EP1135236A1 - Reverse linear polisher with loadable housing - Google Patents
Reverse linear polisher with loadable housingInfo
- Publication number
- EP1135236A1 EP1135236A1 EP99959045A EP99959045A EP1135236A1 EP 1135236 A1 EP1135236 A1 EP 1135236A1 EP 99959045 A EP99959045 A EP 99959045A EP 99959045 A EP99959045 A EP 99959045A EP 1135236 A1 EP1135236 A1 EP 1135236A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- wafer
- pad
- polishing
- housing
- chemical mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
Definitions
- Fig. 5 illustrates a side view of a wafer housing adapted to load and unload a wafer onto a wafer housing in accordance with the preferred embodiment
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201928 | 1998-12-01 | ||
US09/201,928 US6103628A (en) | 1998-12-01 | 1998-12-01 | Reverse linear polisher with loadable housing |
PCT/US1999/027477 WO2000032356A1 (en) | 1998-12-01 | 1999-11-19 | Reverse linear polisher with loadable housing |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1135236A1 true EP1135236A1 (en) | 2001-09-26 |
EP1135236B1 EP1135236B1 (en) | 2004-10-20 |
Family
ID=22747860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99959045A Expired - Lifetime EP1135236B1 (en) | 1998-12-01 | 1999-11-19 | Reverse linear polisher with loadable housing |
Country Status (10)
Country | Link |
---|---|
US (2) | US6103628A (en) |
EP (1) | EP1135236B1 (en) |
JP (1) | JP2002531933A (en) |
KR (1) | KR100638798B1 (en) |
CN (1) | CN1131765C (en) |
AT (1) | ATE280014T1 (en) |
AU (1) | AU1629900A (en) |
DE (1) | DE69921354T2 (en) |
TW (1) | TW425332B (en) |
WO (1) | WO2000032356A1 (en) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7531079B1 (en) | 1998-10-26 | 2009-05-12 | Novellus Systems, Inc. | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation |
US7449098B1 (en) | 1999-10-05 | 2008-11-11 | Novellus Systems, Inc. | Method for planar electroplating |
US6468139B1 (en) * | 1998-12-01 | 2002-10-22 | Nutool, Inc. | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
US6589105B2 (en) | 1998-12-01 | 2003-07-08 | Nutool, Inc. | Pad tensioning method and system in a bi-directional linear polisher |
US7425250B2 (en) * | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US6464571B2 (en) * | 1998-12-01 | 2002-10-15 | Nutool, Inc. | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
US6475070B1 (en) | 1999-02-04 | 2002-11-05 | Applied Materials, Inc. | Chemical mechanical polishing with a moving polishing sheet |
US6244935B1 (en) * | 1999-02-04 | 2001-06-12 | Applied Materials, Inc. | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
US6491570B1 (en) * | 1999-02-25 | 2002-12-10 | Applied Materials, Inc. | Polishing media stabilizer |
US6626744B1 (en) | 1999-12-17 | 2003-09-30 | Applied Materials, Inc. | Planarization system with multiple polishing pads |
US7048607B1 (en) | 2000-05-31 | 2006-05-23 | Applied Materials | System and method for chemical mechanical planarization |
US6520833B1 (en) | 2000-06-30 | 2003-02-18 | Lam Research Corporation | Oscillating fixed abrasive CMP system and methods for implementing the same |
US6561884B1 (en) * | 2000-08-29 | 2003-05-13 | Applied Materials, Inc. | Web lift system for chemical mechanical planarization |
US7220166B2 (en) * | 2000-08-30 | 2007-05-22 | Micron Technology, Inc. | Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
US7129160B2 (en) * | 2002-08-29 | 2006-10-31 | Micron Technology, Inc. | Method for simultaneously removing multiple conductive materials from microelectronic substrates |
US7074113B1 (en) | 2000-08-30 | 2006-07-11 | Micron Technology, Inc. | Methods and apparatus for removing conductive material from a microelectronic substrate |
US7134934B2 (en) * | 2000-08-30 | 2006-11-14 | Micron Technology, Inc. | Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium |
US7192335B2 (en) * | 2002-08-29 | 2007-03-20 | Micron Technology, Inc. | Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
US7094131B2 (en) | 2000-08-30 | 2006-08-22 | Micron Technology, Inc. | Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
US7112121B2 (en) | 2000-08-30 | 2006-09-26 | Micron Technology, Inc. | Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
US7160176B2 (en) * | 2000-08-30 | 2007-01-09 | Micron Technology, Inc. | Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate |
US7078308B2 (en) * | 2002-08-29 | 2006-07-18 | Micron Technology, Inc. | Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate |
US7153195B2 (en) | 2000-08-30 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatus for selectively removing conductive material from a microelectronic substrate |
US7153410B2 (en) | 2000-08-30 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
US6867448B1 (en) | 2000-08-31 | 2005-03-15 | Micron Technology, Inc. | Electro-mechanically polished structure |
US6592439B1 (en) | 2000-11-10 | 2003-07-15 | Applied Materials, Inc. | Platen for retaining polishing material |
US6607425B1 (en) | 2000-12-21 | 2003-08-19 | Lam Research Corporation | Pressurized membrane platen design for improving performance in CMP applications |
US6776695B2 (en) * | 2000-12-21 | 2004-08-17 | Lam Research Corporation | Platen design for improving edge performance in CMP applications |
CN1638919A (en) * | 2001-06-12 | 2005-07-13 | 纳托尔公司 | Improved method and apparatus for bi-directionally polishing a workpiece |
US6503131B1 (en) | 2001-08-16 | 2003-01-07 | Applied Materials, Inc. | Integrated platen assembly for a chemical mechanical planarization system |
US7121919B2 (en) * | 2001-08-30 | 2006-10-17 | Micron Technology, Inc. | Chemical mechanical polishing system and process |
US6838149B2 (en) * | 2001-12-13 | 2005-01-04 | 3M Innovative Properties Company | Abrasive article for the deposition and polishing of a conductive material |
US6776693B2 (en) | 2001-12-19 | 2004-08-17 | Applied Materials Inc. | Method and apparatus for face-up substrate polishing |
US6722946B2 (en) * | 2002-01-17 | 2004-04-20 | Nutool, Inc. | Advanced chemical mechanical polishing system with smart endpoint detection |
US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
CN1653600A (en) * | 2002-03-13 | 2005-08-10 | Asm努突尔股份有限公司 | Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
US6939203B2 (en) | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
US7799200B1 (en) | 2002-07-29 | 2010-09-21 | Novellus Systems, Inc. | Selective electrochemical accelerator removal |
US7138039B2 (en) * | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
US7087144B2 (en) * | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
US7025861B2 (en) * | 2003-02-06 | 2006-04-11 | Applied Materials | Contact plating apparatus |
US7018273B1 (en) | 2003-06-27 | 2006-03-28 | Lam Research Corporation | Platen with diaphragm and method for optimizing wafer polishing |
US20050016861A1 (en) * | 2003-07-24 | 2005-01-27 | Thomas Laursen | Method for planarizing a work piece |
US7112122B2 (en) * | 2003-09-17 | 2006-09-26 | Micron Technology, Inc. | Methods and apparatus for removing conductive material from a microelectronic substrate |
US8158532B2 (en) | 2003-10-20 | 2012-04-17 | Novellus Systems, Inc. | Topography reduction and control by selective accelerator removal |
US8530359B2 (en) | 2003-10-20 | 2013-09-10 | Novellus Systems, Inc. | Modulated metal removal using localized wet etching |
US7153777B2 (en) * | 2004-02-20 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatuses for electrochemical-mechanical polishing |
US7648622B2 (en) | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US6955588B1 (en) | 2004-03-31 | 2005-10-18 | Lam Research Corporation | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization |
US20050218000A1 (en) * | 2004-04-06 | 2005-10-06 | Applied Materials, Inc. | Conditioning of contact leads for metal plating systems |
US7285195B2 (en) * | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate |
US7566391B2 (en) * | 2004-09-01 | 2009-07-28 | Micron Technology, Inc. | Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media |
US20070014958A1 (en) * | 2005-07-08 | 2007-01-18 | Chaplin Ernest R | Hanger labels, label assemblies and methods for forming the same |
US8168540B1 (en) | 2009-12-29 | 2012-05-01 | Novellus Systems, Inc. | Methods and apparatus for depositing copper on tungsten |
JP2017148931A (en) * | 2016-02-19 | 2017-08-31 | 株式会社荏原製作所 | Polishing device and polishing method |
KR102339948B1 (en) * | 2019-07-02 | 2021-12-17 | (주)미래컴퍼니 | Polishing system and polishing method |
CN111955945A (en) * | 2020-08-27 | 2020-11-20 | 代永金 | Drive arrangement of traditional chinese medicine cabinet |
CN116833900B (en) * | 2023-07-31 | 2024-01-26 | 广东工业大学 | Magnetorheological elastic polishing pad for semiconductor wafer chemical mechanical polishing, preparation method and application thereof |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3113204A1 (en) * | 1981-04-02 | 1982-10-28 | Percy 3008 Garbsen Lambelet | Apparatus for grinding, abrading or polishing workpieces |
DE3643914A1 (en) * | 1986-12-22 | 1988-06-30 | Zeiss Carl Fa | METHOD AND DEVICE FOR LAPPING OR POLISHING OPTICAL SURFACES |
EP0517594B1 (en) * | 1991-06-06 | 1995-12-13 | Commissariat A L'energie Atomique | Polishing machine with a tensioned finishing belt and an improved work supporting head |
US5245796A (en) * | 1992-04-02 | 1993-09-21 | At&T Bell Laboratories | Slurry polisher using ultrasonic agitation |
JP2894153B2 (en) * | 1993-05-27 | 1999-05-24 | 信越半導体株式会社 | Method and apparatus for manufacturing silicon wafer |
US5650039A (en) * | 1994-03-02 | 1997-07-22 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved slurry distribution |
EP0696495B1 (en) * | 1994-08-09 | 1999-10-27 | Ontrak Systems, Inc. | Linear polisher and method for semiconductor wafer planarization |
US5593344A (en) * | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
US5908530A (en) | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
US5951373A (en) * | 1995-10-27 | 1999-09-14 | Applied Materials, Inc. | Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning |
US5961372A (en) | 1995-12-05 | 1999-10-05 | Applied Materials, Inc. | Substrate belt polisher |
JP2830907B2 (en) | 1995-12-06 | 1998-12-02 | 日本電気株式会社 | Semiconductor substrate polishing equipment |
US5770521A (en) * | 1996-05-30 | 1998-06-23 | Cypress Semiconductor Corporation | Anti-shear method and system for semiconductor wafer removal |
JPH09321001A (en) * | 1996-05-31 | 1997-12-12 | Komatsu Electron Metals Co Ltd | Method for polishing semiconductor wafer |
US5899801A (en) * | 1996-10-31 | 1999-05-04 | Applied Materials, Inc. | Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system |
US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
US6110025A (en) | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
US5899798A (en) | 1997-07-25 | 1999-05-04 | Obsidian Inc. | Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing |
US6113479A (en) | 1997-07-25 | 2000-09-05 | Obsidian, Inc. | Wafer carrier for chemical mechanical planarization polishing |
US6196896B1 (en) | 1997-10-31 | 2001-03-06 | Obsidian, Inc. | Chemical mechanical polisher |
-
1998
- 1998-12-01 US US09/201,928 patent/US6103628A/en not_active Expired - Lifetime
-
1999
- 1999-11-19 EP EP99959045A patent/EP1135236B1/en not_active Expired - Lifetime
- 1999-11-19 JP JP2000585032A patent/JP2002531933A/en not_active Withdrawn
- 1999-11-19 AT AT99959045T patent/ATE280014T1/en not_active IP Right Cessation
- 1999-11-19 WO PCT/US1999/027477 patent/WO2000032356A1/en active IP Right Grant
- 1999-11-19 CN CN998139920A patent/CN1131765C/en not_active Expired - Fee Related
- 1999-11-19 DE DE69921354T patent/DE69921354T2/en not_active Expired - Fee Related
- 1999-11-19 KR KR1020017006843A patent/KR100638798B1/en not_active IP Right Cessation
- 1999-11-19 AU AU16299/00A patent/AU1629900A/en not_active Abandoned
- 1999-12-07 TW TW088120885A patent/TW425332B/en not_active IP Right Cessation
-
2000
- 2000-05-22 US US09/576,064 patent/US6207572B1/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
See references of WO0032356A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE69921354T2 (en) | 2005-10-13 |
US6103628A (en) | 2000-08-15 |
AU1629900A (en) | 2000-06-19 |
KR20010089531A (en) | 2001-10-06 |
EP1135236B1 (en) | 2004-10-20 |
US6207572B1 (en) | 2001-03-27 |
DE69921354D1 (en) | 2004-11-25 |
CN1329533A (en) | 2002-01-02 |
KR100638798B1 (en) | 2006-10-25 |
JP2002531933A (en) | 2002-09-24 |
ATE280014T1 (en) | 2004-11-15 |
TW425332B (en) | 2001-03-11 |
CN1131765C (en) | 2003-12-24 |
WO2000032356A1 (en) | 2000-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6103628A (en) | Reverse linear polisher with loadable housing | |
US6932679B2 (en) | Apparatus and method for loading a wafer in polishing system | |
KR100315722B1 (en) | Polishing machine for flattening substrate surface | |
EP0860239B1 (en) | Apparatus and method for polishing a flat surface using a belted polishing pad | |
US6409580B1 (en) | Rigid polishing pad conditioner for chemical mechanical polishing tool | |
US6361423B2 (en) | Chemical mechanical polishing conditioner | |
US6869337B2 (en) | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | |
US6340326B1 (en) | System and method for controlled polishing and planarization of semiconductor wafers | |
US6468139B1 (en) | Polishing apparatus and method with a refreshing polishing belt and loadable housing | |
US6386963B1 (en) | Conditioning disk for conditioning a polishing pad | |
US6439978B1 (en) | Substrate polishing system using roll-to-roll fixed abrasive | |
JPH0839422A (en) | Chemical polishing machinery improved in polishing control | |
US6726532B2 (en) | Belt tensioning assembly for CMP apparatus | |
US6482290B1 (en) | Sweeping slurry dispenser for chemical mechanical polishing | |
TW200301179A (en) | Grooved rollers for a linear chemical mechanical planarization system | |
US6217427B1 (en) | Mobius strip belt for linear CMP tools | |
US20020016136A1 (en) | Conditioner for polishing pads | |
US6752698B1 (en) | Method and apparatus for conditioning fixed-abrasive polishing pads | |
JP3427670B2 (en) | Polishing apparatus and polishing method | |
US7175515B2 (en) | Static pad conditioner | |
US6783441B2 (en) | Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft | |
JPH11156712A (en) | Polishing device | |
CN117415724A (en) | Polishing module, polishing unit, polishing system and polishing method | |
JP2001150311A (en) | Circumference processing method and processing device for thin disc |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20010612 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
17Q | First examination report despatched |
Effective date: 20030704 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20041020 Ref country code: LI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20041020 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20041020 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20041020 Ref country code: CH Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20041020 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20041020 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041119 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041119 |
|
REF | Corresponds to: |
Ref document number: 69921354 Country of ref document: DE Date of ref document: 20041125 Kind code of ref document: P |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050120 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050120 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050131 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
NLT1 | Nl: modifications of names registered in virtue of documents presented to the patent office pursuant to art. 16 a, paragraph 1 |
Owner name: ASM NUTOOL, INC. |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20050721 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20051119 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: CD Ref country code: FR Ref legal event code: CA |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20061105 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20061108 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20061115 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20061116 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20070118 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20050320 |
|
BERE | Be: lapsed |
Owner name: *NUTOOL INC. Effective date: 20071130 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20071119 |
|
NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 20080601 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20071130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20080601 Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20080603 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20080930 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20071119 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20071130 |