EP1108513A2 - Apparatus and process for thermal treatment of substrate material - Google Patents

Apparatus and process for thermal treatment of substrate material Download PDF

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Publication number
EP1108513A2
EP1108513A2 EP00118107A EP00118107A EP1108513A2 EP 1108513 A2 EP1108513 A2 EP 1108513A2 EP 00118107 A EP00118107 A EP 00118107A EP 00118107 A EP00118107 A EP 00118107A EP 1108513 A2 EP1108513 A2 EP 1108513A2
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EP
European Patent Office
Prior art keywords
substrate material
thermal treatment
material according
emitters
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00118107A
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German (de)
French (fr)
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EP1108513B1 (en
EP1108513A3 (en
Inventor
Werner Hitschfel
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ACKERMANN, GUNTHER
GERSTENDOERFER-HART, BARBARA
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/64—Heating or cooling preforms, parisons or blown articles
    • B29C49/68—Ovens specially adapted for heating preforms or parisons
    • B29C49/6835—Ovens specially adapted for heating preforms or parisons using reflectors

Definitions

  • the present invention relates to a device for thermal treatment of substrate material that emits at least one radiation Has heating device.
  • the invention also relates to a method for thermal treatment of substrate material in which the heating by short-wave (high-energy) Infrared radiation occurs.
  • Such devices and methods are used to to thermally treat various types of substrate material in order to achieve a to complete the previous processing process and / or to do so Prepare substrate material for further processing steps.
  • a generic device for the thermal treatment of substrate material is u. a. shown in the document DE-OS 38 23 670, which, however, the Heating of preforms only by means of direct and indirect Infrared radiation affects.
  • the glass pane present in one embodiment is designed as a filter, but does not guarantee explosion protection. Further is the reflector only as a flat reflection surface without radiation-directing Geometries designed, which is why an energetically homogeneous immission on treating material is not representable, the inevitable Scattered radiation for energy losses.
  • heating devices with IR emitters with ceramic reflectors which, however, due to their absorption properties themselves Radiation source and thus a quick control of the immission on difficult to treat material.
  • the object of the present invention is therefore to provide a device for to provide thermal treatment of substrate material, in which the Infrared radiation the material to be heated with a high, defined Energy density and with a largely homogeneous energy distribution acted upon, and in the case of a preferred embodiment also a effective explosion protection in accordance with certain legal regulations is guaranteed.
  • this object is achieved in a device for thermal Treatment of substrate material of the type mentioned at the outset, that reflectors designed as a polyline on the heating field near the emitters are attached so that the irradiation of the material to be heated on the one hand directly by the emitters, on the other hand indirectly by reflection on said reflectors.
  • the geometry of the reflector is due to the individually dimensioned angles of the individual partial surfaces of the reflectors to each other and by their area sizes so that the heating material with a largely uniform energy density is applied.
  • the emitters of the device according to the invention are advantageous in Staggered in the longitudinal direction so that a homogeneous radiation field is achieved both in the x direction and in the y direction.
  • the air of the secondary fresh air duct in addition to the thermal treatment of the Substrate material is used.
  • this is the material to be heated receiving space to the side of the emitters with a pressure-tight attached radiation-permeable plate so that all Regulations such as B. provided in VBG and / or EN, sufficient explosion protection given is.
  • the radiation-transmissive plate is as Spectral filter designed to remove unwanted radiation from the part to be treated Keep substrate material away.
  • the said adjustment said Pickup points take place in a further advantageous development of the
  • the device according to the invention is program and / or sensor controlled, whereby especially in the case of larger distances between the individual emitters Homogeneity of the radiation field is increased, as well as the energy density of the Immission is controllable.
  • the reflectors as a whole and / or one or more reflector segments in the angle of attack adjustable. Said adjustment of the angle of attack of said reflectors and / or reflector segments takes place in a further advantageous Further development of the device according to the program and / or sensor controlled. This is another parameter for influencing the available energy distribution to be treated material.
  • the one in the airflow internal walls of the device according to the invention are for better Heat dissipation preferably with a defined roughness and / or Profiling carried out.
  • the heating field of the device according to the invention preferably has a automatic shutdown controlled by a temperature sensor.
  • said temperature sensor attached explosion-proof.
  • the at least one air duct is with a particle barrier and / or with a fine-mesh sieve for separation of particles.
  • Figure 1 shows an inventive device with heating element 2, with the primary air duct 8 and the secondary air duct 9, and a first radiation-transmissive plate 6 and a second radiation-transmissive Plate 7.
  • At least the radiation-permeable plate 6 is pressure-tight attached and thus ensures explosion protection.
  • the radiation-transmissive plate 7 attached pressure-tight.
  • the radiation transparent Plates 6, 7 designed as a spectral filter, causing unwanted wavelengths suppressed or filtered out.
  • Figure 2 shows a further embodiment of the device according to the invention.
  • emitters 2 a radiation-permeable plate 6 and one Particle lock 10 is present in one air duct 8. It is also in the flow passage of an air duct 8 attached a fine mesh sieve 11, which in Connection with the particle lock 10 separates all unwanted particles.
  • the particle lock 10 or the fine-meshed sieve 11 can also be on others Place of the air duct can be arranged.
  • Figure 3 shows an embodiment of the device according to the invention with as Polygonal reflectors 3 with the heat sink 4, the cooling channels 6 and with the emitters 2.
  • Substrate material at the emitters 2 results from the combination of direct and indirect radiation a largely homogeneous immission.
  • the Heat dissipation through the heat sink 4 prevents selective or too strong Heating on the reflector.
  • Figure 4 shows the reflector of a device according to the invention 3, but without liquid cooling.
  • the heat sink 4 provides for the desired heat dissipation solely through direct radiation of heat in the nearby areas.
  • FIG. 5 shows a similar to the device according to the invention from FIG. 3 Heating field 1 with emitters 2 and the reflector 3 shown, the reflector 3 is designed without cantilevered heat sink geometries.
  • Figure 6 shows the heating field 1 of a further embodiment of an inventive Device with several cascades of emitters 2, the Emitters 2 of each cascade relative to the emitters 2 of the neighboring one Cascade (s) are staggered in the longitudinal direction.
  • the substrate material to be treated is particularly large Homogeneity of the radiation field generated by the emitters 2.

Abstract

The infra-red heating unit(1) is covered by one or more radiation-transparent plates(6,7), at least one of which forms a pressure tight seal with the equipment to prevent explosion risk. An Independent claim is made for a process for thermal treatment of substrates in which the a substrate passes the heater and heat is provided both directly through radiation from the emittors(2) and also indirectly through reflection of the radiation at reflectors(3).

Description

Die vorliegende Erfindung betrifft eine Vorrichtung zur thermischen Behandlung von Substratmaterial, die mindestens eine Strahlung emittierende Heizeinrichtung aufweist.The present invention relates to a device for thermal treatment of substrate material that emits at least one radiation Has heating device.

Die Erfindung betrift darüber hinaus ein Verfahren zur thermischen Behandlung von Substratmaterial, bei dem die Erwärmung durch kurzwellige (energiereiche) Infrarot-Strahlung erfolgt.The invention also relates to a method for thermal treatment of substrate material in which the heating by short-wave (high-energy) Infrared radiation occurs.

Derartige Vorrichtungen bzw. Verfahren werden dazu verwendet, verschiedenste Arten von Substratmaterial thermisch zu behandeln, um einen vorangegangenen Verarbeitungsprozess abzuschließen, und/oder um das Substratmaterial auf weitere Verarbeitungsschritte vorzubereiten.Such devices and methods are used to to thermally treat various types of substrate material in order to achieve a to complete the previous processing process and / or to do so Prepare substrate material for further processing steps.

Eine gattungsmäßige Vorrichtung zur thermischen Behandlung von Substratmaterial ist u. a. in der Schrift DE-OS 38 23 670 dargestellt, die jedoch die Erwärmung ausschließlich von Vorformlingen mittels direkter und indirekter Infrarotstrahlung betrifft. Die in einer Ausführungsform vorhandene Glasscheibe ist als Filter ausgelegt, gewährleistet jedoch keinen Explosionsschutz. Ferner ist der Reflektor nur als ebene Reflexionsfläche ohne strahlungslenkende Geometrien ausgelegt, weshalb eine energetisch homogene Immission am zu behandelnden Material nicht darstellbar ist, femer sorgt die unvermeidliche Streustrahlung für energetische Verluste.A generic device for the thermal treatment of substrate material is u. a. shown in the document DE-OS 38 23 670, which, however, the Heating of preforms only by means of direct and indirect Infrared radiation affects. The glass pane present in one embodiment is designed as a filter, but does not guarantee explosion protection. Further is the reflector only as a flat reflection surface without radiation-directing Geometries designed, which is why an energetically homogeneous immission on treating material is not representable, the inevitable Scattered radiation for energy losses.

Eine weitere Vorrichtung ist aus der DE-OS 197 24 621 bekannt, die ebenfalls eine thermische Behandlung ausschließlich von Vorformlingen betrifft, und bei der die Erwärmung des Materials allein durch Reflexion der von einer Heizeinrichtung emittierten Strahlung erfolgt. Diese Vorrichtung besitzt ebenfalls keinen Explosionsschutz. Durch die ausschließlich über Reflektoren erfolgende Beaufschlagung des zu behandelnden Materials mit Strahlung ergibt sich nur eine geringe Strahlungsdichte, bzw. ist eine hohe und unwirtschaftliche Heizleistung der eingesetzten Emittoren erforderlich.Another device is known from DE-OS 197 24 621, which also a thermal treatment concerns only preforms, and at which is the heating of the material solely by reflection of that of a Radiation emitted radiation takes place. This device also has no explosion protection. By using only reflectors There is only exposure to the material to be treated with radiation a low radiation density, or is a high and uneconomical Heating power of the emitters used is required.

Weiter bekannt sind Heiz-Vorrichtungen mit IR-Emittoren mit Keramik-Reflektoren, die jedoch in Folge ihrer Absorptionseigenschaften selbst zur Strahlungsquelle werden und somit eine schnelle Regelung der Immission am zu behandelnden Material erschweren.Also known are heating devices with IR emitters with ceramic reflectors, which, however, due to their absorption properties themselves Radiation source and thus a quick control of the immission on difficult to treat material.

Bekannte Heiz-Vorrichtungen besitzen zudem keinen wirksamen Schutz gegen Explosionsgefahr, der insbesondere beim Einsatz lösemittelhaltiger Materialien erforderlich ist. Weiterhin bekannte Heizvorrichtungen mit ausschließlichem Umluftbetrieb sind nicht zur Erzeugung der für den eingangs genannten Zweck notwendigen Energiedichten geeignet.Known heating devices also have no effective protection against Risk of explosion, especially when using solvent-based materials is required. Furthermore known heaters with exclusive Recirculation mode are not for the generation of the purpose mentioned at the beginning necessary energy densities.

Aufgabe der vorliegenden Erfindung ist es daher, eine Vorrichtung zur thermischen Behandlung von Substratmaterial bereit zu stellen, bei der die Infrarot-Strahlung das zu erwärmende Material mit einer hohen, definierten Energiedichte und mit einer weitgehend homogenen energetischen Verteilung beaufschlagt, und bei der in einer bevorzugten Ausführungsform zudem ein wirksamer Explosionsschutz gemäß bestimmten rechtlichen Vorschriften gewährleistet ist.The object of the present invention is therefore to provide a device for to provide thermal treatment of substrate material, in which the Infrared radiation the material to be heated with a high, defined Energy density and with a largely homogeneous energy distribution acted upon, and in the case of a preferred embodiment also a effective explosion protection in accordance with certain legal regulations is guaranteed.

Erfindungsgemäß wird diese Aufgabe bei einer Vorrichtung zur thermischen Behandlung von Substratmaterial der eingangs genannten Art dadurch gelöst, dass an dem Heizfeld nahe den Emittoren als Polygonzug ausgeführte Reflektoren angebracht sind, so dass die Bestrahlung des zu erwärmenden Materials einerseits direkt durch die Emittoren, andererseits indirekt durch die Reflexion an besagten Reflektoren erfolgt. Die Geometrie des Reflektors ist durch die individuell bemessenen Winkel der einzelnen Teilflächen der Reflektoren zueinander sowie durch deren Flächengrößen so ausgelegt, dass das zu erwärmende Material mit einer weitgehend gleichmäßigen Energiedichte beaufschlagt wird.According to the invention, this object is achieved in a device for thermal Treatment of substrate material of the type mentioned at the outset, that reflectors designed as a polyline on the heating field near the emitters are attached so that the irradiation of the material to be heated on the one hand directly by the emitters, on the other hand indirectly by reflection on said reflectors. The geometry of the reflector is due to the individually dimensioned angles of the individual partial surfaces of the reflectors to each other and by their area sizes so that the heating material with a largely uniform energy density is applied.

Vorteilhafte Ausgestaltungen und Weiterbildungen gehen aus den Unteransprüchen hervor.Advantageous refinements and developments go from the Sub-claims emerge.

Vorteilhaft sind die Emittoren der erfindungsgemäßen Vorrichtung in Längsrichtung gegeneinander versetzt, so dass ein homogenes Strahlungsfeld sowohl in x-Richtung als auch in y-Richtung erzielt wird.The emitters of the device according to the invention are advantageous in Staggered in the longitudinal direction so that a homogeneous radiation field is achieved both in the x direction and in the y direction.

In einer bevorzugten Ausführungsform der erfindungsgemäßen Vorrichtung ist an der Rückseite der Reflektoren ein vorzugsweise verrippter und/oder flüssigkeitsbefüllter bzw. flüssigkeitsdurchströmter Kühlkörper vorhanden, um die Wärmeableitung zu erhöhen. Vorzugsweise ist der Reflektor und/oder der Kühlkörper in Leichtmetall bzw. hoch wärmeleitfähigem Material ausgeführt.In a preferred embodiment of the device according to the invention a preferably ribbed and / or on the back of the reflectors liquid-filled or liquid-flowed heat sink available in order to increase heat dissipation. The reflector and / or is preferably Heatsink made of light metal or highly thermally conductive material.

Nach einer vorteilhaften Weiterbildung ist zusätzlich zu dem primären Frischluftkanal ein sekundärer Frischluftkanal vorhanden, wobei die Luft des sekundären Frischluftkanals zusätzlich zur thermischen Behandlung des Substratmaterials verwendet wird.According to an advantageous development, in addition to the primary one Fresh air duct a secondary fresh air duct is available, the air of the secondary fresh air duct in addition to the thermal treatment of the Substrate material is used.

In einer vorteilhaften Ausführungsform ist der das zu erwärmende Material aufnehmende Raum zur Seite der Emittoren hin mit einer druckdicht angebrachten strahlungsdurchlässigen Platte versehen, so dass ein sämtlichen Vorschriften, wie z. B. in VBG und/oder EN vorgesehen, genügender Explosionsschutz gegeben ist.In an advantageous embodiment, this is the material to be heated receiving space to the side of the emitters with a pressure-tight attached radiation-permeable plate so that all Regulations such as B. provided in VBG and / or EN, sufficient explosion protection given is.

In einer vorteilhaften Ausgestaltung ist die strahlungsdurchlässige Platte als Spektralfilter ausgeführt, um unerwünschte Strahlungsanteile vom zu behandelnden Substratmaterial fern zu halten. In an advantageous embodiment, the radiation-transmissive plate is as Spectral filter designed to remove unwanted radiation from the part to be treated Keep substrate material away.

Nach einer vorteilhaften Weiterbildung der erfindungsgemäßen Vorrichtung sind die Aufnahmepunkte der Emittoren in x-Richtung und/oder in y-Richtung und/oder in z-Richtung verstellbar ausgeführt. Die besagte Verstellung besagter Aufnahmepunkte erfolgt in einer weiteren vorteilhaften Weiterbildung der erfindungsgemäßen Vorrichtung programm- und/oder sensorgesteuert, wodurch insbesondere bei größeren Abständen der einzelnen Emittoren zueinander die Homogenität des Strahlungsfeldes gesteigert wird, sowie die Energiedichte der Immission steuerbar ist.According to an advantageous development of the device according to the invention the pick-up points of the emitters in the x-direction and / or in the y-direction and / or designed to be adjustable in the z direction. The said adjustment said Pickup points take place in a further advantageous development of the The device according to the invention is program and / or sensor controlled, whereby especially in the case of larger distances between the individual emitters Homogeneity of the radiation field is increased, as well as the energy density of the Immission is controllable.

In einer weiteren vorteilhaften Ausgestaltung sind die Reflektoren als Ganzes und/oder eines oder mehrere Reflektoren-Segmente im Anstellwinkel verstellbar. Die besagte Verstellung der Anstellwinkel besagter Reflektoren und/oder Reflektoren-Segmente erfolgt in einer weiteren vorteilhaften Weiterbildung der erfindungsgemäßen Vorrichtung programm- und/oder sensorgesteuert. Hiermit steht ein weiterer Parameter zur Beeinflussung der am zu behandelnden Material auftretenden Energie-Verteilung zur Verfügung.In a further advantageous embodiment, the reflectors as a whole and / or one or more reflector segments in the angle of attack adjustable. Said adjustment of the angle of attack of said reflectors and / or reflector segments takes place in a further advantageous Further development of the device according to the program and / or sensor controlled. This is another parameter for influencing the available energy distribution to be treated material.

In einer vorteilhaften Weiterbildung der erfindungsgemäßen Vorrichtung wird der Luftstrom zuerst entlang der Innenwände der erfindungsgemäßen Vorrichtung sowie anschließend an der mindestens einen strahlungsdurchlässigen Platte sowie an den Enden besagter Emittoren vorbei geführt. Die im Luftstrom befindlichen Innenwände der erfindungsgemäßen Vorrichtung sind zur besseren Wärmeabfuhr vorzugsweise mit einer definierten Rauigkeit und/oder einer Profilierung ausgeführt.In an advantageous development of the device according to the invention, the Air flow first along the inner walls of the device according to the invention and then on the at least one radiation-transmissive plate as well as past the ends of said emitters. The one in the airflow internal walls of the device according to the invention are for better Heat dissipation preferably with a defined roughness and / or Profiling carried out.

Vorzugsweise besitzt das Heizfeld der erfindungsgemäßen Vorrichtung eine automatische Abschaltung, die über einen Temperaturfühler gesteuert wird. In einer vorteilhaften Ausführungsform der erfindungsgemäßen Vorrichtung ist besagter Temperaturfühler explosionsgeschützt angebracht. The heating field of the device according to the invention preferably has a automatic shutdown controlled by a temperature sensor. In an advantageous embodiment of the device according to the invention said temperature sensor attached explosion-proof.

In einer weiteren vorteilhaften Ausgestaltung ist der mindestens eine Luftkanal mit einer Partikel-Sperre und/oder mit einem feinmaschigen Sieb zur Abscheidung von Partikeln versehen.In a further advantageous embodiment, the at least one air duct is with a particle barrier and / or with a fine-mesh sieve for separation of particles.

Nachstehend wird die vorliegende Erfindung anhand von Ausführungsbeispielen näher beschrieben, die schematisch in den Zeichnungen dargestellt sind. Gleiche oder funktionsidentische Bauteile sind hierbei mit den selben Bezugszeichen versehen. Dabei zeigt:

Figur 1
die schematische Ansicht des Querschnitts durch eine erfindungsgemäße Vorrichtung mit dem Heizelement, mit primärem und sekundärem Luftkanal sowie den strahlungsdurchlässigen Platten;
Figur 2
die schematische Ansicht des Querschnitts durch eine weitere Ausführungsform einer erfindungsgemäßen Vorrichtung mit Partikelsperre und feinmaschigen Sieb;
Figur 3
die schematische Ansicht des Querschnitts durch den Reflektor mit Kühlkörper und Emittoren, und mit als Polygonzug ausgeführten Reflektor-Flächen;
Figur 4
den Reflektor mit Kühlkörper gemäß Fig. 3, jedoch in einer Ausführung ohne Kühlkanäle;
Figur 5
die schematische Ansicht des Querschnitts eines erfindungsgemäßen Reflektors mit einem Kühlkörper mit Kühlkanälen, jedoch ohne Kühlrippen;
Figur 6
in der Aufsicht schematisch das Heizfeld einer weiteren Ausführungsform der erfindungsgemäßen Vorrichtung mit mehreren Emittor-Kaskaden.
The present invention is described in more detail below on the basis of exemplary embodiments which are illustrated schematically in the drawings. The same or functionally identical components are provided with the same reference numerals. It shows:
Figure 1
the schematic view of the cross section through a device according to the invention with the heating element, with primary and secondary air duct and the radiation-permeable plates;
Figure 2
the schematic view of the cross section through a further embodiment of a device according to the invention with particle barrier and fine-mesh sieve;
Figure 3
the schematic view of the cross section through the reflector with heat sink and emitters, and with reflector surfaces designed as a polygon;
Figure 4
the reflector with heat sink according to FIG 3, but in an embodiment without cooling channels.
Figure 5
the schematic view of the cross section of a reflector according to the invention with a heat sink with cooling channels, but without cooling fins;
Figure 6
the top view schematically shows the heating field of a further embodiment of the device according to the invention with several emitter cascades.

Figur 1 zeigt eine erfindungsgemäße Vorrichtung mit Heizelement 2, mit dem primären Luftkanal 8 und dem sekundären Luftkanal 9, sowie einer ersten strahlungsdurchlässigen Platte 6 und einer zweiten strahlungsdurchlässigen Platte 7. Mindestens die strahlungsdurchlässige Platte 6 ist druckdicht angebracht und gewährleistet somit einen Explosionsschutz. Vorzugsweise ist zusätzlich die strahlungsdurchlässige Platte 7 druckdicht angebracht. In einer vorteilhaften Ausführungsform ist mindestens eine der strahlungsdurchlässigen Platten 6, 7 als Spektralfilter ausgelegt, wodurch unerwünschte Wellenlängen unterdrückt bzw. ausgefiltert werden. Während der thermischen Behandlung des Substratmaterials werden in vorteilhafter Ausgestaltung die Aufnahmepunkte 12 der Emittoren 2 in x-Richtung und/oder in y-Richtung und/oder in z-Richtung verstellt, wobei diese Verstellung manuell und/oder sensorgesteuert und/oder programmgesteuert erfolgt, wodurch sich eine definierte Immission am zu behandelnden Substratmaterial erzielen lässt.Figure 1 shows an inventive device with heating element 2, with the primary air duct 8 and the secondary air duct 9, and a first radiation-transmissive plate 6 and a second radiation-transmissive Plate 7. At least the radiation-permeable plate 6 is pressure-tight attached and thus ensures explosion protection. Preferably in addition, the radiation-transmissive plate 7 attached pressure-tight. In a advantageous embodiment is at least one of the radiation transparent Plates 6, 7 designed as a spectral filter, causing unwanted wavelengths suppressed or filtered out. During the thermal treatment of the substrate material are in an advantageous embodiment Pickup points 12 of the emitters 2 in the x direction and / or in the y direction and / or adjusted in the z direction, this adjustment being manual and / or sensor-controlled and / or program-controlled, which results in a can achieve defined immissions on the substrate material to be treated.

Figur 2 zeigt eine weitere Ausführungsform der erfindungsgemäßen Vorrichtung. Hier sind Emittoren 2, eine strahlungsdurchlässige Platte 6 und eine Partikelsperre 10 in dem einen Luftkanal 8 vorhanden. Ferner ist im Strömungsgang des einen Luftkanals 8 ein feinmaschiges Sieb 11 angebracht, das in Verbindung mit der Partikelsperre 10 alle unerwünschten Partikel abscheidet. Die Partikelsperre 10 bzw. das feinmaschige Sieb 11 können auch an anderer Stelle des Luftkanals angeordnet sein.Figure 2 shows a further embodiment of the device according to the invention. Here are emitters 2, a radiation-permeable plate 6 and one Particle lock 10 is present in one air duct 8. It is also in the flow passage of an air duct 8 attached a fine mesh sieve 11, which in Connection with the particle lock 10 separates all unwanted particles. The particle lock 10 or the fine-meshed sieve 11 can also be on others Place of the air duct can be arranged.

Figur 3 zeigt eine Ausführungsform der erfindungsgemäßen Vorrichtung mit als Polygonzug ausgeführten Reflektoren 3 mit dem Kühlkörper 4, den Kühlkanälen 6 und mit den Emittoren 2. Beim Vorbeifahren des zu behandelnden Substratmaterials an den Emittoren 2 ergibt sich durch die Kombination von direkter und indirekter Strahlung eine weitgehend homogene Immission. Die Wärmeableitung durch den Kühlkörper 4 verhindert punktuelle bzw. zu starke Erwärmung am Reflektor.Figure 3 shows an embodiment of the device according to the invention with as Polygonal reflectors 3 with the heat sink 4, the cooling channels 6 and with the emitters 2. As the patient to be treated drives past Substrate material at the emitters 2 results from the combination of direct and indirect radiation a largely homogeneous immission. The Heat dissipation through the heat sink 4 prevents selective or too strong Heating on the reflector.

Die Figur 4 zeigt den Reflektor einer erfindungsgemäßen Vorrichtung entsprechend Fig. 3, jedoch ohne Flüssigkeitskühlung. Der Kühlkörper 4 sorgt für die erwünschte Wärmeableitung allein durch direkte Abstrahlung von Wärme in die Umgebung. Figure 4 shows the reflector of a device according to the invention 3, but without liquid cooling. The heat sink 4 provides for the desired heat dissipation solely through direct radiation of heat in the nearby areas.

In Figur 5 wird analog zur erfindungsgemäßen Vorrichtung aus Fig. 3 ein Heizfeld 1 mit Emittoren 2 und dem Reflektor 3 gezeigt, wobei der Reflektor 3 ohne auskragende Kühlkörper-Geometrien ausgeführt ist.FIG. 5 shows a similar to the device according to the invention from FIG. 3 Heating field 1 with emitters 2 and the reflector 3 shown, the reflector 3 is designed without cantilevered heat sink geometries.

Figur 6 zeigt das Heizfeld 1 einer weiteren Ausführungsform einer erfindungsgemäßen Vorrichtung mit mehreren Kaskaden von Emittoren 2, wobei die Emittoren 2 einer jeden Kaskade relativ zu den Emittoren 2 der benachbarten Kaskade(n) in Längsrichtung gegeneinander versetzt sind. Beim Vorbeiführen des zu behandelnden Substratmaterials ergibt sich so eine besonders große Homogenität des von den Emittoren 2 erzeugten Strahlungsfeldes.Figure 6 shows the heating field 1 of a further embodiment of an inventive Device with several cascades of emitters 2, the Emitters 2 of each cascade relative to the emitters 2 of the neighboring one Cascade (s) are staggered in the longitudinal direction. When leading past the substrate material to be treated is particularly large Homogeneity of the radiation field generated by the emitters 2.

Claims (26)

Vorrichtung zur thermischen Behandlung von Substratmaterial,
dadurch gekennzeichnet,
dass die Heizeinrichtung 1 mit mindestens einer strahlungsdurchlässigen Platte 6, 7 abgedeckt ist, wobei mindestens die strahlungsdurchlässige Platte 6 druckdicht angebracht ist.Device for the thermal treatment of substrate material,
characterized,
that the heating device 1 is covered with at least one radiation-permeable plate 6, 7, at least the radiation-permeable plate 6 being attached in a pressure-tight manner. Vorrichtung zur thermischen Behandlung von Substratmaterial nach Anspruch 1,
dadurch gekennzeichnet,
dass mindestens eine der strahlungsdurchlässigen Platten 6, 7 ein Spektralfilter ist.Device for the thermal treatment of substrate material according to claim 1,
characterized,
that at least one of the radiation-transmissive plates 6, 7 is a spectral filter. Vorrichtung zur thermischen Behandlung von Substratmaterial nach einem der Ansprüche 1 oder 2
dadurch gekennzeichnet,
dass die Arbeitstemperatur der Emittoren 2 mindestens 2500 Grad Kelvin beträgt.Device for the thermal treatment of substrate material according to one of claims 1 or 2
characterized,
that the working temperature of the emitters 2 is at least 2500 degrees Kelvin. Vorrichtung zur thermischen Behandlung von Substratmaterial nach Anspruch 3,
dadurch gekennzeichnet,
dass die Heizeinrichtung 1 Reflektoren 3 aufweist, wobei die Erwärmung des Substratmaterials a) direkt durch die Heizstrahlung der Emittoren 2
und b) indirekt durch Reflexion an den Reflektoren 3
erfolgt. Device for the thermal treatment of substrate material according to claim 3,
characterized,
that the heating device 1 has reflectors 3, the heating of the substrate material a) directly by the radiant heat from the emitters 2
and b) indirectly by reflection on the reflectors 3
he follows. Vorrichtung zur thermischen Behandlung von Substratmaterial nach Anspruch 4,
dadurch gekennzeichnet,
dass die Reflektoren 3 eine als Polygonzug gestaltete Geometrie aufweisen.Device for the thermal treatment of substrate material according to claim 4,
characterized,
that the reflectors 3 have a geometry designed as a polygon. Vorrichtung zur thermischen Behandlung von Substratmaterial nach Anspruch 5,
dadurch gekennzeichnet,
dass die Reflektoren 3 einen Kühlkörper 4, vorzugsweise aus Aluminium, aufweisen.Device for the thermal treatment of substrate material according to claim 5,
characterized,
that the reflectors 3 have a heat sink 4, preferably made of aluminum. Vorrichtung zur thermischen Behandlung von Substratmaterial nach einem der Ansprüche 5 oder 6,
dadurch gekennzeichnet,
dass die Reflektoren 3 flüssigkeitsgekühlt ausgeführt sind.Device for the thermal treatment of substrate material according to one of claims 5 or 6,
characterized,
that the reflectors 3 are liquid-cooled. Vorrichtung zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 4 bis 7
dadurch gekennzeichnet,
dass die Reflektoren 3 eine variable Geometrie aufweisen. Device for the thermal treatment of substrate material according to at least one of Claims 4 to 7
characterized,
that the reflectors 3 have a variable geometry. Vorrichtung zur thermischen Behandlung von Substratmaterial nach mindestens einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
dass die Emittoren 2 a) mit Steckverbindungen befestigt sind und/oder b) in x-Richtung und/oder in y-Richtung und/oder in z-Richtung verstellbare Aufnahmepunkte besitzen. Device for the thermal treatment of substrate material according to at least one of the preceding claims,
characterized,
that the issuers 2 a) are fastened with plug connections and / or b) have pick-up points adjustable in the x-direction and / or in the y-direction and / or in the z-direction. Vorrichtung zur thermischen Behandlung von Substratmaterial nach mindestens einem der vorhergehenden Ansprüche
dadurch gekennzeichnet,
dass ein primärer Luftkanal 8 und ein sekundärer Luftkanal 9 vorhanden sind.Device for the thermal treatment of substrate material according to at least one of the preceding claims
characterized,
that a primary air duct 8 and a secondary air duct 9 are present. Vorrichtung zur thermischen Behandlung von Substratmaterial nach Anspruch 11,
dadurch gekennzeichnet,
dass mindestens in dem primären Luftkanal 8 eine Partikelsperre 10 und/oder ein feinmaschiges Gitter 11 vorhanden ist.Device for the thermal treatment of substrate material according to claim 11,
characterized,
that a particle barrier 10 and / or a fine-meshed grid 11 is present at least in the primary air duct 8. Vorrichtung zur thermischen Behandlung von Substratmaterial nach einem der Ansprüche 10 oder 11,
dadurch gekennzeichnet,
dass die Luft des sekundären Luftkanals 9 zusätzlich zur Trocknung des Substratmaterials verwendet wird.Device for the thermal treatment of substrate material according to one of claims 10 or 11,
dadur c h marked,
that the air of the secondary air duct 9 is additionally used for drying the substrate material. Vorrichtung zur thermischen Behandlung von Substratmaterial nach einem der Ansprüche 11 oder 12,
dadurch gekennzeichnet,
dass das Volumen der in den mindestens einen Luftkanal 8, 9 einströmenden Frischluftmenge durch einen Sensor überwacht wird.Device for the thermal treatment of substrate material according to one of claims 11 or 12,
characterized,
that the volume of the fresh air quantity flowing into the at least one air duct 8, 9 is monitored by a sensor. Vorrichtung zur thermischen Behandlung von Substratmaterial nach mindestens einem der vorhergehenden Ansprüche
dadurch gekennzeichnet,
dass das Heizfeld 1 eine automatische Abschaltung aufweist.Device for the thermal treatment of substrate material according to at least one of the preceding claims
characterized,
that the heating field 1 has an automatic shutdown. Vorrichtung zur thermischen Behandlung von Substratmaterial nach mindestens einem der vorhergehenden Ansprüche
dadurch gekennzeichnet,
dass ein explosionsgeschützter Sensor die Arbeitstemperatur der Emittoren 2 überwacht.Device for the thermal treatment of substrate material according to at least one of the preceding claims
characterized,
that an explosion-proof sensor monitors the working temperature of the emitters 2. Verfahren zur thermischen Behandlung von Substratmaterial,
dadurch gekennzeichnet,
dass das Substratmaterial an der Heizeinrichtung 1 vorbei geführt wird, wobei die Erwärmung sowohl direkt durch die die Strahlung der Emittoren 2 als auch indirekt durch Reflexion der Emittor-Strahlung an den Reflektoren 3 erfolgt. Process for the thermal treatment of substrate material,
characterized,
that the substrate material is guided past the heating device 1, the heating being effected both directly by the radiation from the emitters 2 and indirectly by reflection of the emitter radiation at the reflectors 3. Verfahren zur thermischen Behandlung von Substratmaterial nach Anspruch 16,
dadurch gekennzeichnet,
dass das Substratmaterial mittels einer druckdichten Anbringung der mindestens einen strahlungsdurchlässigen Platte 6, 7 explosionsgeschützt behandelt wird.Process for the thermal treatment of substrate material according to claim 16,
characterized,
that the substrate material is treated explosion-proof by means of a pressure-tight attachment of the at least one radiation-permeable plate 6, 7. Verfahren zur thermischen Behandlung von Substratmaterial nach einem der Ansprüche 16 oder 17,
dadurch gekennzeichnet,
dass die Heizleistung der Emittoren 2 und/oder die Erwärmung des Substratmaterials über mindestens einen Sensor überwacht wird.Method for the thermal treatment of substrate material according to one of claims 16 or 17,
characterized,
that the heating power of the emitters 2 and / or the heating of the substrate material is monitored by at least one sensor. Verfahren zur thermischen Behandlung von Substratmaterial nach einem der Ansprüche 17 oder 18,
dadurch gekennzeichnet,
dass a) der Abstand der Emittoren 2 zum Substratmaterial und/oder b) der Abstand der Emittoren 2 voneinander in x-Richtung und/oder in y-Richtung variabel eingestellt wird. Process for the thermal treatment of substrate material according to one of claims 17 or 18,
characterized,
that a) the distance between the emitters 2 and the substrate material and / or b) the distance between the emitters 2 from one another is variably set in the x direction and / or in the y direction. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 16 bis 19,
dadurch gekennzeichnet,
dass das Volumen der den mindestens einen Luftkanal 8, 9 durchströmenden Frischluftmenge überwacht wird.Process for the thermal treatment of substrate material according to at least one of Claims 16 to 19,
characterized,
that the volume of the fresh air quantity flowing through the at least one air duct 8, 9 is monitored. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 16 bis 20,
dadurch gekennzeichnet,
dass die Temperatur der Emittoren 2 durch einen explosionsgeschützt angebrachten Sensor überwacht sowie durch einen Regelkreis gesteuert wird.Process for the thermal treatment of substrate material according to at least one of Claims 16 to 20,
characterized,
that the temperature of the emitters 2 is monitored by an explosion-proof sensor and is controlled by a control loop. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 16 bis 21,
dadurch gekennzeichnet,
dass die Emittoren 2 mit einer Arbeitstemperatur von mindestens 2500 Grad Kelvin betrieben werden.Process for the thermal treatment of substrate material according to at least one of Claims 16 to 21,
characterized,
that the emitters 2 are operated with a working temperature of at least 2500 degrees Kelvin. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 16 bis 22,
dadurch gekennzeichnet,
dass die erwärmte Frischluft des sekundären Luftkanals 9 zusätzlich zur Trocknung des Substratmaterials verwendet wird. Process for the thermal treatment of substrate material according to at least one of Claims 16 to 22,
characterized,
that the heated fresh air of the secondary air duct 9 is additionally used for drying the substrate material. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 16 bis 23,
dadurch gekennzeichnet,
dass Hohlkörper durch Erhitzung auf Dichtigkeit geprüft werden, wobei besagte Hohlkörper mit einem temperaturabhängig volumenändernden Substrat befüllt sind.Process for the thermal treatment of substrate material according to at least one of Claims 16 to 23,
characterized,
that hollow bodies are checked for leaks by heating, said hollow bodies being filled with a temperature-dependent volume-changing substrate. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 16 bis 23,
dadurch gekennzeichnet,
dass durch die thermische Behandlung Lack und/oder Farbe getrocknet wird.Process for the thermal treatment of substrate material according to at least one of Claims 16 to 23,
characterized,
that paint and / or paint is dried by the thermal treatment. Verfahren zur thermischen Behandlung von Substratmaterial nach mindestens einem der Ansprüche 17 bis 23,
dadurch gekennzeichnet,
dass durch die thermische Behandlung eine Thermoverformung vorbereitet und/oder vorgenommen wird.Process for the thermal treatment of substrate material according to at least one of Claims 17 to 23,
characterized,
that thermoforming is prepared and / or carried out by the thermal treatment.
EP00118107A 1999-08-27 2000-08-25 Apparatus and process for thermal treatment of substrate material Expired - Lifetime EP1108513B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19940838 1999-08-27
DE19940838 1999-08-27

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Also Published As

Publication number Publication date
EP1108513B1 (en) 2006-05-17
DE50012763D1 (en) 2006-06-22
DE10035080C2 (en) 2003-06-26
ATE326323T1 (en) 2006-06-15
EP1108513A3 (en) 2002-05-22
DE10035080A1 (en) 2001-07-12

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