EP0692928A1 - Programmable lead conditioner - Google Patents
Programmable lead conditioner Download PDFInfo
- Publication number
- EP0692928A1 EP0692928A1 EP95110751A EP95110751A EP0692928A1 EP 0692928 A1 EP0692928 A1 EP 0692928A1 EP 95110751 A EP95110751 A EP 95110751A EP 95110751 A EP95110751 A EP 95110751A EP 0692928 A1 EP0692928 A1 EP 0692928A1
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- EP
- European Patent Office
- Prior art keywords
- lead
- conditioning
- leads
- package
- conditioner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0439—Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
- The present invention relates to a system and method for processing electronic devices and, more particularly, to a programmable lead conditioning system for properly adjusting electronic component package leads.
- Unintended deformation of electronic component package leads is a well-known problem in the electronics industry. Heretofore, this problem has been dealt with by manually manipulating leads back into their correct shape when deformation occurs. The problem with this method, however, is that as lead pitch decreases, manual adjustment becomes increasingly difficult. Moreover, as electronic component package processing becomes more automated, manual manipulation becomes less efficient. Manual working and handling of electronic component package for lead conditioning, therefore, becomes less desirable.
- U.S. Patent No. 5,219,404 to T.P. Moore, et al., entitled "Lead Conditioner for Quad Semiconductor Packages" and assigned to Texas Instruments, Inc., Dallas, Texas, hereinafter Moore describes a lead conditioning system that provides an offset conditioner, a planarity conditioner, and a tweeze conditioner station together with a centering station, transport assembly, and a cabinet that has an input station and an output station together with an electronic control apparatus. The offset conditioner conditions the offset space in between leads of the electronic component package by shifting the leads axially in both directions and returning the leads to a center position according to a predetermined specification. The planarity conditioner station deforms the leads so that they are essentially upright and then repositions the leads by exerting forces downwardly on the tips of the leads. This makes the tips of the leads essentially shifted to a coplanar position according to a predetermined specification. The offset conditioner features a self-centering device with blades which accurately center the semiconductor device when the self-centering device is lowered thereover. The offset conditioner also features a blade unit which is constructed with successive laminations of steel for enhancing strength and durability of the blades.
- Although the invention of Moore provides numerous technical advantages, it also suffers from certain limitations. For example, the Moore system requires tooling for every electronic component package size difference. In the Moore device, combs are run through the electronic component package leads. These combs must correspond to the space between the leads of the electronic component package. To condition the leads of a package where the spacing is different, a different comb is required. This necessitates replacing the comb and using a different comb for the package. This change in tooling consumes time and limits throughput of the electronic component packages.
- Another limitation of Moore and other conventional devices is the amount of force required to condition the leads. Because electronic component packages generally include so many leads, as much as 250 pounds of force may be required to actuate the mechanism that conditions all of the leads of the package. This amount of force could cause damage to the leads if the package is not properly aligned.
- Still a further limitation that exists in conventional devices is the inability to both inspect and condition the leads in a single processing setup. This inability limits the throughput of semiconductor device packages that are conditioned, since the semiconductor device package either has to be rerun through the system or moved upstream against the normal process flow.
- Yet another limitation of conventional lead conditioning systems such as that of Moore is their conditioning of all leads on a side of an electronic component package irrespective of whether a lead needs conditioning. The action of conditioning a lead causes some amount of disturbance to the surface finish of that lead. This may just be a marking of the lead that can only be seen under a 20x magnification, but there is also the potential of damaging the lead, or creating solder slivers, or dislodging solder flakes from the lead. This can generally degrade the operation of a semiconductor device by conditioning a lead that in the first place required no conditioning.
- Therefore, a need has arisen for a lead conditioning system that does not require additional tooling or the associated cost of purchasing and maintaining that tooling.
- There is a need for a lead conditioning system that does not require the time of changing the combs or tools that condition the leads.
- There is a need for an improved lead conditioning system that does not present the potential to expose the electronic component package to the large conditioning forces of known lead conditioning systems.
- There is a further need for an improved lead conditioning system for electronic component packages that permits simultaneous and iterative conditioning and inspection of the electronic component package leads.
- There is yet a further need for an improved lead conditioning system that limits the potential lead damage that may arise from conditioning individual leads that require no conditioning.
- In accordance with the present invention, a programmable lead conditioning system is provided that substantially eliminates or reduces disadvantages and problems associated with previously developed lead conditioning systems.
- More specifically, the present invention provides a lead conditioning system for conditioning the leads of an electronic component package that includes a table for holding the electronic component package and making accessible the leads. The conditioning tool selectively contacts a predetermined number of the leads. A manipulator moves the conditioning tool in three dimensions to position the contacted predetermined number of leads to condition the predetermined leads. A control system is programmed to control the operation of the manipulator.
- The table may be, for example, a rotary table that turns the electronic component package to allow access to all of its sides. The conditioning tool may be a single blade tool for contacting the single lead, a multiple blade tool for contacting selective multiple leads, or a bar that moves leads in or out. The manipulator has the ability to move the conditioning tool in three dimensions to correct for planarity, pitch, and tweeze in the selected leads. The manipulator may be, for example, a stepper motor, a linear stepper motor, a servomotor, or a pneumatic actuator configuration that permits three-dimensional movement of the conditioning tool. The control system of the present invention may include the ability to calculate the amount of positioning required to condition the predetermined number of leads, as well as to maintain a database of various numbers of devices and to provide analysis of the conditioning of the predetermined number of such leads.
- The present invention may also include a lead inspection system that inspects the leads of the package. The lead inspection system of the present invention works with the control system to precisely define the desired operation of a conditioning tool based on the results of the lead inspection analysis.
- A technical advantage of the present invention is its flexibility over known lead conditioning systems. The programmable lead conditioner of the present invention makes all lead movement programmable and requires no hardware changeover when converting from one package type to another.
- Another technical advantage of the present invention is that it in one system provides for both lead inspection and lead correction. The inspection portion of the present invention ties the lead conditioner frame of reference to the package frame of reference. This provides the exact location of every lead on the device for precise lead conditioning.
- Another technical advantage of the present invention is that it could provide real-time analysis of the lead conditioning process. This information may be used to automatically adjust the conditioning process. For example, based on the real-time analysis, the lead conditioning system may position the conditioning tool, determine the necessary amount of tool movement, and assess the speed of conditioning tool positioning. The lead conditioning system may also be automatically shutdown if the leads are not capable of conditioning.
- A further technical advantage of the present invention is that it eliminates the need for device-specific tooling. This virtually eliminates downtime required for package tool conversion that exists in conventional devices.
- Another technical advantage of the present invention is that it integrates both lead inspection and conditioning to save cycle time for conditioning leads, as well as saving the floor space required for separate inspection and conditioning systems, and general semiconductor device package integrity by selectively conditioning only the leads that are bent.
- Yet a further technical advantage of the present invention is that it selectively conditions only those leads that require conditioning. The present invention, therefore, limits the potential lead finish degradation to only the leads that require conditioning.
- For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following description which is to be taken in conjunction with the accompanying drawings in which like reference numerals indicate like features and wherein:
- FIGURE 1 illustrates a conceptual block diagram of the process flow for the lead conditioning system of the present embodiment;
- FIGURE 2 shows an isometric view of the various operative components of the lead conditioning system of the present embodiment;
- FIGURE 3 shows an exemplary screen that a monitor associated with the present embodiment shows to indicate the need for conditioning one or more leads of an electronic component package.
- FIGUREs 4a through 4d illustrate the various conditions of standoff, sweep, pitch, and bent leads that the present embodiment addresses in an electronic component package;
- FIGURE 5 illustrates the manipulator and conditioner arm configuration of the present embodiment;
- FIGUREs 6a and 6b illustrate views of the conditioner arm of the present embodiment;
- FIGUREs 7a and 7b illustrate an aspect of the reference calculations that the real-time reference of the conditioner arm of the present embodiment make possible;
- FIGURE 8 illustrates a lead correction calibration operation using the present embodiment; and
- FIGURE 9 illustrates an exemplary flow diagram that the control system of the present embodiment may employ for conditioning electronic component package leads; and
- FIGUREs 10 and 11 illustrate an alternative embodiment of the present invention for in-tray programmable lead inspection and conditioning.
- Preferred embodiments of the present invention are illustrated in the FIGUREs like numerals being used to refer to like and corresponding parts of the various drawings.
- Referring to FIGURE 1, process flow through
lead conditioning system 10 is shown schematically as beginning withinchassis 12 which contains the components necessary to inspect and condition electronic device package leads. Atinput 14, the electronic device package enterslead conditioning system 10 and is positioned on table 16. While the electronic component package is on table 16,inspection system 18, inspects its leads to determine whether conditioning is required. If so, thenconditioning tool 20 conditions the identified leads.Manipulator 22 has the ability to operate in three dimensions to controlconditioning tool 20.Control system 24 controls the operation ofmanipulator 22. After conditioning, aspath 26 indicates, reinspection may occur usinginspection system 18. If no further conditioning is required, the electronic component package is removed from table 16 and exits leadconditioning system 10 atoutput 28. If further conditioning is required, on the other hand,conditioning tool 20 will perform the conditioning, and inspection may continue until no further conditioning is required. - Referring to FIGURE 2, there is an isometric diagram of one embodiment of the invention that includes
inspection system 18 that viewselectronic component package 30 on rotary table 16.Conditioning tool 20 includesconditioner arm 34.Conditioning tool 20 connects tomanipulator 22.Manipulator 22 has the ability to moveconditioning tool 20 in the X, Y, and Z directions for three-dimensional control ofconditioner arm 34.Manipulator 22 includesX-directional stepper motor 36 that controls the movement of X-translation table 38. Y-direction stepper motor 40 controls the movement of Y-direction translation table 42. Z-direction stepper motor 44 controls the direction of movement for Z-direction translation table 46. - Lead
inspection system 18 includes an optical system that hascamera 50 for recording the position of leads onelectronic component package 30.Camera 50 includeslens 52 which receives an image that upperimage adjustment mechanism 54 adjusts by varying the position ofbeam splitter 56.Beam splitter 56 is further controlled bylower image adjustment 58. Additional controls forlead inspection system 18 include magnification adjustment 64 andfine focus adjustment 66 that more precisely focuses the image thatcamera 50 receives. Opticalplatform height micrometer 68 adjusts the height oflead inspection system 18. In order to precisely determine the amount of conditioning required for the leads ofelectronic component package 30,conditioner arm 34 includes a real-time reference (see FIGUREs 6a, 6b, 7a, and 7b below). -
Cabinet 12 is conventional in nature and is primarily housing forlead conditioning system 10 as well as for providing physical support to the various stations and protection from the environment.Cabinet 12 may have individual compartments storing different components oflead conditioning system 10, such as a compartment forelectronic control system 24. In addition, certain technical considerations of the present embodiment may be more easily understood with reference to U.S. Patent No. 5,219,404, entitled "Lead Conditioner for Quad Semiconductor Packages," by Troy D. Moore, et al. (some of the inventors being common to the inventors hereof) and assigned to Texas Instruments Incorporated of Dallas, Texas (hereinafter Moore). For this purpose, Moore is here incorporated by reference. - Transport within
conditioning system 10 of the present embodiment is an automated, tray-to-tray system which includes structures suitable for automated conveyance of electronic component packages 30 from input 14 (and any other stations appropriate to cabinet 12) to rotary table 16 where lead inspection and conditioning may take place. Indeed, the transport withinlead conditioning system 10 could be automated to the point of introducing electronic component packages 30 intoinput point 14 and out ofoutput location 28, if desired. Such transport assemblies are well-understood in the art and, therefore, will not be described in greater detail here. -
Lead conditioning system 10 of the present embodiment also provides the ability to condition electronic component packages that are in tubes or other types of device containers. With the present invention, an embodiment may be configured to inspect and condition electronic component packages without removing them from their tray. - Rotary table 16 may be any station which relatively precisely locates
electronic component package 30 and which holdselectronic component package 30 in place. For example, in the present embodiment, rotary table 16 includes a chuck that has vacuum ports through which a vacuum is drawn. The chuck and its vacuum holdelectronic component package 30 in place using a vacuum force. An advantage of the present embodiment is that relatively little force (e.g., less than 10 pounds) is necessary to hold the electronic component package during conditioning. This is in contrast to the conventional systems which may require as much as 250 pounds force to actuate the conditioner mechanism. - FIGURE 3 depicts a
monitor screen 100 that shows the image fromcamera 50 ofinspection system 18.Monitor screen 100 is split intoupper screen portion 102 andlower screen portion 104. Inupper screen portion 102 part of a side ofelectronic component package 30 appears. Inlower screen portion 104 the remaining part of the same side ofelectronic component package 30.Upper screen portion 102 showsconditioner arm 34 that includes referencesquare openings 108.Square openings 108 show the relative position of leads 74 ofelectronic component package 30 and, as will be discussed below in much detail, provides the necessary reference for measuring the necessary degree of conditioning for each lead.Bottom screen portion 104 also showsconditioner arm 34 withsquare openings 108 along with the rest ofelectronic component package 30. Note that, for illustrative purposes, lead 110 is shown bent.Square openings 108, as will be described more fully below, show the amount of bending to which lead 110 is subject. By splittingscreen 100 intoupper portion 102 andlower portion 104, the present embodiment makes possible more detailed examination of eachindividual lead 74. - For illustrative purposes, FIGURES 4a through 4d show situations that exist with leads that the present embodiment of the invention can both identify and remedy as necessary. For example, FIGURE 4a shows device standoff using
distance indication 120. Note thatlead 122 has greater height than does lead 124. This height difference is referred to as the lead's coplanarity error. In FIGURE 4a, lead 123 is the highest lead on a particular side of anelectronic component package 30. This lead can establish the seating plane ofpackage 30. In such case the lead 123 coplanarity error is zero. Lead 124 will have a coplanarity error greater than zero, since it is not touching the seating plane. - FIGURE 4b shows the desired pitch between leads 74. Pitch should be uniform, in most instances, from one
lead 74 to another. To assure that the pitch is proper,lead conditioning system 10 can independently adjust the position of each lead 74. FIGURE 4c shows the problem of sweep that the present embodiment addresses. Due to contact or other problems, sweep may occur so that all leads 74 shifted laterally. By movingleads 74 in FIGURE 4c, the present embodiment corrects for sweep. FIGURE 4d shows the problem of bent leads. Leads 74 in FIGURE 4d are moved in different directions. In addition, different pitches and standoff exist among the different leads 74 in FIGURE 4d. For example, lead 128 is bent in a different direction than is lead 130. Usinglead inspection system 18 of the present embodiment, each of these situations can be identified and, as necessary, corrected by conditioning one or more of theleads 74 ofelectronic component package 30. - FIGURE 5 shows an isometric view of
conditioning tool 20 together withmanipulator 22.Conditioning tool 20 includesconditioner arm 34 to whichconditioner blade 70 attaches.Conditioner arm 34 fastens to mount 140 which itself attaches tomanipulator 22. In the X-direction,stepper motor 36 rotates and controls the motion of X-direction translation table 38. For Y-directional movement,stepper motor 40 rotates to cause movement of Y-direction translation table 42. X-direction movement is possible through control of stepper motor 44 that causes movement of Z-direction translation table 46. Angle arm 144 attaches between X-direction translation table 38 and Z-direction translation table 46 for vertical movement of Z-direction translation table 46. By precisely controllingstepper motors conditioner blade 70 to contact one or more leads to condition them as described below.Manipulator 22 fastens at base 146 which holdsmanipulator 22 rigidly in place while permitting movement of Y-direction translation table 42, X-direction translation table 38, and Z-direction translation table 46. - FIGURES 6a and 6b show the configuration of
conditioner arm 34 that includesconditioner blade 70 and referencesquare opening 108. As can be seen in FIGURES 6a and 6b,conditioner arm 34 serves two functions. One function is to align individual leads ofelectronic component package 30.Conditioner blade 70 performs this function. Note, however, thatconditioner blade 70 may be wider to accommodate the conditioning of more than one lead at a time. Instead,conditioner blade 70 may also be a bar that conditions a set of leads on a side ofelectronic component package 30. As FIGURE 6b shows,conditioner arm 34 also serves the function of providing a real-time reference to leadinspection system 18. That is, by knowing precisely the spacing between and height of referencesquare openings 108, it is possible to discern to a high degree of accuracy that leadinspection system 18 requires. - There are generally tight tolerances on
lead 74 positions forelectronic component package 30, for example, in the case a surface mount package. As such, 100 percent inspection is required for these devices. The greater the accuracy and the more repeatable the inspection, the smaller are the guard bands and the lesser is the amount of over-kill in these devices. Leadinspection system 18 uses referencesquare openings 108 ofconditioner arm 34 for increasing the accuracy of the lead inspection. This results in moreaccurate lead 74 conditioning. From the overhead view of FIGURE 6a and the side view of FIGURE 6b, the two functions ofconditioner arm 34 become apparent. -
Lead conditioning system 10 of the present embodiment combineslead inspection 18 and lead conditioning in one system. An important aspect of the present embodiment is the generic lead conditioning tool thatconditioner arm 34 represents. Through the control system of the present embodiment,conditioner arm 34 may carry out a program of lead conditioning that automatically adapts to different types of devices based on an input parameter file. -
Manipulator 22 is controlled by a host computer to moveconditioner arm 34 in three dimensional space.Control system 24 is conventional in nature and may be a computer or microprocessor with the appropriate connective circuitry to the various stations as indicated schematically in FIGURE 1.Lead conditioning system 10 conditions a bent lead usingconditioner blade 70 to push the lead side-to-side or up and down. Since leads 74 are generally made of a metal which generally has a spring property, leads 74 are pushed beyond their initial positions to spring back to their normal positions. The amount of extra distance that the leads are pushed may be termed "overdrive."Lead conditioning system 10 of the present embodiment stores three separate overdrives for side-to-side, and up and down directions. These numbers also may be saved in a file associated with each device type. -
Lead conditioning system 10 assumes that each lead 74 is in its correct position at the point where thelead 74 leaveselectronic component package 30.Lead conditioning system 10inserts conditioner blade 70 close to thelead 74 shoulder atelectronic component package 30. Then,lead conditioning system 10 movesconditioner blade 70 up toward the tip of the lead before moving side to side in the direction opposite to the bending. -
Lead conditioning system 10 conditions each lead 74 that is bent up by placingconditioner blade 70 above the lead 74 foot and pushing the lead 74 foot down. Leads that are bent down, are corrected by placingconditioner blade 70 below the lead foot and pushing it up. When a lead is bent up, generally it is bent in toward the package as well since the tip of the foot tends to move in an arc. Conversely, when a lead is bent down, generally it is bent outward. Therefore, correcting the height of the lead will generally correct the positioning in toward or away from the package.Conditioner arm 34 andconditioner blade 70 can move the lead in toward or away from the package as necessary, either as part of the height correction, or as an independent movement. - Another important aspect of the present embodiment is a real-time calibration function that permits more reproducible inspection measurements than conventional devices provide. The real-time calibration system of the present embodiment provides universal calibration tooling to reduce device-specific costs.
Conditioner arm 34 includes numeroussquare openings 108 and rotary table 16 holdselectronic component package 30. A technical advantage to the present invention is that the same rotary table 16 may be used for all devices of the same package size irrespective of the draft angle. In fact rotary table 16 may serve as a reference for conditioning calculations. In the present embodiment, therefore, conditioner armsquare openings 108, theconditioner arm 34 lower edge and rotary table 16 are references for lead measurement and calibration.Square openings 108 provide both horizontal and vertical scale factors across the inspection field of view. This is especially helpful to correct horizontal parallaxtic errors which are not corrected with the calibration block technique, for example. - With reference to FIGUREs 6a and 6b, software within
control system 24 of the present embodiment uses a digital image of tensquare openings 108 as interpolation zones which scan the lower edge ofconditioner arm 34. Note, however, that the present embodiment ofconditioner arm 34 includes 24square openings 108. Depending on the magnification (which itself depends on the size of electronic component package 30), a variable number ofsquare openings 108 come into thelead inspection system 18 field of view. The scale factors are calculated using the information stored in a file ofcontrol system 24. Sincesquare openings 108 stretch across the X-axis ofmonitor 100,lead inspection system 18 finds the square edges (i.e., the vertical edges) that are furthest apart and measures these to calculate the X scale factor (e.g., at a scale of a predetermined number of mils per pixel). The Y scale factor is calculated from the averagesquare opening 108 height. - In FIGUREs 7a and 7b, each of the ten
square openings 108 is separated by a fixed horizontal distance. The software ofcontrol system 24 measures the height of the light-dark transitions that take place in the digital image signal. These values are used to calculate the position and angle of the lower edge by a mathematical method called linear regression. Linear regression averages the ten transition points and generates a two-dimensional line equation which represents the edge. The line equation is used to create the X-axis of a new coordinate system. The Y-axis is at a 90-degree downward angle from the plate lower edge. All measurements on this side are referenced to the new coordinate system. - In the present embodiment, each interpolation zone is a box three pixels wide and twelve pixels high.
Square openings 108 determine the coordinate system X-axis reference line.Square openings 108 also provide vertical and height scale across the field of view ofcamera 50. The actual dimension of the features ofsquare openings 108 are stored in a file withincontrol system 24. Each plate has a serial number and, in operation, the file calls out the respective serial number. Each square opening is 0.050 inches on each side and are separated by 0.025 inches. The distance between the center opening is 0.050 inches wide to allow visual identification of the reference plate center during optical adjustment. In the present embodiment, the interpolation zones applied to thesquare openings 108 measure each side of eachsquare opening 108 to determine the center of each opening. The individual square opening 108 measurements are averaged to minimize possible errors due to dust accumulation as well as to filter electrical noise. - The present embodiment further scans the upper edge of rotary table 16 with the interpolation zones to calculate the two-dimensional line equation of the edge of rotary table 16 by linear regression. A two-dimensional pedestal coordinate system is created from these measurements. Then, a transformation of the
square opening 108 measurements with the rotary table 16 measurements occurs within the software ofcontrol system 24. In further implementing the lead inspection system of the present embodiment, a two-dimensional coordinate system is formed for each side ofelectronic component package 30 by rotating rotary table 16 and taking measurements associated with each ofsquare openings 108 ofconditioner arm 34. - FIGURE 8 shows an important aspect of the
control system 24 of the present embodiment, which is the further calculation of a three-dimensional plane on rotary table 16 top surface. The two-dimensional coordinate systems that the present embodiment forms from the rotation of rotary table 16 and measurements relative tosquare openings 108 ofconditioner arm 34 are used to calculate a three-dimensional plane. The pedestal plane is calculated to provide a reference coordinate system for thelead 74 tip measurements. Thelead 74 tip locations which are measured in the two-dimensional coordinate systems are transferred to the three-dimensional coordinate system in the control system software. These measurements are used in the lead inspection process of the present embodiment. - The process of conditioning
electronic component package 30 leads 74 will now be described. Although the lead inspection portion of the present embodiment or the lead conditioning system of a present embodiment may operate separately, the following discussion describes their use together. That is,lead conditioning system 10 may be used solely as an inspection station for inspectingleads 74 without performing the operation of conditioning. On the other hand, given a known need and measurements for conditioning one or more leads on anelectronic component package 30, the lead conditioning aspect of the present embodiment may condition the designated leads independent of the inspection station. The conditioner would only need information on the package type and which leads need correction; neither the amount nor the direction of the bend would be required. With consideration of these matters, the following discussion details the operation of the system as a whole. - Referring again to FIGUREs 1 through 8, an electronic component packages 30 is introduced into
lead conditioning system 10 atinput station 14 where an adjustment is made to insure proper placement.Electronic component package 30 is engaged by rotary table 16. Then,inspection system 18 operates to determine the need for conditioning leads ofelectronic component package 30.Conditioning tool 20 will condition the identified leads 74 ofelectronic component package 30 by manipulatingconditioner arm 34 in the X, Y and Z directions. Control ofmanipulator 22 occurs throughcontrol system 24. The process can be iterative so thatinspection system 18 continues to inspect until the desired conditioning ofleads 74 occurs. -
Lead conditioning system 10 of the present embodiment performs a program start-up function during initialization. In addition to initialization ofcamera 50 and the handler (not shown) of the system that placeselectronic component package 30 on rotary table 16,lead conditioning system 10 also initializesmanipulator 22.Manipulator 22 moves its home sensors to define its home position in all three axes. Once home positions have been found,manipulator 22 will moveconditioner arm 34 so that the real-time reference ofsquare openings 108 line up with rotary table 16. This makes the system including rotary table 16 andsquare openings 108 ready for inspectingleads 74 of anelectronic component package 30. Then, for computer control the system may display several menus oncomputer monitor 100 ofcontrol system 24. These menus permit the operator to select operations such as production, set-up, maintenance, and engineering operations. - In the conditioning operation, set-up is necessary. One set-up function is calibration of
conditioner arm 34. This only needs to be done once during theinitial reconditioning system 10 set-up or aftercamera 50 orconditioner arm 34 modification. The other set-up is the conditioner parameter set-up. This includes both a generic conditioner parameter and some device dependent parameters. These parameters are set up for each device type. - Conditioner calibration orients the conditioner blade position information relative to
camera 50 and rotary table 16.Conditioner blade 70 is positioned in the field of view ofcamera 50 in a known location in "X," and thencamera 50 takes a picture and measures the values for "Y" and "Z" directly. During calibration, the camera's picture is shown onvideo monitor 100. This helps the user to positionconditioner arm 34 relative to rotary table 16. - After calibrating
conditioner arm 34, conditioner parameters are calibrated. These parameters are saved for each device type. The file name may be derived from the current device parameter file name with a new extension such as "*.twk". This file will be automatically loaded when the device is selected for conditioning. - In initializing
lead conditioning system 10, parameters that the present embodiment includes are the following: - OVERDRIVE_SIDE which defines the distance that
conditioner arm 34 will push lead 74 past its normal point in the side-to-side direction. A default value of 5 mils is generally acceptable with most of the 10 mil leads. A user can increase or decrease this value based on a particular lead property.
OVERDRIVE_DOWN is an assigned value for moving in the downward direction to compensate forlead 74 material properties.
OVERDRIVE_UP is an assigned value for the move in the up direction to compensate for lead material properties. (Default value of 5 mils).
LEAD_THICK defines the thickness of each lead 74. (Since the normal position oflead 74 is defined at the top of the lead in the dead-bug position,lead conditioning system 10 needs this amount to compensate for the push up distance).
FOOT_LENGTH defines the length from the lead tip to the first bent position. (Lead conditioning system 10 uses this number to define the distance thatconditioner blade 70 must move in underlead 74 before it bends lead 74 up).
TOOL_Y-REFERENCE is a reference in Y-direction from the tip ofconditioner arm 34 to the center of rotary table 16 during calibration.
TOOL_SPEED controls the speed of conditioner arm 34 (mils per second).
TOOL_ENABLE is a flag to turn on or offmanipulator 22. (N.B. The user can change this. This flag is enabled forlead conditioning system 10 to fixlead 74 during the run mode). - Having initialized the conditioning portion of
lead conditioning system 10, operation may further continue by the operator selecting a production mode from the monitor of a control system. Ifmanipulator 22 has not been calibrated,lead conditioning system 10 prompts the operator to calibratemanipulator 22 and exit the production mode. Otherwise,lead conditioning system 10 displays the normallead conditioning system 10 production screen. The run mode oflead conditioning system 10 of the present embodiment includes a manual mode and an automatic mode. In the manual mode, to fix bent leads 74 the operator must inspect a device using an inspection command. Then, to fix alead 74, the operator may enter a command to causelead conditioning system 10 to fix the leads on all sides of the device. In the automatic mode,lead conditioning system 10 inspects each lead 74 first. Then leadconditioning system 10 conditions the identified leads only where inspection shows a bent lead. After leads 74 have been conditioned,lead conditioning system 10 reinspectselectronic component package 30. If leads 74 are conditioned properly, the conditionedelectronic component package 34 is moved from rotary table 16. However, if thelead 74 is bent beyond repair or the parameters are not set up properly, theleads 74 may not be fixed. In that case, the affectedelectronic component package 30 is either corrected a second time or moved from rotary table 16 to a reject sort. - An important part of the present embodiment is the processing operation in conjunction with
lead inspection system 18. Thus, after initial calibration,lead inspection system 18 may begin by placing anelectronic component package 30 on rotary table 16. In the lead inspection process, anelectronic component package 30 is placed in rotary table 16. Leads on a first side are located. Measurements are transformed to the two-dimensional coordinate system applicable to the particular side of the package. Rotary table 16 is then rotated on each remaining side and scanned. The lead 74 positions on each side are transformed to the respective two-dimensional coordinate system. Then, the lead position vertical measurements are transformed into the three-dimensional coordinate system applicable to the plane of the rotary table 16. A three-point plane is then calculated, as a seating plane formed as if theelectronic component package 30 were inverted and placed on a flat surface. Only three lead tips will touch the seating plane according to this calculation. The other lead tips may be very close to the seating plane, but only three will actually touch. In this formation, a triangle is formed in the calculations that connects the three leads which touch in the three-point plane. - A device center of gravity (as projected on the three-point plane) is inside this triangle. Note, however, that some devices may be by-stable which means that there are two centers of gravity because a side of the three-point plane passes near the center of the device. The common side of the two seating planes intersects the package center of gravity. All coplanarity measurements are from the three-point plane to each lead tip. Individual lead tip distances for the three-point plane are calculated to provide coplanarity measurements for the
electronic component package 30. Then, the other lead measurements such as standoff, sweep, bent lead, and pitch may be determined for the electronic component package. With this information,control system 24 can appropriately actuatemanipulator 22 to causeconditioner arm 34 to condition the individual leads. - FIGURE 9 shows a
flow chart 200 that further exemplifies the operation of the present embodiment. The combined inspection and conditioning begins, as described, atblock 202 wherelead inspection system 18 inspectselectronic component package 30 and determines thatelectronic component package 30 has failed the inspection criteria. Then, asquery 204 indicates, a test is made to determine whether thelead 74 is "okay." If not,lead inspection system 18 determines whether there is an error, asquery 206 depicts. If there is a measurement error, then a query takes place, asquery 208 indicates, to determine if it is possible to locate the bad leads. If not, program flow goes to block 210 at which pointelectronic component package 30 is reinspected. If there is no measurement error atquery 206, or if it is possible to locate the bad leads, program flow goes to block 212 at which pointlead conditioning system 10 fixes the lead on the side to which it has access. Atquery 214,lead conditioning system 10 tests whether all sides ofelectronic component package 30 have been fixed or conditioned. If all sides have been fixed or conditioned, then program flow goes to block 210 at which pointelectronic component device 30 is reinspected. Then, program flow goes to block 214 at which programmable lead conditioning finishes. This completes the process flow forleads 74 of eachelectronic component package 30 that leadconditioning system 10 conditions. - FIGURE 10 shows an
alternative embodiment 300 of programmable lead conditioning system of the present embodiment. Begin atbase 302, there appearsrail transport beam 308 slidably engages.Transport beam 308 includesrails 310 and 312 in whichtranslation bed 314 slides.Conditioning fixture 316 slides withinrails translation bed 314. Withinconditioning fixture 316 is a conditioning device similar to the conditioning tool of the embodiment that appears in FIGUREs 2 and 5, above. In addition,conditioning fixture 316 includesthumb 324 for contacting the top of anelectronic component package 30. Beneathconditioning fixture 316 appearstray 326 of electronic component packages 30. Associated withconditioning fixture 316 may be a lead inspection viewing point that permits inspecting of the electronic component packages 30 withintray 326. - As is described in connection with FIGUREs 1 through 9, above, in-tray programmable
lead conditioning system 300 will permit inspection and conditioning of electronic component packages 30 with a single placement oftray 326. In-tray programmablelead inspection system 300 provides the further advantage of in-tray inspection and conditioning. By permitting eachelectronic component package 30 to remain in itstray 326, no handling or movement is necessary for lead inspection and conditioning. This significantly improves throughput of eachelectronic component package 30 in its manufacturing processes. - FIGURE 11 shows placement of
thumb 324 onelectronic component package 30. As FIGURE 11 illustrates,lead conditioning fixture 316 containsconditioning arm 330.Conditioning arm 330 includesconditioning blade 332.Conditioning blade 332 may contact alead 74 ofelectronic component package 30 to perform necessary conditioning. X, Y, and Z translation occurs astranslation beam 308 slides inrails translation bed 314 slides alongrails 310 and 312, andconditioning fixture 316 slides inrails translation bed 314. Precise manipulation ofconditioning arm 330 may be achieved. Alternatively, a separate X, Y, Z translation scheme may be incorporated inconditioning fixture 316 for more precise placement ofconditioning arm 330 and, thus,conditioning blade 332.Thumb 324 applies positive pressure onelectronic component package 30 so that application of conditioning force to lead 74conditioning blade 332 does not causeelectronic component package 30 to move. - In FIGURE 11, it is clear that by rotating
conditioning arm 330 withinconditioning fixture 316 all the sides ofelectronic component package 30 that include leads may be addressed with a single placement bythumb 324. As such, in-tray programmablelead conditioning system 300 provides the technical advantages of not only permitting in-tray inspection and conditioning, but also of inspecting and conditioning all leads ofelectronic component package 30 with a single placement ofconditioning fixture 316. In performing the desired conditioning forleads 74 ofelectronic component package 30 using in-tray programmablelead conditioning system 300, calculations similar to those described above in connection withlead inspection system 18 may be translated according to the orientation of the lead inspecting lens, as appropriate. - Although the invention has been described in detail herein with reference to the illustrative embodiments, it is to be understood that this description is by way of example only and is not to be construed in a limiting sense. For example,
conditioner blade 70 may have multiple blades or may be a bar that would move all leads up and down according to a specified program or a set of parameters in a particular program. Furthermore, any number of tools to be designed to push, pull, grab or otherwise manipulate leads 74 of theelectronic component package 30. In addition,manipulator 22 may use any number of motion generators such as stepper motors, servomotors, linear stepper motors, pneumatic actuators, etc.Controller 24 may be any type of processor capable of performing the above-described functions with bothlead inspection system 18 andmanipulator 22. It is to be further understood that numerous changes in the details of the embodiments of the invention and additional embodiments of the invention, will be apparent to, and may be made by, persons of ordinary skill in the art having reference to this description. It is contemplated that all such changes and additional embodiments are within the spirit and true scope of the invention as claimed below.
Claims (18)
- A lead conditioning system for a package comprising:
a table for holding the package and making accessible a set of leads of said package;
a conditioning tool for selectively contacting a predetermined number of said leads;
a manipulator for moving said conditioning tool to positions that contact said leads so as to condition said leads; and
a control system for programmably controlling the operation of said manipulator. - The lead condition system of Claim 1, further comprising a lead inspection system for inspecting said leads.
- The lead conditioning system of Claims 1 - 2, wherein said table comprises a rotary table that rotates the package to allow access to all sides of the package.
- The lead conditioning system of Claims 1 - 3, wherein said conditioning tool comprises a conditioner arm having a conditioner blade for contacting a single lead.
- The lead conditioning system of Claims 1 - 3, wherein said conditioning tool comprises a conditioner arm having one or more conditioner blades for selectively contacting a plurality of leads.
- The lead conditioning system of Claim 1 - 5, wherein said conditioning tool comprises a conditioner arm having a conditioner bar for simultaneously contacting a plurality of leads and moving said leads as a unit.
- The lead conditioning system of Claims 1 - 6, wherein said manipulator moves said conditioning tool in three dimensions for conditioning the set of leads in coplanarity, pitch, and tweeze.
- The lead conditioning system of Claims 1 - 7, wherein said control system calculates the amount of positioning required to condition each of said predetermined number of said set of leads based on data from said lead inspection system.
- The lead conditioning system of Claims 1 - 8, wherein said control system further comprises a database containing parameters associated with a plurality of packages and for determining desired amounts of conditioning for the selected leads.
- The lead conditioning system of Claims 1 - 9, wherein said table is configured to hold the package in a tray, and further wherein said conditioning tool and said manipulator are configured for conditioning the set of leads with the package in the tray.
- A method of conditioning a set of leads of a package, comprising:
holding the package and making accessible said set of leads;
selectively contacting one or more of said leads; and
moving a conditioning tool to positions that contact the or each lead so as to condition the or each lead. - The method of Claim 11, further comprising inspecting the leads.
- The method of Claims 11 - 12, further comprising rotating the package on a rotary table for making accessible all sides of the package.
- The method of Claims 11 - 13, further comprising contacting a plurality of leads and moving said leads as a unit.
- The method of Claims 11 - 16, further comprising conditioning said leads in coplanarity, pitch, and tweeze.
- The method of Claims 11 - 17, further comprising calculating the amount of positioning required to condition said leads.
- The method of Claims 11 - 18, further comprising addressing a database containing parameters associated with a plurality of packages.
- The method of Claims 11 - 19, further comprising conditioning the or each lead while the package is in a tray containing a plurality of packages.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US275162 | 1994-07-14 | ||
US08/275,162 US5777886A (en) | 1994-07-14 | 1994-07-14 | Programmable lead conditioner |
Publications (2)
Publication Number | Publication Date |
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EP0692928A1 true EP0692928A1 (en) | 1996-01-17 |
EP0692928B1 EP0692928B1 (en) | 1998-10-07 |
Family
ID=23051125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP95110751A Expired - Lifetime EP0692928B1 (en) | 1994-07-14 | 1995-07-10 | Programmable lead conditioner |
Country Status (6)
Country | Link |
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US (1) | US5777886A (en) |
EP (1) | EP0692928B1 (en) |
JP (1) | JPH0846110A (en) |
KR (1) | KR960005979A (en) |
DE (1) | DE69505202T2 (en) |
TW (1) | TW355811B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0781991A3 (en) * | 1995-12-26 | 1997-09-24 | Texas Instruments Inc | Improvements in or relating to semiconductor devices |
EP2056661A2 (en) * | 2007-11-01 | 2009-05-06 | Trinc.Org | A chip mounter |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1012785A (en) * | 1996-06-21 | 1998-01-16 | Nec Corp | Lead correcting device for surface mounted component |
US6155311A (en) * | 1997-07-01 | 2000-12-05 | Precision Technologies, Inc. | Lead conditioning system |
US6734577B2 (en) * | 2002-05-16 | 2004-05-11 | Earl R. Holcomb, Jr. | Vehicle auxiliary accessory system |
US8393066B2 (en) * | 2009-02-26 | 2013-03-12 | Lawrence Livermore National Security, Llc | Method and system for assembling miniaturized devices |
WO2014038087A1 (en) * | 2012-09-10 | 2014-03-13 | 富士機械製造株式会社 | Lead correction method and lead correction device |
CN110958832B (en) * | 2014-03-10 | 2022-01-11 | 株式会社富士 | Electronic circuit assembling device and radial pin element assembling method |
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WO1992009382A1 (en) * | 1990-11-21 | 1992-06-11 | Microtek Industries, Inc. | Tape automated bonding feeder and lead forming apparatus |
US5219404A (en) | 1991-05-20 | 1993-06-15 | Texas Instruments Incorporated | Lead conditioner for Quad semiconductor packages |
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US4063347A (en) * | 1976-10-01 | 1977-12-20 | Usm Corporation | Machine for inserting multi-lead components sequentially |
US4450619A (en) * | 1981-06-09 | 1984-05-29 | Usm Corporation | Component inserting machine |
US4387506A (en) * | 1981-06-09 | 1983-06-14 | Usm Corporation | Component inserting machine |
US4705081A (en) * | 1986-02-21 | 1987-11-10 | Hewlett-Packard Company | System for sensing and forming objects such as leads of electronic components |
US5185811A (en) * | 1990-12-27 | 1993-02-09 | International Business Machines Corporation | Automated visual inspection of electronic component leads prior to placement |
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US5487416A (en) * | 1991-12-11 | 1996-01-30 | Precision Technologies, Inc. | Lead conditioning system for semiconductor devices |
US5406372A (en) * | 1993-04-16 | 1995-04-11 | Modular Vision Systems Inc. | QFP lead quality inspection system and method |
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1994
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1995
- 1995-07-10 EP EP95110751A patent/EP0692928B1/en not_active Expired - Lifetime
- 1995-07-10 DE DE69505202T patent/DE69505202T2/en not_active Expired - Lifetime
- 1995-07-11 JP JP7175147A patent/JPH0846110A/en active Pending
- 1995-07-13 KR KR1019950020555A patent/KR960005979A/en not_active Application Discontinuation
- 1995-09-12 TW TW084109483A patent/TW355811B/en not_active IP Right Cessation
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EP0781991A3 (en) * | 1995-12-26 | 1997-09-24 | Texas Instruments Inc | Improvements in or relating to semiconductor devices |
EP2056661A2 (en) * | 2007-11-01 | 2009-05-06 | Trinc.Org | A chip mounter |
EP2056661A3 (en) * | 2007-11-01 | 2010-08-04 | Trinc.Org | A chip mounter |
Also Published As
Publication number | Publication date |
---|---|
US5777886A (en) | 1998-07-07 |
DE69505202D1 (en) | 1998-11-12 |
JPH0846110A (en) | 1996-02-16 |
TW355811B (en) | 1999-04-11 |
DE69505202T2 (en) | 1999-03-04 |
EP0692928B1 (en) | 1998-10-07 |
KR960005979A (en) | 1996-02-23 |
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