EP0434141A1 - Method for encoding identification information on circuit dice using step and repeat lithography - Google Patents

Method for encoding identification information on circuit dice using step and repeat lithography Download PDF

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Publication number
EP0434141A1
EP0434141A1 EP90203310A EP90203310A EP0434141A1 EP 0434141 A1 EP0434141 A1 EP 0434141A1 EP 90203310 A EP90203310 A EP 90203310A EP 90203310 A EP90203310 A EP 90203310A EP 0434141 A1 EP0434141 A1 EP 0434141A1
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EP
European Patent Office
Prior art keywords
circuit
dice
identification
elements
circuit die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP90203310A
Other languages
German (de)
French (fr)
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EP0434141B1 (en
Inventor
Victor Akylas
Charles Seaborg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
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Application filed by Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Gloeilampenfabrieken NV
Publication of EP0434141A1 publication Critical patent/EP0434141A1/en
Application granted granted Critical
Publication of EP0434141B1 publication Critical patent/EP0434141B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates in general to a method for encoding identification, serialization, or other information on circuit dice during fabrication.
  • an array of electrically readable elements such as polysilicon resistors, on each of the circuit dice, and then selectively removing different ones of the elements on each of the dice for identification purposes.
  • a conventional step and repeat lithopraphic process is utilized for this purpose, and it is arranged so that as each circuit die on a semiconductor wafer is exposed thereby, a step and repeat mask will shift just enough so that a different element in the array will be left unexposed on each of the dice on the wafer. In this manner, all of the dice on the wafer can be differentiated from each other by the identification elements which differs for each die.
  • the element in the array that is left unaxposed on each die corresponds with the position of the die on the wafer. Any conventional electrical sensing means can be then employed to sense or detect the presence of the identification element. A multiplexing circuit can be employed to check each of the element locations in the array quickly.
  • Fig. 1 is a perspective illustration of a semiconductor wafer with a plurality of circuit dice formed thereon;
  • Figs. 2A-C are partial perspective illustrations of portions of the circuit dice showing the fabrication steps by which an identification element is formed on each circuit die;
  • Fig. 3 is a schematic block diagram of a circuit for sensing the presence or absence of identification elements on a circuit die.
  • Disposed in the lower left corner of each of the dice 12 is an identification element array area 14 as illustrated by the dashed lines in Fig. 1.
  • the array area 14 contains a number of identification elements 16, each of which corresponds to one of the circuit dice 12 on the wafer 10.
  • the elements 16 can be any suitable electrically readable elements, such as polysilicon resistors, for example.
  • each of the circuit dice 12 has a unique identification element 16 which can be employed to distinguish the circuit dice 12 from one another electrically.
  • the first step is to form the circuit patterns, including all of the identification elements 16 and a plurality of associated lead lines 17, on each of the circuit dice 12 by using conventional photolithopgraphic techniques.
  • the finished circuits are then covered with a photoresist mask 18 which includes a plurality of openings 20 for each of the identification resistors 16.
  • a step and repeat mask 22 is then positioned above the photoresist mask 18 so that a dark area 23 on the mask 22 shields the opening 20 which corresponds to the identification element 16 that is to remain on each of the circuit dice 12.
  • Step and repeat photolithography is then employed to expose and remove each of the unmasked identification elements 16 from the circuit dice 12.
  • Each exposure step exposes the identification elements on one of the circuit dice 12.
  • the step and repeat mask 22 is stepped a distance equal to the width of the circuit die 12 as denoted by X in Fig. 2B plus the distance D between adjacent identification elements 16.
  • the step and repeat mask 22 will be positioned above a different element 16 for each of the circuit dice 12 so that a different identification element 16 will remain on each of the dice 12 after the step and repeat photolithographic process is completed.
  • the final step is to remove the photoresist mask 18 as is conventional in the art thereby leaving the circuits as shown in Fig. 2C with a plurality of open spaces 24 where the removed elements used to be. Any suitable technique is then employed to determine the location of the identification resistor 16 on each of the circuit dice 12 and thereby distinguish each of the circuit dice from each other.
  • FIG. 3 there is illustrated an example of a circuit for determining the identification of a circuit die by electrically testing for the presence or absence of identification elements on the circuit die.
  • a variation on the identification elements of Figs. 1-2 is illustrated in which, a plurality of column identification elements 50 and row indentification elements 52 are disposed on each circuit die within the identification element array area 14 as illustrated by the dashed lines in Fig. 3.
  • Each circuit die on a wafer is identified by its column and row position on the wafer through use of the column identification elements 50 and the row identification elements 52, respectively.
  • Fig. 3 a variation on the identification elements of Figs. 1-2 is illustrated in which, a plurality of column identification elements 50 and row indentification elements 52 are disposed on each circuit die within the identification element array area 14 as illustrated by the dashed lines in Fig. 3.
  • Each circuit die on a wafer is identified by its column and row position on the wafer through use of the column identification elements 50 and the row identification elements 52, respectively.
  • a first open circuit 54 is formed in the second of the plurality of column identification elements 50 to indicate that the circuit die was positioned in the second column of dice on the wafer.
  • a second open circuit 56 is formed in the second of the plurality of row identification elements 52 to indicate that the circuit die was positioned in the second row of dice on the wafer.
  • a testing circuit 60 is connected to the column and row identification elements 50 and 52 to apply a test voltage to each of the elements sequentially with a conventional multiplexer circuit.
  • the testing circuit 60 applies a positive voltage through a first output line 62 to a first plurality of FET type gates 64.
  • the gates 64 are in turn connected through a plurality of lines 66 to the column identification elements 50.
  • a second output 68 of testing circuit 60 supplies a positive voltage selectively to a second plurality of FET type gates 70, which in turn are connected through a plurality of lines 72 to the row indentification elements 52.
  • a plurality of multiplexer outputs 74 of testing circuit 60 are connected through a plurality of lines 76 to a plurality of corresponding gates 78 on each of the first plurality of FET gates 64, and to a corresponding plurality of gates 82 of the second plurality of FET gates 70.
  • voltages are first supplied to the column identification elements 50 and the gates of the FET gates 64 are sequentially enabled by the multiplexer so that the testing circuit can determine if current flows through each of the column identification elements 50. In the example illustrated in Fig. 3, no current will flow through the second column identification element and the testing circuit will therefore be able to determine that the circuit die under test was positioned in column 2 on the wafer.
  • the voltage is then supplied to the row indentification elements 52 and the gates of the FET gates 80 are sequentially enabled with the multiplexer so that the testing circuit 60 can determine the identification of the missing row identification element.
  • the testing circuit 60 will determine that the circuit die under test was positioned in the second row on the wafer.

Abstract

A method is disclosed whereby identification information can be encoded onto a plurality of circuit dice on a wafer to enable each of them to be distinguished from one another. An array of electrically readable identification elements, such as resistors, is disposed on each of the circuit dice during the circuit fabrication process. A first mask is then positioned over the each of the dice which completely covers all but the identification elements. A step and repeat mask is then selectively positioned over a particular element or elements in the array which identify a circuit die by its location on the wafer. The die is then exposed using a conventional step and repeat photolithographic process so that only the selected identification element or elements in the array will remain. The second mask is then stepped over the next circuit die on the wafer but is positioned over a different identification element or elements in the array. This process is repeated for all of the circuit dice on the wafer so that different identification elements remain for each circuit die to distinguish them from one another. Using the step and repeat process in this manner eliminates the necessity for individually coding the identification information into each of the circuit dice.

Description

  • The present invention relates in general to a method for encoding identification, serialization, or other information on circuit dice during fabrication.
  • There is a need for providing identification and other types of information on circuit dice or chips. For example, it may be desireable or necessary in circuit parameter studies to monitor small shifts in the values of the various circuit parameters of a test die over time. In order to observe such shifts accurately, a particular test circuit die must be used for each measurement because the variation of the circuit parameters from die to die may be comparable to, or even larger than, the shifts that are to be monitored. Consequently, some means must be provided by which a particular circuit die can be identified.
    The use of visible or optically readable marks and codes is not generally suitable because the dice are encapsulated so that the marks or codes can not be seen. As a consequence, electrical identification of the dice is the only workable solution, especially for large volumes of parts processed in production, assembly and test facilities. The only other alternative is to maintain part identification with physical means, such as part carriers or identification bins, however, this solution is unworkable with large numbers of parts and the risk of misclassification is unacceptably high.
  • In technologies in which there are inherently built-in programmable structures, such as programmable memories, it is a rather straight forward to use these available structures for encoding the identification information into the circuits. However, with other types of circuits that do not include any programmable structures, extra undesirable or even impossible fabrication steps are required to add them which could have an effect on the measured circuit parameters that would defeat the whole purpose of the parameter study. What is needed is a simple method for incorporating identification information into a circuit die during the fabricating of the die.
  • It is therefore the object of the present invention to provide a method for fabricating circuit dice in which electrically detectable identification information is incorporated into each of the dice during the fabrication process without any programming operation, or incompatible fabrication steps.
  • This and other objects of the invention are achieved by providing an array of electrically readable elements, such as polysilicon resistors, on each of the circuit dice, and then selectively removing different ones of the elements on each of the dice for identification purposes. A conventional step and repeat lithopraphic process is utilized for this purpose, and it is arranged so that as each circuit die on a semiconductor wafer is exposed thereby, a step and repeat mask will shift just enough so that a different element in the array will be left unexposed on each of the dice on the wafer. In this manner, all of the dice on the wafer can be differentiated from each other by the identification elements which differs for each die. In one preferred embodiment of the invention, the element in the array that is left unaxposed on each die corresponds with the position of the die on the wafer. Any conventional electrical sensing means can be then employed to sense or detect the presence of the identification element. A multiplexing circuit can be employed to check each of the element locations in the array quickly.
  • The foregoing and additional objects, features and advantages of the present invention will become apparent from a consideration of the following detailed description of the preferred embodiments thereof taken in conjuction with the accompanying drawings in which:
    Fig. 1 is a perspective illustration of a semiconductor wafer with a plurality of circuit dice formed thereon;
    Figs. 2A-C are partial perspective illustrations of portions of the circuit dice showing the fabrication steps by which an identification element is formed on each circuit die; and,
    Fig. 3 is a schematic block diagram of a circuit for sensing the presence or absence of identification elements on a circuit die.
  • Turning now to a more detailed consideration of the present invention, there is illustrated in Fig. 1, a semiconductor wafer 10 on which are formed a plurality of circuit dice 12. Although only four dice are illustrated in Fig. 1 for convenience, it will be understood that a considerably greater number of circuit dice could be formed in the wafer 10 as is conventional in the art. Disposed in the lower left corner of each of the dice 12 is an identification element array area 14 as illustrated by the dashed lines in Fig. 1. The array area 14 contains a number of identification elements 16, each of which corresponds to one of the circuit dice 12 on the wafer 10. The elements 16 can be any suitable electrically readable elements, such as polysilicon resistors, for example. During the fabrication of the circuit dice 12, only one identification element 16 remains on each of the circuit dice 12 and that element is disposed in the array area 14 at a position which corresponds to the position of the circuit die 12 on the wafer 10. As a result, each of the circuit dice 12 has a unique identification element 16 which can be employed to distinguish the circuit dice 12 from one another electrically.
  • Turning now to Figs. 2A-C, the method by which the identification elements 16 are formed on each of the circuit dice 12 is illustrated. With reference to Fig. 2A, the first step is to form the circuit patterns, including all of the identification elements 16 and a plurality of associated lead lines 17, on each of the circuit dice 12 by using conventional photolithopgraphic techniques. As illustrated in Fig. 2B, the finished circuits are then covered with a photoresist mask 18 which includes a plurality of openings 20 for each of the identification resistors 16. A step and repeat mask 22 is then positioned above the photoresist mask 18 so that a dark area 23 on the mask 22 shields the opening 20 which corresponds to the identification element 16 that is to remain on each of the circuit dice 12.
  • Step and repeat photolithography is then employed to expose and remove each of the unmasked identification elements 16 from the circuit dice 12. Each exposure step exposes the identification elements on one of the circuit dice 12. After this, the step and repeat mask 22 is stepped a distance equal to the width of the circuit die 12 as denoted by X in Fig. 2B plus the distance D between adjacent identification elements 16. In this manner, the step and repeat mask 22 will be positioned above a different element 16 for each of the circuit dice 12 so that a different identification element 16 will remain on each of the dice 12 after the step and repeat photolithographic process is completed. The final step is to remove the photoresist mask 18 as is conventional in the art thereby leaving the circuits as shown in Fig. 2C with a plurality of open spaces 24 where the removed elements used to be. Any suitable technique is then employed to determine the location of the identification resistor 16 on each of the circuit dice 12 and thereby distinguish each of the circuit dice from each other.
  • Turning now to Fig. 3, there is illustrated an example of a circuit for determining the identification of a circuit die by electrically testing for the presence or absence of identification elements on the circuit die. In particular, a variation on the identification elements of Figs. 1-2 is illustrated in which, a plurality of column identification elements 50 and row indentification elements 52 are disposed on each circuit die within the identification element array area 14 as illustrated by the dashed lines in Fig. 3. Each circuit die on a wafer is identified by its column and row position on the wafer through use of the column identification elements 50 and the row identification elements 52, respectively. In the example shown in Fig. 3, a first open circuit 54 is formed in the second of the plurality of column identification elements 50 to indicate that the circuit die was positioned in the second column of dice on the wafer. Similarly, a second open circuit 56 is formed in the second of the plurality of row identification elements 52 to indicate that the circuit die was positioned in the second row of dice on the wafer. It should be noted that in this embodiment, the absence of an identification element identifies the circuit die in contrast to the embodiment of Fig. 1, in which the presence of an identification element identifies the circuit die.
  • A testing circuit 60 is connected to the column and row identification elements 50 and 52 to apply a test voltage to each of the elements sequentially with a conventional multiplexer circuit. The testing circuit 60 applies a positive voltage through a first output line 62 to a first plurality of FET type gates 64. The gates 64 are in turn connected through a plurality of lines 66 to the column identification elements 50. Similarly, a second output 68 of testing circuit 60 supplies a positive voltage selectively to a second plurality of FET type gates 70, which in turn are connected through a plurality of lines 72 to the row indentification elements 52.
  • A plurality of multiplexer outputs 74 of testing circuit 60 are connected through a plurality of lines 76 to a plurality of corresponding gates 78 on each of the first plurality of FET gates 64, and to a corresponding plurality of gates 82 of the second plurality of FET gates 70. In the operation of the circuit of Fig. 3, voltages are first supplied to the column identification elements 50 and the gates of the FET gates 64 are sequentially enabled by the multiplexer so that the testing circuit can determine if current flows through each of the column identification elements 50. In the example illustrated in Fig. 3, no current will flow through the second column identification element and the testing circuit will therefore be able to determine that the circuit die under test was positioned in column 2 on the wafer. Similarly, the voltage is then supplied to the row indentification elements 52 and the gates of the FET gates 80 are sequentially enabled with the multiplexer so that the testing circuit 60 can determine the identification of the missing row identification element. In this example, the testing circuit 60 will determine that the circuit die under test was positioned in the second row on the wafer.
  • Although the invention has been disclosed in terms of preferred embodiments, it will be understood that numerous variations and modifications could be made thereto without departing from the true spirit and scope of the invention as defined by the following claims.

Claims (3)

  1. A method for encoding identification information onto each of a plurality of circuit dice on a semiconductor wafer comprising the steps of:
    a) forming a plurality of electrically readable identification elements on each of a plurality of circuit dice on a semiconductor wafer; and
    b) removing selected ones of said identification elements from each of said circuit dice such that a different one or ones of said plurality of identification elements remains on each said circuit die so that each said circuit die can be distinquished from one another electrically.
  2. The method of claim 1 wherein said step of removing comprises:
    i) covering at least one of said identification elements on a first circuit die with a mask;
    ii) exposing the first circuit die to remove all unmasked identification elements;
    iii) moving said mask over a second different one or ones of said identification elements on a second circuit die on said semiconductor wafer;
    iv) exposing said second circuit die to remove all unmasked identification elements; and,
    v) repeating steps iii and iv for each circuit die in said semiconductor wafer so that different identification elements remain on each circuit die so that each circuit die on said wafer can be distinquished from one another.
  3. The method of claim 2, whererein step and repeat photolithography is used for the steps of moving and exposing.
EP90203310A 1989-12-20 1990-12-13 Method for encoding identification information on circuit dice using step and repeat lithography Expired - Lifetime EP0434141B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45354489A 1989-12-20 1989-12-20
US453544 1989-12-20

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EP0434141A1 true EP0434141A1 (en) 1991-06-26
EP0434141B1 EP0434141B1 (en) 1998-11-04

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Cited By (9)

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DE19829674A1 (en) * 1998-07-03 2000-01-13 Heidelberg Instruments Mikrotechnik Gmbh Layer technology utilizing direct writing for lithography of semiconductor chips
WO2001039269A1 (en) * 1999-11-24 2001-05-31 Micronic Laser Systems Ab Method and apparatus for personalization of semiconductor
WO2001054194A1 (en) * 2000-01-20 2001-07-26 Zavitan Semiconductors, Inc. Personalized hardware
EP1589578A1 (en) * 2004-04-19 2005-10-26 STMicroelectronics S.r.l. Method and structures for indexing dice
EP1598854A1 (en) * 2003-02-20 2005-11-23 Hitachi High-Technologies Corporation Semiconductor device and semiconductor production management system
EP1843382A3 (en) * 2000-03-10 2008-01-02 Canon Kabushiki Kaisha Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
US9136222B2 (en) 2012-05-11 2015-09-15 GlobalFoundries, Inc. Chip identification pattern and method of forming
US9235127B2 (en) 2010-03-05 2016-01-12 Mycronic AB Method and apparatus for merging multiple geometrical pixel images and generating a single modulator pixel image
CN106531721A (en) * 2015-09-09 2017-03-22 株式会社东芝 Semiconductor device, inspection pattern arrangement method and method of manufacturing semiconductor device

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DE102015112962B4 (en) * 2015-08-06 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for arranging a multiplicity of semiconductor structural elements on a carrier and a carrier with a multiplicity of semiconductor structural elements

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US4409686A (en) * 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
EP0133955A1 (en) * 1983-07-29 1985-03-13 Siemens Aktiengesellschaft Test structure for identifying semiconductor chips, and process for their identification

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US4409686A (en) * 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
EP0057645A1 (en) 1981-02-04 1982-08-11 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Electrically coded identification of integrated circuit devices
EP0133955A1 (en) * 1983-07-29 1985-03-13 Siemens Aktiengesellschaft Test structure for identifying semiconductor chips, and process for their identification

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19829674A1 (en) * 1998-07-03 2000-01-13 Heidelberg Instruments Mikrotechnik Gmbh Layer technology utilizing direct writing for lithography of semiconductor chips
US7211453B2 (en) 1999-11-24 2007-05-01 Micronic Laser Systems Ab Method and apparatus for personalization of semiconductor
WO2001039269A1 (en) * 1999-11-24 2001-05-31 Micronic Laser Systems Ab Method and apparatus for personalization of semiconductor
US6813058B1 (en) 1999-11-24 2004-11-02 Micronic Laser Systems Ab Method and apparatus for personalization of semiconductor
US7842525B2 (en) 1999-11-24 2010-11-30 Micronic Mydata AB Method and apparatus for personalization of semiconductor
WO2001054194A1 (en) * 2000-01-20 2001-07-26 Zavitan Semiconductors, Inc. Personalized hardware
EP1843382A3 (en) * 2000-03-10 2008-01-02 Canon Kabushiki Kaisha Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
EP2192608A1 (en) * 2000-03-10 2010-06-02 Canon Kabushiki Kaisha Substrate holding device
EP1598854A4 (en) * 2003-02-20 2007-03-21 Hitachi High Tech Corp Semiconductor device and semiconductor production management system
EP1598854A1 (en) * 2003-02-20 2005-11-23 Hitachi High-Technologies Corporation Semiconductor device and semiconductor production management system
US7348682B2 (en) 2004-04-19 2008-03-25 Stmicroelectronics S.R.L. Method and structures for indexing dice
US7491620B2 (en) 2004-04-19 2009-02-17 Stmicroelectronics S.R.L. Method and structures for indexing dice
EP1589578A1 (en) * 2004-04-19 2005-10-26 STMicroelectronics S.r.l. Method and structures for indexing dice
US7868474B2 (en) 2004-04-19 2011-01-11 Stmicroelectronics, S.R.L. Method and structures for indexing dice
EP2282338A3 (en) * 2004-04-19 2012-10-24 STMicroelectronics Srl Method and structures for indexing dice
US9235127B2 (en) 2010-03-05 2016-01-12 Mycronic AB Method and apparatus for merging multiple geometrical pixel images and generating a single modulator pixel image
US9291902B2 (en) 2010-03-05 2016-03-22 Mycronic AB Method and apparatus for merging multiple geometrical pixel images and generating a single modulator pixel image
US9136222B2 (en) 2012-05-11 2015-09-15 GlobalFoundries, Inc. Chip identification pattern and method of forming
CN106531721A (en) * 2015-09-09 2017-03-22 株式会社东芝 Semiconductor device, inspection pattern arrangement method and method of manufacturing semiconductor device

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EP0434141B1 (en) 1998-11-04
JP3007421B2 (en) 2000-02-07

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