EP0523862B1 - Accelerometer mounting arrangement having reduced temperature dependance - Google Patents
Accelerometer mounting arrangement having reduced temperature dependance Download PDFInfo
- Publication number
- EP0523862B1 EP0523862B1 EP92305727A EP92305727A EP0523862B1 EP 0523862 B1 EP0523862 B1 EP 0523862B1 EP 92305727 A EP92305727 A EP 92305727A EP 92305727 A EP92305727 A EP 92305727A EP 0523862 B1 EP0523862 B1 EP 0523862B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- accelerometer
- silicon
- housing
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 71
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 50
- 229910052710 silicon Inorganic materials 0.000 claims description 50
- 239000010703 silicon Substances 0.000 claims description 50
- 230000001133 acceleration Effects 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 230000003750 conditioning effect Effects 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 239000002210 silicon-based material Substances 0.000 claims 1
- 229920003266 Leaf® Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/006—Details of instruments used for thermal compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
Definitions
- the field of the invention is that of accelerometers, and the invention relates more particularly to silicon accelerometers for use in automotive safety air bag applications and the like.
- Conventional silicon accelerometers comprise a silicon mass which is movable in a silicon body relative to an integral silicon support to provide strain in the silicon body in response to acceleration of the body.
- Piezoresistive sensor means are formed in the silicon body material to be responsive to the strain to provide an electrical signal corresponding to the acceleration.
- the silicon body is mounted on an object whose acceleration is to be monitored, and the piezoresistive sensors are connected in a signal conditioning circuit or the like to provide a control signal or the like corresponding to acceleration of the object.
- Such accelerometers are known from EP-A- 0 401 669 and EP-A- 0 247 247. It has been proposed that such accelerometers are particularly adapted for sensing automotive vehicle acceleration for regulating operation of safety air bag systems and the like.
- the silicon body materials, the materials used in mounting the accelerometer in a vehicle and the materials used in electrically connecting piezoresistive sensors on the silicon body into a vehicle circuit display substantially different coefficients of thermal expansion.
- Some portions of the accelerometer also have to be fixed to a vehicle mount or the like with secure clamping forces. Accordingly when such materials are subjected to widely varying temperature conditions likely to be encountered during automotive vehicle use, which temperatures typically vary over a range from -40°C. to 85°C., the silicon body of the accelerometer tends to be subjected to strain due to the noted differences in thermal expansion properties so that the accuracy of output signal provided by the accelerometer is deleteriously affected by the strain.
- the novel and improved accelerometer device of the invention comprises a circuit board or substrate of electrically insulating material having electrically conductive circuit paths thereon.
- the circuit paths are provided on a planar upper surface of the substrate and the substrate has an opening therein disposed in spaced relation to the circuit paths.
- the substrate also has three triangularly-spaced mounting apertures.
- the device also comprises an accelerometer unit having a silicon mass movable in a silicon body relative to an integral silicon support to provide strain in the silicon body in response to acceleration and having piezoresistive sensor means in the body to be responsive to the strain to provide an electrical signal corresponding to the extent of the acceleration.
- Electrical circuit components such as a control circuit embodied in an integrated circuit chip or the like and/or various resistors and/or capacitors or the like are provided on the substrate and connected to the circuit paths to form a signal conditioning circuit or the like.
- a member is also provided for mounting the accelerometer unit on the substrate and means are provided to connect the piezoresistive sensor means to the circuit paths on the substrate while isolating or shielding the piezoresistive sensor means from strain in the silicon body which might be due to clamping forces during device mounting or to differences in thermal expansion of the silicon body, the substrate, and the conductive circuit paths during temperature changes likely to be encountered.
- the mounting member is formed of a metal material such as a nickel-iron alloy having a coefficient of thermal expansion substantially corresponding to that of silicon and has opposite ends of the member secured to the substrate at respective opposite sides of the substrate opening, preferably on the planar substrate surface on which the circuit paths are disposed.
- a central platform portion of the member is connected to the opposite member ends by respective folded-leaf spring or flexure-reducing member portions so that the platform portion of the member is received within the substrate opening, preferably with a platform surface disposed parallel to and adjacent but somewhat below the level of the planar substrate surface to position accelerometer and substrate circuit paths and terminals in the same plane.
- the accelerometer unit as above described is mounted on that platform surface with an adhesive or the like to be suspended in or immediately over the substrate opening to be compactly accommodated in the device.
- the accelerometer device includes a housing of cup shape orthe like having three integral pins upstanding from the cup bottom inside the housing, each pin having a larger diameter portion adjacent the cup bottom forming a shoulder spaced over the cup bottom.
- the mounting apertures of the substrate are fitted over those pins to rest and position the substrate on the noted shoulders and the heads or distal ends of the pins are flattened by ultrasonic staking or the like for securing the substrate on the pin shoulders.
- the member mounting the accelerometer has two corresponding mounting apertures in its respective opposite ends and the member mounting apertures are also fitted over two of the housing pins to be secured to the substrate by the flattened heads of the pins.
- a cover is fitted over the open end of the cup-shaped housing and sealed to the housing.
- the device housing has mounting lugs and bumper means thereon to permit mounting the device on an automotive vehicle or the like while isolating the accelerometer unit from strain due to device mounting.
- the accelerometer unit is adapted to provide an electrical signal more precisely corresponding to the acceleration forces to which the device is subjected, particularly when the device is subjected to the widely varying temperature conditions likely to be encountered in an automotive environment.
- 10 in Figures 1-4 indicates the novel and improved accelerometer device of the invention which is shown to include a circuit board or substrate 12 of an electrically insulating material such as ceramic, or fiberglass-filled polyethylene or the like.
- the substrate is provided with electrically conductive circuit paths of copper foil or the like in any conventional manner as is d iagrammatical- ly indicated at 14 in Figures 3 and 4.
- the circuit paths are provided on a planar upper surface 12.1 of the substrate and the substrate has an opening 16 formed in the substrate spaced from the circuit paths and preferably has three mounting apertures 18 arranged and spaced from each other in a triangular pattern as shown.
- Terminal pads 14.1 of the circuit paths are preferably formed along one edge of the substrate as shown and the thickness of the substrate is selected so that it is adapted to be rigid under the acceleration forces likely to be encountered by the device.
- the acceleration device 10 also includes a silicon accelerometer unit 20 of generally conventional type.
- the accelerometer unit comprises a silicon mass 20.1 which is movable in a silicon body 20.2 relative to an integral silicon support 20.3 to provide strain in the silicon body in response to acceleration of the body, and piezoresistive sensor means 22 are formed in the silicon body to be responsive to that strain to provide an electrical signal corresponding to the acceleration.
- the piezoresistive means are connected to unit terminal pads 22.1 as will be understood.
- acceleration units are known as shown in commonly assigned, copending European Patent Applications Nos.
- the accelerometer unit is not further described herein and it will be understood that the unit is adapted to be mounted on an object such as an automotive vehicle 24 (see Fig. 1) or the like whose acceleration is to be monitored and the piezoresistive sensor means 22 are adapted to be connected in a control circuit or the like to perform a control function in response to the occurrence of selected acceleration (or deceleration) of the object.
- the accelerometer unit is adapted to provide an electrical output signal corresponding to vehicle acceleration to regulate operation of an automotive safety air bag system or the like on occurrence of a vehicle accident.
- the accelerometer device 10 also includes circuit components such as a control circuit 26 embodied in an integrated circuit chip or the like as well as resistors and/or capacitors and the like diagrammatically indicated at 28 in Figs. 2-4 which are mounted on the substrate 12 and electrically connected to the circuit paths 14 to form a circuit for conditioning the electrical output signal provided by the accelerometer unit 20 in conventional manner.
- the noted circuit components are attached and connected on the substrate using conventional surface-mount and chip- on-board technologies.
- the i.c. chip 26 is bonded to the substrate by die-attach adhesives and terminals 26.1 of the chip etc. are connected to circuit paths by small diameter aluminum wires 26.2 wire bonded to the terminals 26.1 and to the circuit paths 14.
- the resistors and capacitors are soldered directly to the circuit paths and substrates.
- the components and wire bond locations are provided with a conformal coating diagrammatically indicated at 26.3 to chemically and mechanically protect the components and bonds.
- a member 30 is also provided in the device for suspending or mounting the accelerometer unit 20 on the substrate 12 to permit the unit to respond to acceleration forces while the piezoresistive sensor means of the unit are connected in then signal conditioning circuit while also isolating the sensor means from strain in the silicon body 20.2 which might be due to clamping forces during device mounting in the automotive vehicle or to differences in thermal expansion properties of the silicon body, the materials of the substrate 12, and the materials of the circuit paths 14.
- the member has portions 30.1, 30.2 secured to the substrate and another portion 30.5 for receiving the accelerometer unit thereon.
- the member is formed of a metal material such as a nickel-iron alloy having a nominal composition by weight of 36-50% nickel and the balance iron and having coefficient of thermal expansion which substantially corresponds to that of silicon used in the accelerometer 20.
- a metal material such as a nickel-iron alloy having a nominal composition by weight of 36-50% nickel and the balance iron and having coefficient of thermal expansion which substantially corresponds to that of silicon used in the accelerometer 20.
- the member is formed of a nickel-iron alloy comprising from 38.3 to 39.5% nickel, 0.35 to 05.% manganese, 0.25% max. silicon, 0.12% max. carbon, and 0.25 max. each of sulfur and phosphorous, and the balance iron the material being sold under the designation Low E39 by Carpenter Technology Corporation and having a coefficient of thermal expansion of 2.2 ppm/°C..
- the member has opposite member ends 30.1, 30.2 secured to the substrate 12 at opposite sides of the substrate opening 16, has a central platform portion 30.3 disposed within the substrate opening, and has folded-leaf spring portions 30.4, 30.5 (preferably with two half-leafs 30.6 folded back on opposite sides of a full central leaf 30.7) extending between the platform 30.3 and the opposite member ends 30.1, 30.2 to suspend the platform in the substrate opening.
- the folded leaf-spring portions serve as flexure-reducing means to reduce movement of the member platform when stresses due to relative thermal expansion of the substrate are transmitted to the member from the substrate.
- the member has a mounting aperture 30.8 in each of the opposite member ends and a top surface 30.9 of the platform is arranged to be parallel and just below the top surface level of the substrate surface 12.1.
- Preferably small diameter aluminum wires 22.2 are wire-bonded to the accelerometer unit terminals 22.1 and to the circuit path means 14.
- the accelerometer device 10 also preferably includes a cup-shaped housing 32 having a bottom 32.1, a side wall 32.2 and a rim 32.3, the rim having a shoulder 32.4 formed therein around the open end of the cup.
- the housing is preferably formed of a strong rigid material such as glass-filled nylon or the like and preferably has a pair of mounting lugs 32.5 spaced at opposite sides of the housing adjacent one end 32.6 of the housing while integral, flexible bumper feet 32.7 or the like are provided on an exterior surface of the housing adjacent the opposite housing end.
- Three integral pins 34 are also provided in the housing in upstanding relation to the housing bottom inside the housing and preferably each pin has a portion 34.1 of relatively larger diameter forming a shoulder 34.2 on the pin spaced from the housing bottom.
- each pin has small barbs running around its circumference.
- device terminals 36 are provided in the housing to extend out from the housing.
- the terminals 36 are insert-molded within the housing to extend in sealed relation through the housing side wall and preferably a cover 38 is provided to be secured in sealed relation to the housing shoulder 32.4 by adhesive means or the like for sealing the device housing.
- each of the terminals has an inner end 36.1 exposed within the housing and supported on a step 32.8 provided in the housing and aluminum wires 36.2 are wire bonded to the respective terminals ends 36.1 and to corresponding circuit path pads 14.1.
- each terminal has two right angle bend portions 36.2, 36.3 therein as shown.
- the accelerometer device 10 is easily and accurately assembled to provide improved performance when used in an automotive environment or the like. That is, the circuit components 26 and 28 are mounted and connected on the substrate and the mounting apertures 18 of the substrate are fitted over the integral housing pins 34 to rest the substrate on the pin shoulders 34.2. The pin barbs provide a force fit within the mounting apertures to provide centering or precise positioning of the substrate in the housing.
- the accelerometer unit mounting member 30 with its accelerometer unit 20 secured to the platform portion of the member by adhesive or the like has its mounting apertures 30.8 fitted over two of the housing pins to dispose the platform portion of the member within the opening 16 in the substrate.
- the distal ends of the pins are then flattened by ultrasonic staking or the like to form the pin heads 34.3 against the member 30 or the substrate 12 for securing the member to the substrate and for securing the member and substrate in securely fixed position in the housing.
- the terminal pads 22.1 of the accelerometer unit are thereby disposed in closely spaced relation to the circuit paths 14 and are connected to the circuit paths with wire bonds as described above either before or after assembly of the member and substrate within the housing as preferred.
- the substrate terminal pads are connected to the terminal ends 36.1 by wire bonds after the substrate is positioned within the housing.
- the cover 38 is then sealed over the open housing end with an adhesive for sealing the device.
- the resulting accelerometer device has a rugged and durable construction.
- bolting of the two mounting lugs is preferably arranged as shown so that the flexible housing bumper is wedged against a portion of the vehicle to secure the device firmly to the vehicle without exerting excessive clamping stresses on the device 10.
- the silicon mass 20.1 of the accelerometer unit is positioned to be highly responsive to acceleration forces in the direction indicated by the arrow 40 in Fig. 1.
- the substrate 12 and the member 30 cooperate to provide securely fixed and solid support for the accelerometer unit 20 during exposure of the device to acceleration forces.
- the aluminum wires wire-bonded to the various circuit paths, pads and terminals in the device are oriented to avoid excessive stress during device acceleration.
- the configuration and thermal expansion properties of the member 30 cooperate to effectively isolate and shield the piezoresistive sensor means in the accelerometer unit from strain in the silicon accelerometer unit body which might be due to differential thermal expansions of the body, the substrate 12, and the circuit path means 14. That is, the very low thermal expansion characteristics of the member 30 limit strain in the silicon body due to differential thermal expansion of the silicon body and the member. Further, any stress which is applied to the member as a result of differential thermal expansion between the substrate and circuit paths and the member is substantially absorbed in the folded-back leaf spring orflexure-reducing portions 30.4, 30.5 of the member so that movement of the platform 30.3 of the member during such temperature changes is substantially reduced. In that way, the accelerometer device is adapted to provide an output signal move precisely corresponding to the acceleration forces applied to the device.
Description
- The field of the invention is that of accelerometers, and the invention relates more particularly to silicon accelerometers for use in automotive safety air bag applications and the like.
- Conventional silicon accelerometers comprise a silicon mass which is movable in a silicon body relative to an integral silicon support to provide strain in the silicon body in response to acceleration of the body. Piezoresistive sensor means are formed in the silicon body material to be responsive to the strain to provide an electrical signal corresponding to the acceleration. The silicon body is mounted on an object whose acceleration is to be monitored, and the piezoresistive sensors are connected in a signal conditioning circuit or the like to provide a control signal or the like corresponding to acceleration of the object. Such accelerometers are known from EP-A- 0 401 669 and EP-A- 0 247 247. It has been proposed that such accelerometers are particularly adapted for sensing automotive vehicle acceleration for regulating operation of safety air bag systems and the like.
- Frequently, when such accelerometers are proposed for use in automotive environments, it is found that the silicon body materials, the materials used in mounting the accelerometer in a vehicle and the materials used in electrically connecting piezoresistive sensors on the silicon body into a vehicle circuit display substantially different coefficients of thermal expansion. Some portions of the accelerometer also have to be fixed to a vehicle mount or the like with secure clamping forces. Accordingly when such materials are subjected to widely varying temperature conditions likely to be encountered during automotive vehicle use, which temperatures typically vary over a range from -40°C. to 85°C., the silicon body of the accelerometer tends to be subjected to strain due to the noted differences in thermal expansion properties so that the accuracy of output signal provided by the accelerometer is deleteriously affected by the strain.
- It is an object of the invention to provide a novel and improved accelerometer device; to provide such a device which is particularly adapted for use in automotive vehicles; to provide such a device having a silicon accelerometer body having piezoresistive sensors formed therein; to provide such a device wherein the silicon accelerometer body is substantially isolated from strain due to differences in thermal expansion between the silicon body, the means mounting the body, and the means connecting the sensors in an electrical circuit; and to provide such an accelerometer device which is of simple, rugged and reliable construction.
- Briefly described, the novel and improved accelerometer device of the invention comprises a circuit board or substrate of electrically insulating material having electrically conductive circuit paths thereon. Preferably the circuit paths are provided on a planar upper surface of the substrate and the substrate has an opening therein disposed in spaced relation to the circuit paths. Preferably the substrate also has three triangularly-spaced mounting apertures.
- The device also comprises an accelerometer unit having a silicon mass movable in a silicon body relative to an integral silicon support to provide strain in the silicon body in response to acceleration and having piezoresistive sensor means in the body to be responsive to the strain to provide an electrical signal corresponding to the extent of the acceleration. Electrical circuit components such as a control circuit embodied in an integrated circuit chip or the like and/or various resistors and/or capacitors or the like are provided on the substrate and connected to the circuit paths to form a signal conditioning circuit or the like. A member is also provided for mounting the accelerometer unit on the substrate and means are provided to connect the piezoresistive sensor means to the circuit paths on the substrate while isolating or shielding the piezoresistive sensor means from strain in the silicon body which might be due to clamping forces during device mounting or to differences in thermal expansion of the silicon body, the substrate, and the conductive circuit paths during temperature changes likely to be encountered.
- Preferably the mounting member is formed of a metal material such as a nickel-iron alloy having a coefficient of thermal expansion substantially corresponding to that of silicon and has opposite ends of the member secured to the substrate at respective opposite sides of the substrate opening, preferably on the planar substrate surface on which the circuit paths are disposed. A central platform portion of the member is connected to the opposite member ends by respective folded-leaf spring or flexure-reducing member portions so that the platform portion of the member is received within the substrate opening, preferably with a platform surface disposed parallel to and adjacent but somewhat below the level of the planar substrate surface to position accelerometer and substrate circuit paths and terminals in the same plane. The accelerometer unit as above described is mounted on that platform surface with an adhesive or the like to be suspended in or immediately over the substrate opening to be compactly accommodated in the device. Preferably the accelerometer device includes a housing of cup shape orthe like having three integral pins upstanding from the cup bottom inside the housing, each pin having a larger diameter portion adjacent the cup bottom forming a shoulder spaced over the cup bottom. The mounting apertures of the substrate are fitted over those pins to rest and position the substrate on the noted shoulders and the heads or distal ends of the pins are flattened by ultrasonic staking or the like for securing the substrate on the pin shoulders. Preferably the member mounting the accelerometer has two corresponding mounting apertures in its respective opposite ends and the member mounting apertures are also fitted over two of the housing pins to be secured to the substrate by the flattened heads of the pins. Preferably a cover is fitted over the open end of the cup-shaped housing and sealed to the housing. In a preferred embodiment, the device housing has mounting lugs and bumper means thereon to permit mounting the device on an automotive vehicle or the like while isolating the accelerometer unit from strain due to device mounting. In that device, the accelerometer unit is adapted to provide an electrical signal more precisely corresponding to the acceleration forces to which the device is subjected, particularly when the device is subjected to the widely varying temperature conditions likely to be encountered in an automotive environment.
- Other objects, advantages and details of the novel and improved accelerometer device of the invention appear in the following detailed description of preferred embodiments of the invention, the detailed description referring to the drawings in which:
- Figure 1 is a side elevation view of the accelerometer device of the invention;
- Figure 2 is a perspective view of the device of Figure 1;
- Figure 3 is an exploded view of the device of Figure 1 illustrating assembly of the device, reoriented relative to Fig. 2 for clarity of illustration;
- Figures 4-5 are section views to enlarged scale along lines 4-4 and 5-5 of Figure 2; and
- Figure 6 is a perspective view to greatly enlarged scale of an accelerometer unit used in the device of Figure 1.
- Referring to the drawings, 10 in Figures 1-4 indicates the novel and improved accelerometer device of the invention which is shown to include a circuit board or
substrate 12 of an electrically insulating material such as ceramic, or fiberglass-filled polyethylene or the like. The substrate is provided with electrically conductive circuit paths of copper foil or the like in any conventional manner as is d iagrammatical- ly indicated at 14 in Figures 3 and 4. In the preferred embodiment of the invention, the circuit paths are provided on a planar upper surface 12.1 of the substrate and the substrate has anopening 16 formed in the substrate spaced from the circuit paths and preferably has threemounting apertures 18 arranged and spaced from each other in a triangular pattern as shown. Terminal pads 14.1 of the circuit paths are preferably formed along one edge of the substrate as shown and the thickness of the substrate is selected so that it is adapted to be rigid under the acceleration forces likely to be encountered by the device. - The
acceleration device 10 also includes asilicon accelerometer unit 20 of generally conventional type. As shown particularly in Figure 6, the accelerometer unit comprises a silicon mass 20.1 which is movable in a silicon body 20.2 relative to an integral silicon support 20.3 to provide strain in the silicon body in response to acceleration of the body, and piezoresistive sensor means 22 are formed in the silicon body to be responsive to that strain to provide an electrical signal corresponding to the acceleration. The piezoresistive means are connected to unit terminal pads 22.1 as will be understood. As such acceleration units are known as shown in commonly assigned, copending European Patent Applications Nos. 91311803.0 and 92305151.0, the disclosures of which are incorporated herein by this reference, the accelerometer unit is not further described herein and it will be understood that the unit is adapted to be mounted on an object such as an automotive vehicle 24 (see Fig. 1) or the like whose acceleration is to be monitored and the piezoresistive sensor means 22 are adapted to be connected in a control circuit or the like to perform a control function in response to the occurrence of selected acceleration (or deceleration) of the object. For example, the accelerometer unit is adapted to provide an electrical output signal corresponding to vehicle acceleration to regulate operation of an automotive safety air bag system or the like on occurrence of a vehicle accident. - The
accelerometer device 10 also includes circuit components such as acontrol circuit 26 embodied in an integrated circuit chip or the like as well as resistors and/or capacitors and the like diagrammatically indicated at 28 in Figs. 2-4 which are mounted on thesubstrate 12 and electrically connected to thecircuit paths 14 to form a circuit for conditioning the electrical output signal provided by theaccelerometer unit 20 in conventional manner. Preferably the noted circuit components are attached and connected on the substrate using conventional surface-mount and chip- on-board technologies. Preferably for example, the i.c.chip 26 is bonded to the substrate by die-attach adhesives and terminals 26.1 of the chip etc. are connected to circuit paths by small diameter aluminum wires 26.2 wire bonded to the terminals 26.1 and to thecircuit paths 14. Preferably the resistors and capacitors are soldered directly to the circuit paths and substrates. Preferably the components and wire bond locations are provided with a conformal coating diagrammatically indicated at 26.3 to chemically and mechanically protect the components and bonds. - A
member 30 is also provided in the device for suspending or mounting theaccelerometer unit 20 on thesubstrate 12 to permit the unit to respond to acceleration forces while the piezoresistive sensor means of the unit are connected in then signal conditioning circuit while also isolating the sensor means from strain in the silicon body 20.2 which might be due to clamping forces during device mounting in the automotive vehicle or to differences in thermal expansion properties of the silicon body, the materials of thesubstrate 12, and the materials of thecircuit paths 14. Preferably the member has portions 30.1, 30.2 secured to the substrate and another portion 30.5 for receiving the accelerometer unit thereon. In a preferred embodiment of the invention, the member is formed of a metal material such as a nickel-iron alloy having a nominal composition by weight of 36-50% nickel and the balance iron and having coefficient of thermal expansion which substantially corresponds to that of silicon used in theaccelerometer 20. Preferably for example, the member is formed of a nickel-iron alloy comprising from 38.3 to 39.5% nickel, 0.35 to 05.% manganese, 0.25% max. silicon, 0.12% max. carbon, and 0.25 max. each of sulfur and phosphorous, and the balance iron the material being sold under the designation Low E39 by Carpenter Technology Corporation and having a coefficient of thermal expansion of 2.2 ppm/°C.. Preferably the member has opposite member ends 30.1, 30.2 secured to thesubstrate 12 at opposite sides of thesubstrate opening 16, has a central platform portion 30.3 disposed within the substrate opening, and has folded-leaf spring portions 30.4, 30.5 (preferably with two half-leafs 30.6 folded back on opposite sides of a full central leaf 30.7) extending between the platform 30.3 and the opposite member ends 30.1, 30.2 to suspend the platform in the substrate opening. In that configuration of the member, the folded leaf-spring portions serve as flexure-reducing means to reduce movement of the member platform when stresses due to relative thermal expansion of the substrate are transmitted to the member from the substrate. In a preferred embodiment of the invention, the member has a mounting aperture 30.8 in each of the opposite member ends and a top surface 30.9 of the platform is arranged to be parallel and just below the top surface level of the substrate surface 12.1. Preferably small diameter aluminum wires 22.2 are wire-bonded to the accelerometer unit terminals 22.1 and to the circuit path means 14. - The
accelerometer device 10 also preferably includes a cup-shaped housing 32 having a bottom 32.1, a side wall 32.2 and a rim 32.3, the rim having a shoulder 32.4 formed therein around the open end of the cup. The housing is preferably formed of a strong rigid material such as glass-filled nylon or the like and preferably has a pair of mounting lugs 32.5 spaced at opposite sides of the housing adjacent one end 32.6 of the housing while integral, flexible bumper feet 32.7 or the like are provided on an exterior surface of the housing adjacent the opposite housing end. Threeintegral pins 34 are also provided in the housing in upstanding relation to the housing bottom inside the housing and preferably each pin has a portion 34.1 of relatively larger diameter forming a shoulder 34.2 on the pin spaced from the housing bottom. Preferably each pin has small barbs running around its circumference. Preferablydevice terminals 36 are provided in the housing to extend out from the housing. Preferably theterminals 36 are insert-molded within the housing to extend in sealed relation through the housing side wall and preferably acover 38 is provided to be secured in sealed relation to the housing shoulder 32.4 by adhesive means or the like for sealing the device housing. Preferably each of the terminals has an inner end 36.1 exposed within the housing and supported on a step 32.8 provided in the housing and aluminum wires 36.2 are wire bonded to the respective terminals ends 36.1 and to corresponding circuit path pads 14.1. Preferably each terminal has two right angle bend portions 36.2, 36.3 therein as shown. - With that structure, the
accelerometer device 10 is easily and accurately assembled to provide improved performance when used in an automotive environment or the like. That is, thecircuit components apertures 18 of the substrate are fitted over theintegral housing pins 34 to rest the substrate on the pin shoulders 34.2. The pin barbs provide a force fit within the mounting apertures to provide centering or precise positioning of the substrate in the housing. The accelerometerunit mounting member 30 with itsaccelerometer unit 20 secured to the platform portion of the member by adhesive or the like has its mounting apertures 30.8 fitted over two of the housing pins to dispose the platform portion of the member within theopening 16 in the substrate. The distal ends of the pins are then flattened by ultrasonic staking or the like to form the pin heads 34.3 against themember 30 or thesubstrate 12 for securing the member to the substrate and for securing the member and substrate in securely fixed position in the housing. The terminal pads 22.1 of the accelerometer unit are thereby disposed in closely spaced relation to thecircuit paths 14 and are connected to the circuit paths with wire bonds as described above either before or after assembly of the member and substrate within the housing as preferred. The substrate terminal pads are connected to the terminal ends 36.1 by wire bonds after the substrate is positioned within the housing. Thecover 38 is then sealed over the open housing end with an adhesive for sealing the device. - The resulting accelerometer device has a rugged and durable construction. When the device is mounted on an
automotive vehicle 24, bolting of the two mounting lugs is preferably arranged as shown so that the flexible housing bumper is wedged against a portion of the vehicle to secure the device firmly to the vehicle without exerting excessive clamping stresses on thedevice 10. Within the device, the silicon mass 20.1 of the accelerometer unit is positioned to be highly responsive to acceleration forces in the direction indicated by the arrow 40 in Fig. 1. Thesubstrate 12 and themember 30 cooperate to provide securely fixed and solid support for theaccelerometer unit 20 during exposure of the device to acceleration forces. The aluminum wires wire-bonded to the various circuit paths, pads and terminals in the device are oriented to avoid excessive stress during device acceleration. Further, when the device is exposed to wide swings in temperature in an automotive environment, the configuration and thermal expansion properties of themember 30 cooperate to effectively isolate and shield the piezoresistive sensor means in the accelerometer unit from strain in the silicon accelerometer unit body which might be due to differential thermal expansions of the body, thesubstrate 12, and the circuit path means 14. That is, the very low thermal expansion characteristics of themember 30 limit strain in the silicon body due to differential thermal expansion of the silicon body and the member. Further, any stress which is applied to the member as a result of differential thermal expansion between the substrate and circuit paths and the member is substantially absorbed in the folded-back leaf spring orflexure-reducing portions 30.4, 30.5 of the member so that movement of the platform 30.3 of the member during such temperature changes is substantially reduced. In that way, the accelerometer device is adapted to provide an output signal move precisely corresponding to the acceleration forces applied to the device. - It should be understood that although particular embodiments of the accelerometer device of the invention have been described by way of illustrating the invention, the invention includes all modifications and equivalents of the disclosed embodiments falling within the scope of the appended claims.
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/725,844 US5233873A (en) | 1991-07-03 | 1991-07-03 | Accelerometer |
US725844 | 1991-07-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0523862A1 EP0523862A1 (en) | 1993-01-20 |
EP0523862B1 true EP0523862B1 (en) | 1995-04-19 |
Family
ID=24916186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP92305727A Expired - Lifetime EP0523862B1 (en) | 1991-07-03 | 1992-06-22 | Accelerometer mounting arrangement having reduced temperature dependance |
Country Status (5)
Country | Link |
---|---|
US (2) | US5233873A (en) |
EP (1) | EP0523862B1 (en) |
JP (1) | JPH05164777A (en) |
KR (1) | KR930002824A (en) |
DE (1) | DE69202113T2 (en) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05164775A (en) * | 1991-12-17 | 1993-06-29 | Atsugi Unisia Corp | Acceleration sensor |
EP0618450A1 (en) * | 1993-03-30 | 1994-10-05 | Siemens Aktiengesellschaft | Acceleration sensor |
DE69432396T2 (en) * | 1993-12-27 | 2004-03-04 | Hitachi, Ltd. | An acceleration |
US5503016A (en) * | 1994-02-01 | 1996-04-02 | Ic Sensors, Inc. | Vertically mounted accelerometer chip |
EP0675363A3 (en) * | 1994-03-31 | 1997-03-05 | Delco Electronics Corp | Accelerometer assembly. |
JP3387199B2 (en) * | 1994-04-21 | 2003-03-17 | 松下電器産業株式会社 | Angular velocity sensor device |
US5808197A (en) * | 1995-01-13 | 1998-09-15 | Remec, Inc. | Vehicle information and control system |
JPH08233848A (en) * | 1995-02-28 | 1996-09-13 | Mitsubishi Electric Corp | Semiconductor sensor |
US5644081A (en) * | 1995-09-28 | 1997-07-01 | Delco Electronics Corp. | Microaccelerometer package with integral support braces |
US5719334A (en) * | 1996-07-11 | 1998-02-17 | Ford Motor Company | Hermetically protected sensor assembly |
FR2752942B1 (en) * | 1996-08-29 | 1998-11-20 | Gibert Francis Jean Paul | LOW DRIFT ACCELEROMETER COMPONENT |
JP3576727B2 (en) * | 1996-12-10 | 2004-10-13 | 株式会社デンソー | Surface mount type package |
US5763970A (en) * | 1997-03-03 | 1998-06-09 | Lexmark International, Inc. | Encoder system with cover mounted encoder |
DE19717348A1 (en) * | 1997-04-24 | 1998-10-29 | Siemens Ag | Method of manufacturing a sensor assembly and sensor assembly |
US6040625A (en) * | 1997-09-25 | 2000-03-21 | I/O Sensors, Inc. | Sensor package arrangement |
WO2000055648A1 (en) * | 1999-03-17 | 2000-09-21 | Input/Output, Inc. | Hydrophone assembly |
AT3609U1 (en) * | 1999-06-02 | 2000-05-25 | Austria Mikrosysteme Int | MICROSENSOR |
US6115261A (en) * | 1999-06-14 | 2000-09-05 | Honeywell Inc. | Wedge mount for integrated circuit sensors |
US7152473B1 (en) | 2000-03-17 | 2006-12-26 | Input/Output, Inc. | Integrated and multi-axis sensor assembly and packaging |
DE10145679A1 (en) * | 2001-09-15 | 2003-04-03 | Conti Temic Microelectronic | Electronic assembly |
US6568268B1 (en) | 2001-10-31 | 2003-05-27 | Western Digital Technologies, Inc. | Multi-axis accelerometer comprising a mass suspended by springs above an optical sensor |
JP2004003886A (en) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Works Ltd | Sensor package |
DE10249767B4 (en) * | 2002-10-24 | 2006-11-23 | Asmec Advanced Surface Mechanics Gmbh | Sample table for the measurement of lateral forces and displacements |
US7199498B2 (en) * | 2003-06-02 | 2007-04-03 | Ambient Systems, Inc. | Electrical assemblies using molecular-scale electrically conductive and mechanically flexible beams and methods for application of same |
US7148579B2 (en) * | 2003-06-02 | 2006-12-12 | Ambient Systems, Inc. | Energy conversion systems utilizing parallel array of automatic switches and generators |
EP1718980B1 (en) | 2004-02-27 | 2010-06-09 | Atlantic Inertial Systems Limited | Accelerometer |
WO2007024204A2 (en) | 2004-07-19 | 2007-03-01 | Ambient Systems, Inc. | Nanometer-scale electrostatic and electromagnetic motors and generators |
US20070048160A1 (en) * | 2005-07-19 | 2007-03-01 | Pinkerton Joseph F | Heat activated nanometer-scale pump |
JP4595779B2 (en) * | 2005-10-12 | 2010-12-08 | 株式会社デンソー | Angular velocity sensor |
AU2007289057C1 (en) * | 2006-09-01 | 2014-01-16 | Pacific Biosciences Of California, Inc. | Substrates, systems and methods for analyzing materials |
WO2008124084A2 (en) | 2007-04-03 | 2008-10-16 | Pinkerton Joseph F | Nanoelectromechanical systems and methods for making the same |
JP2008256570A (en) * | 2007-04-05 | 2008-10-23 | Fujitsu Media Device Kk | Angular velocity sensor |
US8349611B2 (en) * | 2009-02-17 | 2013-01-08 | Leversense Llc | Resonant sensors and methods of use thereof for the determination of analytes |
JP5669076B2 (en) * | 2009-03-25 | 2015-02-12 | パナソニックIpマネジメント株式会社 | Substrate fixing structure and physical quantity sensor |
US10198097B2 (en) | 2011-04-26 | 2019-02-05 | Sentons Inc. | Detecting touch input force |
US9477350B2 (en) | 2011-04-26 | 2016-10-25 | Sentons Inc. | Method and apparatus for active ultrasonic touch devices |
US9189109B2 (en) | 2012-07-18 | 2015-11-17 | Sentons Inc. | Detection of type of object used to provide a touch contact input |
US9639213B2 (en) | 2011-04-26 | 2017-05-02 | Sentons Inc. | Using multiple signals to detect touch input |
US11327599B2 (en) | 2011-04-26 | 2022-05-10 | Sentons Inc. | Identifying a contact type |
DE102012213916A1 (en) * | 2011-11-08 | 2013-05-08 | Robert Bosch Gmbh | Electronic module for a control unit |
KR101960836B1 (en) | 2011-11-18 | 2019-03-22 | 센톤스 아이엔씨. | Localized haptic feedback |
KR101803261B1 (en) | 2011-11-18 | 2017-11-30 | 센톤스 아이엔씨. | Detecting touch input force |
DE102012223886A1 (en) * | 2012-12-20 | 2014-06-26 | Robert Bosch Gmbh | Vibration damper for a sensor unit and sensor arrangement for a motor vehicle |
DE102013105518A1 (en) * | 2013-05-29 | 2014-12-04 | Escha Bauelemente Gmbh | signal distributor |
US9459715B1 (en) | 2013-09-20 | 2016-10-04 | Sentons Inc. | Using spectral control in detecting touch input |
US10869393B2 (en) | 2015-06-29 | 2020-12-15 | Microsoft Technology Licensing, Llc | Pedestal mounting of sensor system |
US10187977B2 (en) | 2015-06-29 | 2019-01-22 | Microsoft Technology Licensing, Llc | Head mounted computing device, adhesive joint system and method |
EP3239665A1 (en) * | 2016-04-25 | 2017-11-01 | Weickmann & Weickmann PartmbB | Sensor casing |
US10908741B2 (en) | 2016-11-10 | 2021-02-02 | Sentons Inc. | Touch input detection along device sidewall |
US10296144B2 (en) | 2016-12-12 | 2019-05-21 | Sentons Inc. | Touch input detection with shared receivers |
US10126877B1 (en) | 2017-02-01 | 2018-11-13 | Sentons Inc. | Update of reference data for touch input detection |
US10585522B2 (en) | 2017-02-27 | 2020-03-10 | Sentons Inc. | Detection of non-touch inputs using a signature |
US11038801B2 (en) | 2017-06-06 | 2021-06-15 | Nocell Technologies, LLC | System, method and apparatus for restricting use of a network device through automated policy enforcement |
US10743241B1 (en) | 2017-06-06 | 2020-08-11 | Nocell Technologies, LLC | System, method and apparatus for facilitating the restriction of the use of one or more network devices through automated policy enforcement |
US11009411B2 (en) | 2017-08-14 | 2021-05-18 | Sentons Inc. | Increasing sensitivity of a sensor using an encoded signal |
US11580829B2 (en) | 2017-08-14 | 2023-02-14 | Sentons Inc. | Dynamic feedback for haptics |
WO2019036334A1 (en) * | 2017-08-14 | 2019-02-21 | Sentons Inc. | Piezoresistive sensor |
JP7013991B2 (en) * | 2018-03-26 | 2022-02-01 | セイコーエプソン株式会社 | Sensor unit, mobile positioning device, portable electronic device, electronic device, mobile body and display device |
JP2019184453A (en) * | 2018-04-12 | 2019-10-24 | セイコーエプソン株式会社 | Sensor unit and structure monitoring device |
JP2019184452A (en) * | 2018-04-12 | 2019-10-24 | セイコーエプソン株式会社 | Sensor unit and structure monitoring device |
US11340254B2 (en) * | 2019-09-30 | 2022-05-24 | Seiko Epson Corporation | Inertial measurement unit having a sensor unit that is detachable from a substrate |
JP2022050915A (en) * | 2020-09-18 | 2022-03-31 | セイコーエプソン株式会社 | Inertial measurement device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2655604C2 (en) * | 1976-12-08 | 1984-11-29 | Robert Bosch Gmbh, 7000 Stuttgart | Delay recorder for triggering occupant protection devices in motor vehicles |
DE8607653U1 (en) * | 1986-03-20 | 1987-08-06 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
US4811604A (en) * | 1986-05-23 | 1989-03-14 | British Aerospace Public Limited Company | Accelerometers |
EP0268351B1 (en) * | 1986-08-25 | 1991-10-23 | Richard A. Hanson | Proof mass suspension assembly for an accelerometer |
EP0456285A3 (en) * | 1986-09-22 | 1992-01-02 | Nippondenso Co., Ltd. | Semiconductor accelerometer |
JPH01302169A (en) * | 1988-05-30 | 1989-12-06 | Mitsubishi Electric Corp | Breakage preventor for semiconductor acceleration sensor |
DE8915981U1 (en) * | 1989-02-23 | 1992-10-01 | Kristal Instrumente Ag, Winterthur, Ch | |
US5130600A (en) * | 1989-06-02 | 1992-07-14 | Mitsubishi Petrochemical Co., Ltd. | Acceleration sensor |
JPH0623780B2 (en) * | 1989-09-21 | 1994-03-30 | 日本電装株式会社 | Method of manufacturing semiconductor acceleration sensor |
US5058430A (en) * | 1989-12-29 | 1991-10-22 | Honeywell Inc. | Sensor capsule mounting |
-
1991
- 1991-07-03 US US07/725,844 patent/US5233873A/en not_active Expired - Fee Related
-
1992
- 1992-05-28 JP JP4136999A patent/JPH05164777A/en active Pending
- 1992-06-22 DE DE69202113T patent/DE69202113T2/en not_active Expired - Fee Related
- 1992-06-22 EP EP92305727A patent/EP0523862B1/en not_active Expired - Lifetime
- 1992-07-03 KR KR1019920011817A patent/KR930002824A/en not_active Application Discontinuation
-
1993
- 1993-03-31 US US08/040,730 patent/US5343748A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5343748A (en) | 1994-09-06 |
US5233873A (en) | 1993-08-10 |
KR930002824A (en) | 1993-02-23 |
DE69202113D1 (en) | 1995-05-24 |
EP0523862A1 (en) | 1993-01-20 |
JPH05164777A (en) | 1993-06-29 |
DE69202113T2 (en) | 1995-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0523862B1 (en) | Accelerometer mounting arrangement having reduced temperature dependance | |
EP0540071B1 (en) | Accelerometer assembly with evaluation circuit | |
JP3020426B2 (en) | Transducer assembly, transducer device for mounting to circuit board, and method of mounting transducer to circuit board | |
US5277064A (en) | Thick film accelerometer | |
KR100225330B1 (en) | Semiconductor sensor | |
EP0542436B1 (en) | Accelerometer | |
US6388887B1 (en) | Surface mount type package unit | |
US7196404B2 (en) | Motion detector and method of producing the same | |
US6112594A (en) | Acceleration measurement device | |
EP1610105B1 (en) | Apparatus for mounting electronic module assembly in a sensor | |
US6098459A (en) | Method of producing a sensor subassembly, and sensor subassembly | |
EP0786651A2 (en) | Pressure sensor apparatus with integrated circuit | |
EP1407278B1 (en) | Acceleration sensor | |
US5644081A (en) | Microaccelerometer package with integral support braces | |
US5542296A (en) | Compact capacitive acceleration sensor | |
US5827967A (en) | Semiconductor accelerometer including strain gauges forming a wheatstone bridge and diffusion resistors | |
US5817941A (en) | Method and apparatus for supporting a sensor in a vehicle | |
EP0675363A2 (en) | Accelerometer assembly | |
JPH09318652A (en) | Acceleration sensor device | |
JP2720087B2 (en) | Acceleration sensor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT NL |
|
17P | Request for examination filed |
Effective date: 19930601 |
|
17Q | First examination report despatched |
Effective date: 19940711 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB IT NL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 19950419 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 19950419 Ref country code: FR Effective date: 19950419 |
|
REF | Corresponds to: |
Ref document number: 69202113 Country of ref document: DE Date of ref document: 19950524 |
|
EN | Fr: translation not filed | ||
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19960622 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19960622 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20000810 Year of fee payment: 9 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20020403 |