EP1038635A3 - Polishing apparatus - Google Patents

Polishing apparatus Download PDF

Info

Publication number
EP1038635A3
EP1038635A3 EP00302005A EP00302005A EP1038635A3 EP 1038635 A3 EP1038635 A3 EP 1038635A3 EP 00302005 A EP00302005 A EP 00302005A EP 00302005 A EP00302005 A EP 00302005A EP 1038635 A3 EP1038635 A3 EP 1038635A3
Authority
EP
European Patent Office
Prior art keywords
polishing pad
slurry
polishing
brush
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00302005A
Other languages
German (de)
French (fr)
Other versions
EP1038635A2 (en
Inventor
Gee Hoey
Manoocher Birang
Doyle E. Bennett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1038635A2 publication Critical patent/EP1038635A2/en
Publication of EP1038635A3 publication Critical patent/EP1038635A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Abstract

A chemical mechanical polishing system having a dual position slurry/rinse arm for moving between a polishing position in which slurry is supplied to a polishing pad from a location remote from the polishing pad's center, and a rinsing position in which rinsing fluid is supplied from a location above or adjacent the polishing pad's center. The rinsing fluid is preferably sprayed from one or more nozzles that extend from the edge of the polishing pad to the center of the polishing pad. Preferably, in the polishing position, the slurry/rinse arm is positioned horizontally remote from the polishing pad's center and supplies slurry to the polishing pad via a horizontally angled slurry supply line. The slurry/rinse arm may include a gimbled brush for contacting the polishing pad when the slurry/rinse arm is in the rinsing position, and may further include brush nozzles positioned to direct rinsing fluid to the brush so as to rinse particles therefrom. Rinsing fluid nozzles may also be angled to spray rinsing fluid in front of the brush, so as to prewet the polishing pad.
EP00302005A 1999-03-16 2000-03-13 Polishing apparatus Withdrawn EP1038635A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27064299A 1999-03-16 1999-03-16
US270642 1999-03-16

Publications (2)

Publication Number Publication Date
EP1038635A2 EP1038635A2 (en) 2000-09-27
EP1038635A3 true EP1038635A3 (en) 2003-05-14

Family

ID=23032186

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00302005A Withdrawn EP1038635A3 (en) 1999-03-16 2000-03-13 Polishing apparatus

Country Status (3)

Country Link
EP (1) EP1038635A3 (en)
JP (1) JP2000280165A (en)
TW (1) TW434113B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379229B1 (en) * 1999-05-17 2002-04-30 Ebara Corporation Polishing apparatus
KR100494145B1 (en) * 2000-12-15 2005-06-10 주식회사 하이닉스반도체 Method for polishing the semiconductor wafer by Chemical Mechanical Polishing device
US6409580B1 (en) * 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
WO2003018256A1 (en) * 2001-08-31 2003-03-06 Koninklijke Philips Electronics N.V. Method and apparatus for chemical mechanical planarization end-o f-polish optimization
EP1628334A4 (en) 2003-05-09 2006-08-02 Sanyo Chemical Ind Ltd Polishing liquid for cmp process and polishing method
JP4901301B2 (en) * 2006-05-23 2012-03-21 株式会社東芝 Polishing method and semiconductor device manufacturing method
JP2011167800A (en) * 2010-02-18 2011-09-01 Disco Corp Cutting device
TWI548483B (en) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 Polishing device and method
JP5791987B2 (en) * 2011-07-19 2015-10-07 株式会社荏原製作所 Polishing apparatus and method
JP5775797B2 (en) * 2011-11-09 2015-09-09 株式会社荏原製作所 Polishing apparatus and method
JP5911786B2 (en) * 2012-10-31 2016-04-27 株式会社荏原製作所 Polishing equipment
US11298798B2 (en) * 2020-02-14 2022-04-12 Nanya Technology Corporation Polishing delivery apparatus
US20210402565A1 (en) * 2020-06-24 2021-12-30 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
CN113471108B (en) * 2021-07-06 2022-10-21 华海清科股份有限公司 Vertical rotatory processing apparatus of wafer based on marangoni effect

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421768A (en) * 1993-06-30 1995-06-06 Mitsubishi Materials Corporation Abrasive cloth dresser
EP0878269A2 (en) * 1997-05-12 1998-11-18 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads
EP0887153A2 (en) * 1997-06-24 1998-12-30 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
EP1095734A1 (en) * 1997-12-26 2001-05-02 Ebara Corporation Polishing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421768A (en) * 1993-06-30 1995-06-06 Mitsubishi Materials Corporation Abrasive cloth dresser
EP0878269A2 (en) * 1997-05-12 1998-11-18 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads
EP0887153A2 (en) * 1997-06-24 1998-12-30 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
EP1095734A1 (en) * 1997-12-26 2001-05-02 Ebara Corporation Polishing device

Also Published As

Publication number Publication date
TW434113B (en) 2001-05-16
JP2000280165A (en) 2000-10-10
EP1038635A2 (en) 2000-09-27

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