EP0156746A1 - Working heads of polishing machines and the like - Google Patents
Working heads of polishing machines and the like Download PDFInfo
- Publication number
- EP0156746A1 EP0156746A1 EP85420047A EP85420047A EP0156746A1 EP 0156746 A1 EP0156746 A1 EP 0156746A1 EP 85420047 A EP85420047 A EP 85420047A EP 85420047 A EP85420047 A EP 85420047A EP 0156746 A1 EP0156746 A1 EP 0156746A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- flange
- spindle
- bellows
- polishing
- working head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
On sait que les têtes de travail classiques comprennent généralement un arbre ou broche dont la partie supérieure est associée à des moyens (moteur et vérin) propres à assurer son entraînement en rotation et une poussée axiale, tandis que sa base porte le flasque destiné à former support pour l'échantillon ou autre pièce à travailler. A cet effet, l'extrémité inférieure de l'arbre est établie à un profil semi-sphérique de manière à venir coopérer avec la paroi tronconique d'une cavité ménagée dans la face supérieure du flasque précité, lequel est découpé de deux entailles diamétralement opposées formant logements pour deux doigts en saillie solidaires de l'arbre. On conçoit dans ces conditions que le flasque porte-pièce peut tourner au-dessus du plateau tournant de polissage contre le face libre duquel il est appliqué par le vérin associé à l'arbre, tout en étant libre de s'orienter correctement par rapport à ladite face libre pour compenser les variations de planéité dudit plateau et les imprécisions de la géométrie de l'ensemble.It is known that conventional working heads generally comprise a shaft or spindle, the upper part of which is associated with means (motor and jack) capable of ensuring its drive in rotation and an axial thrust, while its base carries the flange intended to form support for the sample or other workpiece. For this purpose, the lower end of the shaft is established in a semi-spherical profile so as to come to cooperate with the frustoconical wall of a cavity formed in the upper face of the aforementioned flange, which is cut from two diametrically opposite notches forming housings for two projecting fingers integral with the shaft. It is conceivable under these conditions that the workpiece flange can rotate above the polishing turntable against the free face of which it is applied by the jack associated with the shaft, while being free to orient itself correctly with respect to said free face to compensate for the variations in flatness of said plate and the inaccuracies in the geometry of the assembly.
Cette disposition présente des inconvénients pratiques non négligeables. Elle est relativement coûteuse du fait que l'extrémité sphérique de l'arbre ou broche doit être réalisée en acier dur, recouvert d'un film chromé afin d'éviter les déformations dues aux efforts mécaniques et à la corrosion. On observera par ailleurs que la rotule formée par la partie semi-sphérique et la partie tronconique est soumise à une force verticale (pression axiale) et à une force horizontale (défilement du plateau de polissage) ; or du fait que dans le système classique la force verticale s'applique au centre du flasque, ce dernier risque de se déformer en même temps qu'il est soumis à un effet de basculcment par suite du défilement du plateau, effet de basculement qui est accru par l'entraînement central en rctation à partir d'un point situé au-dessus du plan de contact plateau/flasque.This arrangement has significant practical disadvantages. It is relatively expensive because the spherical end of the shaft or spindle must be made of hard steel, covered with a chromed film in order to avoid deformations due to mechanical forces and to corrosion. It will also be observed that the ball joint formed by the semi-spherical part and the frustoconical part is subjected to a vertical force (axial pressure) and to a horizontal force (movement of the polishing plate); however, because in the conventional system the vertical force is applied to the center of the flange, the latter risks deforming at the same time as it is subjected to a tilting effect as a result of the movement of the plate, the tilting effect which is increased by the central drive in rctation from a point located above the plate / flange contact plane.
Dans le document DE-A-1 677 168 (FRANKE) on a décrit une tête de travail pour machine de polissage dans laquelle la rotule est remplacée par un premier coussin susceptible d'être gonfle avec de l'air et par un second coussin à gonflage constant, ces deux coussins étant disposés entre la table tournante et un portoir destiné à supporter la pièce à travailler.In document DE-A-1 677 168 (FRANKE) a working head for a polishing machine has been described in which the ball joint is replaced by a first cushion capable of being inflated with air and by a second cushion constant inflation, these two cushions being arranged between the turntable and a rack intended to support the workpiece.
Il y a lieu de considérer que cet agencement, conçu pour le polissage de pièces creuses tridimensionnelles et asymétriques, ne peut être adopté pour le polissage de plaquettes symétriques à faible épaisseur, tel que visé dans la présente invention. En effet le second coussin d'air à gonflage constant a pour but, non pas de conférer une pression de polissage, mais de former pivot afin de permettre l'adaptation de la pièce creuse à polir aux brosser tournantes de polissage. Dans ces conditions, si cette technique antérieure était transposée au cas du polissage de plaquettes minces on n'obtiendrait une pression localisée sur la plaquette à polir (ou sur le portoir) qu'aux seuls points de contact entre coussin et plaquette (ou portoir) et non une pression constante répartie sur toute la surface. De plus et en tout état de cause le fait qu'il y ait deux coussins ne peut assurer une flexibilité constante dans toutes les directions (360°), alors que celle-ci est essentielle pour polir plan entre deux surfaces dont les axes de rotation ne sont jamais exactement parallèles.It should be considered that this arrangement, designed for the polishing of three-dimensional and asymmetrical hollow parts, cannot be adopted for the polishing of symmetrical wafers of small thickness, as referred to in the present invention. In fact, the second air cushion with constant inflation aims not to impart a polishing pressure, but to form a pivot in order to allow the adaptation of the hollow part to be polished to the rotating polishing brushes. Under these conditions, if this prior technique were transposed to the case of polishing thin wafers, localized pressure would be obtained on the polishing pad (or on the rack) only at the points of contact between cushion and pad (or rack) and not a constant pressure distributed over the entire surface. In addition and in any event the fact that there are two cushions can not ensure constant flexibility in all directions (360 °), while this is essential to polish plane between two surfaces whose axes of rotation are never exactly parallel.
C'est à l'ensemble de ces inconvénients qu'entend principalement remédier la présente invention, laquelle consiste essentiellement à assurer l'entraînement en rotation du flasque porte-pièce par le moyen d'un soufflet déformable qui définit, avec les faces en vis-à-vis d'un disque supérieur tournant et du flasque précité, une chambre qui une fois mise en pression permet la libre orientation dudit flasque et son application contre le plateau de polissage.It is to all of these drawbacks that the present invention mainly intends to remedy, which essentially consists in ensuring the drive in rotation of the workpiece flange by means of a deformable bellows which defines, with the faces in screw -with a rotating upper disc and the aforementioned flange, a chamber which once pressurized allows the free orientation of said flange and its application against the polishing plate.
On conçoit que ce soufflet déformable peut comporter un diamètre relativement grand, égal en pratique à celui du flasque porte-pièce qui est ainsi entraîné en rotation par sa périphérie, ce qui évite tout risque de basculement.It is understood that this deformable bellows may have a relatively large diameter, in practice equal to that of workpiece flange which is thus driven in rotation by its periphery, which avoids any risk of tipping.
Le dessin annexé, donné à titre d'exemple, permettra de mieux comprendre l'invention, les caractéristiques qu'elle présente et les avantages qu'elle est susceptible de procurer :
- La figure unique de ce dessin est une coupe axiale schématique illustrant l'agencement général d'une tête de travail établie conformément à l'invention.
- The single figure of this drawing is a schematic axial section illustrating the general arrangement of a working head established in accordance with the invention.
Sur cette figure, la référence 1 désigne la partie inférieure d'une broche supportée et guidée à l'intérieur d'un palier schématisé en 2 ; cette broche est animée d'un mouvement de rotation à l'aide d'un moteur électrique, non représenté. Son extrémité inférieure présente un épanouissement la à périphérie arondie, engagé à jeu réduit à l'intérieur d'un logement cylindrique ménagé dans un bossage tubulaire 3a prévu dans la partie centrale d'un flasque 3 ; on conçoit dans ces conditions que ce flasque 3 dispose d'une liberté angulaire pratiquement totale par rapport à la base de la broche 1.In this figure, the
L'entraînement en rotation du flasque 3 est assuré par un soufflet 4 dont l'extrémité inférieure est assujettie, par exemple par soudage, à la périphérie dudit flasque. L'extrémité supérieure de ce soufflet 4 est de la même manière rendue angulairement solidaire d'un disque 5, perforé en son centre pour laisser passage à la broche 1 à laquelle il est fixé par un cordon de soudure étanche 6. Ce disque 5 est équipé d'un embout traversant 7 sur lequel est branchée une canalisation 8 reliée à une source de pression à travers un joint tournant (non représenté) porté par la partie supérieure de la broche 1.The
La partie inférieure du flasque 3 est agencée à la manière usuelle pour la fixation de l'échantillon à polir. Dans l'exemple de réalisation considéré, on a supposé que la broche 1 était creusée d'un alésage axial borgne Ib relié à une source de vide et sur l'extrémité duquel est branchée une canalisation 9 pour l'alimentation d'une platine à dépression 10, l'échantillon 11 étant maintenu par aspiration ; on peut cependant prévoir tout autre agencement de type connu.The lower part of the
On conçoit en tout état de cause que dans la tête de travail représentée, l'entraînement du flasque 3 par l'intermédiaire du soufflet 4 évite tout risque de basculement intempestif sous l'effet de la rotation du plateau tournant de polissage contre lequel l'échantillon 11 est appliqué. Cette application est obtenue par la pression maintenue par la canalisation 8 à l'intérieur de la chambre étanche définie par le soufflet 4, le flasque 3 et le disque supérieur 5 ; la déformabilité de cette chambre assure, outre la pression d'application précitée, l'auto-orientation de l'échantillon 11 par rapport à la face supérieure du plateau de polissage de la machine.In any event, it can be understood that in the working head shown, the drive of the
On se dispense ainsi du système de rotule classique et du vérin de pression axiale, si bien que la construction est considérablement simplifiée alors que le fonctionnement est amélioré. On observera que la pression d'application de l'échantillon contre le plateau de polissage est susceptible d'être réglée de manière très précise pour chaque travail, ce qui constitue en fait un avantage considérable par rapport aux têtes usuelle à vérin.This eliminates the classic ball system and the axial pressure cylinder, so that the construction is considerably simplified while the operation is improved. It will be observed that the pressure for applying the sample against the polishing plate is capable of being adjusted very precisely for each job, which in fact constitutes a considerable advantage compared with the usual cylinder heads.
Il convient également de remarquer que l'invention est susceptible d'être avantageusement appliquée au rodage, du type une face ou double face.It should also be noted that the invention is capable of being advantageously applied to running-in, of the one-sided or double-sided type.
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8404175A FR2558095B1 (en) | 1984-03-14 | 1984-03-14 | IMPROVEMENTS TO THE WORKING HEADS OF POLISHING MACHINES AND THE LIKE |
FR8404175 | 1984-03-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0156746A1 true EP0156746A1 (en) | 1985-10-02 |
Family
ID=9302151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85420047A Withdrawn EP0156746A1 (en) | 1984-03-14 | 1985-03-13 | Working heads of polishing machines and the like |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0156746A1 (en) |
FR (1) | FR2558095B1 (en) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0264572A1 (en) * | 1986-08-19 | 1988-04-27 | Mitsubishi Kinzoku Kabushiki Kaisha | Polishing apparatus |
EP0589433A1 (en) * | 1992-09-24 | 1994-03-30 | Ebara Corporation | Polishing apparatus |
EP0747167A2 (en) * | 1995-06-09 | 1996-12-11 | Applied Materials, Inc. | Apparatus for holding a substrate during polishing |
WO1999004930A1 (en) * | 1997-07-25 | 1999-02-04 | Speedfam-Ipec Corporation | Wafer carrier for semiconductor wafer polishing machine |
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US5964653A (en) * | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
US6080050A (en) * | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
US6083090A (en) * | 1998-03-18 | 2000-07-04 | Rohm Co., Ltd. | Polishing apparatus for semiconductor wafers |
US6146259A (en) * | 1996-11-08 | 2000-11-14 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US6183354B1 (en) | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6386947B2 (en) | 2000-02-29 | 2002-05-14 | Applied Materials, Inc. | Method and apparatus for detecting wafer slipouts |
US6398621B1 (en) | 1997-05-23 | 2002-06-04 | Applied Materials, Inc. | Carrier head with a substrate sensor |
US6722965B2 (en) | 2000-07-11 | 2004-04-20 | Applied Materials Inc. | Carrier head with flexible membranes to provide controllable pressure and loading area |
US6739958B2 (en) | 2002-03-19 | 2004-05-25 | Applied Materials Inc. | Carrier head with a vibration reduction feature for a chemical mechanical polishing system |
US6848980B2 (en) | 2001-10-10 | 2005-02-01 | Applied Materials, Inc. | Vibration damping in a carrier head |
US6857945B1 (en) | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
US6872122B2 (en) | 1998-12-30 | 2005-03-29 | Applied Materials, Inc. | Apparatus and method of detecting a substrate in a carrier head |
USRE38878E1 (en) * | 1992-09-24 | 2005-11-15 | Ebara Corporation | Polishing apparatus |
US7014545B2 (en) | 2000-09-08 | 2006-03-21 | Applied Materials Inc. | Vibration damping in a chemical mechanical polishing system |
US7198561B2 (en) | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
US7255771B2 (en) | 2004-03-26 | 2007-08-14 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
US7255637B2 (en) | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
US7497767B2 (en) | 2000-09-08 | 2009-03-03 | Applied Materials, Inc. | Vibration damping during chemical mechanical polishing |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6036587A (en) | 1996-10-10 | 2000-03-14 | Applied Materials, Inc. | Carrier head with layer of conformable material for a chemical mechanical polishing system |
TW371635B (en) * | 1996-10-10 | 1999-10-11 | Applied Materials Inc | Carrier head with a layer conformable material for a chemical mechanical polishing system |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU280262A1 (en) * | Специальное конструкторское бюро проектированию шлифовального | |||
US1653108A (en) * | 1926-04-29 | 1927-12-20 | Koenig Otto Alfred | Surfacing machine |
US1840254A (en) * | 1929-06-27 | 1932-01-05 | Fischman & Sons I | Polishing apparatus |
US2189472A (en) * | 1937-09-27 | 1940-02-06 | Edward G Peterson | Buffing device |
US2323962A (en) * | 1941-07-25 | 1943-07-13 | George W Williams | Sanding and buffing tool |
US2781617A (en) * | 1955-05-27 | 1957-02-19 | Jerry J Lines | Swivel sander |
DE1029699B (en) * | 1954-06-30 | 1958-05-08 | Fritz Graupner | Device for flat grinding stone slabs, in particular terrazzo slabs |
US2860496A (en) * | 1955-04-13 | 1958-11-18 | Berne Tocci Guilbert | Ring oscillator |
US3053063A (en) * | 1960-08-03 | 1962-09-11 | Flexan Corp | Abrading disc mount |
FR1573314A (en) * | 1967-06-07 | 1969-07-04 | ||
US3499641A (en) * | 1967-10-02 | 1970-03-10 | Collins Radio Co | Fluid pressure actuated diaphragm workpiece clamping device |
DE1677168A1 (en) * | 1967-03-09 | 1971-04-29 | Franke Gmbh Edelstahlerzeugnis | Grinding and polishing device |
FR2239089A6 (en) * | 1973-07-24 | 1975-02-21 | Zeitlin Leo | Polishing or grinding machine - inflatable pneumatic or hydraulic cushion to oppose rotation of guide |
US4373991A (en) * | 1982-01-28 | 1983-02-15 | Western Electric Company, Inc. | Methods and apparatus for polishing a semiconductor wafer |
-
1984
- 1984-03-14 FR FR8404175A patent/FR2558095B1/en not_active Expired
-
1985
- 1985-03-13 EP EP85420047A patent/EP0156746A1/en not_active Withdrawn
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU280262A1 (en) * | Специальное конструкторское бюро проектированию шлифовального | |||
US1653108A (en) * | 1926-04-29 | 1927-12-20 | Koenig Otto Alfred | Surfacing machine |
US1840254A (en) * | 1929-06-27 | 1932-01-05 | Fischman & Sons I | Polishing apparatus |
US2189472A (en) * | 1937-09-27 | 1940-02-06 | Edward G Peterson | Buffing device |
US2323962A (en) * | 1941-07-25 | 1943-07-13 | George W Williams | Sanding and buffing tool |
DE1029699B (en) * | 1954-06-30 | 1958-05-08 | Fritz Graupner | Device for flat grinding stone slabs, in particular terrazzo slabs |
US2860496A (en) * | 1955-04-13 | 1958-11-18 | Berne Tocci Guilbert | Ring oscillator |
US2781617A (en) * | 1955-05-27 | 1957-02-19 | Jerry J Lines | Swivel sander |
US3053063A (en) * | 1960-08-03 | 1962-09-11 | Flexan Corp | Abrading disc mount |
DE1677168A1 (en) * | 1967-03-09 | 1971-04-29 | Franke Gmbh Edelstahlerzeugnis | Grinding and polishing device |
FR1573314A (en) * | 1967-06-07 | 1969-07-04 | ||
US3499641A (en) * | 1967-10-02 | 1970-03-10 | Collins Radio Co | Fluid pressure actuated diaphragm workpiece clamping device |
FR2239089A6 (en) * | 1973-07-24 | 1975-02-21 | Zeitlin Leo | Polishing or grinding machine - inflatable pneumatic or hydraulic cushion to oppose rotation of guide |
US4373991A (en) * | 1982-01-28 | 1983-02-15 | Western Electric Company, Inc. | Methods and apparatus for polishing a semiconductor wafer |
Cited By (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897966A (en) * | 1986-08-19 | 1990-02-06 | Japan Silicon Co., Ltd. | Polishing apparatus |
EP0264572A1 (en) * | 1986-08-19 | 1988-04-27 | Mitsubishi Kinzoku Kabushiki Kaisha | Polishing apparatus |
EP0911115A1 (en) * | 1992-09-24 | 1999-04-28 | Ebara Corporation | Polishing apparatus |
EP0589433A1 (en) * | 1992-09-24 | 1994-03-30 | Ebara Corporation | Polishing apparatus |
US5476414A (en) * | 1992-09-24 | 1995-12-19 | Ebara Corporation | Polishing apparatus |
USRE38878E1 (en) * | 1992-09-24 | 2005-11-15 | Ebara Corporation | Polishing apparatus |
US6290577B1 (en) | 1995-06-09 | 2001-09-18 | Applied Materials, Inc. | Fluid pressure regulated wafer polishing head |
US6652368B2 (en) | 1995-06-09 | 2003-11-25 | Applied Materials, Inc. | Chemical mechanical polishing carrier head |
US6443824B2 (en) | 1995-06-09 | 2002-09-03 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
EP0747167A2 (en) * | 1995-06-09 | 1996-12-11 | Applied Materials, Inc. | Apparatus for holding a substrate during polishing |
EP0747167A3 (en) * | 1995-06-09 | 1997-01-29 | Applied Materials Inc | Apparatus for holding a substrate during polishing |
US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
US7101261B2 (en) | 1995-06-09 | 2006-09-05 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
US6540594B2 (en) | 1996-11-08 | 2003-04-01 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6386955B2 (en) | 1996-11-08 | 2002-05-14 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US7040971B2 (en) | 1996-11-08 | 2006-05-09 | Applied Materials Inc. | Carrier head with a flexible membrane |
US6146259A (en) * | 1996-11-08 | 2000-11-14 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US6183354B1 (en) | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6368191B1 (en) | 1996-11-08 | 2002-04-09 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US6511367B2 (en) | 1996-11-08 | 2003-01-28 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US6705924B2 (en) * | 1997-05-23 | 2004-03-16 | Applied Materials Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6547641B2 (en) | 1997-05-23 | 2003-04-15 | Applied Materials, Inc. | Carrier head with a substrate sensor |
US6343973B1 (en) * | 1997-05-23 | 2002-02-05 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6244932B1 (en) | 1997-05-23 | 2001-06-12 | Applied Materials, Inc. | Method for detecting the presence of a substrate in a carrier head |
US6093082A (en) * | 1997-05-23 | 2000-07-25 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6517415B2 (en) | 1997-05-23 | 2003-02-11 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6398621B1 (en) | 1997-05-23 | 2002-06-04 | Applied Materials, Inc. | Carrier head with a substrate sensor |
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6106378A (en) * | 1997-07-11 | 2000-08-22 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6506104B2 (en) | 1997-07-11 | 2003-01-14 | Applied Materials, Inc. | Carrier head with a flexible membrane |
US6277010B1 (en) | 1997-07-11 | 2001-08-21 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5964653A (en) * | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6648740B2 (en) | 1997-07-11 | 2003-11-18 | Applied Materials, Inc. | Carrier head with a flexible membrane to form multiple chambers |
US6896584B2 (en) | 1997-07-11 | 2005-05-24 | Applied Materials, Inc. | Method of controlling carrier head with multiple chambers |
WO1999004930A1 (en) * | 1997-07-25 | 1999-02-04 | Speedfam-Ipec Corporation | Wafer carrier for semiconductor wafer polishing machine |
US6080050A (en) * | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
US6277009B1 (en) | 1997-12-31 | 2001-08-21 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
US6083090A (en) * | 1998-03-18 | 2000-07-04 | Rohm Co., Ltd. | Polishing apparatus for semiconductor wafers |
US6872122B2 (en) | 1998-12-30 | 2005-03-29 | Applied Materials, Inc. | Apparatus and method of detecting a substrate in a carrier head |
US6386947B2 (en) | 2000-02-29 | 2002-05-14 | Applied Materials, Inc. | Method and apparatus for detecting wafer slipouts |
US6722965B2 (en) | 2000-07-11 | 2004-04-20 | Applied Materials Inc. | Carrier head with flexible membranes to provide controllable pressure and loading area |
US6979250B2 (en) | 2000-07-11 | 2005-12-27 | Applied Materials, Inc. | Carrier head with flexible membrane to provide controllable pressure and loading area |
US7198561B2 (en) | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
US6857945B1 (en) | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
US7014545B2 (en) | 2000-09-08 | 2006-03-21 | Applied Materials Inc. | Vibration damping in a chemical mechanical polishing system |
US7255637B2 (en) | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
US7331847B2 (en) | 2000-09-08 | 2008-02-19 | Applied Materials, Inc | Vibration damping in chemical mechanical polishing system |
US7497767B2 (en) | 2000-09-08 | 2009-03-03 | Applied Materials, Inc. | Vibration damping during chemical mechanical polishing |
US8376813B2 (en) | 2000-09-08 | 2013-02-19 | Applied Materials, Inc. | Retaining ring and articles for carrier head |
US8535121B2 (en) | 2000-09-08 | 2013-09-17 | Applied Materials, Inc. | Retaining ring and articles for carrier head |
US6848980B2 (en) | 2001-10-10 | 2005-02-01 | Applied Materials, Inc. | Vibration damping in a carrier head |
US6739958B2 (en) | 2002-03-19 | 2004-05-25 | Applied Materials Inc. | Carrier head with a vibration reduction feature for a chemical mechanical polishing system |
US7255771B2 (en) | 2004-03-26 | 2007-08-14 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
US7842158B2 (en) | 2004-03-26 | 2010-11-30 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
US8088299B2 (en) | 2004-03-26 | 2012-01-03 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
Also Published As
Publication number | Publication date |
---|---|
FR2558095B1 (en) | 1988-04-08 |
FR2558095A1 (en) | 1985-07-19 |
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