EP1191635A3 - Interconnect structure - Google Patents

Interconnect structure Download PDF

Info

Publication number
EP1191635A3
EP1191635A3 EP01122202A EP01122202A EP1191635A3 EP 1191635 A3 EP1191635 A3 EP 1191635A3 EP 01122202 A EP01122202 A EP 01122202A EP 01122202 A EP01122202 A EP 01122202A EP 1191635 A3 EP1191635 A3 EP 1191635A3
Authority
EP
European Patent Office
Prior art keywords
interconnects
planar
interconnect structure
circuit boards
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01122202A
Other languages
German (de)
French (fr)
Other versions
EP1191635B1 (en
EP1191635A2 (en
Inventor
Yoshinori Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to EP05027017A priority Critical patent/EP1643596A2/en
Publication of EP1191635A2 publication Critical patent/EP1191635A2/en
Publication of EP1191635A3 publication Critical patent/EP1191635A3/en
Application granted granted Critical
Publication of EP1191635B1 publication Critical patent/EP1191635B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10893—Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Abstract

An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.
EP01122202A 2000-09-19 2001-09-17 Interconnect structure Expired - Lifetime EP1191635B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05027017A EP1643596A2 (en) 2000-09-19 2001-09-17 Interconnect structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000282945A JP3826696B2 (en) 2000-09-19 2000-09-19 Wiring structure
JP2000282945 2000-09-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP05027017A Division EP1643596A2 (en) 2000-09-19 2001-09-17 Interconnect structure

Publications (3)

Publication Number Publication Date
EP1191635A2 EP1191635A2 (en) 2002-03-27
EP1191635A3 true EP1191635A3 (en) 2003-10-15
EP1191635B1 EP1191635B1 (en) 2009-01-14

Family

ID=18767370

Family Applications (2)

Application Number Title Priority Date Filing Date
EP05027017A Withdrawn EP1643596A2 (en) 2000-09-19 2001-09-17 Interconnect structure
EP01122202A Expired - Lifetime EP1191635B1 (en) 2000-09-19 2001-09-17 Interconnect structure

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP05027017A Withdrawn EP1643596A2 (en) 2000-09-19 2001-09-17 Interconnect structure

Country Status (4)

Country Link
US (1) US6641407B2 (en)
EP (2) EP1643596A2 (en)
JP (1) JP3826696B2 (en)
DE (1) DE60137387D1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7631242B2 (en) 2001-06-22 2009-12-08 Broadcom Corporation System, method and computer program product for mitigating burst noise in a communications system
DE10336634B3 (en) * 2003-08-08 2005-02-03 Siemens Ag Electronic device e.g. for motor vehicle controllers, has inner layer forming flexible connections between circuit boards of 2 assemblies and lead-through capacitors in common with other conducting tracks of first assembly
WO2005119765A2 (en) * 2004-06-02 2005-12-15 Tessera, Inc. Assembly including vertical and horizontal joined circuit panels
US7658621B2 (en) * 2008-04-17 2010-02-09 Hon Hai Precision Ind. Co., Ltd. Connector assembly having connecting device
AT506929B1 (en) * 2008-04-29 2012-10-15 Siemens Ag ARRANGEMENT OF TWO CIRCUITS
US20100254109A1 (en) * 2009-03-19 2010-10-07 Olympus Corporation Mount assembly and method for manufacturing mount assembly
DE102009017621B3 (en) * 2009-04-16 2010-08-19 Semikron Elektronik Gmbh & Co. Kg Device for reducing the noise emission in a power electronic system
JP5097791B2 (en) * 2010-04-05 2012-12-12 株式会社日立産機システム Power converter
GB2484742B (en) * 2010-10-22 2013-06-12 Murata Power Solutions Milton Keynes Ltd Electronic component for surface mounting
WO2013121732A1 (en) * 2012-02-15 2013-08-22 パナソニック株式会社 Wireless module
JP5946339B2 (en) * 2012-06-27 2016-07-06 双信電機株式会社 Noise filter
KR102034717B1 (en) 2013-02-07 2019-10-21 삼성전자주식회사 Substrate and terminals for power module and power module comprising the same
US9837380B2 (en) 2014-01-28 2017-12-05 Infineon Technologies Austria Ag Semiconductor device having multiple contact clips
US9468103B2 (en) * 2014-10-08 2016-10-11 Raytheon Company Interconnect transition apparatus
JP2016092024A (en) * 2014-10-29 2016-05-23 株式会社豊田自動織機 Electronic device
US9660333B2 (en) 2014-12-22 2017-05-23 Raytheon Company Radiator, solderless interconnect thereof and grounding element thereof
US9780458B2 (en) 2015-10-13 2017-10-03 Raytheon Company Methods and apparatus for antenna having dual polarized radiating elements with enhanced heat dissipation
US10361485B2 (en) 2017-08-04 2019-07-23 Raytheon Company Tripole current loop radiating element with integrated circularly polarized feed
US10923830B2 (en) * 2019-01-18 2021-02-16 Pc-Tel, Inc. Quick solder chip connector for massive multiple-input multiple-output antenna systems
TW202142517A (en) * 2020-05-12 2021-11-16 台灣愛司帝科技股份有限公司 Substrate combining structure, substrate combining system and substrate combining method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0372768A1 (en) * 1988-12-05 1990-06-13 The Whitaker Corporation Connector for mating two bus bars
FR2753310A1 (en) * 1996-09-12 1998-03-13 Gandois Jean Marie Skirting board trunking with integral electrical conductors
DE29805943U1 (en) * 1998-03-26 1998-06-10 Abb Daimler Benz Transp Low-induction railing of two multi-layer busbar arrangements for power converters
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
US20020025724A1 (en) * 1999-09-15 2002-02-28 Yakov Belopolsky Low inductance power connector and method of reducing inductance in an electrical connector

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5037311A (en) * 1989-05-05 1991-08-06 International Business Machines Corporation High density interconnect strip
GB9713849D0 (en) * 1997-06-30 1997-09-03 Amp Italia Capacitance coupled cross-talk suppressing communication connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0372768A1 (en) * 1988-12-05 1990-06-13 The Whitaker Corporation Connector for mating two bus bars
FR2753310A1 (en) * 1996-09-12 1998-03-13 Gandois Jean Marie Skirting board trunking with integral electrical conductors
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
DE29805943U1 (en) * 1998-03-26 1998-06-10 Abb Daimler Benz Transp Low-induction railing of two multi-layer busbar arrangements for power converters
US20020025724A1 (en) * 1999-09-15 2002-02-28 Yakov Belopolsky Low inductance power connector and method of reducing inductance in an electrical connector

Also Published As

Publication number Publication date
JP2002094209A (en) 2002-03-29
US6641407B2 (en) 2003-11-04
EP1191635B1 (en) 2009-01-14
EP1643596A2 (en) 2006-04-05
EP1191635A2 (en) 2002-03-27
DE60137387D1 (en) 2009-03-05
US20020037656A1 (en) 2002-03-28
JP3826696B2 (en) 2006-09-27

Similar Documents

Publication Publication Date Title
EP1191635A3 (en) Interconnect structure
EP1085788A3 (en) Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
EP1020915A3 (en) Semiconductor device
EP0921609A3 (en) Right angled HF coaxial connector
EP1170795A3 (en) Electronic component with side contacts and associated method of fabrication
EP0939455A3 (en) Low cross talk connector configuration
EP1180818A3 (en) Electronic control unit mounting structure
JP2000138433A5 (en)
EP0829930A3 (en) Surface mount connector with integrated power leads
EP1102332A3 (en) Photovoltaic panel and method of producing same
EP1517596A3 (en) High tollerance embedded capacitors
EP1487060A3 (en) Technique for interconnecting multilayer circuit boards
EP1427016A3 (en) Semiconductor device and circuit board mounted with the same
EP0751479A3 (en) Chip card
EP2040519A3 (en) Wired Circuit Board
WO2005119765A3 (en) Assembly including vertical and horizontal joined circuit panels
MY118419A (en) Robust interconnect structure
EP1180920A3 (en) Circuit board and method of manufacturing same
WO2002039483A2 (en) Single metal programmability in a customizable integrated circuit device
EP2549537A3 (en) Photo-detecting device
EP1465471A3 (en) Wiring board, method for manufacturing a wiring board and electronic equipment
JP2002261420A5 (en)
EP1098555A3 (en) Printed-wiring board
EP2461656A3 (en) Circuit board and connection substrate
EP1265358A3 (en) Laminated electronic component

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20010917

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RIC1 Information provided on ipc code assigned before grant

Ipc: 7H 05K 7/14 B

Ipc: 7H 05K 3/36 B

Ipc: 7H 01R 12/04 A

17Q First examination report despatched

Effective date: 20040504

AKX Designation fees paid

Designated state(s): DE FR GB

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60137387

Country of ref document: DE

Date of ref document: 20090305

Kind code of ref document: P

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20090916

Year of fee payment: 9

26N No opposition filed

Effective date: 20091015

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20090910

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20091012

Year of fee payment: 9

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20100917

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20110531

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60137387

Country of ref document: DE

Effective date: 20110401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110401

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100917