EP0798079A3 - Polishing apparatus and polishing method for silicon wafers - Google Patents

Polishing apparatus and polishing method for silicon wafers Download PDF

Info

Publication number
EP0798079A3
EP0798079A3 EP97104697A EP97104697A EP0798079A3 EP 0798079 A3 EP0798079 A3 EP 0798079A3 EP 97104697 A EP97104697 A EP 97104697A EP 97104697 A EP97104697 A EP 97104697A EP 0798079 A3 EP0798079 A3 EP 0798079A3
Authority
EP
European Patent Office
Prior art keywords
polishing
polishing slurry
semiconductor wafers
turn table
silicon wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97104697A
Other languages
German (de)
French (fr)
Other versions
EP0798079B1 (en
EP0798079A2 (en
Inventor
Teruaki C-304 Aza Ohhira 150-5 Fukami
Kiyoshi Aza Uenohara 186 Suzuki
Toshio Azaue Uenohara 2 Azito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of EP0798079A2 publication Critical patent/EP0798079A2/en
Publication of EP0798079A3 publication Critical patent/EP0798079A3/en
Application granted granted Critical
Publication of EP0798079B1 publication Critical patent/EP0798079B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Abstract

A polishing apparatus and a polishing method of semiconductor wafers are provided, whereby heavy metal contamination of semiconductor wafers can be prevented effectively in a polishing process.
A polishing apparatus of semiconductor wafers including a turn table assembly having a rotatably fixed turn table and a polishing slurry tank for storing polishing slurry to be supplied onto the turn table with a polishing slurry supplying member, wherein the polishing slurry supplying member is provided with means for eliminating heavy metal ions from the polishing slurry.
EP97104697A 1996-03-25 1997-03-19 Polishing apparatus and polishing method for silicon wafers Expired - Lifetime EP0798079B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP6799796 1996-03-25
JP67997/96 1996-03-25
JP6799796 1996-03-25
JP54504/97 1997-03-10
JP5450497 1997-03-10
JP05450497A JP3384530B2 (en) 1996-03-25 1997-03-10 Apparatus and method for polishing semiconductor wafer

Publications (3)

Publication Number Publication Date
EP0798079A2 EP0798079A2 (en) 1997-10-01
EP0798079A3 true EP0798079A3 (en) 1998-03-25
EP0798079B1 EP0798079B1 (en) 2000-10-18

Family

ID=26395260

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97104697A Expired - Lifetime EP0798079B1 (en) 1996-03-25 1997-03-19 Polishing apparatus and polishing method for silicon wafers

Country Status (4)

Country Link
EP (1) EP0798079B1 (en)
JP (1) JP3384530B2 (en)
DE (1) DE69703312T2 (en)
MY (1) MY132494A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121407A (en) 1999-10-21 2001-05-08 Nec Corp Polisher
JP4657412B2 (en) * 1999-12-10 2011-03-23 エルエスアイ コーポレーション Apparatus and method for polishing a semiconductor wafer
JP4510362B2 (en) * 2001-11-30 2010-07-21 俊郎 土肥 CMP apparatus and CMP method
JP2004075859A (en) * 2002-08-19 2004-03-11 Chubu Kiresuto Kk Method for cleaning polishing slurry
CN100437925C (en) * 2003-03-18 2008-11-26 野村微科学股份有限公司 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
JP4551167B2 (en) * 2004-09-14 2010-09-22 日本化学工業株式会社 Semiconductor wafer polishing apparatus and polishing method using the same
JP2006346753A (en) * 2005-06-13 2006-12-28 Nomura Micro Sci Co Ltd Method of decontaminating polishing slurry contaminated with metal
TWI417430B (en) * 2006-08-25 2013-12-01 Applied Materials Inc Method and system for point of use treatment of substrate polishing fluids
JP2010167551A (en) 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd Method for regenerating used slurry
US9259668B2 (en) * 2012-02-17 2016-02-16 Jsr Corporation Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate
CN104552002A (en) * 2014-12-29 2015-04-29 苏州用朴合金工具有限公司 Cooling liquid recycling system for CBN (cubic boron nitride) grinding wheel processing based on hard alloy rod
JP6454599B2 (en) 2015-05-14 2019-01-16 株式会社ディスコ Polishing equipment
JP6844970B2 (en) * 2016-08-18 2021-03-17 株式会社ディスコ Polishing equipment
JP7000102B2 (en) * 2017-09-29 2022-01-19 株式会社フジミインコーポレーテッド Polishing method and polishing composition
JP6946166B2 (en) * 2017-12-20 2021-10-06 パナソニックＩｐマネジメント株式会社 Polishing equipment and polishing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (en) * 1983-04-11 1984-10-27 Nec Corp Circulative use of waste water used for grinding silicon wafer
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JPH04293587A (en) * 1991-03-25 1992-10-19 Asahi Chem Ind Co Ltd Treatment of waste ga-as grinding water
EP0639534A2 (en) * 1993-08-16 1995-02-22 Ebara Corporation Waste treatment system in a polishing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (en) * 1983-04-11 1984-10-27 Nec Corp Circulative use of waste water used for grinding silicon wafer
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JPH04293587A (en) * 1991-03-25 1992-10-19 Asahi Chem Ind Co Ltd Treatment of waste ga-as grinding water
EP0639534A2 (en) * 1993-08-16 1995-02-22 Ebara Corporation Waste treatment system in a polishing apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 045 (C - 268) 26 February 1985 (1985-02-26) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 102 (C - 1031) 2 March 1993 (1993-03-02) *

Also Published As

Publication number Publication date
EP0798079B1 (en) 2000-10-18
JP3384530B2 (en) 2003-03-10
DE69703312D1 (en) 2000-11-23
MY132494A (en) 2007-10-31
DE69703312T2 (en) 2001-02-22
EP0798079A2 (en) 1997-10-01
JPH09314466A (en) 1997-12-09

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