EP0497948A1 - Procede et dispositif d'encapsulation hermetique de composants electroniques. - Google Patents
Procede et dispositif d'encapsulation hermetique de composants electroniques.Info
- Publication number
- EP0497948A1 EP0497948A1 EP91914937A EP91914937A EP0497948A1 EP 0497948 A1 EP0497948 A1 EP 0497948A1 EP 91914937 A EP91914937 A EP 91914937A EP 91914937 A EP91914937 A EP 91914937A EP 0497948 A1 EP0497948 A1 EP 0497948A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- components
- hermetic
- encapsulation
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000005538 encapsulation Methods 0.000 title claims description 10
- 229910052500 inorganic mineral Inorganic materials 0.000 claims abstract description 9
- 239000011707 mineral Substances 0.000 claims abstract description 9
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 3
- 238000005121 nitriding Methods 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 150000002894 organic compounds Chemical class 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Definitions
- the subject of the present invention is a device ensuring encapsulation of electronic components, encapsulation which is hermetic, that is to say which does not allow gases to pass and, in particular, not water vapor.
- component housings whose base is ceramic and the metal cover, hermetically sealed on the base, degassing before closing the cover is also generally provided.
- a disadvantage of this solution is its cost price, which is very high.
- the present invention relates to an encapsulation of electronic components which is both hermetic, simple to implement and inexpensive.
- the components (such as semiconductor wafers) are covered:
- This process applies to components taken individually as well as to components (possibly already encapsulated) mounted on a printed circuit board: ii is then applied to the board and components assembly.
- the pads can be easily mounted on the card through their housings and, in any known manner, using inexpensive materials (housings and printed board); hermeticity is ensured by the second layer and the assembly is relatively low cost on the one hand, due to the choice of materials (housings and / or printed board) and, on the other hand, that this technique is directly applicable to any card carrying an electronic circuit, without requiring the relocation of the components, for example in order to provide space for means ensuring sealing.
- FIG. 1 therefore represents an embodiment of the device according to the invention and will be described in relation to FIG. 2, which illustrates the different stages of its manufacture.
- electronic components such as semiconductor wafers forming discrete components or integrated circuits
- the boxes components themselves do not have to be airtight; it is thus possible to use any type of case, for example plastic cases, the cost of which is known to be very much lower than that of ceramic cases.
- boxes intended to be mounted flat such boxes being marked 10 in FIG. 1, or boxes provided with connection lugs (or pins), boxes marked 11 in FIG. 1 , with tabs 12, intended to pass through the printed circuit board on which they are mounted.
- a printed circuit substrate or card
- the preceding cases are also conventionally mounted on a printed circuit substrate (or card), marked 50 in FIG. 1.
- a printed circuit substrate or card
- the invention and as above is possible to use any type of printed circuit, ceramic or epoxy, single layer or multilayer, single face or double face, and whose size is not limited.
- a multilayer card comprising a plurality of internal connection planes, identified
- the printed circuit substrate 50 has metallized holes 51 for those of the housings (11) which include connection tabs (12).
- the next step (23 in FIG. 2) consists in depositing on substantially all of the printed circuit and of the boxes 10 and 11 a first layer 30, constituted by an organic compound.
- a material known as PARYLENE produced by the company UNION CARBIDE is suitable.
- a varnish, silicone, epoxy or acrylic, is also suitable. Its function is to substantially level the surface on which the next layer will be deposited; here we mean by leveling, achieving a certain softening of the angles as well as a certain leveling of the surface and a clogging of the interstices (in particular between components 10 or 11 and surface of the printed circuit 50), to form a substantially uniform surface facilitating the deposition of the next layer and allowing for the latter, * a very small thickness without risk of cracks.
- this first layer preferably has a relatively large thickness (typically a few tens of microns).
- the next step (24 in FIG. 2) consists in depositing on substantially all of the layer 30 a second layer, marked 40, of a hermetic mineral material.
- This layer can typically consist of a metallic compound and can be very thin (typically a few microns) thanks to the presence of the first layer.
- the cost of depositing a layer such as 40 being higher than that of layer 30, this constitutes an advantage.
- a metal oxide aluminum, silicon, zirconium, titanium or tin for example
- a metal nitride silicon nitride for example
- This layer can be obtained either by direct deposition of the metallic compound, or by deposition of the metal which is then oxidized and / or nitride, by any known means. Furthermore, in the case where the material chosen to make the layer 40 is electrically conductive, the layer 30 material must also be electrically insulating.
- a third mechanical protection layer is deposited on the mineral layer 40: in fact, if the layer 40 is very thin, it may be preferable to protect it against impacts or scratches .
- this third layer may consist of a thin layer (typically from 5 to 10 ⁇ m approximately) of PARYLENE. According to another variant, one deposits, always on the
- layer 40 a third layer of an organic material such as PARYLENE, then a fourth layer of mineral material such as that constituting layer 40 (SiO 2 for example); the second -fourth layers then form a sandwich type structure which has reinforced mechanical strength.
- an organic material such as PARYLENE
- a fourth layer of mineral material such as that constituting layer 40 (SiO 2 for example)
- the presence of the first layer 30 under the layer 40 also makes it possible to easily release as necessary the parts thus covered and which should not be, such as adjustable elements or switches. In addition, it allows, by local laser machining for example, to make punctual holes allowing the application of a test tip, without compromising the tightness of the entire card.
- the advantage is in particular the repair of a card: in this case, the out-of-service box or boxes can be replaced by plastic boxes for example, covered with the two layers described above before they are mounted on the card.
- the method according to the invention is, in the same way, also applicable for achieving hermetic protection of an individual component, whether or not mounted on a printed circuit board.
- steps 21 and 22 of FIG. 2 are deleted and the component is directly coated with the two layers referred to in steps 23 and 24, respectively.
- step 21 of FIG. 2 is omitted: the components are mounted on the printed circuit then covered with the two preceding layers, organic then mineral.
- the invention makes it possible in particular to achieve hermeticity of the two faces of any circuit mounted on a printed circuit, without requiring modification of the latter, of layout or of material in particular. It also allows local repair without destroying the hermé ⁇ ticity of the rest of the circuit carried by the card, the replacement component or components also being hermetic by the same method.
- the layers thus deposited being not very thick compared to the thickness of the circuit itself, they do not form an obstacle to the evacuation of the heat generated by the operation of the components.
- these different layers being transparent at low thickness, the circuit markings are visible through the layers and it is not necessary to reproduce them on the outer layer.
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9010631A FR2666190B1 (fr) | 1990-08-24 | 1990-08-24 | Procede et dispositif d'encapsulation hermetique de composants electroniques. |
FR9010631 | 1990-08-24 | ||
PCT/FR1991/000688 WO1992003902A1 (fr) | 1990-08-24 | 1991-08-23 | Procede et dispositif d'encapsulation hermetique de composants electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0497948A1 true EP0497948A1 (fr) | 1992-08-12 |
EP0497948B1 EP0497948B1 (fr) | 1995-05-03 |
Family
ID=9399835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP91914937A Expired - Lifetime EP0497948B1 (fr) | 1990-08-24 | 1991-08-23 | Procede et dispositif d'encapsulation hermetique de composants electroniques |
Country Status (7)
Country | Link |
---|---|
US (1) | US5461545A (fr) |
EP (1) | EP0497948B1 (fr) |
JP (1) | JPH05502142A (fr) |
CA (1) | CA2067784C (fr) |
DE (1) | DE69109464T2 (fr) |
FR (1) | FR2666190B1 (fr) |
WO (1) | WO1992003902A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
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FR3114643B1 (fr) | 2020-09-25 | 2022-09-09 | Nexter Munitions | Fusee electronique pour projectile |
DE102020133099A1 (de) | 2020-12-11 | 2022-06-15 | Zf Cv Systems Global Gmbh | Leiterplatte für elektronische Schaltungen |
DE102020133098A1 (de) | 2020-12-11 | 2022-06-15 | Zf Cv Systems Europe Bv | Elektronisches Steuergerät eines Fahrzeugs |
US20230269866A1 (en) * | 2022-02-24 | 2023-08-24 | Advanced Semiconductor Engineering, Inc. | Electronic device |
JP7460013B1 (ja) | 2023-11-30 | 2024-04-02 | artience株式会社 | 電子部品搭載基板及び電子機器 |
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GB956001A (en) * | 1960-08-17 | 1964-04-22 | Reyrolle A & Co Ltd | Improvements relating to the encapsulation of electrical components |
US4063349A (en) * | 1976-12-02 | 1977-12-20 | Honeywell Information Systems Inc. | Method of protecting micropackages from their environment |
US4300184A (en) * | 1979-07-11 | 1981-11-10 | Johnson Controls, Inc. | Conformal coating for electrical circuit assemblies |
JPS60160145A (ja) * | 1984-01-30 | 1985-08-21 | Mitsubishi Electric Corp | 混成集積回路のパツケ−ジング |
EP0308676A3 (fr) * | 1987-09-25 | 1990-01-10 | Siemens Aktiengesellschaft | Enrobage sans contrainte pour composants électriques et électroniques, notamment pour circuits hybrides |
JPH0278299A (ja) * | 1988-09-14 | 1990-03-19 | Hitachi Ltd | 電子部品塔載基板 |
JP2505868B2 (ja) * | 1988-10-15 | 1996-06-12 | 富士通株式会社 | 半導体装置 |
-
1990
- 1990-08-24 FR FR9010631A patent/FR2666190B1/fr not_active Expired - Fee Related
-
1991
- 1991-08-23 EP EP91914937A patent/EP0497948B1/fr not_active Expired - Lifetime
- 1991-08-23 WO PCT/FR1991/000688 patent/WO1992003902A1/fr active IP Right Grant
- 1991-08-23 CA CA002067784A patent/CA2067784C/fr not_active Expired - Lifetime
- 1991-08-23 JP JP3514366A patent/JPH05502142A/ja active Pending
- 1991-08-23 DE DE69109464T patent/DE69109464T2/de not_active Expired - Lifetime
-
1994
- 1994-09-13 US US08/305,424 patent/US5461545A/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
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See references of WO9203902A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Also Published As
Publication number | Publication date |
---|---|
CA2067784A1 (fr) | 1992-02-25 |
FR2666190B1 (fr) | 1996-07-12 |
EP0497948B1 (fr) | 1995-05-03 |
DE69109464T2 (de) | 1995-09-14 |
JPH05502142A (ja) | 1993-04-15 |
DE69109464D1 (de) | 1995-06-08 |
US5461545A (en) | 1995-10-24 |
FR2666190A1 (fr) | 1992-02-28 |
WO1992003902A1 (fr) | 1992-03-05 |
CA2067784C (fr) | 2001-10-23 |
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