DE69918063D1 - Reaktor zur radiofrequenz betriebenen plasma-aktivierten chemischen dampfabscheidung und verfahren - Google Patents

Reaktor zur radiofrequenz betriebenen plasma-aktivierten chemischen dampfabscheidung und verfahren

Info

Publication number
DE69918063D1
DE69918063D1 DE69918063T DE69918063T DE69918063D1 DE 69918063 D1 DE69918063 D1 DE 69918063D1 DE 69918063 T DE69918063 T DE 69918063T DE 69918063 T DE69918063 T DE 69918063T DE 69918063 D1 DE69918063 D1 DE 69918063D1
Authority
DE
Germany
Prior art keywords
frequency
electrode
vapor deposition
chemical vapor
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918063T
Other languages
English (en)
Other versions
DE69918063T2 (de
Inventor
Sujit Sharan
S Sandhu
Paul Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Micron Technology Inc
Original Assignee
Applied Materials Inc
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Micron Technology Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69918063D1 publication Critical patent/DE69918063D1/de
Publication of DE69918063T2 publication Critical patent/DE69918063T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155—Frequency modulation
    • H01J37/32165—Plural frequencies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE69918063T 1998-02-19 1999-02-16 Reaktor zur radiofrequenz betriebenen plasma-aktivierten chemischen dampfabscheidung und verfahren Expired - Lifetime DE69918063T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/026,566 US6112697A (en) 1998-02-19 1998-02-19 RF powered plasma enhanced chemical vapor deposition reactor and methods
US26566 1998-02-19
PCT/US1999/003229 WO1999043017A1 (en) 1998-02-19 1999-02-16 Rf powered plasma enhanced chemical vapor deposition reactor and methods

Publications (2)

Publication Number Publication Date
DE69918063D1 true DE69918063D1 (de) 2004-07-22
DE69918063T2 DE69918063T2 (de) 2005-06-30

Family

ID=21832548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918063T Expired - Lifetime DE69918063T2 (de) 1998-02-19 1999-02-16 Reaktor zur radiofrequenz betriebenen plasma-aktivierten chemischen dampfabscheidung und verfahren

Country Status (9)

Country Link
US (2) US6112697A (de)
EP (1) EP1057207B1 (de)
JP (2) JP3822055B2 (de)
KR (1) KR100388529B1 (de)
AT (1) ATE269586T1 (de)
AU (1) AU3293999A (de)
DE (1) DE69918063T2 (de)
TW (1) TW523830B (de)
WO (1) WO1999043017A1 (de)

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US20090104541A1 (en) * 2007-10-23 2009-04-23 Eui Kyoon Kim Plasma surface treatment to prevent pattern collapse in immersion lithography
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Also Published As

Publication number Publication date
WO1999043017A1 (en) 1999-08-26
ATE269586T1 (de) 2004-07-15
JP3822055B2 (ja) 2006-09-13
KR20010040831A (ko) 2001-05-15
EP1057207A1 (de) 2000-12-06
US6112697A (en) 2000-09-05
EP1057207B1 (de) 2004-06-16
AU3293999A (en) 1999-09-06
US6227141B1 (en) 2001-05-08
JP2002504748A (ja) 2002-02-12
JP4217883B2 (ja) 2009-02-04
DE69918063T2 (de) 2005-06-30
KR100388529B1 (ko) 2003-06-25
TW523830B (en) 2003-03-11
JP2004006885A (ja) 2004-01-08

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