DE9315652U1 - Application head for applying adhesive to a substrate, in particular for gluing a chip to a card - Google Patents

Application head for applying adhesive to a substrate, in particular for gluing a chip to a card

Info

Publication number
DE9315652U1
DE9315652U1 DE9315652U DE9315652U DE9315652U1 DE 9315652 U1 DE9315652 U1 DE 9315652U1 DE 9315652 U DE9315652 U DE 9315652U DE 9315652 U DE9315652 U DE 9315652U DE 9315652 U1 DE9315652 U1 DE 9315652U1
Authority
DE
Germany
Prior art keywords
gluing
card
chip
substrate
application head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9315652U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson Corp
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Priority to DE9315652U priority Critical patent/DE9315652U1/en
Publication of DE9315652U1 publication Critical patent/DE9315652U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B42D2033/46—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
DE9315652U 1993-10-15 1993-10-15 Application head for applying adhesive to a substrate, in particular for gluing a chip to a card Expired - Lifetime DE9315652U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9315652U DE9315652U1 (en) 1993-10-15 1993-10-15 Application head for applying adhesive to a substrate, in particular for gluing a chip to a card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9315652U DE9315652U1 (en) 1993-10-15 1993-10-15 Application head for applying adhesive to a substrate, in particular for gluing a chip to a card

Publications (1)

Publication Number Publication Date
DE9315652U1 true DE9315652U1 (en) 1993-12-23

Family

ID=6899399

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9315652U Expired - Lifetime DE9315652U1 (en) 1993-10-15 1993-10-15 Application head for applying adhesive to a substrate, in particular for gluing a chip to a card

Country Status (1)

Country Link
DE (1) DE9315652U1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9412935U1 (en) * 1994-08-11 1994-10-13 Nordson Corp Slot nozzle for the application of flowable materials
DE4401458A1 (en) * 1994-01-19 1995-07-20 Ods Gmbh & Co Kg Chip card prodn.
WO2000073986A1 (en) * 1999-05-27 2000-12-07 Gemplus Head for depositing a substance on a support with an electronic circuit
EP1168240A2 (en) * 1997-03-27 2002-01-02 Gemplus Connection by depositing a viscous material following the relief shape
DE102005026160A1 (en) * 2005-06-06 2006-12-07 Willi Borst Binding agent e.g. plastisol, applying device for product path e.g. knitted fabric, has splitter unit arranged between product path and coating nozzle and connected with bonding agent discharge cross-section in coating nozzle sided manner

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7929197U1 (en) * 1979-10-15 1980-03-20 Homburg, Eberhard, 4970 Bad Oeynhausen NOZZLE HEAD FOR A SPRAY GUN FOR DISPENSING LIQUID LIKE ADHESIVE
US4265377A (en) * 1977-10-31 1981-05-05 Moen Lenard E Multiple nozzle fluid dispenser having uniform openings in an operating bar
US4527717A (en) * 1981-10-15 1985-07-09 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus for quantitatively supplying liquid
US4828886A (en) * 1986-11-05 1989-05-09 U.S. Philips Corporation Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method
WO1990000852A1 (en) * 1988-07-08 1990-01-25 Mytronic Ab Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards
EP0449691A1 (en) * 1990-03-28 1991-10-02 Schlumberger Industries Electronic Memory Card Manufacturing Process
US5195656A (en) * 1991-09-03 1993-03-23 Motorola, Inc. Accurately controlled fluid dispenser with upper and lower stroke adjusters

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4265377A (en) * 1977-10-31 1981-05-05 Moen Lenard E Multiple nozzle fluid dispenser having uniform openings in an operating bar
DE7929197U1 (en) * 1979-10-15 1980-03-20 Homburg, Eberhard, 4970 Bad Oeynhausen NOZZLE HEAD FOR A SPRAY GUN FOR DISPENSING LIQUID LIKE ADHESIVE
US4527717A (en) * 1981-10-15 1985-07-09 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus for quantitatively supplying liquid
US4828886A (en) * 1986-11-05 1989-05-09 U.S. Philips Corporation Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method
WO1990000852A1 (en) * 1988-07-08 1990-01-25 Mytronic Ab Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards
EP0449691A1 (en) * 1990-03-28 1991-10-02 Schlumberger Industries Electronic Memory Card Manufacturing Process
US5195656A (en) * 1991-09-03 1993-03-23 Motorola, Inc. Accurately controlled fluid dispenser with upper and lower stroke adjusters

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
1-253488 A., M-915, Jan. 8. 1990, Vol.14 *
1-253489 A., M-915, Jan. 8, 1990, Vol.14 *
JP Patents Abstracts of Japan: 1-253493 A., M-915, Jan. 8, 1990, Vol 14 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4401458A1 (en) * 1994-01-19 1995-07-20 Ods Gmbh & Co Kg Chip card prodn.
DE9412935U1 (en) * 1994-08-11 1994-10-13 Nordson Corp Slot nozzle for the application of flowable materials
EP1168240A2 (en) * 1997-03-27 2002-01-02 Gemplus Connection by depositing a viscous material following the relief shape
EP1168240A3 (en) * 1997-03-27 2002-01-30 Gemplus Connection by depositing a viscous material following the relief shape
WO2000073986A1 (en) * 1999-05-27 2000-12-07 Gemplus Head for depositing a substance on a support with an electronic circuit
FR2797203A1 (en) * 1999-05-27 2001-02-09 Gemplus Card Int HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE ELECTRONIC CIRCUIT SUPPORT TYPE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES
DE102005026160A1 (en) * 2005-06-06 2006-12-07 Willi Borst Binding agent e.g. plastisol, applying device for product path e.g. knitted fabric, has splitter unit arranged between product path and coating nozzle and connected with bonding agent discharge cross-section in coating nozzle sided manner

Similar Documents

Publication Publication Date Title
DE69839276D1 (en) METHOD FOR PRODUCING A CHIP CARD, SUITABLE FOR CONTACTED OR CONTACTLESS OPERATION
DE3789282T2 (en) FAN-FOLDED BLOCK CONSTRUCTED FROM A SHEET THAT CAN BE DIVIDED IN BOWS, EVERYONE CARRYING A PATTERN OF A PRESSURE-SENSITIVE ADHESIVE.
DE68928268T2 (en) METHOD FOR APPLYING A LABEL TO A CONTAINER
DE3784796D1 (en) METHOD FOR CONNECTING A SEMICONDUCTOR CHIP TO A SUBSTRATE.
DE69802708T2 (en) METHOD FOR STORING DATA IN A Rewritable MEMORY OF A CHIP CARD
DE3767474D1 (en) DEVICE FOR APPLYING LIQUID, PASTOESE OR PLASTIC SUBSTANCES TO A SUBSTRATE.
DE69426591T2 (en) Brush for applying nail polish or a similar product
DE69808605T2 (en) METHOD FOR PRODUCING A CHIP CARD OR A COMPARABLE ELECTRONIC DEVICE
DE69332745D1 (en) Process for regulating credit notes using a chip card
DE69117158D1 (en) Device for applying a pasty product, in particular a cosmetic product, e.g. a lipstick and a tubular component for such a device
DE19983745T1 (en) Use page label registers to keep track of a state of physical pages in a storage device
DE69908769D1 (en) METHOD FOR SWITCHING APPLICATIONS IN A MULTIPLE APPLICATION CHIP CARD
DE3779253D1 (en) METHOD FOR REPAIRING INTERRUPTIONS IN THICK FILM LINES ON A SUBSTRATE.
DE68905353D1 (en) METHOD AND DEVICE FOR APPLYING SOLDER FLUID TO A SUBSTRATE.
DE9315652U1 (en) Application head for applying adhesive to a substrate, in particular for gluing a chip to a card
DE69517738T2 (en) Process for applying electronically stored labels to a print job
DE59806526D1 (en) METHOD FOR APPLYING A LIQUID TO A RUNNING THREAD
DE69327315T2 (en) METHOD AND DEVICE FOR APPLYING FLUID, ESPECIALLY HOT MELT, TO A SUBSTRATE BY A SEQUENTIAL APPLICATION DEVICE
DE59107330D1 (en) Process for applying liquid, pasty or plastic substances to a substrate
DE59813416D1 (en) Method and postal device with a chip card read / write unit for reloading change data by chip card
DE59907727D1 (en) Glue unit for applying an adhesive to the back or adjacent areas of a book block that has passed.
DE69033208D1 (en) Gluing ink jet recording head with photopolymerizable adhesive
DE3778426D1 (en) METHOD FOR GLUING SUBSTRATES.
DE9316085U1 (en) Application head for applying cold glue to a substrate
DE69119831T2 (en) Identification label for devices, in particular for data devices