社 | 車両用内装部材 |
DE102020109335A1 (de) | 2020-04-03 | 2021-10-07 | Bayerische Motoren Werke Aktiengesellschaft | Formteil mit elektrischer Kontaktierung |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1457805A (en) * | 1974-03-01 | 1976-12-08 | Mullard Ltd | Electric circuit modules |
US4065197A (en) * | 1974-06-17 | 1977-12-27 | Chomerics, Inc. | Isolated paths connector |
US4031268A (en) * | 1976-01-05 | 1977-06-21 | Sirius Corporation | Process for spraying metallic patterns on a substrate |
US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
JPS6346945A (ja) * | 1986-08-14 | 1988-02-27 | Yazaki Corp | 自動車用ワイヤ−ハ−ネス装置 |
US4848829A (en) * | 1987-10-26 | 1989-07-18 | General Motors Corporation | Door trim panel assembly |
DE3821121A1 (de) * | 1988-06-23 | 1990-02-08 | Ullmann Ulo Werk | Verfahren zur herstellung von kontakttraegerkoerpern |
US5950305A (en) * | 1992-02-14 | 1999-09-14 | Research Organization For Circuit Knowledge | Environmentally desirable method of manufacturing printed circuits |
US5309634A (en) * | 1992-04-28 | 1994-05-10 | Prince Corporation | Method of assembling electrical circuit to vehicle panel |
FR2708170B1 (fr) * | 1993-07-19 | 1995-09-08 | Innovation Dev Cie Gle | Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant. |
GB9603836D0 (en) * | 1996-02-23 | 1996-04-24 | Rover Group | A vehicle door assembly |
US5712764A (en) * | 1996-05-03 | 1998-01-27 | Ford Motor Company | Apparatus and method of assembling vehicle instrument panel structural and electronic components |
US5743010A (en) * | 1996-07-24 | 1998-04-28 | Ut Automotive Dearborn, Inc. | Wire harness assembly on trim panel |
-
1998
- 1998-05-27 US US09/085,986 patent/US6106303A/en not_active Expired - Fee Related
-
1999
- 1999-05-25 JP JP2000550707A patent/JP2002516209A/ja active Pending
- 1999-05-25 EP EP99953321A patent/EP0999950B1/de not_active Expired - Lifetime
- 1999-05-25 DE DE69916970T patent/DE69916970T2/de not_active Expired - Fee Related
- 1999-05-25 KR KR1020007000274A patent/KR20010021715A/ko not_active Application Discontinuation
- 1999-05-25 WO PCT/US1999/011505 patent/WO1999061282A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE69916970T2 (de) | 2004-10-28 |
US6106303A (en) | 2000-08-22 |
WO1999061282A1 (en) | 1999-12-02 |
KR20010021715A (ko) | 2001-03-15 |
EP0999950A1 (de) | 2000-05-17 |
EP0999950B1 (de) | 2004-05-06 |
JP2002516209A (ja) | 2002-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |