EP1389506A1 - Automatic metallographic polishing apparatus - Google Patents

Automatic metallographic polishing apparatus Download PDF

Info

Publication number
EP1389506A1
EP1389506A1 EP03354069A EP03354069A EP1389506A1 EP 1389506 A1 EP1389506 A1 EP 1389506A1 EP 03354069 A EP03354069 A EP 03354069A EP 03354069 A EP03354069 A EP 03354069A EP 1389506 A1 EP1389506 A1 EP 1389506A1
Authority
EP
European Patent Office
Prior art keywords
polishing
station
axis
rotation
polishing station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03354069A
Other languages
German (de)
French (fr)
Inventor
Lucien Grisel
Christophe Dalban
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Procedes Et Equipements Pour Les Sciences Et L'industrie
Original Assignee
Procedes Et Equipements Pour Les Sciences Et L'industrie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Procedes Et Equipements Pour Les Sciences Et L'industrie filed Critical Procedes Et Equipements Pour Les Sciences Et L'industrie
Publication of EP1389506A1 publication Critical patent/EP1389506A1/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/003—Accessories therefor

Definitions

  • the invention relates to a device for preparing samples.
  • metallographic with a polishing station with a support plate said polishing station being adjacent to a vertical magazine comprising several horizontal shelves, each supporting a tray intended to be placed on the tray support, the device also comprising a sample cleaning station, gripping and transport of a plate between the store and the polishing station, a door samples, intended to polish and transfer the samples between the polishing and cleaning by a rotational movement around a first axis of rotation, and means for controlling the sample holder and means of transport of the plateau.
  • Document US5800254 describes an automatic preparation machine metallographic samples, including polishing and cleaning, a set of shelves supporting several abrasive trays and a transfer mechanism.
  • the transfer mechanism allows you to select a trays, bring it to the polishing station and put it back in its place on all of the shelves and select a second one.
  • a brochure able to move horizontally and vertically, is intended for transport an abrasive plate from the set of shelves to a plate support from the polishing station. To transfer a tray from the shelf set to the tray support, the plate is positioned upstream of the assembly shelves and at a tray disposed in the set of shelves.
  • the device also includes a sample support head moving between the polishing and cleaning stations. However, the device does not allow carry out all the stages of sample preparation.
  • WO-A-9951398 describes a mechanical polishing apparatus and chemical of substrates.
  • the device has three polishing stations and a head polisher supporting the substrates and allowing the substrates to pass from one polishing station to another.
  • Cleaning stations are arranged between two neighboring polishing stations so as to rinse the substrates before that they don't go from one polishing station to another.
  • Such a device turns out bulky and impractical to carry out all of the preparation stages some samples.
  • the object of the invention is to provide a device for preparing samples metallographic automatic, compact and allowing to realize all the sample preparation steps.
  • the tray support of the polishing is rotated relative to a third axis of rotation
  • the pre-polishing station comprising a pre-polishing plate support rotated relative to a fourth axis of rotation.
  • the axis of symmetry of the store and the third and fourth axes of rotation are arranged in the same first vertical plane.
  • the cleaning station comprises an axis of symmetry, forming, with the first axis of rotation of the door samples, a second vertical plane perpendicular to the first vertical plane.
  • the device 1 for preparation of samples for metallographic examination includes a chassis 2 parallelepiped.
  • a first parallelepipedic compartment 3 consisting of four lateral faces and two upper 4 and lower 5 walls, is arranged inside the chassis 2.
  • the first compartment 3 also comprises means for gripping and transporting the trays 10 between the magazine 9 and the polishing station 8, as well as a sample holder 11.
  • the gripping and transport means 10 are arranged between the magazine 9 and the polishing station 8.
  • a first lateral face 12 of the first compartment 3 is constituted by windows 13, allowing an operator to access the interior of the first compartment 3 and follow, through the windows, the progress of the different sample preparation operations.
  • a second compartment 14, intended to receive control means 15, and a third compartment storage 16 are arranged one above the other, next to the first compartment 3.
  • the control means 15, as well as the means of gripping and transport 10 and the sample holder 11 make it possible to carry out an automatic sample preparation device.
  • Tray 9 for polishing plates is arranged against a second face lateral 17 of the first compartment 3, perpendicular to the first face lateral 12 (figure 2). It has an axis of symmetry s11 and several shelves 18 horizontal, the number of shelves preferably being between five and ten.
  • Each shelf 18 is intended to support a polishing plate 19 disc-shaped, allowing the samples to be polished on the polishing.
  • Each plate 19 has a first circular face (or surface) smooth and a second circular abrasive face (or surface), of a predetermined and different particle size for each tray 19.
  • the trays preferably have a diameter of 300mm and are arranged on the shelves of the magazine, so that the first smooth side of each tray is placed on the shelf and that the second abrasive face is free.
  • the plates 19 can be arranged, in the store, according to the particle size of their surface abrasive. For example, they can be arranged from bottom to top by increasing particle size.
  • the store 9 can include any type of known centering, so as to correctly replace the plates on the shelves.
  • the polishing station 8 is arranged next to the magazine 9 and is constituted by a tank 20 ( Figure 3), mounted on the bottom wall 5 of the first compartment 3, the tank 20 being preferably made of stainless steel and easily removable to clean it.
  • the bottom 21 of the tank 20 has an opening 22 in which is introduced a motor shaft 23 having an axis of rotation s1.
  • a circular plate support 24 (FIG. 2) is mounted on the motor shaft, perpendicular to the axis of rotation s1, so as to be animated by a rotational movement with respect to the axis of rotation s1, during the operation of polishing.
  • the tray support 24 is intended to receive and support one polishing plates 19.
  • the polishing station 8 also includes means for fixing a plate 19, of any known type.
  • the polishing station 8 also includes a supply arm 25 in abrasives and liquid thinners, retractable along an axis of rotation s2 so as to move it from a first fallback position to a second position placing it above the tray support 24 supporting a tray 19.
  • the second position of the supply arm allows the plate 19 used during the polishing operation, to always be wet with the liquid abrasive.
  • the bottom 21 of the tank 20 is preferably inclined ( Figure 3) and has an orifice outlet 26, so as to favor the flow of the liquid abrasive towards a container of any type, which is preferably disposed under the post of polishing 8.
  • the feed arm 25 is preferably connected to a plurality of pumps, each pump being connected to a reservoir 27 (or a bottle) comprising a abrasive or liquid thinner ( Figure 4).
  • the supply arm 25 may include a plurality of injection nozzles, each connected to a pump or else have a single injection nozzle, connected to all of the pumps.
  • the tanks 27 and the pumps are preferably arranged in a tank 28 itself disposed in the third storage compartment 16 of the chassis 2.
  • the supply of the abrasive supply arm is controlled by the means of control 15, which in particular determines the abrasive suitable for the plate 19 arranged on the tray support.
  • the gripping and transport means 10 of the plates 19 make it possible to automatically select and transfer a first tray 19, from the shelf 18, on which it is placed, to the tray support 24 of the polishing 8, on which the first plate 19 must be placed to achieve a first polishing operation ( Figures 2 and 5). Following the first operation polishing, the gripping and transport means transfer the first tray 19 placed on the tray support 24 to the shelf of the magazine 9 intended to bear it. They then choose and transport a second tray to the tray support 24 for a second polishing operation.
  • the grain size of the abrasive surface of the second plate is usually more smaller than that of the first tray. Several polishing operations can take place successively, using a tray of smaller grain size.
  • the gripping and transport means 10 comprise a gripper gripping, pneumatic, flat, and preferably constituted by three rods 29, the rods being arranged regularly around an axis of symmetry s3 (figure 2).
  • the free end of each rod 29 comprises a hook 30 making it possible to hold one of the plates 19 by its periphery, the clamp then gripping the plate by its upper part, that is to say by its second abrasive face.
  • the clamp formed by the three rods 29 is secured to an arm gripper 31, which is driven by a vertical translational movement.
  • the arm gripper 31 can move vertically between a first position low located substantially at the height of the tray support 24 and a second high position located above the highest shelf 18 of the store 9.
  • the lowest shelf in store 9 is preferably located at a height greater than or equal to the height of the polishing station 8 and in particular that of the tray support 24.
  • the gripping arm 31 is also driven in a rotational movement, according to an axis of rotation s4, so as to move between a first position of rotation and a second rotation position.
  • the first rotation position is located at store 9, between two shelves 18, so as to allow placing (or lifting) a tray 19 on (d ') a shelf 18, while the second position of rotation is located above the polishing station 8, so as to allow the installation (or lifting) of a plate 19 on the tray support 24.
  • the axis of symmetry s3 of the gripper coincides, preferably, with the axis of symmetry s11 of the magazine 9 ( Figures 1 and 2).
  • the gripper arm is integral with a first guide column 32, it even secured to the chassis 2 by a vertical support 33.
  • the translation of the arm gripper is provided by a motor 34 arranged in the upper part of the guide column, above the gripper arm and by a ball screw 35.
  • the rotation of the gripper arm is ensured by the rotation of the first guide column 32 on itself.
  • Two lower and upper pivots 36 and 37 integral with the vertical support 33 serve as support for the first column of vertical guide 32 and allow it to rotate around the axis of rotation s4 which is also the axis of symmetry of the first guide column 32.
  • the rotation of the first guide column 32 can be driven by any type means known per se.
  • the lower end of the first guide column 32 has a drive pulley 38 which can be connected to a motor by a drive belt.
  • the movements of translation and rotation of the gripping and transport means of trays, therefore the motors generating these movements are controlled by the control means 15.
  • the operating mode of the gripping and transport means 10 of trays allow for an automatic and compact device. Indeed, the transfer of trays being carried out in translational movements vertical and rotational, the gripping and transport means 10 can be brought closer to store 9 and polishing station 8.
  • the pre-polishing station 6 also called dressing station or grinding station, is arranged in the first compartment 3, against a third lateral face 39, opposite the second lateral face 17 of the first compartment 3 and perpendicular to the first lateral face 12.
  • the operation of pre-polishing allows to flatten the samples to be polished.
  • the pre-polishing station 6 is similar to the polishing station 8, comprising a tank in which is arranged a pre-polishing plate support 40 whose rotation around a axis of rotation s5 is ensured by a motor shaft.
  • the pre-polishing station 6 is preferably arranged so that the three axes s11, s1 and s5, which are respectively the axis of symmetry of the magazine 9, the axis of rotation of the plate support 24 of the polishing station 8 and the axis of rotation of the support pre-polishing plate 40 of the pre-polishing station 6, are preferably arranged in the same vertical foreground.
  • the first vertical section perpendicularly the bottom wall 5 of the first compartment 3 according to a right s6 (figure 2).
  • the pre-polishing station 6 can also be equipped with a lapidary wheel 280 mm or a magnetic system allowing the use of trays diamond or composite. It may include a straightening arm 41, used in combination with a lapidary wheel. After each use of the grinding wheel, the diamond dressing is done automatically.
  • the tank is preferably covered by a cover, so as to avoid the projection of liquid abrasive.
  • the cleaning station 7 preferably comprises a cylindrical tank 42 of cleaning with an axis of symmetry s7, two pressurized inlets of detergent and a water supply for rinsing the samples. He is willing between the polishing station 8 and the pre-polishing station 6, so that the axis of symmetry s7 is parallel to the first vertical plane formed by the axes s11, s1 and s5 and offset towards the first lateral face 12.
  • a sample holder 11 is arranged between the pre-polishing station 3 and the polishing station 8. It is intended to support and polish several samples, to move from one position to another by a movement of rotation around a axis of rotation s8. Rotation movement allows samples to be placed on the plate 19 of the polishing station 8, or in the cleaning tank 42 of the cleaning station 7 or on the plate of the pre-polishing station 6, so polishing, cleaning or grinding them depending on the operation to be performed.
  • the axis of rotation s8 and the axis of symmetry s7 of the cleaning tank preferably forms a second vertical plane, preferably perpendicular to the first vertical plane. The second vertical plane intersects the bottom wall 5 of the first compartment 3 along a straight line s9 ( Figure 2).
  • the sample holder 11 includes an element support 43 vertical and integral with the first compartment 3 of the device, a second vertical guide column 44 and mounted on the support element 43.
  • the sample holder 11 also includes a support box 45 mounted on the guide column and a polishing head 46 secured to the support housing 45, so that the assembly formed by the polishing head 46 and the housing support 45 can move vertically.
  • the polishing head 46 is extends into a plate 47 on which samples to be prepared are mounted, preferably six.
  • the samples can be coated or uncoated, and have generally a diameter between 20 and 50mm.
  • the second guide column 44 can be animated by a movement of rotation about its axis of symmetry which is the axis of rotation s8 of the door samples 11, so as to move the samples supported by the stage 47 from one station to another by a rotation movement of the second column guide 44 around the axis of rotation s8.
  • the rotational movement can be carried out by any type of known means.
  • the rotation of the second guide column 44 is provided by a rotation motor 51 of the guide column, arranged at the lower end of the second column of guide 44.
  • the polishing head 46 is intended to move, by a movement of vertical translation of the support case 45, the samples between a height lowered and height raised.
  • the lowered height is equivalent to placing the samples on a plate 19 of the polishing station 8 or on a plate of the pre-polishing station 6, while the raised position corresponds to a predetermined height does not interfere with the transfer of samples from one station to another.
  • the translational movement can be achieved by any type of means known.
  • a hydraulic cylinder 48 is mounted on the upper part of the second guide column 44, so as to ensure the translation vertical of the support box 45.
  • the polishing head 46 is also driven in a rotational movement around its axis of symmetry s10, so that the samples are rotated, preferably opposite to that of the table top polishing station 8 or pre-polishing station 6, when the samples are arranged on the polishing plate to be polished.
  • the movement of rotation of the polishing head 46 and of the samples makes the operation of more efficient polishing or pre-polishing, when samples are in contact with a plate 19 of the polishing station 8 or a plate of the polishing station pre-polishing 6.
  • the rotation of the polishing head is ensured by a motor for rotation of the polishing head 49 disposed inside the support box 45, known type of transmission means connecting the shaft from the motor for rotation of the polishing head 49 to the polishing head 46.
  • the speed of rotation of the polishing head is preferably variable and between 20 revolutions per minute and 100 revolutions per minute.
  • the plate 47 is integral with the polishing head 46, thanks to a central jack 50 disposed between the free end of the polishing head 46 and the plate 47.
  • the jack central exerts central pressure on the stage and on the samples.
  • the platinum preferably has a diameter of about 160mm, allowing to polish 3 or 6 samples from 20mm to 50mm in diameter.
  • Each sample can also receive intermediate pressure through cylinders 51 arranged above each sample, between the polishing head 46 and the plate 47, this allows to polish from 1 to 6 samples from 20mm to 50mm in diameter.
  • the translational and rotational movements of the sample holder 11 and of the gripping and transport means 10 of the plates 19 are controlled by automatically by the control means 15.
  • the means of command 15 order the sample holder to stand above the station cleaning 7 or performing a cleaning operation, during the transfer trays 19 between the magazine 9 and the tray support 24 of the polishing 8. They also allow switching from a first pressure mode exerting central pressure through the central cylinder 50 on the plate 47 to a second pressure mode exerting pressure on each sample via cylinders 51.
  • the control means 15 comprise a data processing unit 52, comprising an input terminal connected to a keypad 53 and 4 output terminals.
  • the keyboard 53 allows a operator supplying the processing unit 52 with the parameters of the sample preparation.
  • Three of the output terminals control respectively the gripping and transport means 10 of trays, the sample holder 11 and the pumps connected to the tanks or flasks 27 in liquid abrasives of the polishing station 8.
  • the fourth output terminal is connected to a screen 54 which makes it possible to view all of the parameters and the procedure for the sample preparation method.
  • the keyboard 53 and the screen 54 are preferably arranged in the second compartment 14, while that the processing unit 52 is placed on a fourth lateral face 55 of the first compartment 3 (FIG. 2), opposite the first lateral face 12.
  • the means of command allow all preparation operations to be carried out samples, i.e. pre-polishing, polishing according to different types grain size and sample cleaning.
  • the parameters of order are, for example, the nature of the samples to be prepared, the choice between the first and second pressure modes to be applied on the plate 47.
  • the control means 15 include preparation methods of predetermined samples according to the control parameters. So for a given material, the control means determine the operations pre-polishing to be performed, the number of polishing operations required, the type of plates 19 to be used, the duration of each polishing step, the type liquid abrasive to use ...
  • the control means 15 also make it possible to control the wear of the trays 19 and the amount of abrasives or liquid thinners remaining in the tanks or flasks 27 ( Figure 8).
  • the control parameters are, for example, for the wear of the plates, the position of the plates 19, their duration of life and the date on which the abrasive surface of the plates 19 was changed.
  • the processing unit calculating the time of use of this tray from this date, alerts the user by a message on the screen 54, of the wear of the plate when it arrives at a time of use greater than a time predetermined.
  • the processing unit calculates, during the preparation operations, the quantity of liquid abrasive consumed, depending on the quantity introduced into the bottle 27 and sends a alert message on the screen when a bottle is almost empty.
  • sample preparation device automatically all sample preparation operations before their examination, which allows for continuous preparations, 24 24 hours a day, for example or repetitive operations.

Abstract

The metallographic sample preparation device comprises a polishing post (8) located next to a vertical magazine (9) supporting polishing plates. Gripping and transport means (10) enable the plate to be transferred between the magazine and the polishing post. There is a pre-polishing post (6) and a cleaning post (7) located between the polishing and pre-polishing posts. A samples door (11) enables the transfer of the samples between the different posts by a rotational movement around a first rotational axis (s8). Control means engage the gripping means for transferring the plates between the magazine and the polishing post during which the samples door is located above the cleaning post.

Description

Domaine technique de l'inventionTechnical field of the invention

L'invention concerne un dispositif de préparation d'échantillons métallographiques comportant un poste de polissage comportant un support de plateau, ledit poste de polissage étant adjacent à un magasin vertical comportant plusieurs étagères horizontales, supportant chacune un plateau destiné à être posé sur le support de plateau, le dispositif comportant également un poste de nettoyage des échantillons, des moyens de préhension et de transport d'un plateau entre le magasin et le poste de polissage, un porte échantillons, destiné à polir et à transférer les échantillons entre les postes de polissage et de nettoyage par un mouvement de rotation autour d'un premier axe de rotation, et des moyens de commande du porte échantillons et des moyens de transport du plateau.The invention relates to a device for preparing samples. metallographic with a polishing station with a support plate, said polishing station being adjacent to a vertical magazine comprising several horizontal shelves, each supporting a tray intended to be placed on the tray support, the device also comprising a sample cleaning station, gripping and transport of a plate between the store and the polishing station, a door samples, intended to polish and transfer the samples between the polishing and cleaning by a rotational movement around a first axis of rotation, and means for controlling the sample holder and means of transport of the plateau.

État de la techniqueState of the art

Le document US5800254 décrit une machine automatique de préparation d'échantillons métallographiques, comportant des postes de polissage et de nettoyage, un ensemble d'étagères supportant plusieurs plateaux abrasifs et un mécanisme de transfert. Le mécanisme de transfert permet de sélectionner un des plateaux, de l'apporter au poste de polissage puis le remettre à sa place sur l'ensemble des étagères et d'en sélectionner un second. Ainsi, une plaquette, capable de se déplacer horizontalement et verticalement, est destinée à transporter un plateau abrasif de l'ensemble d'étagères à un support de plateau du poste de polissage. Pour transférer un plateau de l'ensemble d'étagères vers le support de plateau, la plaquette est positionnée, en amont de l'ensemble d'étagères et au niveau d'un plateau disposé dans l'ensemble d'étagères. Elle soulève le plateau par sa partie inférieure et elle le porte dans un mouvement de translation horizontale, jusqu'au poste de polissage disposé en aval de l'ensemble d'étagères puis elle le dépose sur le support de plateau. Le dispositif comporte également une tête de support des échantillons se déplaçant entre les postes de polissage et de nettoyage. Le dispositif ne permet cependant pas de réaliser l'ensemble des étapes de préparation des échantillons.Document US5800254 describes an automatic preparation machine metallographic samples, including polishing and cleaning, a set of shelves supporting several abrasive trays and a transfer mechanism. The transfer mechanism allows you to select a trays, bring it to the polishing station and put it back in its place on all of the shelves and select a second one. So a brochure, able to move horizontally and vertically, is intended for transport an abrasive plate from the set of shelves to a plate support from the polishing station. To transfer a tray from the shelf set to the tray support, the plate is positioned upstream of the assembly shelves and at a tray disposed in the set of shelves. She lift the tray by its lower part and carry it in a movement of horizontal translation, up to the polishing station located downstream of the set of shelves and then places it on the shelf support. The device also includes a sample support head moving between the polishing and cleaning stations. However, the device does not allow carry out all the stages of sample preparation.

Le document WO-A-9951398 décrit un appareil de polissage mécanique et chimique de substrats. L'appareil comporte trois postes de polissage et une tête de polissage supportant les substrats et permettant de faire passer les substrats d'un poste de polissage à un autre. Des stations de nettoyage sont disposées entre deux postes de polissage voisins de manière à rincer les substrats avant qu'ils ne passent d'une poste de polissage à un autre. Un tel appareil s'avère encombrant et peu pratique pour réaliser l'ensemble des étapes de préparations des échantillons.WO-A-9951398 describes a mechanical polishing apparatus and chemical of substrates. The device has three polishing stations and a head polisher supporting the substrates and allowing the substrates to pass from one polishing station to another. Cleaning stations are arranged between two neighboring polishing stations so as to rinse the substrates before that they don't go from one polishing station to another. Such a device turns out bulky and impractical to carry out all of the preparation stages some samples.

Objet de l'inventionSubject of the invention

L'invention a pour but de réaliser un dispositif de préparation d'échantillons métallographiques automatique, compact et permettant de réaliser toutes les étapes de préparation d'échantillons.The object of the invention is to provide a device for preparing samples metallographic automatic, compact and allowing to realize all the sample preparation steps.

Selon l'invention, ce but est atteint par les revendications annexées.According to the invention, this object is achieved by the appended claims.

Plus particulièrement, le but de l'invention est atteint par le fait que :

  • le poste de nettoyage est disposé entre le poste de polissage et un poste de pré-polissage, de manière à ce que le porte échantillons puisse transférer les échantillons entre le poste de polissage, le poste de nettoyage et le poste de pré-polissage,
  • les moyens de préhension et de transport du plateau comportent une pince de préhension, destinée à saisir le plateau par sa partie supérieure et solidaire d'un bras préhenseur animé d'un mouvement de translation verticale et d'un mouvement de rotation autour d'un second axe de rotation, de manière à déplacer le plateau entre une étagère du magasin et le poste de polissage,
  • les moyens de commande (15) coopèrent avec les moyens de préhension et de transport (15), pour transférer des plateaux (19) entre le magasin (9) et le poste de polissage (8), pendant que le porte échantillons (11) est disposé au-dessus du poste de nettoyage (7).
More particularly, the object of the invention is achieved by the fact that:
  • the cleaning station is arranged between the polishing station and a pre-polishing station, so that the sample holder can transfer the samples between the polishing station, the cleaning station and the pre-polishing station,
  • the means for gripping and transporting the tray comprise a gripper, intended to grip the tray by its upper part and secured to a gripper arm driven by a vertical translational movement and a rotational movement around a second axis of rotation, so as to move the plate between a store shelf and the polishing station,
  • the control means (15) cooperate with the gripping and transport means (15), to transfer trays (19) between the magazine (9) and the polishing station (8), while the sample holder (11) is arranged above the cleaning station (7).

Selon un développement de l'invention, le support de plateau du poste de polissage est animé d'un mouvement de rotation par rapport à un troisième axe de rotation, le poste de pré-polissage comportant un support de plateau de pré-polissage animé d'un mouvement de rotation par rapport à un quatrième axe de rotation.According to a development of the invention, the tray support of the polishing is rotated relative to a third axis of rotation, the pre-polishing station comprising a pre-polishing plate support rotated relative to a fourth axis of rotation.

Selon un mode de réalisation préférentiel, l'axe de symétrie du magasin et les troisième et quatrième axes de rotation sont disposés dans un même premier plan vertical.According to a preferred embodiment, the axis of symmetry of the store and the third and fourth axes of rotation are arranged in the same first vertical plane.

Selon une autre caractéristique de l'invention, le poste de nettoyage comporte un axe de symétrie, formant, avec le premier axe de rotation du porte échantillons, un second plan vertical perpendiculaire au premier plan vertical. According to another characteristic of the invention, the cleaning station comprises an axis of symmetry, forming, with the first axis of rotation of the door samples, a second vertical plane perpendicular to the first vertical plane.

Description sommaire des dessinsBrief description of the drawings

D'autres avantages et caractéristiques ressortiront plus clairement de la description qui va suivre de modes particuliers de réalisation de l'invention donnés à titre d'exemples non limitatifs et représentés aux dessins annexés, dans lesquels ;

  • La figure 1 est une représentation schématique, vue de face, d'un dispositif de préparation d'échantillons selon l'invention.
  • La figure 2 est une vue de dessus du magasin et des postes du dispositif selon la figure 1.
  • La figure 3 est une vue en coupe partielle d'un poste de polissage d'un dispositif selon l'invention.
  • La figure 4 représente un distributeur d'abrasifs et de diluant d'un dispositif selon l'invention.
  • La figure 5 est une vue de face de moyens de préhension et de transport d'un plateau du dispositif selon la figure 2.
  • La figure 6 est une vue de face, en coupe partielle, d'un porte échantillons du dispositif selon la figure 2.
  • La figure 7 représente, sous forme de schéma blocs, des moyens de commande d'un dispositif selon l'invention.
  • La figure 8 représente des moyens de contrôle d'un dispositif selon l'invention.
    • Other advantages and characteristics will emerge more clearly from the description which follows of particular embodiments of the invention given by way of nonlimiting examples and represented in the appended drawings, in which;
  • Figure 1 is a schematic representation, front view, of a sample preparation device according to the invention.
  • FIG. 2 is a top view of the store and of the stations of the device according to FIG. 1.
  • Figure 3 is a partial sectional view of a polishing station of a device according to the invention.
  • Figure 4 shows a dispenser of abrasives and diluent of a device according to the invention.
  • FIG. 5 is a front view of means for gripping and transporting a tray of the device according to FIG. 2.
  • FIG. 6 is a front view, in partial section, of a sample holder of the device according to FIG. 2.
  • FIG. 7 represents, in the form of a block diagram, means for controlling a device according to the invention.
  • FIG. 8 represents means of controlling a device according to the invention.

    • Description de modes particuliers de réalisation.Description of particular embodiments.

    Comme représenté sur les figures 1 et 2, le dispositif 1 de préparation d'échantillons destinés à subir un examen métallographique, comporte un châssis 2 parallélépipédique. Un premier compartiment 3 parallélépipédique, constitué par quatre faces latérales et deux parois supérieure 4 et inférieure 5, est disposé à l'intérieur du châssis 2. Un poste de pré-polissage 6, un poste de nettoyage 7, un poste de polissage 8 et un magasin 9 vertical, destiné à supporter des plateaux de polissage, sont montés à l'intérieur du premier compartiment 3, sur la paroi inférieure 5 (figure 2). Le premier compartiment 3 comporte également des moyens de préhension et de transport 10 des plateaux entre le magasin 9 et le poste de polissage 8, ainsi qu'un porte échantillons 11. Les moyens de préhension et de transport 10 sont disposés entre le magasin 9 et le poste de polissage 8.As shown in Figures 1 and 2, the device 1 for preparation of samples for metallographic examination, includes a chassis 2 parallelepiped. A first parallelepipedic compartment 3, consisting of four lateral faces and two upper 4 and lower 5 walls, is arranged inside the chassis 2. A pre-polishing station 6, a cleaning 7, a polishing station 8 and a vertical magazine 9, intended for support polishing pads, are mounted inside the first compartment 3, on the lower wall 5 (Figure 2). The first compartment 3 also comprises means for gripping and transporting the trays 10 between the magazine 9 and the polishing station 8, as well as a sample holder 11. The gripping and transport means 10 are arranged between the magazine 9 and the polishing station 8.

    Une première face latérale 12 du premier compartiment 3 est constituée par des vitres 13, permettant à un opérateur d'accéder à l'intérieur du premier compartiment 3 et de suivre, à travers les vitres, le déroulement des différentes opérations de préparation des échantillons. Un second compartiment 14, destiné à recevoir des moyens de commande 15, et un troisième compartiment de stockage 16 sont disposés l'un au-dessus de l'autre, à côté du premier compartiment 3. Les moyens de commande 15, ainsi que les moyens de préhension et de transport 10 et le porte échantillons 11 permettent de réaliser un dispositif de préparation d'échantillons automatique.A first lateral face 12 of the first compartment 3 is constituted by windows 13, allowing an operator to access the interior of the first compartment 3 and follow, through the windows, the progress of the different sample preparation operations. A second compartment 14, intended to receive control means 15, and a third compartment storage 16 are arranged one above the other, next to the first compartment 3. The control means 15, as well as the means of gripping and transport 10 and the sample holder 11 make it possible to carry out an automatic sample preparation device.

    Le magasin 9 pour plateaux de polissage est disposé contre une seconde face latérale 17 du premier compartiment 3, perpendiculaire à la première face latérale 12 (figure 2). Il comporte un axe de symétrie s11 et plusieurs étagères 18 horizontales, le nombre d'étagères étant, de préférence, compris entre cinq et dix. Chaque étagère 18 est destinée à supporter un plateau de polissage 19 en forme de disque, permettant de polir les échantillons sur le poste de polissage. Chaque plateau 19 comporte une première face circulaire (ou surface) lisse et une seconde face (ou surface) circulaire abrasive, d'une granulométrie prédéterminée et différente pour chaque plateau 19. Les plateaux ont, de préférence, un diamètre de 300mm et sont disposés sur les étagères du magasin, de sorte que la première face lisse de chaque plateau soit posée sur l'étagère et que la seconde face abrasive soit libre. Les plateaux 19 peuvent être disposés, dans le magasin, en fonction de la granulométrie de leur surface abrasive. Par exemple, ils peuvent être disposés de bas en haut par granulométrie croissante. Le magasin 9 peut comporter tout type de système de centrage connu, de manière à replacer correctement les plateaux sur les étagères.Tray 9 for polishing plates is arranged against a second face lateral 17 of the first compartment 3, perpendicular to the first face lateral 12 (figure 2). It has an axis of symmetry s11 and several shelves 18 horizontal, the number of shelves preferably being between five and ten. Each shelf 18 is intended to support a polishing plate 19 disc-shaped, allowing the samples to be polished on the polishing. Each plate 19 has a first circular face (or surface) smooth and a second circular abrasive face (or surface), of a predetermined and different particle size for each tray 19. The trays preferably have a diameter of 300mm and are arranged on the shelves of the magazine, so that the first smooth side of each tray is placed on the shelf and that the second abrasive face is free. The plates 19 can be arranged, in the store, according to the particle size of their surface abrasive. For example, they can be arranged from bottom to top by increasing particle size. The store 9 can include any type of known centering, so as to correctly replace the plates on the shelves.

    Le poste de polissage 8 est disposé à côté du magasin 9 et est constitué par une cuve 20 (figure 3), montée sur la paroi inférieure 5 du premier compartiment 3, la cuve 20 étant, de préférence en acier inoxydable et facilement démontable pour la nettoyer. Le fond 21 de la cuve 20 comporte une ouverture 22 dans laquelle est introduit un arbre de moteur 23 comportant un axe de rotation s1. Un support de plateau circulaire 24 (figure 2), est monté sur l'arbre du moteur, perpendiculairement à l'axe de rotation s1, de manière à être animé d'un mouvement de rotation par rapport à l'axe de rotation s1, lors de l'opération de polissage. Le support de plateau 24 est destiné à recevoir et à supporter l'un des plateaux de polissage 19. Le poste de polissage 8 comporte également des moyens de fixation d'un plateau 19, de tout type connu.The polishing station 8 is arranged next to the magazine 9 and is constituted by a tank 20 (Figure 3), mounted on the bottom wall 5 of the first compartment 3, the tank 20 being preferably made of stainless steel and easily removable to clean it. The bottom 21 of the tank 20 has an opening 22 in which is introduced a motor shaft 23 having an axis of rotation s1. A circular plate support 24 (FIG. 2) is mounted on the motor shaft, perpendicular to the axis of rotation s1, so as to be animated by a rotational movement with respect to the axis of rotation s1, during the operation of polishing. The tray support 24 is intended to receive and support one polishing plates 19. The polishing station 8 also includes means for fixing a plate 19, of any known type.

    Sur la figure 2, le poste de polissage 8 comporte également un bras d'amenée 25 en abrasifs et en diluants liquides, escamotable selon un axe de rotation s2 de manière à le déplacer d'une première position de repli à une seconde position le disposant au-dessus du support de plateau 24 supportant un plateau 19. La seconde position du bras d'amenée permet au plateau 19 utilisé lors de l'opération de polissage, d'être toujours mouillé par l'abrasif liquide. Le fond 21 de la cuve 20 est, de préférence, incliné (figure 3) et comporte un orifice de sortie 26, de manière à favoriser l'écoulement de l'abrasif liquide vers un contenant de tout type, qui est, de préférence, disposé sous le poste de polissage 8.In FIG. 2, the polishing station 8 also includes a supply arm 25 in abrasives and liquid thinners, retractable along an axis of rotation s2 so as to move it from a first fallback position to a second position placing it above the tray support 24 supporting a tray 19. The second position of the supply arm allows the plate 19 used during the polishing operation, to always be wet with the liquid abrasive. The bottom 21 of the tank 20 is preferably inclined (Figure 3) and has an orifice outlet 26, so as to favor the flow of the liquid abrasive towards a container of any type, which is preferably disposed under the post of polishing 8.

    Le bras d'amenée 25 est, de préférence, connecté à une pluralité de pompes, chaque pompe étant connectée à un réservoir 27 (ou un flacon) comportant un abrasif ou un diluant liquide (figure 4). Le bras d'amenée 25 peut comporter une pluralité de buses d'injection, chacune connectée à une pompe ou bien comporter une seule buse d'injection, connectée à l'ensemble des pompes. Les réservoirs 27 et les pompes sont, de préférence, disposés dans un bac 28 lui-même disposé dans le troisième compartiment de stockage 16 du châssis 2. L'alimentation du bras d'amenée en abrasif est commandée par les moyens de commande 15, qui détermine notamment l'abrasif adapté au plateau 19 disposé sur le support de plateau.The feed arm 25 is preferably connected to a plurality of pumps, each pump being connected to a reservoir 27 (or a bottle) comprising a abrasive or liquid thinner (Figure 4). The supply arm 25 may include a plurality of injection nozzles, each connected to a pump or else have a single injection nozzle, connected to all of the pumps. The tanks 27 and the pumps are preferably arranged in a tank 28 itself disposed in the third storage compartment 16 of the chassis 2. The supply of the abrasive supply arm is controlled by the means of control 15, which in particular determines the abrasive suitable for the plate 19 arranged on the tray support.

    Les moyens de préhension et de transport 10 des plateaux 19 permettent de sélectionner et de transférer automatiquement un premier plateau 19, de l'étagère 18, sur laquelle il est posé, au support de plateau 24 du poste de polissage 8, sur lequel le premier plateau 19 doit être posé pour réaliser une première opération de polissage (figures 2 et 5). Suite à la première opération de polissage, les moyens de préhension et de transport transfèrent le premier plateau 19 placé sur le support de plateau 24 à l'étagère du magasin 9 destinée à le supporter. Ils choisissent ensuite et transportent un second plateau vers le support de plateau 24 pour une seconde opération de polissage. La granulométrie de la surface abrasive du second plateau est usuellement plus petite que celle du premier plateau. Plusieurs opérations de polissage peuvent avoir lieu successivement, en utilisant à chaque opération un plateau de granulométrie plus petite. The gripping and transport means 10 of the plates 19 make it possible to automatically select and transfer a first tray 19, from the shelf 18, on which it is placed, to the tray support 24 of the polishing 8, on which the first plate 19 must be placed to achieve a first polishing operation (Figures 2 and 5). Following the first operation polishing, the gripping and transport means transfer the first tray 19 placed on the tray support 24 to the shelf of the magazine 9 intended to bear it. They then choose and transport a second tray to the tray support 24 for a second polishing operation. The grain size of the abrasive surface of the second plate is usually more smaller than that of the first tray. Several polishing operations can take place successively, using a tray of smaller grain size.

    Les moyens de préhension et de transport 10 comportent une pince de préhension, pneumatique, plate, et de préférence constituée par trois tiges 29, les tiges étant disposées régulièrement autour d'un axe de symétrie s3 (figure 2). L'extrémité libre de chaque tige 29 comporte un crochet 30 permettant de maintenir un des plateaux 19 par sa périphérie, la pince saisissant alors le plateau par sa partie supérieure, c'est-à-dire par sa seconde face abrasive. Sur la figure 5, la pince formée par les trois tiges 29 est solidaire d'un bras préhenseur 31, qui est animé d'un mouvement de translation verticale. Le bras préhenseur 31 peut se déplacer verticalement entre une première position basse située sensiblement à la hauteur du support de plateau 24 et une seconde position haute se situant au-dessus de l'étagère 18 la plus élevée du magasin 9. L'étagère la plus basse du magasin 9 est, de préférence, située à une hauteur supérieure ou égale à la hauteur du poste de polissage 8 et notamment de celle du support de plateau 24.The gripping and transport means 10 comprise a gripper gripping, pneumatic, flat, and preferably constituted by three rods 29, the rods being arranged regularly around an axis of symmetry s3 (figure 2). The free end of each rod 29 comprises a hook 30 making it possible to hold one of the plates 19 by its periphery, the clamp then gripping the plate by its upper part, that is to say by its second abrasive face. Sure Figure 5, the clamp formed by the three rods 29 is secured to an arm gripper 31, which is driven by a vertical translational movement. The arm gripper 31 can move vertically between a first position low located substantially at the height of the tray support 24 and a second high position located above the highest shelf 18 of the store 9. The lowest shelf in store 9 is preferably located at a height greater than or equal to the height of the polishing station 8 and in particular that of the tray support 24.

    Le bras préhenseur 31 est également animé d'un mouvement de rotation, selon un axe de rotation s4, de manière à se déplacer entre une première position de rotation et une seconde position de rotation. La première position de rotation se situe au niveau du magasin 9, entre deux étagères 18, de manière à permettre de poser (ou soulever) un plateau 19 sur (d') une étagère 18, tandis que la seconde position de rotation se situe au-dessus du poste de polissage 8, de manière à permettre la pose (ou le soulèvement) d'un plateau 19 sur le (du) support de plateau 24. Lorsque le bras préhenseur 31 est disposé à la première position de rotation, l'axe de symétrie s3 de la pince de préhension coïncide, de préférence, avec l'axe de symétrie s11 du magasin 9 (figures 1 et 2).The gripping arm 31 is also driven in a rotational movement, according to an axis of rotation s4, so as to move between a first position of rotation and a second rotation position. The first rotation position is located at store 9, between two shelves 18, so as to allow placing (or lifting) a tray 19 on (d ') a shelf 18, while the second position of rotation is located above the polishing station 8, so as to allow the installation (or lifting) of a plate 19 on the tray support 24. When the gripper arm 31 is disposed at the first rotational position, the axis of symmetry s3 of the gripper coincides, preferably, with the axis of symmetry s11 of the magazine 9 (Figures 1 and 2).

    Le bras préhenseur est solidaire d'une première colonne de guidage 32, elle même solidarisée au châssis 2 par un support vertical 33. La translation du bras préhenseur est assurée par un moteur 34 disposé dans la partie supérieure de la colonne de guidage, au-dessus du bras préhenseur et par une vis à billes 35. La rotation du bras préhenseur est assurée par la rotation de la première colonne de guidage 32 sur elle-même. Deux pivots inférieur et supérieur 36 et 37 solidaires du support vertical 33 servent de support à la première colonne de guidage verticale 32 et lui permettent de tourner autour de l'axe de rotation s4 qui est également l'axe de symétrie de la première colonne de guidage 32. La rotation de la première colonne de guidage 32 peut être entraínée par tout type de moyens connus en soi. Sur la figure 5, l'extrémité inférieure de la première colonne de guidage 32 comporte une poulie d'entraínement 38 qui peut être réliée à un moteur par une courroie d'entraínement. Les mouvements de translation et de rotation des moyens de préhension et de transport de plateaux, donc les moteurs engendrant ces mouvements, sont commandés par les moyens de commande 15.The gripper arm is integral with a first guide column 32, it even secured to the chassis 2 by a vertical support 33. The translation of the arm gripper is provided by a motor 34 arranged in the upper part of the guide column, above the gripper arm and by a ball screw 35. The rotation of the gripper arm is ensured by the rotation of the first guide column 32 on itself. Two lower and upper pivots 36 and 37 integral with the vertical support 33 serve as support for the first column of vertical guide 32 and allow it to rotate around the axis of rotation s4 which is also the axis of symmetry of the first guide column 32. The rotation of the first guide column 32 can be driven by any type means known per se. In Figure 5, the lower end of the first guide column 32 has a drive pulley 38 which can be connected to a motor by a drive belt. The movements of translation and rotation of the gripping and transport means of trays, therefore the motors generating these movements are controlled by the control means 15.

    Le mode de fonctionnement des moyens de préhension et de transport 10 de plateaux permet de réaliser un dispositif automatique et compact. En effet, le transfert de plateaux étant réalisé selon des mouvements de translation verticale et de rotation, les moyens de préhension et de transport 10 peuvent être rapprochés au plus près du magasin 9 et du poste de polissage 8.The operating mode of the gripping and transport means 10 of trays allow for an automatic and compact device. Indeed, the transfer of trays being carried out in translational movements vertical and rotational, the gripping and transport means 10 can be brought closer to store 9 and polishing station 8.

    Sur la figure 2, le poste de pré-polissage 6, aussi appelé poste de dressage ou poste de meulage, est disposé dans le premier compartiment 3, contre une troisième face latérale 39, opposée à la seconde face latérale 17 du premier compartiment 3 et perpendiculaire à la première face latérale 12. L'opération de pré-polissage permet d'aplanir les échantillons à polir. Le poste de pré-polissage 6 est similaire au poste de polissage 8, comportant une cuve dans laquelle est disposé un support de plateau de pré-polissage 40 dont la rotation autour d'un axe de rotation s5 est assurée par un arbre de moteur. Le poste de pré-polissage 6 est, de préférence, disposé de sorte que les trois axes s11, s1 et s5, qui sont respectivement l'axe de symétrie du magasin 9, l'axe de rotation du support de plateau 24 du poste de polissage 8 et l'axe de rotation du support de plateau de pré-polissage 40 du poste de pré-polissage 6, sont, de préférence, disposés dans un même premier plan vertical. Le premier plan vertical coupe perpendiculairement la paroi inférieure 5 du premier compartiment 3 selon une droite s6 (figure 2).In FIG. 2, the pre-polishing station 6, also called dressing station or grinding station, is arranged in the first compartment 3, against a third lateral face 39, opposite the second lateral face 17 of the first compartment 3 and perpendicular to the first lateral face 12. The operation of pre-polishing allows to flatten the samples to be polished. The pre-polishing station 6 is similar to the polishing station 8, comprising a tank in which is arranged a pre-polishing plate support 40 whose rotation around a axis of rotation s5 is ensured by a motor shaft. The pre-polishing station 6 is preferably arranged so that the three axes s11, s1 and s5, which are respectively the axis of symmetry of the magazine 9, the axis of rotation of the plate support 24 of the polishing station 8 and the axis of rotation of the support pre-polishing plate 40 of the pre-polishing station 6, are preferably arranged in the same vertical foreground. The first vertical section perpendicularly the bottom wall 5 of the first compartment 3 according to a right s6 (figure 2).

    Le poste de pré-polissage 6 peut également être équipé d'une meule lapidaire de 280 mm ou d'un système magnétique permettant d'utiliser des plateaux diamantés ou composites. Il peut comporter un bras de dressage 41, utilisé en combinaison avec une meule lapidaire. Après chaque utilisation de la meule, le diamantage se fait automatiquement. La cuve est de préférence recouverte par un couvercle, de manière à éviter la projection d'abrasif liquide.The pre-polishing station 6 can also be equipped with a lapidary wheel 280 mm or a magnetic system allowing the use of trays diamond or composite. It may include a straightening arm 41, used in combination with a lapidary wheel. After each use of the grinding wheel, the diamond dressing is done automatically. The tank is preferably covered by a cover, so as to avoid the projection of liquid abrasive.

    Le poste de nettoyage 7 comporte, de préférence, une cuve 42 cylindrique de nettoyage ayant un axe de symétrie s7, deux arrivées sous pression de détergent et une arrivée d'eau pour le rinçage des échantillons. Il est disposé entre le poste de polissage 8 et le poste de pré-polissage 6, de sorte que l'axe de symétrie s7 soit parallèle au premier plan vertical formé par les axes s11, s1 et s5 et décalé vers la première face latérale 12.The cleaning station 7 preferably comprises a cylindrical tank 42 of cleaning with an axis of symmetry s7, two pressurized inlets of detergent and a water supply for rinsing the samples. He is willing between the polishing station 8 and the pre-polishing station 6, so that the axis of symmetry s7 is parallel to the first vertical plane formed by the axes s11, s1 and s5 and offset towards the first lateral face 12.

    Un porte échantillons 11 est disposé entre le poste de pré-polissage 3 et le poste de polissage 8. II est destiné à supporter et à polir plusieurs échantillons, à se déplacer d'un poste à un autre par un mouvement de rotation autour d'un axe de rotation s8. Le mouvement de rotation permet de placer les échantillons sur le plateau 19 du poste de polissage 8, ou dans la cuve de nettoyage 42 du poste de nettoyage 7 ou sur le plateau du poste de pré-polissage 6, de manière à les polir, à les nettoyer ou à les meuler selon l'opération à réaliser. L'axe de rotation s8 et l'axe de symétrie s7 de la cuve de nettoyage forme, de préférence, un second plan vertical, de préférence perpendiculaire au premier plan vertical. Le second plan vertical coupe la paroi inférieure 5 du premier compartiment 3 selon une droite s9 (figure 2).A sample holder 11 is arranged between the pre-polishing station 3 and the polishing station 8. It is intended to support and polish several samples, to move from one position to another by a movement of rotation around a axis of rotation s8. Rotation movement allows samples to be placed on the plate 19 of the polishing station 8, or in the cleaning tank 42 of the cleaning station 7 or on the plate of the pre-polishing station 6, so polishing, cleaning or grinding them depending on the operation to be performed. The axis of rotation s8 and the axis of symmetry s7 of the cleaning tank preferably forms a second vertical plane, preferably perpendicular to the first vertical plane. The second vertical plane intersects the bottom wall 5 of the first compartment 3 along a straight line s9 (Figure 2).

    Comme représenté sur la figure 6, le porte échantillons 11 comporte un élément de support 43 vertical et solidaire du premier compartiment 3 du dispositif, une seconde colonne de guidage 44 verticale et montée sur l'élément de support 43. Le porte échantillons 11 comporte également un boítier de support 45 monté sur la colonne de guidage et une tête de polissage 46 solidaire du boítier de support 45, de sorte que l'ensemble formé par la tête de polissage 46 et le boítier de support 45 puissent se déplacer verticalement. La tête de polissage 46 se prolonge en une platine 47 sur laquelle sont montés des échantillons à préparer, six de préférence. Les échantillons peuvent être enrobés ou non, et ont généralement un diamètre compris entre 20 et 50mm.As shown in FIG. 6, the sample holder 11 includes an element support 43 vertical and integral with the first compartment 3 of the device, a second vertical guide column 44 and mounted on the support element 43. The sample holder 11 also includes a support box 45 mounted on the guide column and a polishing head 46 secured to the support housing 45, so that the assembly formed by the polishing head 46 and the housing support 45 can move vertically. The polishing head 46 is extends into a plate 47 on which samples to be prepared are mounted, preferably six. The samples can be coated or uncoated, and have generally a diameter between 20 and 50mm.

    La seconde colonne de guidage 44 peut être animée d'un mouvement de rotation autour de son axe de symétrie qui est l'axe de rotation s8 du porte échantillons 11, de manière à déplacer les échantillons supporté par la platine 47 d'un poste à un autre par un mouvement de rotation de la seconde colonne de guidage 44 autour de l'axe de rotation s8. Le mouvement de rotation peut être réalisé par tout type de moyen connu. Sur la figure 6, la rotation de la seconde colonne de guidage 44 est assurée par un moteur de rotation 51 de la colonne de guidage, disposé à l'extrémité inférieure de la seconde colonne de guidage 44.The second guide column 44 can be animated by a movement of rotation about its axis of symmetry which is the axis of rotation s8 of the door samples 11, so as to move the samples supported by the stage 47 from one station to another by a rotation movement of the second column guide 44 around the axis of rotation s8. The rotational movement can be carried out by any type of known means. In Figure 6, the rotation of the second guide column 44 is provided by a rotation motor 51 of the guide column, arranged at the lower end of the second column of guide 44.

    La tête de polissage 46 est destinée à déplacer, par un mouvement de translation verticale du boítier de support 45, les échantillons entre une hauteur abaissée et une hauteur relevée. La hauteur abaissée équivaut à disposer les échantillons sur un plateau 19 du poste de polissage 8 ou sur un plateau du poste de pré-polissage 6, tandis que la position relevée correspond à une hauteur prédéterminée ne gênant pas le transfert des échantillons d'un poste à un autre. Le mouvement de translation peut être réalisé par tout type de moyen connu. Sur la figure 6, un vérin hydraulique 48 est monté sur la partie supérieure de la seconde colonne de guidage 44, de manière à assurer la translation verticale du boítier de support 45.The polishing head 46 is intended to move, by a movement of vertical translation of the support case 45, the samples between a height lowered and height raised. The lowered height is equivalent to placing the samples on a plate 19 of the polishing station 8 or on a plate of the pre-polishing station 6, while the raised position corresponds to a predetermined height does not interfere with the transfer of samples from one station to another. The translational movement can be achieved by any type of means known. In FIG. 6, a hydraulic cylinder 48 is mounted on the upper part of the second guide column 44, so as to ensure the translation vertical of the support box 45.

    La tête de polissage 46 est également animée d'un mouvement de rotation autour de son axe de symétrie s10, de manière à ce que les échantillons soient animés d'un mouvement de rotation, de préférence inverse à celui du plateau du poste de polissage 8 ou du poste de pré-polissage 6, lorsque les échantillons sont disposés sur le plateau de polissage pour être polis. Le mouvement de rotation de la tête de polissage 46 et des échantillons rend l'opération de polissage ou de pré-polissage plus efficace, lorsque les échantillons sont en contact avec un plateau 19 du poste de polissage 8 ou un plateau du poste de pré-polissage 6. Sur la figure 6, la rotation de la tête de polissage est assurée par un moteur de rotation de la tête de polissage 49 disposé à l'intérieur du boítier de support 45, des moyens de transmissions de type connu reliant l'arbre du moteur de rotation de la tête de polissage 49 à la tête de polissage 46. La vitesse de rotation de la tête de polissage est, de préférence, variable et comprise entre 20 tours par minute et 100 tours par minute.The polishing head 46 is also driven in a rotational movement around its axis of symmetry s10, so that the samples are rotated, preferably opposite to that of the table top polishing station 8 or pre-polishing station 6, when the samples are arranged on the polishing plate to be polished. The movement of rotation of the polishing head 46 and of the samples makes the operation of more efficient polishing or pre-polishing, when samples are in contact with a plate 19 of the polishing station 8 or a plate of the polishing station pre-polishing 6. In FIG. 6, the rotation of the polishing head is ensured by a motor for rotation of the polishing head 49 disposed inside the support box 45, known type of transmission means connecting the shaft from the motor for rotation of the polishing head 49 to the polishing head 46. The speed of rotation of the polishing head is preferably variable and between 20 revolutions per minute and 100 revolutions per minute.

    La platine 47 est solidaire de la tête de polissage 46, grâce à un vérin central 50 disposé entre l'extrémité libre de la tête de polissage 46 et la platine 47. Le vérin central exerce une pression centrale sur la platine et sur les échantillons. La platine a, de préférence, un diamètre de 160mm environ, permettant de polir 3 ou 6 échantillons de 20mm à 50mm de diamètre. Chaque échantillon peut également recevoir une pression intermédiaire grâce à des vérins 51 disposés au-dessus de chaque échantillon, entre la tête de polissage 46 et la platine 47, ceci permettant de polir de 1 à 6 échantillons de 20mm à 50mm de diamètre. Les mouvements de translation et de rotation du porte échantillons 11 et des moyens de préhension et de transport 10 des plateaux 19 sont commandés de façon automatique par les moyens de commande 15. Les moyens de commande 15 ordonnent au porte échantillons de se placer au-dessus du poste de nettoyage 7 ou de réaliser une opération de nettoyage, pendant le transfert des plateaux 19 entre le magasin 9 et le support de plateau 24 du poste de polissage 8. Ils permettent également de passer d'un premier mode de pression exerçant une pression centrale par l'intermédiaire du vérin central 50 sur la platine 47 à un second mode de pression exerçant une pression sur chaque échantillon par l'intermédiaire des vérins 51.The plate 47 is integral with the polishing head 46, thanks to a central jack 50 disposed between the free end of the polishing head 46 and the plate 47. The jack central exerts central pressure on the stage and on the samples. The platinum preferably has a diameter of about 160mm, allowing to polish 3 or 6 samples from 20mm to 50mm in diameter. Each sample can also receive intermediate pressure through cylinders 51 arranged above each sample, between the polishing head 46 and the plate 47, this allows to polish from 1 to 6 samples from 20mm to 50mm in diameter. The translational and rotational movements of the sample holder 11 and of the gripping and transport means 10 of the plates 19 are controlled by automatically by the control means 15. The means of command 15 order the sample holder to stand above the station cleaning 7 or performing a cleaning operation, during the transfer trays 19 between the magazine 9 and the tray support 24 of the polishing 8. They also allow switching from a first pressure mode exerting central pressure through the central cylinder 50 on the plate 47 to a second pressure mode exerting pressure on each sample via cylinders 51.

    Comme représentés sur la figure 7, les moyens de commande 15 comportent une unité de traitement 52 de données, comportant une borne d'entrée connectée à un clavier 53 et 4 bornes de sortie. Le clavier 53 permet à un opérateur de fournir à l'unité de traitement 52 les paramètres de la méthode de préparation des échantillons. Trois des bornes de sortie commandent respectivement les moyens de préhension et de transport 10 de plateaux, le porte échantillons 11 et les pompes connectées aux réservoirs ou flacons 27 en abrasifs liquides du poste de polissage 8. La quatrième borne de sortie est connectée à un écran 54 qui permet de visualiser l'ensemble des paramètres et le déroulement de la méthode de préparation des échantillons. Le clavier 53 et l'écran 54 sont, de préférence disposés dans le second compartiment 14, tandis que l'unité de traitement 52 est placée sur une quatrième face latérale 55 du premier compartiment 3 (figure 2), opposée à la première face latérale 12.As shown in FIG. 7, the control means 15 comprise a data processing unit 52, comprising an input terminal connected to a keypad 53 and 4 output terminals. The keyboard 53 allows a operator supplying the processing unit 52 with the parameters of the sample preparation. Three of the output terminals control respectively the gripping and transport means 10 of trays, the sample holder 11 and the pumps connected to the tanks or flasks 27 in liquid abrasives of the polishing station 8. The fourth output terminal is connected to a screen 54 which makes it possible to view all of the parameters and the procedure for the sample preparation method. The keyboard 53 and the screen 54 are preferably arranged in the second compartment 14, while that the processing unit 52 is placed on a fourth lateral face 55 of the first compartment 3 (FIG. 2), opposite the first lateral face 12.

    A partir d'un nombre de paramètres de commande limités, les moyens de commande permettent de réaliser l'ensemble des opérations de préparation d'échantillons, c'est-à-dire le pré-polissage, le polissage selon différents types de granulométrie et le nettoyage des échantillons. Les paramètres de commande sont, par exemple, la nature des échantillons à préparer, le choix entre les premier et second modes de pression à appliquer sur la platine 47. Les moyens de commande 15 comportent des méthodes de préparation d'échantillons prédéterminées en fonction des paramètres de commande. Ainsi pour un matériau donné, les moyens de commande déterminent les opérations de pré-polissage à effectuer, le nombre d'opérations de polissage nécessaires, le type de plateaux 19 à utiliser, la durée de chaque étape de polissage, le type d'abrasif liquide à utiliser...From a limited number of control parameters, the means of command allow all preparation operations to be carried out samples, i.e. pre-polishing, polishing according to different types grain size and sample cleaning. The parameters of order are, for example, the nature of the samples to be prepared, the choice between the first and second pressure modes to be applied on the plate 47. The control means 15 include preparation methods of predetermined samples according to the control parameters. So for a given material, the control means determine the operations pre-polishing to be performed, the number of polishing operations required, the type of plates 19 to be used, the duration of each polishing step, the type liquid abrasive to use ...

    Les moyens de commande 15 permettent également de contrôler l'usure des plateaux 19 et la quantité d'abrasifs ou de diluants liquides restants dans les réservoirs ou flacons 27 (figure 8). Les paramètres de contrôle sont, par exemple, pour l'usure des plateaux, la position des plateaux 19, leur durée de vie et la date à laquelle la surface abrasive des plateaux 19 a été changée. L'unité de traitement calculant le temps d'utilisation de ce plateau depuis cette date, alerte l'utilisateur par un message sur l'écran 54, de l'usure du plateau lorsque celui-ci arrive à un temps d'utilisation supérieur à un temps prédéterminé. Pour la contenance des flacons 27, l'unité de traitement calcule, au fur et à mesure des opérations de préparation, la quantité d'abrasif liquide consommée, en fonction de la quantité introduite dans le flacon 27 et envoie un message d'alerte sur l'écran lorsqu'un flacon est presque vide.The control means 15 also make it possible to control the wear of the trays 19 and the amount of abrasives or liquid thinners remaining in the tanks or flasks 27 (Figure 8). The control parameters are, for example, for the wear of the plates, the position of the plates 19, their duration of life and the date on which the abrasive surface of the plates 19 was changed. The processing unit calculating the time of use of this tray from this date, alerts the user by a message on the screen 54, of the wear of the plate when it arrives at a time of use greater than a time predetermined. For the capacity of the bottles 27, the processing unit calculates, during the preparation operations, the quantity of liquid abrasive consumed, depending on the quantity introduced into the bottle 27 and sends a alert message on the screen when a bottle is almost empty.

    Selon un mode de réalisation particulier, les étapes de réalisation d'un dispositif de préparation selon l'invention sont les suivantes :

    • Un opérateur place les échantillons à polir sur la platine 47 et saisie sur le clavier 53 les paramètres de commande,
    • L'unité de traitement 52 détermine alors la méthode à utiliser et ordonne au porte échantillons 11 de se placer au-dessus du poste de pré-polissage 6,
    • Selon la nature des échantillons à polir, une première étape de pré-polissage peut avoir lieu,
    • L'unité de traitement 52 ordonne ensuite au porte échantillons de placer les échantillons dans la cuve du poste de nettoyage 7 si une opération de nettoyage est programmée, sinon le porte échantillons se positionne au-dessus de la cuve du poste de nettoyage 7,
    • Dès lors que le porte échantillons est placé au poste de nettoyage 7, l'unité de traitement 52 commande au bras préhenseur 31 de prendre un premier plateau 19 sur une étagère 18 prédéterminée par l'unité de traitement 52 et de le transférer du magasin 9 au support de plateau 24 du poste de polissage 8,
    • L'unité de traitement 52 déplace alors le porte échantillons du poste de nettoyage 7 au poste de polissage 8,
    • Une première opération de polissage peut ainsi avoir lieu pendant une durée prédéterminée,
    • A la fin de la première opération de polissage, le porte échantillons se replace au-dessus du poste de nettoyage 7, le temps que les moyens de préhension et de transport remplace le premier plateau 19 par un second plateau 19, pour une seconde opération de polissage,
    • Lorsque l'ensemble des opérations de polissage est terminé, le porte échantillons se place au-dessus du poste de nettoyage 7 pour nettoyer et sécher les échantillons et la platine les supportant. Pendant la phase de nettoyage, la tête de polissage 46 tourne lentement tandis que pour l'essorage, la vitesse de la tête de polissage 46 s'accélère.
    According to a particular embodiment, the steps for producing a preparation device according to the invention are the following:
    • An operator places the samples to be polished on the stage 47 and enters the command parameters on the keyboard 53,
    • The processing unit 52 then determines the method to be used and orders the sample holder 11 to be placed above the pre-polishing station 6,
    • Depending on the nature of the samples to be polished, a first pre-polishing step can take place,
    • The processing unit 52 then orders the sample holder to place the samples in the tank of the cleaning station 7 if a cleaning operation is programmed, otherwise the sample holder is positioned above the tank of the cleaning station 7,
    • As soon as the sample holder is placed at the cleaning station 7, the processing unit 52 commands the gripper arm 31 to take a first tray 19 from a shelf 18 predetermined by the processing unit 52 and to transfer it from the store 9 to the plate support 24 of the polishing station 8,
    • The processing unit 52 then moves the sample holder from the cleaning station 7 to the polishing station 8,
    • A first polishing operation can thus take place for a predetermined period,
    • At the end of the first polishing operation, the sample holder is replaced above the cleaning station 7, the time that the gripping and transport means replaces the first plate 19 with a second plate 19, for a second operation of polishing,
    • When all of the polishing operations have been completed, the sample holder is placed above the cleaning station 7 to clean and dry the samples and the stage supporting them. During the cleaning phase, the polishing head 46 rotates slowly while for spinning, the speed of the polishing head 46 accelerates.

    Le dispositif de préparation d'échantillons présente l'avantage de réaliser automatiquement l'ensemble des opérations de préparations d'échantillons avant leur examen, ce qui permet de réaliser des préparations en continu, 24 heures sur 24, par exemple ou des opérations répétitives.The advantage of the sample preparation device is that automatically all sample preparation operations before their examination, which allows for continuous preparations, 24 24 hours a day, for example or repetitive operations.

    Claims (10)

    Dispositif de préparation d'échantillons métallographiques comportant un poste de polissage (8) comportant un support de plateau (24), ledit poste de polissage (8) étant adjacent à un magasin (9) vertical comportant un axe de symétrie (s11) et plusieurs étagères (18) horizontales, supportant chacune un plateau (19) destiné à être posé sur le support de plateau (24), le dispositif comportant également un poste de nettoyage (7) des échantillons, des moyens de préhension et de transport (10) d'un plateau (19) entre le magasin (9) et le poste de polissage (8), un porte échantillons (11), destiné à polir et à transférer les échantillons entre les postes de polissage (8) et de nettoyage (7) par un mouvement de rotation autour d'un premier axe de rotation (s8), et des moyens de commande (15) du porte échantillons (11) et des moyens de préhension et de transport (10) du plateau (19), dispositif caractérisé en ce que : le poste de nettoyage (7) est disposé entre le poste de polissage (8) et un poste de pré-polissage (6), de manière à ce que le porte échantillons (11) puisse transférer les échantillons entre le poste de polissage (8), le poste de nettoyage (7) et le poste de pré-polissage (6), les moyens de préhension et de transport (10) du plateau (19) comportent une pince de préhension, destinée à saisir le plateau (19) par sa partie supérieure et solidaire d'un bras préhenseur (31) animé d'un mouvement de translation verticale et d'un mouvement de rotation autour d'un second axe de rotation (s4), de manière à déplacer le plateau (19) entre une étagère (18) du magasin (9) et le poste de polissage (8), les moyens de commande (15) coopèrent avec les moyens de préhension et de transport (15), pour transférer des plateaux (19) entre le magasin (9) et le poste de polissage (8), pendant que le porte échantillons (11) est disposé au-dessus du poste de nettoyage (7). Device for preparing metallographic samples comprising a polishing station (8) comprising a tray support (24), said polishing station (8) being adjacent to a vertical magazine (9) comprising an axis of symmetry (s11) and several horizontal shelves (18), each supporting a tray (19) intended to be placed on the tray support (24), the device also comprising a station for cleaning (7) samples, gripping and transport means (10) a tray (19) between the magazine (9) and the polishing station (8), a sample holder (11), intended to polish and transfer the samples between the polishing (8) and cleaning (7) stations ) by a rotational movement around a first axis of rotation (s8), and control means (15) of the sample holder (11) and gripping and transport means (10) of the plate (19), device characterized in that : the cleaning station (7) is arranged between the polishing station (8) and a pre-polishing station (6), so that the sample holder (11) can transfer the samples between the polishing station (8 ), the cleaning station (7) and the pre-polishing station (6), the gripping and transport means (10) of the plate (19) comprise a gripper, intended to grip the plate (19) by its upper part and secured to a gripping arm (31) driven in a translational movement vertical and with a rotational movement around a second axis of rotation (s4), so as to move the plate (19) between a shelf (18) of the magazine (9) and the polishing station (8), the control means (15) cooperate with the gripping and transport means (15), to transfer trays (19) between the magazine (9) and the polishing station (8), while the sample holder (11) is arranged above the cleaning station (7). Dispositif selon la revendication 1, caractérisé en ce que le support de plateau (24) du poste de polissage (8) est animé d'un mouvement de rotation par rapport à un troisième axe de rotation (s1).Device according to claim 1, characterized in that the plate support (24) of the polishing station (8) is rotated relative to a third axis of rotation (s1). Dispositif selon l'un des revendications 1 et 2, caractérisé en ce que le poste de pré-polissage (6) comporte un support de plateau de pré-polissage (40) animé d'un mouvement de rotation par rapport à un quatrième axe de rotation (s5).Device according to either of Claims 1 and 2, characterized in that the pre-polishing station (6) comprises a support for the pre-polishing plate (40) driven in a rotational movement relative to a fourth axis of rotation (s5). Dispositif selon la revendication 3, caractérisé en ce que l'axe de symétrie (s11) du magasin (9) et les troisième et quatrième axes de rotation (s1 et s5) sont disposés dans un même premier plan vertical.Device according to claim 3, characterized in that the axis of symmetry (s11) of the magazine (9) and the third and fourth axes of rotation (s1 and s5) are arranged in the same first vertical plane. Dispositif selon la revendication 4, caractérisé en ce que le poste de nettoyage (7) comporte un axe de symétrie (s7), formant avec le premier axe de rotation (s8) du porte échantillons (11), un second plan vertical perpendiculaire au premier plan vertical.Device according to claim 4, characterized in that the cleaning station (7) has an axis of symmetry (s7), forming with the first axis of rotation (s8) of the sample holder (11), a second vertical plane perpendicular to the first vertical plane. Dispositif selon l'une quelconque des revendications 1 à 5, caractérisé en ce que la pince de préhension est constituée par trois tiges (29), l'extrémité libre de chaque tige (29) comportant un crochet (30) permettant de maintenir le plateau (19) par sa périphérie.Device according to any one of Claims 1 to 5, characterized in that the gripping forceps consist of three rods (29), the free end of each rod (29) comprising a hook (30) making it possible to hold the plate (19) by its periphery. Dispositif selon l'une quelconque des revendications 1 à 6, caractérisé en ce que le bras préhenseur (31) est solidaire d'une colonne de guidage (32), elle même montée sur un support vertical (33) et pouvant être en rotation autour du second axe de rotation (s4) grâce à deux pivots (36, 37).Device according to any one of Claims 1 to 6, characterized in that the gripping arm (31) is integral with a guide column (32), itself mounted on a vertical support (33) and able to be rotated around of the second axis of rotation (s4) by means of two pivots (36, 37). Dispositif selon l'une quelconque des revendications 1 à 7, caractérisé en ce que le poste de polissage (8) comporte un bras d'amenée (25) en abrasifs liquides, connecté à une pluralité de pompes elles mêmes connectées à une pluralité de réservoirs (27) contenant chacune un abrasif liquide.Device according to any one of Claims 1 to 7, characterized in that the polishing station (8) comprises a supply arm (25) in liquid abrasives, connected to a plurality of pumps themselves connected to a plurality of reservoirs (27) each containing a liquid abrasive. Dispositif selon la revendication 8, caractérisé en ce que les moyens de commande (15) commandent les pompes connectées aux réservoirs (27), de manière à choisir l'abrasif liquide en fonction du plateau (19) disposé sur le support de plateau (24) et à alimenter le bras d'amenée (25) en abrasif liquide pendant chaque opération de polissage.Device according to claim 8, characterized in that the control means (15) control the pumps connected to the reservoirs (27), so as to choose the liquid abrasive as a function of the tray (19) disposed on the tray support (24 ) and to supply the supply arm (25) with liquid abrasive during each polishing operation. Dispositif selon l'une des revendications 8 et 9, caractérisé en ce que les moyens de commande (15) contrôlent l'usure des plateaux (19) et la quantité d'abrasif liquide contenue dans chaque réservoir (27).Device according to one of claims 8 and 9, characterized in that the control means (15) control the wear of the plates (19) and the amount of liquid abrasive contained in each tank (27).
    EP03354069A 2002-08-12 2003-08-04 Automatic metallographic polishing apparatus Withdrawn EP1389506A1 (en)

    Applications Claiming Priority (2)

    Application Number Priority Date Filing Date Title
    FR0210220 2002-08-12
    FR0210220A FR2843320B1 (en) 2002-08-12 2002-08-12 DEVICE FOR PREPARING AUTOMATIC METALLOGRAPHIC SAMPLES

    Publications (1)

    Publication Number Publication Date
    EP1389506A1 true EP1389506A1 (en) 2004-02-18

    Family

    ID=30471076

    Family Applications (1)

    Application Number Title Priority Date Filing Date
    EP03354069A Withdrawn EP1389506A1 (en) 2002-08-12 2003-08-04 Automatic metallographic polishing apparatus

    Country Status (2)

    Country Link
    EP (1) EP1389506A1 (en)
    FR (1) FR2843320B1 (en)

    Cited By (1)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    CN105751058A (en) * 2016-03-14 2016-07-13 吉林大学 Automatic abrasive disc switch device of metallographic grinder

    Citations (6)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    US3762103A (en) * 1970-04-27 1973-10-02 Scan Dia Machine for grinding and polishing metallographic and mineralogic samples
    US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
    FR2505712A1 (en) * 1981-05-18 1982-11-19 Procedes Equip Sciences Ind Sa Automatic polishing machine for semiconductor wafers - has stack of cassettes carrying wafers with pistons to push cassettes into and out of polishing position
    US5800254A (en) * 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
    WO1999051398A1 (en) * 1998-04-08 1999-10-14 Applied Materials, Inc. Apparatus and methods for slurry removal in chemical mechanical polishing
    WO2001058644A1 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus

    Patent Citations (6)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    US3762103A (en) * 1970-04-27 1973-10-02 Scan Dia Machine for grinding and polishing metallographic and mineralogic samples
    US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
    FR2505712A1 (en) * 1981-05-18 1982-11-19 Procedes Equip Sciences Ind Sa Automatic polishing machine for semiconductor wafers - has stack of cassettes carrying wafers with pistons to push cassettes into and out of polishing position
    US5800254A (en) * 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
    WO1999051398A1 (en) * 1998-04-08 1999-10-14 Applied Materials, Inc. Apparatus and methods for slurry removal in chemical mechanical polishing
    WO2001058644A1 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus

    Cited By (1)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    CN105751058A (en) * 2016-03-14 2016-07-13 吉林大学 Automatic abrasive disc switch device of metallographic grinder

    Also Published As

    Publication number Publication date
    FR2843320B1 (en) 2005-05-06
    FR2843320A1 (en) 2004-02-13

    Similar Documents

    Publication Publication Date Title
    US4141180A (en) Polishing apparatus
    US4193226A (en) Polishing apparatus
    CA2878432C (en) Device for spraying a dye penetration inspection product onto a component
    FR2624844A1 (en) Apparatus for producing beverages consisting of mixtures of ingredients, particularly cocktails
    EP1973152A1 (en) Substrate cleaning apparatus, method of substrate cleaning, substrate treating system and recording medium
    FR2627587A1 (en) DEVICE FOR COLORING TISSUES FOR THE MONITORING OF THE IMMUNE RESPONSE
    FR2519893A1 (en) GRINDER, WITH AUTOMATIC EXCHANGE OF GRINDING WHEELS FROM A STORE
    JPH09285958A (en) Polishing device system for wafer
    EP1389506A1 (en) Automatic metallographic polishing apparatus
    EP1137514B1 (en) Modular machine for polishing and planing substrates
    FR2482576A1 (en) AUTOMATIC MACHINE FOR WASHING AND DRYING IN SERIES OF FULL BOTTLES
    FR2730387A1 (en) MACHINE FOR THE AUTOMATIC MANUFACTURE OF PAPERBEARD
    FR2630216A1 (en) Robotised installation for analyses, in particular medical analyses
    JP3872159B2 (en) Brush cleaning device and wafer polishing device system
    EP0434542B1 (en) Device for packaging various products
    EP0154606B1 (en) Oscillatory device for moving articles in surface treatment installations
    CN217103601U (en) Full-automatic AG glass frosting polishing equipment
    EP1193030B1 (en) Machine for finishing mechanical pieces
    EP0588692B1 (en) Automatic immuno-assay apparatus
    FR2739251A1 (en) Production system for encapsulation of individual adventitious seed-germs
    JPH09171983A (en) Substrate cleaning equipment
    JPS62136365A (en) Polishing device
    WO2020012290A1 (en) Stud transfer and treatment system
    EP0050083A1 (en) Apparatus for grouping unit-containers
    JPH09262557A (en) Thin disc cleaning apparatus, thin disc rinsing apparatus and thin disc cleaning and rinsing apparatus

    Legal Events

    Date Code Title Description
    PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

    Free format text: ORIGINAL CODE: 0009012

    AK Designated contracting states

    Kind code of ref document: A1

    Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

    AX Request for extension of the european patent

    Extension state: AL LT LV MK

    17P Request for examination filed

    Effective date: 20040724

    AKX Designation fees paid

    Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

    STAA Information on the status of an ep patent application or granted ep patent

    Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

    18W Application withdrawn

    Effective date: 20070212