EP0362516A3 - System for mechanical planarization - Google Patents

System for mechanical planarization Download PDF

Info

Publication number
EP0362516A3
EP0362516A3 EP19890114685 EP89114685A EP0362516A3 EP 0362516 A3 EP0362516 A3 EP 0362516A3 EP 19890114685 EP19890114685 EP 19890114685 EP 89114685 A EP89114685 A EP 89114685A EP 0362516 A3 EP0362516 A3 EP 0362516A3
Authority
EP
European Patent Office
Prior art keywords
wafer
rollers
plane
spin
mechanical planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890114685
Other languages
German (de)
French (fr)
Other versions
EP0362516A2 (en
EP0362516B1 (en
Inventor
Michael Albert Leach
Brian John Machesney
James Konrad Paulsen
Daniel John Venditti
Christopher Robert Whitaker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0362516A2 publication Critical patent/EP0362516A2/en
Publication of EP0362516A3 publication Critical patent/EP0362516A3/en
Application granted granted Critical
Publication of EP0362516B1 publication Critical patent/EP0362516B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Abstract

A polishing tool for abrasively polishing a semicon­ ductor wafer that edge clamps the wafer (100) between two rollers (102, 104). The wafer is spun-up in one plane and the rollers spin in a second plane which is orthogonal to the wafer spin plane. One of the rollers is split with each section rotating in opposite direc­ tions. Each of the rollers is mounted by a spring-­ gimballed assembly (202, 204) to follow the wafer con­ tour.
EP89114685A 1988-10-04 1989-08-09 System for mechanical planarization Expired - Lifetime EP0362516B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/253,028 US4934102A (en) 1988-10-04 1988-10-04 System for mechanical planarization
US253028 1988-10-04

Publications (3)

Publication Number Publication Date
EP0362516A2 EP0362516A2 (en) 1990-04-11
EP0362516A3 true EP0362516A3 (en) 1991-01-09
EP0362516B1 EP0362516B1 (en) 1993-12-15

Family

ID=22958538

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89114685A Expired - Lifetime EP0362516B1 (en) 1988-10-04 1989-08-09 System for mechanical planarization

Country Status (4)

Country Link
US (1) US4934102A (en)
EP (1) EP0362516B1 (en)
JP (1) JPH08359B2 (en)
DE (1) DE68911456T2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109500669A (en) * 2018-12-10 2019-03-22 皖西学院 A kind of fixed grinding device of adjustable bearing processing

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5487697A (en) * 1993-02-09 1996-01-30 Rodel, Inc. Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
ATE186001T1 (en) * 1994-08-09 1999-11-15 Ontrak Systems Inc LINEAR POLISHER AND WAFER PLANARISATION PROCESS
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
JP3566417B2 (en) * 1994-10-31 2004-09-15 株式会社荏原製作所 Polishing equipment
JPH08335562A (en) * 1995-01-20 1996-12-17 Seiko Instr Inc Semiconductor device and its manufacture
DE69632553T2 (en) * 1995-02-15 2004-09-30 Texas Instruments Inc., Dallas Process for removing particulate contaminants from the surface of a semiconductor wafer
KR100227924B1 (en) * 1995-07-28 1999-11-01 가이데 히사오 Wafer fabricating method and polishing method therefor and apparatus thereof
DE19534080A1 (en) * 1995-09-14 1997-03-20 Wacker Siltronic Halbleitermat Method for generating stack-fault-causing damage on the back of semiconductor wafers
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5928062A (en) * 1997-04-30 1999-07-27 International Business Machines Corporation Vertical polishing device and method
US5897425A (en) * 1997-04-30 1999-04-27 International Business Machines Corporation Vertical polishing tool and method
US6228231B1 (en) 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6056869A (en) * 1998-06-04 2000-05-02 International Business Machines Corporation Wafer edge deplater for chemical mechanical polishing of substrates
US5944588A (en) * 1998-06-25 1999-08-31 International Business Machines Corporation Chemical mechanical polisher
US6086460A (en) 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
EP1052062A1 (en) * 1999-05-03 2000-11-15 Applied Materials, Inc. Pré-conditioning fixed abrasive articles
US6083082A (en) * 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
US6347977B1 (en) 1999-09-13 2002-02-19 Lam Research Corporation Method and system for chemical mechanical polishing
US6431959B1 (en) * 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6537144B1 (en) 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6428394B1 (en) 2000-03-31 2002-08-06 Lam Research Corporation Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6402591B1 (en) 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6261959B1 (en) 2000-03-31 2001-07-17 Lam Research Corporation Method and apparatus for chemically-mechanically polishing semiconductor wafers
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6500056B1 (en) 2000-06-30 2002-12-31 Lam Research Corporation Linear reciprocating disposable belt polishing method and apparatus
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6495464B1 (en) 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6896776B2 (en) * 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6613200B2 (en) 2001-01-26 2003-09-02 Applied Materials, Inc. Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US20060169597A1 (en) * 2001-03-14 2006-08-03 Applied Materials, Inc. Method and composition for polishing a substrate
US7323416B2 (en) * 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) 2001-12-21 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US6811680B2 (en) 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7582564B2 (en) * 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US7128825B2 (en) 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US6592742B2 (en) 2001-07-13 2003-07-15 Applied Materials Inc. Electrochemically assisted chemical polish
US6863794B2 (en) * 2001-09-21 2005-03-08 Applied Materials, Inc. Method and apparatus for forming metal layers
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
US6645052B2 (en) * 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US20070295611A1 (en) * 2001-12-21 2007-12-27 Liu Feng Q Method and composition for polishing a substrate
US6837983B2 (en) 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7842169B2 (en) * 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US7390429B2 (en) * 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US7025660B2 (en) * 2003-08-15 2006-04-11 Lam Research Corporation Assembly and method for generating a hydrodynamic air bearing
US20050092620A1 (en) * 2003-10-01 2005-05-05 Applied Materials, Inc. Methods and apparatus for polishing a substrate
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) * 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US20060021974A1 (en) * 2004-01-29 2006-02-02 Applied Materials, Inc. Method and composition for polishing a substrate
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20060249394A1 (en) * 2005-05-05 2006-11-09 Applied Materials, Inc. Process and composition for electrochemical mechanical polishing
US20060249395A1 (en) * 2005-05-05 2006-11-09 Applied Material, Inc. Process and composition for electrochemical mechanical polishing
TW200720494A (en) * 2005-11-01 2007-06-01 Applied Materials Inc Ball contact cover for copper loss reduction and spike reduction
US20070151866A1 (en) * 2006-01-05 2007-07-05 Applied Materials, Inc. Substrate polishing with surface pretreatment
US20070254485A1 (en) * 2006-04-28 2007-11-01 Daxin Mao Abrasive composition for electrochemical mechanical polishing
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
CN110370096B (en) * 2019-08-14 2021-04-13 珠海镇东有限公司 Plate grinding method for high-precision opposite-grinding plate brushing machine
CN114574927A (en) * 2022-03-07 2022-06-03 安徽中嘉环保建材科技有限公司 Surface treatment process for aluminum template

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1899463A (en) * 1930-03-26 1933-02-28 Simonds Saw & Steel Co Method of and apparatus for grinding and polishing materials
US2536444A (en) * 1949-03-08 1951-01-02 Alfred E Hamilton Grinding and polishing apparatus
US4671018A (en) * 1985-11-15 1987-06-09 Ekhoff Donald L Rigid disk finishing apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151984U (en) * 1978-04-14 1979-10-22
JPS604346Y2 (en) * 1981-07-27 1985-02-07 古河電気工業株式会社 Electric cable manufacturing equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1899463A (en) * 1930-03-26 1933-02-28 Simonds Saw & Steel Co Method of and apparatus for grinding and polishing materials
US2536444A (en) * 1949-03-08 1951-01-02 Alfred E Hamilton Grinding and polishing apparatus
US4671018A (en) * 1985-11-15 1987-06-09 Ekhoff Donald L Rigid disk finishing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109500669A (en) * 2018-12-10 2019-03-22 皖西学院 A kind of fixed grinding device of adjustable bearing processing

Also Published As

Publication number Publication date
EP0362516A2 (en) 1990-04-11
DE68911456T2 (en) 1994-06-23
DE68911456D1 (en) 1994-01-27
JPH02139172A (en) 1990-05-29
US4934102A (en) 1990-06-19
JPH08359B2 (en) 1996-01-10
EP0362516B1 (en) 1993-12-15

Similar Documents

Publication Publication Date Title
EP0362516A3 (en) System for mechanical planarization
EP0366880A3 (en) Alignment device
TW328921B (en) Production process for semiconductor wafer, lapping method used thereof and its apparatus
ATE62437T1 (en) DOUBLE-ROTATING UNIVERSAL SPINDLE HEAD FOR MACHINE TOOLS.
MY106578A (en) Edge polisher
ES8300274A1 (en) Grinding machine for simultaneously grinding internal, external and/or plane surfaces of workpieces.
EP0203255A3 (en) Balanced orbital sander
FR2507935B1 (en)
EP0349653A4 (en) Superfinishing machine with lapping film
AU1285295A (en) Edge grinder for mechanically rounding off edges of structural members
IT1249601B (en) DEVICE FOR COMBINED GRINDING AND SANDING OF ROLLING BEARING RINGS
TW355153B (en) A method for leveling abrasive cloth and device for the same
TW377463B (en) Wafer chamfering method and apparatus
EP0180175A3 (en) Surface grinding apparatus
CA2078479A1 (en) Method of Forming Rib Surfaces on a Power Transmission Belt
MY129699A (en) Apparatus for polishing notch portion of wafer
ES542581A0 (en) MACHINE FOR THE GRINDING OF TORIC SURFACES IN LENSES
ES2013049A6 (en) Rolling ball assembly and deck.
EP1125686A4 (en) Work holding disc for polishing, work polishing apparatus, and work polishing method
JPS57102747A (en) Lens abrasion method
EP0337379A3 (en) Chemical polishing process
HU895835D0 (en) Abrasive grinding wheel
JPS645759A (en) Chamfering method for glass disc
ES8507231A1 (en) Spring driven motor.
IT1258972B (en) DEVICE AND PROCEDURE FOR ROUNDING THE EDGES OF SEMI-CONDUCTOR WASHERS

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB

17P Request for examination filed

Effective date: 19900820

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 19920313

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REF Corresponds to:

Ref document number: 68911456

Country of ref document: DE

Date of ref document: 19940127

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19950726

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19960806

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19960809

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19960809

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980430

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20010821

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030301