DE69923599D1 - Verfahren zur übertragung von bauteilträgerband-informationen zu einem bauteil-bestückungsapparat und vorrichtung dafür - Google Patents

Verfahren zur übertragung von bauteilträgerband-informationen zu einem bauteil-bestückungsapparat und vorrichtung dafür

Info

Publication number
DE69923599D1
DE69923599D1 DE69923599T DE69923599T DE69923599D1 DE 69923599 D1 DE69923599 D1 DE 69923599D1 DE 69923599 T DE69923599 T DE 69923599T DE 69923599 T DE69923599 T DE 69923599T DE 69923599 D1 DE69923599 D1 DE 69923599D1
Authority
DE
Germany
Prior art keywords
tape
component
mounting machine
component mounting
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69923599T
Other languages
English (en)
Other versions
DE69923599T2 (de
Inventor
Johan Bergstroem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mycronic Technologies AB
Original Assignee
MyData Automation AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48901202&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69923599(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from SE9804495A external-priority patent/SE9804495D0/xx
Priority claimed from SE9901057A external-priority patent/SE9901057D0/xx
Application filed by MyData Automation AB filed Critical MyData Automation AB
Publication of DE69923599D1 publication Critical patent/DE69923599D1/de
Application granted granted Critical
Publication of DE69923599T2 publication Critical patent/DE69923599T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S242/00—Winding, tensioning, or guiding
    • Y10S242/912—Indicator or alarm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1105—Delaminating process responsive to feed or shape at delamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1906—Delaminating means responsive to feed or shape at delamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Labeling Devices (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
DE69923599T 1998-12-22 1999-12-22 Verfahren zur übertragung von bauteilträgerband-informationen zu einem bauteil-bestückungsapparat und vorrichtung dafür Expired - Lifetime DE69923599T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
SE9804495A SE9804495D0 (sv) 1998-12-22 1998-12-22 Separating device, tape guide including such a devide, and a method using such a device
SE9804495 1998-12-22
SE9901057A SE9901057D0 (sv) 1999-03-23 1999-03-23 Device at a component mounting machine
SE9901057 1999-03-23
PCT/SE1999/002465 WO2000038492A1 (en) 1998-12-22 1999-12-22 Method for transferring component tape information to a component mounting machine and means therefore

Publications (2)

Publication Number Publication Date
DE69923599D1 true DE69923599D1 (de) 2005-03-10
DE69923599T2 DE69923599T2 (de) 2006-03-23

Family

ID=48901202

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69923599T Expired - Lifetime DE69923599T2 (de) 1998-12-22 1999-12-22 Verfahren zur übertragung von bauteilträgerband-informationen zu einem bauteil-bestückungsapparat und vorrichtung dafür

Country Status (7)

Country Link
US (2) US6631870B2 (de)
EP (1) EP1147697B1 (de)
JP (2) JP4486259B2 (de)
AT (1) ATE288673T1 (de)
AU (1) AU2137000A (de)
DE (1) DE69923599T2 (de)
WO (1) WO2000038492A1 (de)

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SE522521C2 (sv) 2001-09-07 2004-02-10 Mydata Automation Ab Förfarande, system och arrangemang för hantering av komponenttejper
ATE464780T1 (de) 2001-09-19 2010-04-15 Mydata Automation Ab Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern
US7273166B2 (en) * 2002-11-11 2007-09-25 Fuji Machine Mfg. Co., Ltd. Component information applying method and apparatus
ATE370640T1 (de) * 2003-11-10 2007-09-15 Mydata Automation Ab Aussetzungsvorrichtung und bandführungsvorrichtung für eine bauteilbestückungsmaschine
CN2843020Y (zh) * 2005-03-04 2006-11-29 鸿富锦精密工业（深圳）有限公司 料带上胶带的导出装置
WO2006126465A1 (en) * 2005-05-23 2006-11-30 Matsushita Electric Industrial Co., Ltd. Electronic components carrier tape package and electronic components feeding apparatus
JP4820728B2 (ja) * 2006-10-03 2011-11-24 ヤマハ発動機株式会社 部品供給装置、並びに表面実装機
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JP5459239B2 (ja) 2011-02-08 2014-04-02 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
JP5445484B2 (ja) 2011-02-08 2014-03-19 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
JP5510354B2 (ja) * 2011-02-08 2014-06-04 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
JP5730050B2 (ja) * 2011-02-09 2015-06-03 富士機械製造株式会社 部品エラー表示装置
JP5846630B2 (ja) * 2011-11-01 2016-01-20 富士機械製造株式会社 テープフィーダ
JP5797087B2 (ja) * 2011-11-01 2015-10-21 富士機械製造株式会社 テープフィーダ
JP5748284B2 (ja) * 2011-11-01 2015-07-15 富士機械製造株式会社 テープフィーダ
US10178819B2 (en) 2012-03-12 2019-01-08 Micronic Mydata AB Method and device for automatic storage of electronic components
JP5902569B2 (ja) * 2012-06-29 2016-04-13 ヤマハ発動機株式会社 電子部品の装着方法及びその装着装置
JP5967542B2 (ja) * 2012-10-22 2016-08-10 パナソニックＩｐマネジメント株式会社 キャリアテープのトップテープ剥離装置および剥離方法
US9547284B2 (en) * 2013-03-15 2017-01-17 John S. Youngquist Auto-setup control process
US20140318713A1 (en) * 2013-03-15 2014-10-30 Kelvin Wiley Interchangeable cut tape / leaderless feeder finger adaptable to various surface mount assembly machine feeders for chip mounters
JP6245517B2 (ja) * 2013-06-14 2017-12-13 パナソニックＩｐマネジメント株式会社 部品供給装置および部品供給方法
WO2015029124A1 (ja) * 2013-08-26 2015-03-05 富士機械製造株式会社 フィーダ
CN111465309B (zh) 2013-09-18 2021-11-30 迈康尼股份公司 用于组件的改进的存储和处理的方法、系统和设备
JP6320001B2 (ja) * 2013-11-25 2018-05-09 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． テープ先端処理治具
CN104661509B (zh) * 2013-11-25 2018-11-30 韩华泰科株式会社 带端处理设备
US10772249B2 (en) 2015-03-18 2020-09-08 Mycronic AB Method, system and device for providing and changing information related to an SMT job
EP3349557B1 (de) * 2015-09-08 2019-08-14 FUJI Corporation Bandzuführer
JP6219427B2 (ja) * 2016-03-10 2017-10-25 ヤマハ発動機株式会社 電子部品の装着方法及びその装着装置
WO2019026182A1 (ja) 2017-08-01 2019-02-07 ヤマハ発動機株式会社 テープ先端処理方法及びテープ先端処理用治具、並びにテープ先端処理装置
JP7126056B2 (ja) * 2017-08-21 2022-08-26 パナソニックＩｐマネジメント株式会社 部品供給装置および部品供給装置におけるテープ剥離方法
JP2020161746A (ja) * 2019-03-28 2020-10-01 パナソニックＩｐマネジメント株式会社 部品供給システムおよび部品供給装置ならびに部品供給方法
JP7357143B2 (ja) * 2020-03-10 2023-10-05 株式会社Fuji テープガイド管理システム
CN113630985B (zh) * 2020-05-09 2022-09-30 南通深南电路有限公司 一种电路板的加工系统和加工方法

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Also Published As

Publication number Publication date
US20020053136A1 (en) 2002-05-09
US20040149383A1 (en) 2004-08-05
WO2000038492A1 (en) 2000-06-29
US6631870B2 (en) 2003-10-14
US7096571B2 (en) 2006-08-29
AU2137000A (en) 2000-07-12
EP1147697A1 (de) 2001-10-24
JP2010056575A (ja) 2010-03-11
DE69923599T2 (de) 2006-03-23
JP2002533944A (ja) 2002-10-08
EP1147697B1 (de) 2005-02-02
JP4486259B2 (ja) 2010-06-23
ATE288673T1 (de) 2005-02-15

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