DE9218452U1 - Semiconductor arrangement with a semiconductor chip mounted on a system carrier - Google Patents

Semiconductor arrangement with a semiconductor chip mounted on a system carrier

Info

Publication number
DE9218452U1
DE9218452U1 DE9218452U DE9218452U DE9218452U1 DE 9218452 U1 DE9218452 U1 DE 9218452U1 DE 9218452 U DE9218452 U DE 9218452U DE 9218452 U DE9218452 U DE 9218452U DE 9218452 U1 DE9218452 U1 DE 9218452U1
Authority
DE
Germany
Prior art keywords
semiconductor
chip mounted
system carrier
semiconductor chip
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9218452U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9218452U priority Critical patent/DE9218452U1/en
Publication of DE9218452U1 publication Critical patent/DE9218452U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE9218452U 1992-09-17 1992-09-17 Semiconductor arrangement with a semiconductor chip mounted on a system carrier Expired - Lifetime DE9218452U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9218452U DE9218452U1 (en) 1992-09-17 1992-09-17 Semiconductor arrangement with a semiconductor chip mounted on a system carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE9218452U DE9218452U1 (en) 1992-09-17 1992-09-17 Semiconductor arrangement with a semiconductor chip mounted on a system carrier
DE4231179 1992-09-17

Publications (1)

Publication Number Publication Date
DE9218452U1 true DE9218452U1 (en) 1994-04-07

Family

ID=25918622

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9218452U Expired - Lifetime DE9218452U1 (en) 1992-09-17 1992-09-17 Semiconductor arrangement with a semiconductor chip mounted on a system carrier

Country Status (1)

Country Link
DE (1) DE9218452U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10127010A1 (en) * 2001-06-05 2002-12-12 Infineon Technologies Ag Electronic component with semiconductor chip, has substrate attached via adhesive layer on to active chip surface
DE19819217B4 (en) * 1997-04-30 2006-11-30 Ibiden Co., Ltd., Ogaki Printed circuit board for an electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19819217B4 (en) * 1997-04-30 2006-11-30 Ibiden Co., Ltd., Ogaki Printed circuit board for an electronic component
DE10127010A1 (en) * 2001-06-05 2002-12-12 Infineon Technologies Ag Electronic component with semiconductor chip, has substrate attached via adhesive layer on to active chip surface
DE10127010B4 (en) * 2001-06-05 2009-01-22 Infineon Technologies Ag Electronic component with a semiconductor chip on a voltage-reduced substrate

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