EP0483983A3 - Method and apparatus for the detection of leakage current - Google Patents

Method and apparatus for the detection of leakage current Download PDF

Info

Publication number
EP0483983A3
EP0483983A3 EP19910309151 EP91309151A EP0483983A3 EP 0483983 A3 EP0483983 A3 EP 0483983A3 EP 19910309151 EP19910309151 EP 19910309151 EP 91309151 A EP91309151 A EP 91309151A EP 0483983 A3 EP0483983 A3 EP 0483983A3
Authority
EP
European Patent Office
Prior art keywords
detection
leakage current
leakage
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19910309151
Other versions
EP0483983A2 (en
EP0483983B1 (en
Inventor
John M. Heumann
Vance R. Harwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0483983A2 publication Critical patent/EP0483983A2/en
Publication of EP0483983A3 publication Critical patent/EP0483983A3/en
Application granted granted Critical
Publication of EP0483983B1 publication Critical patent/EP0483983B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/265Contactless testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52Testing for short-circuits, leakage current or ground faults
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54Testing for continuity
EP91309151A 1990-10-29 1991-10-07 Method and apparatus for testing the soldering of semiconductor devices by the detection of leakage current Expired - Lifetime EP0483983B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/605,289 US5111137A (en) 1990-10-29 1990-10-29 Method and apparatus for the detection of leakage current
US605289 1990-10-29

Publications (3)

Publication Number Publication Date
EP0483983A2 EP0483983A2 (en) 1992-05-06
EP0483983A3 true EP0483983A3 (en) 1992-09-23
EP0483983B1 EP0483983B1 (en) 1997-04-09

Family

ID=24423044

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91309151A Expired - Lifetime EP0483983B1 (en) 1990-10-29 1991-10-07 Method and apparatus for testing the soldering of semiconductor devices by the detection of leakage current

Country Status (4)

Country Link
US (1) US5111137A (en)
EP (1) EP0483983B1 (en)
JP (1) JP3285913B2 (en)
DE (1) DE69125571T2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625292A (en) * 1990-12-20 1997-04-29 Hewlett-Packard Company System for measuring the integrity of an electrical contact
US5557209A (en) * 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
JP3214766B2 (en) * 1992-08-06 2001-10-02 アジレント・テクノロジーズ・インク Equipment for connection inspection
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
WO1994016337A1 (en) * 1992-12-31 1994-07-21 United Technologies Corporation Non-contact current injection apparatus and method for use with linear bipolar circuits
JP3396834B2 (en) * 1997-12-17 2003-04-14 日本電気エンジニアリング株式会社 IC connection test method
US7474115B1 (en) * 2004-12-28 2009-01-06 Dupont Displays, Inc. Organic electronic device display defect detection
CN101320076B (en) * 2008-07-23 2011-03-23 潘敏智 Reverse dynamic drain current test method and test circuit for fast recovery diode
US9778310B2 (en) 2010-11-05 2017-10-03 Kelsey-Hayes Company Apparatus and method for detection of solenoid current
US10551423B1 (en) 2015-01-13 2020-02-04 The United States Of America As Represented By The Secretary Of The Army System and method for simultaneous testing of radiation, environmental and electrical reliability of multiple semiconductor electrical devices
FR3068781A1 (en) 2017-07-06 2019-01-11 Ateq METHOD FOR DETECTING LEAKAGE OF HOLLOW PIECE AND INSTALLATION FOR IMPLEMENTING SUCH A METHOD
FR3073623B1 (en) 2017-11-16 2019-11-08 Ateq INSTALLATION AND METHOD FOR DETECTING AND LOCATING A LEAK IN A FLUID TRANSPORT CIRCUIT, IN PARTICULAR AN AIRCRAFT
CN112334783B (en) * 2018-06-21 2024-03-22 三菱电机株式会社 Reliability evaluation device for semiconductor element and reliability evaluation method for semiconductor element
ES2966778T3 (en) * 2018-08-31 2024-04-24 Ateq Corp Battery leak test device and procedures
FR3092171B1 (en) 2019-01-29 2021-04-30 Ateq Tracer gas leak detection system and corresponding use.
FR3106661B1 (en) 2020-01-28 2022-01-21 Ateq LEAK DETECTION DEVICE
CN112924840B (en) * 2021-02-26 2023-09-12 航天科工防御技术研究试验中心 LED failure positioning method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0142366A1 (en) * 1983-11-15 1985-05-22 Dataprobe Corporation Test system for integrated circuit and method of testing
US4575676A (en) * 1983-04-04 1986-03-11 Advanced Research And Applications Corporation Method and apparatus for radiation testing of electron devices
US4698587A (en) * 1985-03-28 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
EP0292137A2 (en) * 1987-05-20 1988-11-23 Hewlett-Packard Company Integrated circuit transfer test device system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4588945A (en) * 1983-06-13 1986-05-13 Hewlett-Packard Company High throughput circuit tester and test technique avoiding overdriving damage
US4588946A (en) * 1983-12-30 1986-05-13 At&T Bell Laboratories Method for measuring current at a p-n junction
US4712063A (en) * 1984-05-29 1987-12-08 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for measuring areas of photoelectric cells and photoelectric cell performance parameters
US4644264A (en) * 1985-03-29 1987-02-17 International Business Machines Corporation Photon assisted tunneling testing of passivated integrated circuits
JPS61267336A (en) * 1985-05-21 1986-11-26 Matsushita Electric Ind Co Ltd Method and device for inspecting semiconductor device
US4870352A (en) * 1988-07-05 1989-09-26 Fibertek, Inc. Contactless current probe based on electron tunneling

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575676A (en) * 1983-04-04 1986-03-11 Advanced Research And Applications Corporation Method and apparatus for radiation testing of electron devices
EP0142366A1 (en) * 1983-11-15 1985-05-22 Dataprobe Corporation Test system for integrated circuit and method of testing
US4698587A (en) * 1985-03-28 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
EP0292137A2 (en) * 1987-05-20 1988-11-23 Hewlett-Packard Company Integrated circuit transfer test device system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IEEE JOURNAL OF SOLID-STATE CIRCUITS. vol. SC-12, no. 3, June 1977, NEW YORK US pages 247 - 252; J.G. SMITH: 'LASER TESTING OF INTEGRATED CIRCUITS' *
IEEE JOURNAL OF SOLID-STATE CIRCUITS. vol. SC-20, no. 1, February 1985, NEW YORK US pages 284 - 289; W.R. EISENSTADT ET AL.: 'ON-CHIP PICOSECOND TIME DOMAIN MEASUREMENTS FOR VLSI AND INTERCONNECT TESTING USING PHOTOCONDUCTORS' *

Also Published As

Publication number Publication date
EP0483983A2 (en) 1992-05-06
DE69125571T2 (en) 1997-07-17
JP3285913B2 (en) 2002-05-27
DE69125571D1 (en) 1997-05-15
US5111137A (en) 1992-05-05
EP0483983B1 (en) 1997-04-09
JPH04288900A (en) 1992-10-13

Similar Documents

Publication Publication Date Title
GB9014263D0 (en) Apparatus and method for spatially- and spectrally- resolvedmeasurements
EP0449582A3 (en) Measuring method and apparatus
EP0444869A3 (en) Apparatus and method for detecting images
GB9026770D0 (en) Electrophotographic apparatus and method
EP0483983A3 (en) Method and apparatus for the detection of leakage current
GB9016291D0 (en) Sealing method and apparatus
EP0460471A3 (en) Method and apparatus for measuring cross-toe
GB2240562B (en) Arrangement and method for conducting substance and seal therefor
GB9021859D0 (en) Test apparatus and method
GB2250154B (en) Apparatus and method for locating an object
EP0162201A3 (en) Leak detection method and apparatus
GB2286248B (en) Detection method and apparatus
GB9119503D0 (en) Inspection method and apparatus
GB2289344B (en) Detection method and apparatus
EP0446724A3 (en) Current limiting method and apparatus
GB9011608D0 (en) Method and apparatus
GB2251163B (en) Method and apparatus for coherent detection
EP0495189A3 (en) Method and installation for assuring and determining the guarantee time of an apparatus
GB2249514B (en) Stabilising method and apparatus
GB9009751D0 (en) Measuring apparatus and method
GB9021539D0 (en) Method and apparatus
ZA909170B (en) Rock-stress measuring apparatus and method
GB9016288D0 (en) Method and apparatus
GB9001081D0 (en) Method and apparatus
GB9216750D0 (en) Detection method and apparatus

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB

17P Request for examination filed

Effective date: 19930304

17Q First examination report despatched

Effective date: 19941102

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REF Corresponds to:

Ref document number: 69125571

Country of ref document: DE

Date of ref document: 19970515

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

REG Reference to a national code

Ref country code: FR

Ref legal event code: TP

REG Reference to a national code

Ref country code: FR

Ref legal event code: TP

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20031001

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20031020

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20041007

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20041130

Year of fee payment: 14

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20041007

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050630

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060503