DE69939569D1 - Verfahren zum chemomechanischen Polieren einer Schicht aus einem Cu-basierendem Stoff - Google Patents
Verfahren zum chemomechanischen Polieren einer Schicht aus einem Cu-basierendem StoffInfo
- Publication number
- DE69939569D1 DE69939569D1 DE69939569T DE69939569T DE69939569D1 DE 69939569 D1 DE69939569 D1 DE 69939569D1 DE 69939569 T DE69939569 T DE 69939569T DE 69939569 T DE69939569 T DE 69939569T DE 69939569 D1 DE69939569 D1 DE 69939569D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- based substance
- polishing
- chemomechanical polishing
- comprised
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9809873A FR2781922B1 (fr) | 1998-07-31 | 1998-07-31 | Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69939569D1 true DE69939569D1 (de) | 2008-10-30 |
Family
ID=9529285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69939569T Expired - Lifetime DE69939569D1 (de) | 1998-07-31 | 1999-07-22 | Verfahren zum chemomechanischen Polieren einer Schicht aus einem Cu-basierendem Stoff |
Country Status (13)
Country | Link |
---|---|
US (1) | US6302765B1 (de) |
EP (1) | EP0982766B1 (de) |
JP (1) | JP2000114213A (de) |
KR (1) | KR100596644B1 (de) |
CN (1) | CN1129960C (de) |
AT (1) | ATE408897T1 (de) |
DE (1) | DE69939569D1 (de) |
DK (1) | DK0982766T3 (de) |
ES (1) | ES2313763T3 (de) |
FR (1) | FR2781922B1 (de) |
MY (1) | MY118930A (de) |
SG (1) | SG78371A1 (de) |
TW (1) | TW431947B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2781922B1 (fr) * | 1998-07-31 | 2001-11-23 | Clariant France Sa | Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre |
MY118582A (en) * | 2000-05-12 | 2004-12-31 | Kao Corp | Polishing composition |
JP2001347450A (ja) * | 2000-06-08 | 2001-12-18 | Promos Technologies Inc | 化学機械研磨装置 |
US6737728B1 (en) * | 2000-10-12 | 2004-05-18 | Intel Corporation | On-chip decoupling capacitor and method of making same |
EP1236765A1 (de) | 2001-02-28 | 2002-09-04 | hanse chemie GmbH | Siliciumdioxiddispersion |
KR100444307B1 (ko) * | 2001-12-28 | 2004-08-16 | 주식회사 하이닉스반도체 | 반도체소자의 금속배선 콘택플러그 형성방법 |
DE10208166B4 (de) * | 2002-02-26 | 2006-12-14 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Herstellung von Metallleitungen mit verbesserter Gleichförmigkeit auf einem Substrat |
KR100672940B1 (ko) * | 2004-08-03 | 2007-01-24 | 삼성전자주식회사 | 금속막을 위한 화학적기계적 연마 슬러리 및 이를 이용한금속막의 화학적기계적 연마 방법 |
KR100641348B1 (ko) * | 2005-06-03 | 2006-11-03 | 주식회사 케이씨텍 | Cmp용 슬러리와 이의 제조 방법 및 기판의 연마 방법 |
US20080148652A1 (en) * | 2006-12-21 | 2008-06-26 | Junaid Ahmed Siddiqui | Compositions for chemical mechanical planarization of copper |
JP5403922B2 (ja) | 2008-02-26 | 2014-01-29 | 富士フイルム株式会社 | 研磨液および研磨方法 |
CN101638557A (zh) * | 2008-08-01 | 2010-02-03 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
JP4629154B1 (ja) * | 2010-03-23 | 2011-02-09 | Jx日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
US8836128B1 (en) * | 2013-03-15 | 2014-09-16 | Microchip Technology Incorporated | Forming fence conductors in an integrated circuit |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE677806C (de) * | 1937-06-16 | 1939-07-03 | Ernst Hoch | Selbstverkaeufer |
US3972712A (en) * | 1974-05-29 | 1976-08-03 | Brush Wellman, Inc. | Copper base alloys |
FR2558827B1 (fr) | 1984-01-27 | 1986-06-27 | Azote & Prod Chim | Procede de fabrication de nitromethane et installation |
US5226930A (en) * | 1988-06-03 | 1993-07-13 | Monsanto Japan, Ltd. | Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same |
US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
US5262354A (en) * | 1992-02-26 | 1993-11-16 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
FR2689876B1 (fr) * | 1992-04-08 | 1994-09-02 | Hoechst France | Dispersions silico-acryliques, leur procédé d'obtention, leur application en stéréophotolithographie et procédé de préparation d'objets en résine. |
US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
BE1007281A3 (nl) * | 1993-07-12 | 1995-05-09 | Philips Electronics Nv | Werkwijze voor het polijsten van een oppervlak van koper of een in hoofdzaak koper bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze, röntgenstralingcollimerend element en röntgenstralingreflecterend element, beide voorzien van een volgens de werkwijze gepolijst oppervlak en polijstmiddel geschikt voor toepassing in de werkwijze. |
JP3098661B2 (ja) * | 1993-07-28 | 2000-10-16 | キヤノン株式会社 | 研磨剤組成物及びそれを用いる研磨方法 |
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
US5525191A (en) * | 1994-07-25 | 1996-06-11 | Motorola, Inc. | Process for polishing a semiconductor substrate |
US5695384A (en) * | 1994-12-07 | 1997-12-09 | Texas Instruments Incorporated | Chemical-mechanical polishing salt slurry |
US5614444A (en) * | 1995-06-06 | 1997-03-25 | Sematech, Inc. | Method of using additives with silica-based slurries to enhance selectivity in metal CMP |
US6046110A (en) | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
KR970042941A (ko) * | 1995-12-29 | 1997-07-26 | 베일리 웨인 피 | 기계적 화학적 폴리싱 공정을 위한 폴리싱 합성물 |
US5769689A (en) * | 1996-02-28 | 1998-06-23 | Rodel, Inc. | Compositions and methods for polishing silica, silicates, and silicon nitride |
KR19980019046A (ko) * | 1996-08-29 | 1998-06-05 | 고사이 아키오 | 연마용 조성물 및 이의 용도(Abrasive composition and use of the same) |
US6039891A (en) * | 1996-09-24 | 2000-03-21 | Cabot Corporation | Multi-oxidizer precursor for chemical mechanical polishing |
FR2754937B1 (fr) * | 1996-10-23 | 1999-01-15 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux isolants a base de derives du silicium ou de silicium |
SG54606A1 (en) * | 1996-12-05 | 1998-11-16 | Fujimi Inc | Polishing composition |
US6309560B1 (en) * | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5993685A (en) * | 1997-04-02 | 1999-11-30 | Advanced Technology Materials | Planarization composition for removing metal films |
FR2761629B1 (fr) | 1997-04-07 | 1999-06-18 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope |
US5891205A (en) * | 1997-08-14 | 1999-04-06 | Ekc Technology, Inc. | Chemical mechanical polishing composition |
US5897375A (en) * | 1997-10-20 | 1999-04-27 | Motorola, Inc. | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
FR2772777B1 (fr) | 1997-12-23 | 2000-03-10 | Clariant Chimie Sa | Compositions silico-acryliques, procede de preparation et application pour l'obtention de revetements durcissables thermiquement ou par rayonnement |
FR2781922B1 (fr) * | 1998-07-31 | 2001-11-23 | Clariant France Sa | Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre |
-
1998
- 1998-07-31 FR FR9809873A patent/FR2781922B1/fr not_active Expired - Lifetime
-
1999
- 1999-07-05 SG SG1999003206A patent/SG78371A1/en unknown
- 1999-07-10 MY MYPI99002917A patent/MY118930A/en unknown
- 1999-07-22 EP EP99114392A patent/EP0982766B1/de not_active Expired - Lifetime
- 1999-07-22 ES ES99114392T patent/ES2313763T3/es not_active Expired - Lifetime
- 1999-07-22 AT AT99114392T patent/ATE408897T1/de active
- 1999-07-22 DE DE69939569T patent/DE69939569D1/de not_active Expired - Lifetime
- 1999-07-22 DK DK99114392T patent/DK0982766T3/da active
- 1999-07-27 JP JP21159799A patent/JP2000114213A/ja active Pending
- 1999-07-28 TW TW088112766A patent/TW431947B/zh not_active IP Right Cessation
- 1999-07-30 CN CN99111902A patent/CN1129960C/zh not_active Expired - Lifetime
- 1999-07-30 KR KR1019990031197A patent/KR100596644B1/ko not_active IP Right Cessation
- 1999-08-02 US US09/365,176 patent/US6302765B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1129960C (zh) | 2003-12-03 |
ATE408897T1 (de) | 2008-10-15 |
DK0982766T3 (da) | 2008-11-17 |
US6302765B1 (en) | 2001-10-16 |
ES2313763T3 (es) | 2009-03-01 |
FR2781922B1 (fr) | 2001-11-23 |
TW431947B (en) | 2001-05-01 |
FR2781922A1 (fr) | 2000-02-04 |
JP2000114213A (ja) | 2000-04-21 |
EP0982766A1 (de) | 2000-03-01 |
KR100596644B1 (ko) | 2006-07-06 |
EP0982766B1 (de) | 2008-09-17 |
KR20000012088A (ko) | 2000-02-25 |
MY118930A (en) | 2005-02-28 |
SG78371A1 (en) | 2001-02-20 |
CN1244033A (zh) | 2000-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |