EP1436834A2 - Stacking of multilayer modules - Google Patents
Stacking of multilayer modulesInfo
- Publication number
- EP1436834A2 EP1436834A2 EP02798173A EP02798173A EP1436834A2 EP 1436834 A2 EP1436834 A2 EP 1436834A2 EP 02798173 A EP02798173 A EP 02798173A EP 02798173 A EP02798173 A EP 02798173A EP 1436834 A2 EP1436834 A2 EP 1436834A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- multilayer
- module
- segmentation
- arrayed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Definitions
- This invention relates to the field of electronics packaging, and in particular, to high- density electronic modules for housing and interconnecting electronic components located on stacked substrate layers.
- Increasing the volume density of electronic packaging is crucial for reducing device sizes for a given functionality.
- Efforts to provide high-density electronic packaging have included three-dimensional stacking technology in an attempt to avoid the inherent geometric constraints of standard two-dimensional semiconductor integrated circuits ("ICs"). By stacking electronic modules on top of one another and providing interconnections between the modules, the multiple layers can provide additional circuit elements without extending the two-dimensional footprint beyond that of a single module.
- Certain embodiments have also included heat-conducting, electrically insulating layers to improve heat dissipation during operation of these stacked electronic modules.
- each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein.
- the plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a heat-separating layer disposed between the top side of the first layer and the bottom side of the second layer. The first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.
- a method provides a plurality of releasably adhered multilayer modules.
- the method comprises providing a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises providing a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises releasably adhering the first multilayer module to the second multilayer module by disposing a heat-separating layer between the top side of the first layer and the bottom side of the second layer.
- each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a flexible substrate therein.
- the plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically- conductive traces.
- the plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a heat- separating layer disposed between the top side of the first layer and the bottom side of the second layer.
- the first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.
- a method provides a plurality of releasably adhered multilayer modules.
- the method comprises providing a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises providing a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises releasably adhering the first multilayer module to the second multilayer module by disposing a heat-separating layer between the top side of the first layer and the bottom side of the second layer.
- a method separates a plurality of releasably adhered multilayer modules.
- the method comprises providing a first multilayer module releasably adhered to a second multilayer module by disposing a heat- separating layer between the first and second multilayer modules.
- the first multilayer module comprises a first layer with a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the second multilayer module comprises a second layer with a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises applying heat to the heat-separating layer, thereby releasing the first multilayer module from the second multilayer module.
- the method further comprises separating the first multilayer module from the second multilayer module.
- each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein.
- the plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a metal layer disposed between and adhered to the top side of the first layer and the bottom side of the second layer, whereby the first multilayer module is adhered to the second multilayer module.
- a method provides a plurality of multilayer modules.
- Each multilayer module has a plurality of layers wherein each layer has a substrate therein.
- the method comprises providing a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises providing a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises adhering a metal layer to the top side of the first layer and the bottom side of the second layer.
- the method further comprises adhering the first multilayer module to the second multilayer module.
- each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein.
- the plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the plurality of multilayer modules further comprises a thermoplastic adhesive disposed between the top side of the first layer and the bottom side of the second layer, whereby the first multilayer module is adhered to the second multilayer module.
- a method provides a plurality of multilayer modules.
- Each multilayer module has a plurality of layers wherein each layer has a substrate therein.
- the method comprises providing a first multilayer module comprising a first layer having a top side and bottom side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises providing a second multilayer module comprising a second layer having a top side and bottom side.
- the second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces.
- the method further comprises adhering the first multilayer module to the second multilayer module by disposing a thermoplastic adhesive between the top side of the first layer and the bottom side of the second layer.
- an arrayed module pre-form corresponds to an array of multilayer modules.
- the arrayed module pre-form comprises a plurality of active layer sheets.
- Each active layer sheet comprises a substrate sheet and a plurality of arrayed active areas with borders between adjacent arrayed active areas defining dicing lines.
- Each arrayed active area comprises at least one electronic element and a plurality of electrically-conductive traces.
- the arrayed active layer sheets are adhered together with the dicing lines of the active layer sheets in registry with one another.
- the arrayed module pre-form further comprises a segmentation sheet comprising a substrate sheet and a plurality of arrayed segmentation areas with borders between adjacent arrayed segmentation areas defining dicing lines.
- Each arrayed segmentation area comprises a thermally-conductive material.
- the segmentation sheet is adhered to the plurality of active layer sheets.
- the dicing lines of the segmentation sheet are aligned in registry with the dicing lines of the active layer sheets.
- an arrayed module pre-form corresponds to an array of multilayer modules.
- the arrayed module pre-form is fabricated by a method comprising providing a plurality of active layer sheets.
- Each active layer sheet comprises a substrate sheet and a plurality of arrayed active areas with borders between adjacent arrayed active areas defining dicing lines.
- Each arrayed active area comprises at least one electronic element and a plurality of electrically-conductive traces.
- the method further comprises providing a segmentation sheet comprising a substrate sheet and a plurality of arrayed segmentation areas with borders between adjacent arrayed segmentation areas defining dicing lines.
- Each arrayed segmentation area comprises a thermally-conductive material.
- the method further comprises stacking the plurality of active layer sheets upon one another with adhesive between the active layer sheets.
- the dicing lines of the active layer sheets are aligned in registry with one another.
- the method further comprises stacking the segmentation sheet with the plurality of active layer sheets with adhesive between the segmentation layer sheet and the active layer sheets.
- the dicing lines of the segmentation layer are aligned in registry with the dicing lines of the active layer sheets.
- a stack of arrayed module pre-forms corresponds to a stack of arrayed multilayer modules.
- the stack of arrayed module pre-forms comprises a first arrayed module pre-form comprising a stack of active layer sheets with adhesive between the active layer sheets and a segmentation layer sheet with adhesive between the segmentation layer sheet and the active layer sheets.
- the segmentation layer sheet comprises a thermally-conductive material.
- the stack of arrayed module pre-forms further comprises a second arrayed module pre-form adhered to the first arrayed module preform.
- the second arrayed module pre-form comprises a stack of active layer sheets with adhesive between the active layer sheets and a segmentation layer sheet with adhesive between the segmentation layer sheet and the active layer sheets.
- the segmentation layer sheet comprises a thermally-conductive material.
- the segmentation layer sheet of the first arrayed module preform neighbors the second arrayed module pre-form.
- the stack of arrayed module pre-forms further comprises a thermoplastic adhesive material disposed between the first and second arrayed module pre-forms.
- a stack of arrayed module pre-forms corresponds to a stack of arrayed multilayer modules.
- the stack of arrayed module pre-forms is fabricated by a method comprising providing a first arrayed module preform and a second arrayed module pre-form.
- Each arrayed module pre-form comprises a stack of active layer sheets with adhesive between the active layer sheets and a segmentation layer sheet with adhesive between the segmentation layer sheet and the active layer sheets.
- the segmentation layer sheet comprises a thermally-conductive material.
- the method further comprises applying a thermoplastic adhesive material to the segmentation layer sheet of the first arrayed module pre-form.
- the method further comprises stacking the first and second arrayed module pre-forms.
- the arrayed module pre-forms are oriented with the segmentation layer sheet of the first arrayed module pre-form neighboring the second arrayed module pre-form.
- the first and second arrayed module pre-forms have the segmentation layer sheet of the first arrayed module pre-form and the thermoplastic adhesive material disposed between the first and second arrayed module pre-forms.
- a stack of arrayed multilayer modules comprises a first array of multilayer modules comprising a plurality of active layer sheets and a segmentation layer sheet laminated together.
- the segmentation layer sheet comprises a thermally-conductive material.
- the stack of arrayed multilayer modules further comprises a second array of multilayer modules comprising a plurality of active layer sheets and a segmentation layer sheet laminated together.
- the segmentation layer sheet comprises a thermally-conductive material.
- the second array of multilayer modules is adhered to the first array of multilayer modules with a thermoplastic adhesive material disposed between the first and second arrays of multilayer modules.
- a stack of arrayed multilayer modules is fabricated by a method comprising providing a stack of arrayed module pre-forms.
- Each arrayed module pre-form comprises a stack of active layer sheets with adhesive between the active layer sheets and a segmentation layer sheet with adhesive between the segmentation layer sheet and the active layer sheets.
- the segmentation layer sheet comprises a thermally-conductive material.
- Each pair of neighboring arrayed module pre-forms has a segmentation layer sheet and a thermoplastic adhesive material disposed between the arrayed module pre-forms.
- the method further comprises applying pressure and heat to the stack of arrayed module pre-forms to laminate the active layer sheets and the segmentation layer sheets together.
- a stack of multilayer modules comprises a first multilayer module comprising a plurality of active areas and a segmentation area laminated together.
- the segmentation area comprises a thermally- conductive material.
- the stack of multilayer modules further comprises a second multilayer module comprising a plurality of active areas and a segmentation area laminated together.
- the segmentation area comprises a thermally-conductive material.
- the second multilayer module is releasably adhered to the first multilayer module with a thermoplastic adhesive material disposed between the first and second multilayer module.
- a stack of multilayer modules is fabricated by a method comprising providing a stack of arrayed multilayer modules.
- the arrayed multilayer modules each comprise a stack of active layer sheets and a segmentation layer sheet laminated together.
- the segmentation layer sheet comprises a thermally-conductive material.
- Each pair of neighboring arrayed multilayer modules has a segmentation layer sheet and a thermoplastic adhesive material disposed between the arrayed multilayer modules.
- the method further comprises cutting the stack of arrayed multilayer modules, thereby dividing the stack of arrayed multilayer modules into stacks of multilayer modules having sides formed by edges of the active areas and segmentation areas.
- each multilayer module of a stack of multilayer modules has a plurality of active layers wherein each active layer has a substrate therein.
- the stack of multilayer modules comprises a first multilayer module comprising a first active layer having a top side, a bottom side, and a first electrical contact side.
- the first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the first electrical contact side to the electronic element of the first active layer.
- the stack of multilayer modules further comprises a second multilayer module comprising a second active layer having a top side, a bottom side, and a second electrical contact side.
- the second active layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the second electrical contact side to the electronic element of the second active layer.
- the stack of multilayer modules further comprises a segmentation layer disposed between the top side of the first active layer and the bottom side of the second active layer.
- the first multilayer module is releasably adhered to the second multilayer module so that the first electrical contact side and second electrical contact side are aligned with each other thereby forming a side of the stack of multilayer modules.
- the first multilayer module can be detached from the second multilayer module by applying heat to the segmentation layer.
- the stack of multilayer modules further comprises a plurality of electrically-conductive lines along the side of the stack of multilayer modules. The lines provide electrical connection to the traces.
- a stack of multilayer modules has electrically-conductive lines along a side of the stack of multilayer modules thereby providing electrical connection to a plurality of electronic elements.
- the stack of multilayer modules is fabricated by a method comprising providing a stack of multilayer modules.
- Each multilayer module has a plurality of active areas each comprising at least one electronic element and a plurality of electrically-conductive traces which provide electrical connection from an edge of the active area to the electronic element.
- Each pair of neighboring multilayer modules has a segmentation layer and a thermoplastic adhesive material disposed between the multilayer modules.
- the stack of multilayer modules has a side formed by the edges of the plurality of active areas.
- the method further comprises depositing metallic material on the side of the stack of multilayer modules.
- the method further comprises removing excess metallic material from the side of the stack of multilayer modules to form metallic lines in electrical contact to the traces.
- Figure 1 schematically illustrates a multilayer module compatible with an embodiment of the invention having a top layer and a bottom layer.
- Figure 2 schematically illustrates a partial exploded view of the multilayer module schematically illustrated in Figure 1.
- Figure 3 is a flowchart describing a method of fabricating multilayer modules compatible with an embodiment of the invention.
- Figure 4 schematically illustrates a portion of an active layer sheet compatible with an embodiment of the invention.
- Figure 5 schematically illustrates a registration tool comprising alignment posts which engage registration holes of the active layer sheets and segmentation layer sheets to align the sheets in preparation of lamination.
- Figure 6 is a flowchart describing the process of preparing and adding additional active layer sheets.
- Figure 7 schematically illustrates a portion of a segmentation layer sheet compatible with an embodiment of the invention.
- Figure 8 is a flowchart describing the process of preparing and adding the segmentation layer sheet.
- Figure 9 schematically illustrates a laminated stack of arrays of multilayer modules.
- Figure 10 schematically illustrates an individual stack of multilayer modules obtained after dividing the laminated stack of arrays illustrated in Figure 9.
- Figure 11 is a flowchart describing the process of preparing the sides of the stack of multilayer modules and forming electrically-conductive lines along the sides.
- Figure 12 schematically illustrates the stack of multilayer modules after the sides have been metallized.
- Figure 13 schematically illustrates the stack of multilayer modules after the excess metallization has been removed, leaving the electrically-conductive lines.
- Figure 14 schematically illustrates the stack of multilayer modules in position within a segmentation tool prior to segmenting the stack into individual multilayer modules.
- FIGs 1 and 2 schematically illustrate a multilayer module 10 compatible with an embodiment of the invention having a top layer 12 and a bottom layer 14.
- Figure 2 is a partial exploded view of the multilayer module 10 schematically illustrated in Figure 1.
- the multilayer module 10 comprises a plurality of flexible active layers 20.
- Each active layer 20 comprises a non-electrically-conductive first substrate 22 with an edge 24, at least one electronic element 26, and a plurality of electrically-conductive traces 28 which provide electrical connection from the edge 24 of the first substrate 22 to the electronic element 26.
- the active layers 20 are laminated together so that the edges 24 of the first substrates 22 form a side 30 of the multilayer module 10 and the traces 28 of the active layers 20 are aligned in registry with one another.
- the multilayer module 10 further comprises a plurality of electrically-conductive lines 32 along the side 30 of the multilayer module 10, the lines 32 providing electrical connection to the traces 28.
- the multilayer module 10 further comprises at least one flexible segmentation layer 40 laminated to the active layers 20.
- the segmentation layer 40 comprises a non-electrically- conductive second substrate 42 and a thermally-conductive material 44.
- the segmentation layer 40 is either the top layer 12 or the bottom layer 14 of the multilayer module 10.
- the embodiment illustrated in Figures 1 and 2 has a segmentation layer 40 as the top layer 12 with the thermally- conductive material 44 on the outward top surface of the multilayer module 10.
- the non-electrically-conductive first substrate 22 of each active layer 20 comprises a polymeric material.
- suitable polymeric materials for the first substrate 22 include, but are not limited to, polyimide film such as Kapton®, which is available from E.I. du Pont de Nemours and Company of Wilmington, Delaware, or a benzocyclobutene (BCB)-based polymer dielectric such as Cyclotene®, which is available from Dow Chemical Company of Midland, Michigan. .
- the dimensions of the active layers 20 are not critical but are dependent on the desired functionality and packaging size constraints for the multilayer module 10.
- the active layers 20 are approximately 1" x 1" and 0.002" thick.
- the thickness of the active layers 20 is preferably between approximately 0.0005" to approximately 0.006", more preferably between approximately 0.0005" to approximately 0.005", and most preferably between approximately 0.0005" to approximately 0.003".
- the electronic element 26 of each active layer 20 comprises a polymeric material which is appropriately doped and patterned, typically by photolithographic techniques, to form conductors, insulators, diodes, transistors, memory cells, or other electronic components of the electronic element 26.
- the electronic element 26 can be formed within the first substrate 22 by modification of certain regions of the first substrate 22 by doping or other techniques.
- the electronic element 26 can be formed on a top side of the active layer 20, or a bottom side of the active layer 20, or on both the top and bottom sides of the active layer 20.
- the electrically-conductive traces 28 of each active layer 20 can comprise metallization or a conductive polymeric material, which is patterned onto the first substrate 22.
- the electrically-conductive traces 28 provide electrical connection between the electronic element 26 and an edge 24 of the first substrate 22. Additionally, in embodiments in which the traces 28 comprise a conductive polymeric material, the traces 28 can be formed within the first substrate 22 by modification of certain regions of the first substrate 22 by doping or other techniques.
- the active layers 20 are laminated and held together by an adhesive 50 applied to one or both sides of the active layer 20.
- the bottom side of one active layer 20 is adhered to the top side of another active layer 20.
- the thickness of the combination of two active layers 20 is preferably less than or equal to approximately 0.005", and more preferably between approximately 0.001" and approximately 0.005".
- the number of active layers 20 depends on the desired functionality and packaging size constraints for the multilayer module 10. However, the upper limit on the number of active layers 20 which can comprise a multilayer module 10 is effectively limitless.
- the multilayer module 10 comprises 16 active layers 20.
- the active layers 20 are substantially similar to one another and are laminated in registry with one another so that the traces 28 of each active layer 20 are aligned with the corresponding traces 28 of the other active layers 20.
- each active layer 20 can differ from the other active layers 20 by each having a uniquely positioned trace 28 corresponding to an enable bit of the electronic element 26. This registry between the active layers 20 simplifies the process of providing outside interconnects to the electronic elements 26 of the multilayer modules 10, as described below.
- the active layers 20 are laminated together so that the edges 24 of the first substrates 22 form the electrical contact sides 30 of the multilayer module 10. At least one side 30 of the multilayer module 10 is formed by edges 24 which have the electrically-conductive traces 28. Such sides 30 have electrically-conductive lines 32 to provide electrical connection to the electronic element 26 of the active layers 20 via the traces 28. As described more fully below, in certain embodiments, the lines 32 are deposited metallization which extend across the side 30 of the multilayer module 10, electrically connecting similar traces 28 of the various active layers 20. Examples of suitable metallizations for the lines 32 include, but are not limited to, gold over titanium, gold over tungsten, copper, and nickel.
- the multilayer module 10 further comprises at least one flexible segmentation layer 40 comprising a non-electrically-conductive second substrate 42 and a thermally-conductive material 44.
- the second substrate 42 of the segmentation layer 40 can comprise a polymeric material.
- suitable polymeric materials for the second substrate 42 include, but are not limited to, Kapton®, Cyclotene®, and Zenite® liquid crystal polymer (LCP) resin, which is available from E.I. du Pont de Nemours and Company of Wilmington, Delaware.
- the second substrate 42 of the segmentation layer 40 comprises the same polymeric material as do the first substrates 22 of the active layers 20.
- the segmentation layer 40 can have generally the same dimensions as do the active layers 20.
- the segmentation layer 40 is the top layer 12 of the multilayer module 10 as illustrated in Figures 1 and 2. In other embodiments, the segmentation layer 40 is the bottom layer 14 of the multilayer module 10. In still other embodiments, the multilayer module 10 may have segmentation layers 40 as both the top layer 12 and the bottom layer 14.
- the thermally-conductive material 44 is typically a metallic sheet deposited onto one surface of the second substrate 42 of the segmentation layer 40. Other configurations of the thermally-conductive material 44, such as a grid, are also compatible with an embodiment of the invention. Examples of suitable thermally-conductive materials 44 include, but are not limited to, metals or metal alloys such as copper, aluminum, and nickel, semiconductors such as silicon, silicon carbide, and diamond, and other materials such as aluminum nitride. In certain embodiments, the thermally-conductive material 44 is a copper-clad layer approximately 0.35 mils thick deposited onto the second substrate 42. As described more fully below, in one embodiment, the thermally-conductive material 44 does not extend to the edges of the second substrate 42.
- FIG. 3 is a flowchart describing a method 200 of fabricating multilayer modules 10 compatible with an embodiment of the invention.
- Figure 3 makes reference to the structures schematically illustrated in Figures 1 and 2, as well as the structures schematically illustrated in Figures 4, 5, 7, 9, 10, 12-14.
- a flexible active layer sheet 120 is initially provided in an operational block 210.
- Figure 4 schematically illustrates a portion of an active layer sheet 120 compatible with an embodiment of the invention.
- the active layer sheet 120 comprises a flexible non-electrically-conductive first substrate sheet 122 and a plurality of arrayed active areas 128 with borders between adjacent arrayed active areas 128 defining dicing lines 130.
- the active layer sheet 120 further comprises a plurality of registration holes 124 within a sheet border 126 extending along at least a portion of the circumference of the active layer sheet 120.
- Each arrayed active area 128 corresponds to an active layer 20 of a multilayer module 10, and comprises at least one electronic element 26 and a plurality of electrically-conductive traces 28 which provide electrical connection from an edge of the arrayed active area 128 to the electronic element 26.
- the portion of the first substrate sheet 122 within the arrayed active area 128 corresponds to the non-electrically-conductive first substrate 22 of the multilayer module 10.
- the arrayed active areas 128 are conceptually separated by the dicing lines 130.
- the active layer sheets 120 will eventually be cut along these dicing lines 130 to form the active layers 20 of the multilayer modules 10.
- These dicing lines 130 are conceptual, and the active layer sheet 120 does not require actual lines corresponding to the dicing lines 130 to be manifested on the active layer sheet 120.
- the dimensions of the active layer sheet 120 are not critical to the invention.
- the active layer sheet 120 is approximately 14 inches by 14 inches, is approximately 0.002" thick, and has 169 (13 x 13) electronic element areas 128 which are each one inch by one inch in area.
- the sheet borders 126 which extend along the whole circumference of the active layer sheet 120 are approximately 0.5 inches wide.
- Other embodiments compatible with the invention can have active areas 128 with different dimensions and array configurations, and different sheet border 126 dimensions.
- the embodiment schematically illustrated in Figure 4 has square active areas 128, other embodiments can have other shapes, such as rectangular or triangular, which would result in rectangular or triangular multilayer modules 10.
- the active layer sheets 120 are received in sheet form, while in other embodiments, the active layer sheets 120 are cut from a roll of active layer sheets 120.
- the registry of the registration holes 124 with respect to the active areas 128 are substantially consistent for each active layer sheet 120.
- the registration holes 124 are placed along the whole circumference of the active layer sheet 120, while in other embodiments, the registration holes 124 can be placed along only a portion of the circumference of the active layer sheet 120.
- the registration holes 124 provide a mechanism to align the various active layer sheets 120 in registry with one another as the arrayed module pre-forms 160 are formed.
- an additional active layer sheet 120' is prepared to be added to the existing active layer sheet 120 on the registration tool 150.
- the operational block 220 is separated into sub-blocks in the flowchart of Figure 6.
- an additional active layer sheet 120' is provided.
- the surface of the active layer sheet 120' opposite the electronic element 26' is ashed in preparation of applying an adhesive 50 to the ashed surface.
- ashing of a surface comprises placing the active layer sheet 120' in a partial vacuum and exposing the surface opposite the electronic element 26' to a plasma. In this way, the surface of the active layer sheet 120' is activated, thereby strengthening the bond between the surface and the adhesive 50 to be applied.
- an adhesive 50 is applied to the ashed surface of the active layer sheet 120' in a uniform, thin layer.
- the adhesive 50 is an epoxy which is applied at room temperature by spraying, roll coating, or other method.
- Other certain embodiments may utilize an adhesion promoter sprayed onto the ashed surface of the active layer sheet 120' before the adhesive 50 is applied.
- multiple adhesive compounds may comprise the adhesive 50, and these multiple adhesive compounds may be applied to the active layer sheet 120' as separate steps in the fabrication of the multilayer modules 10. Persons skilled in the art are able to select an appropriate adhesive 50 and method of applying the adhesive 50 to the ashed surface of the active layer sheet 120'. Persons skilled in the art can also appreciate that the adhesive 50 can be applied to the surface of the existing active layer sheet 120 which is to be bonded to the ashed surface of the additional active layer sheet 120', without loss of generality.
- the active layer sheet 120' is heated to drive off the solvents from the adhesive 50 and to densify the adhesive 50.
- This heating is effectively an incomplete curing of the adhesive 50 in order to make subsequent handling of the active layer sheet 120' easier.
- Persons skilled in the art can select appropriate heating temperatures and times to drive off the solvents and densify the adhesive 50 without damaging the electronic element 26' of the active layer sheet 120'.
- the active layer sheet 120' is stacked onto the existing active layer sheet 120 in the registration tool 150.
- the traces 28, 28' of the two active layer sheets 120, 120' can be positioned in registry with one another, in preparation for the formation of the electrically-conductive lines 32 along the sides 30 of the multilayer modules 10.
- the process illustrated in the operational block 220 of Figures 3 and 6 continues until the desired number of active layer sheets 120 for an arrayed module preform 160 are prepared and stacked in the registration tool 150. This determination of whether the desired number of active layer sheets 120 have been prepared and added is illustrated in Figure 3 as the decision block 230.
- a segmentation layer sheet 140 is prepared and stacked with the active layer sheets 120 in the registration tool 150.
- Figure 7 schematically illustrates a portion of a segmentation layer sheet 140 compatible with an embodiment of the invention.
- the segmentation layer sheet 140 comprises a flexible non- electrically-conductive second substrate sheet 142 and a plurality of arrayed segmentation areas 148 with borders between adjacent arrayed segmentation areas 148 defining dicing lines 130.
- the segmentation layer sheet 140 further comprises a plurality of registration holes 144 within a sheet border 146 extending along at least a portion of the circumference of the segmentation layer sheet 140.
- Each segmentation area 148 comprises a thermally-conductive material 44 and corresponds to a segmentation layer 40 of a multilayer module 10.
- the portion of the second substrate sheet 142 within the arrayed segmentation area 148 corresponds to the non-electrically-conductive second substrate 42 of the multilayer module 10.
- the thermally-conductive material 44 of each segmentation area 148 covers most of the corresponding segmentation area 148, but does not extend fully across the segmentation area 148.
- the thermally-conductive material 44 is also generally square in shape, but does not extend fully across the segmentation area 148, leaving thin regions 149 with no thermally-conductive material 44.
- thermally-conductive material 44 is also electrically conductive in certain embodiments, so the thin region 149 prevents electrically shorting the lines 32 along the sides 30 of the multilayer modules 10 to each other via the thermally-conductive material 44.
- the thermally-conductive material 44 is a deposited metal layer such as copper
- this configuration is fabricated by depositing an approximately 0.35 mil-thick copper layer across the non-electrically-conductive second substrate sheet 142, and then etching away some of the copper to form copper-free thin regions 149 approximately 10 mils wide along the borders between adjacent segmentation areas 148 corresponding to the segmentation layers 40.
- Persons skilled in the art are able to select an appropriate method to fabricate a segmentation layer sheet 140 with a configuration compatible with an embodiment of the invention.
- the arrayed segmentation areas 148 are conceptually separated by the dicing lines 130.
- the segmentation layer sheets 140 will eventually be cut along these dicing lines 130 to form the segmentation layers 40 of the multilayer modules 10.
- These dicing lines 130 are conceptual only, and the segmentation layer sheet 140 does not require actual lines corresponding to the dicing lines 130 to be manifested on the segmentation layer sheet 140.
- the dimensions of the segmentation layer sheet 140 are substantially similar to those of the active layer sheets 120.
- the segmentation areas 148 of the segmentation layer sheet 140 has the same array pattern as do the active areas 128 of the active layer sheet 120.
- the segmentation layer sheet 140 has the same dimensions and patterns of the sheet borders 146, dicing lines 130, and registration holes 144 as do the active layer sheets 120, so that the dicing lines 130 of the segmentation layer sheet 140 and active layer sheets 120 are in registry with one another in preparation of dicing the active layer sheets 120 and segmentation layer sheets 140 into stacks of multilayer modules 10.
- the segmentation layer sheet 140 can have a different thickness than that of the active layer sheets 120.
- the segmentation layer sheets 140 can be received in sheet form or cut from a roll of segmentation layer sheets 140.
- the operational block 240 describing the process of preparing and stacking the segmentation layer sheet 140 is separated into sub-blocks in the flowchart of Figure 8, which mirrors the flowchart of Figure 6 for the process of preparing and stacking additional active layer sheets 120.
- a segmentation layer sheet 140 is provided, and in an operational block 420, the surface of the segmentation layer sheet 140 which is opposite the thermally-conductive material 44 is ashed in preparation of applying the adhesive 50.
- the adhesive 50 is applied to the ashed surface of the segmentation layer sheet 140, and in an operational block 440, the segmentation layer sheet 140 is heated to drive off solvents from the adhesive 50 and to densify the adhesive 50.
- the segmentation layer sheet 140 is stacked onto the active layer sheets 120 in the registration tool 150.
- the preparation and stacking of the segmentation layer sheet 140 can be achieved in various embodiments.
- the stacking of the segmentation layer sheet 140 represents the full compilation of all the layers of an arrayed module pre-form 160. As is described below, the formation of the arrayed module pre-forms 160 allows many multilayer modules 10 to be processed concurrently, thereby saving manufacturing costs.
- thermoplastic adhesive 170 is an adhesive which becomes softer and loses some of its adhesive properties at higher temperatures, thereby allowing the stacked multilayer modules 10 to be subsequently separated from one another, as described more fully below.
- thermoplastic adhesive materials compatible with an embodiment of the invention include, but are not limited to, Ultem® which is available from General Electric Structured Products of Pittsfield, Massachusetts, and SumiOxy® which is available from Occidental Chemical Corporation of Grand Island, New York.
- the thermoplastic adhesive 170 is applied by roller coating onto the segmentation layer sheet 140, then heating the segmentation layer sheet 140 to drive off solvents. Additionally, in certain other embodiments, the thermoplastic adhesive 170 can be applied onto the segmentation layer sheet 140 before the segmentation layer sheet 140 is added to the active layer sheets 120 in the registration tool 150.
- thermoplastic adhesive 170 is applied across the entire top side of the segmentation layer sheet 140, while in other embodiments, the thermoplastic adhesive 170 is applied across a portion of the top side of the segmentation layer sheet 140.
- Persons skilled in the art are able to select appropriate thermoplastic materials and usage parameters compatible with an embodiment of the invention.
- the assembled sheets are laminated together, as signified in Figure 3 by the operational block 270.
- the sheets in the registration tool 150 are locked in place, pressed together, and heated to an elevated temperature to cure the adhesive 50 between the active layer sheets 120 and segmentation layer sheets 140.
- the locking of the layers in the registration tool 150 can be achieved by using suction. Alternatively, the locking and heating of the layers can be achieved by placing the registration tool 150 in an autoclave.
- FIG. 9 schematically illustrates the resulting laminated stack 180 of arrayed multilayer modules 10, with the dicing lines 130 shown as dashed lines.
- each pre-form 160 has a segmentation layer sheet 140 as its top sheet.
- the laminated stack 180 of arrayed multilayer modules 10 is divided into stacks 190 of individual multilayer modules 10. In certain embodiments, this division is performed by cutting the stack 180 of arrayed multilayer modules 10 along the dicing lines 130, with the cutting performed by a plurality of blades held under tension. In certain embodiments, the cutting is performed while the stack 180 of arrayed multilayer modules 10 is held onto the registration tool 150, while in other embodiments, the stack 180 of arrayed multilayer modules 10 is removed from the registration tool 150 before cutting.
- Figure 10 schematically illustrates a resulting stack 190 of individual multilayer modules 10 obtained after dividing the stack 180 of arrayed multilayer modules 10 illustrated in Figure 9.
- the sides 192 of the stack 190 of individual multilayer modules 10 are formed by the edges of the active areas 128 and segmentation areas 148.
- the processing of the stacks 190 of multilayer modules 10, e.g., metallization and laser ablating, can be done more simply and efficiently than for the stacks 190 rather than for the multilayer modules 10 individually.
- the sides 192 of the stack 190 of multilayer modules 10 are prepared and electrically-conductive lines 32 are formed along at least one side 192 of the stack 190 of multilayer modules 10.
- the operational block 290 is separated into sub-blocks in the flowchart of Figure 11.
- the sides 192 of the stack 190 of multilayer modules 10 are cleaned by soaking in a cleaning solution.
- an operational block 520 the sides 192 of the stack 190 of multilayer modules 10 are then lapped to remove excess material, to desmear the material from the sides 192 which was smeared by the cutting process, and to make the sides 192 more smooth.
- the lapping indicated by the operational block 520 also ensures that the electrically-conductive traces 28 of the active layers 20 are exposed on the sides 192 of the stack 190 of multilayer modules 10.
- Persons skilled in the art are able to select an appropriate method of lapping the sides 192 of the stack 190 of multilayer modules 10 compatible with an embodiment of the invention.
- a seed layer of palladium is applied to the sides 192 of the stack 190 of multilayer modules 10.
- One technique compatible with an embodiment of the invention for seeding is barrel plating the stack 190 of multilayer modules 10 using a bath of a palladium-containing solution. This technique, based on standard through-hole plating technology, results in a thin layer of palladium deposited onto the sides 192 of the stack 190. Persons skilled in the art can select an appropriate method of seeding palladium compatible with an embodiment of the invention.
- a thin strike layer of nickel is barrel plated onto the sides 192 of the stack 190 of multilayer modules 10 by an electroless plating process.
- the nickel strike layer is approximately 0.01 mils thick, while in other embodiments, the nickel strike layer is not used.
- Nickel is used in the strike layer because electroless copper has been observed to cause some reaction at the interfaces between the active layers 20, thereby reducing the adhesion between these layers.
- a thin layer of copper is barrel plated onto the nickel strike layer by an electroless plating process.
- the copper layer is approximately 0.15 mils thick.
- the nickel strike layer is not used, the copper layer is plated onto the sides 192 of the stack 190 of multilayer modules 10.
- a thin layer of gold is plated onto the copper layer by an electroless plating process.
- the gold layer is approximately 0.005 mils thick. Gold is solderable and is used to protect the copper layer from oxidizing, thereby becoming less conductive.
- the resulting structure after these metallization procedures is schematically illustrated in Figure 12, in which the stack 190 of multilayer modules 10 is shown to have metallization on all four sides 192.
- the stack 190 of multilayer modules 10 has excess metallic material removed from the sides 192 of the stack 190.
- this removal of excess metallic material is performed by placing the stack 190 in a holding fixture and laser ablating the excess material away from the four sides 192.
- the remaining metallic material corresponds to the electrically-conductive lines 32 on the sides 30 of the multilayer modules 10 which provide electrical connection to the traces 28 of the active layers 20.
- the laser ablation is followed by a cleaning process, as indicated in the operational block 580.
- the resulting structure is schematically illustrated in Figure 13.
- the stack 190 of multilayer modules 10 is segmented into individual multilayer modules 10.
- the stack 190 of multilayer modules 10 is placed in a segmentation tool 600 which comprises a fixture surface 610, a stop 620, a plurality of heating elements 630, and a plurality of pushers 640.
- the stack 190 of multilayer modules 10 is placed against the fixture surface 610 of the segmentation tool 600 and the position of the stop 620 is adjusted to hold the stack 190 in place.
- the plurality of heating elements 630 is configured on one side of the stack 190, and the plurality of pushers 640 are configured on the two sides of the stack 190 which neighbor the side with the heating elements 630, as shown in Figure 14.
- the heating elements 630 are positioned to be aligned with the segmentation layers 40 of the multilayer modules 10.
- the pushers 640 are configured so that one pusher 640 is aligned with each multilayer module 10, and each heating element 630 is aligned with a segmentation layer 40 of a multilayer module 10.
- a single heating element 630 can be used which spans all the segmentation layers 40 of the stack 190.
- multiple heating elements 630 can be positioned on opposite sides of the stack 190 to produce more uniform heating of the thermoplastic adhesive 170.
- a stack 190 is segmented into individual multilayer modules 10 by increasing the temperature of the heating elements 630 to approximately 150° C.
- the thermally-conductive material 44 of the segmentation layers 40 serves to focus the applied heat from the heating elements 630 to the thermoplastic adhesive 170, thereby softening and releasing the thermoplastic adhesive 170.
- the term "releasing" indicates reducing the adhesive properties of the thermoplastic adhesive 170.
- the thermally-conductive material 44 allow a lower heat load to be applied, thereby protecting the active layers 20 from excessive heat which may damage the electronic elements 26 or other features of the multilayer modules 10.
- the pushers 640 on the two sides of the stack 190 are displaced in opposite directions towards the stack 190, thereby displacing the multilayer modules 10 relative to one another in a comb-like manner.
- the stack 190 of multilayer modules 10 is segmented into individual multilayer modules 10. Once the segmentation is complete, the individual multilayer modules 10 are cleaned in an operational block 302 to remove the excess thermoplastic adhesive 170.
- the stacking of the sheets comprising an arrayed module pre-form 160 begins by preparing a segmentation layer sheet 140 and placing it onto the registration tool 150. After applying adhesive 50, the next active layer sheet 120 is stacked onto the surface of the segmentation layer sheet 140 opposite the thermally-conductive material 44. The subsequent active layer sheets 120 are added as described above. Furthermore, the thermoplastic adhesive 170 is applied to the last active layer sheet 120 of an arrayed module pre-form 160 and the next segmentation layer sheet 140 would then be positioned with its thermally-conductive material 44 in contact with the thermoplastic adhesive 170. Using these procedures along with the procedures described above, multilayer modules 10 with segmentation layer 40 as the bottom layer 14 are formed.
- multilayer modules 10 are formed with segmentation layers 40 as both the top layer 12 and bottom layer 14. Such multilayer modules 10 can utilize the segmentation layers 40 as moisture barriers to protect the active layers 20 of the multilayer module 10.
- the stacked multilayer modules 10 have two layers of thermally-conductive material 44 between the multilayer modules 10. Persons skilled in the art can select appropriate stacking orders of the active layer sheets 120, segmentation layer sheets 140, adhesive 50, and thermoplastic adhesive 170 guided by the description herein to fabricate multilayer modules 10 with segmentation layers 40 in the desired locations.
Abstract
Description
Claims
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US949203 | 1997-10-10 | ||
US09/949,512 US6717061B2 (en) | 2001-09-07 | 2001-09-07 | Stacking of multilayer modules |
US949024 | 2001-09-07 | ||
US09/949,024 US6560109B2 (en) | 2001-09-07 | 2001-09-07 | Stack of multilayer modules with heat-focusing metal layer |
US949512 | 2001-09-07 | ||
US09/949,203 US20030049889A1 (en) | 2001-09-07 | 2001-09-07 | Method of manufacturing multilayer modules |
PCT/US2002/028628 WO2003023823A2 (en) | 2001-09-07 | 2002-09-09 | Stacking of multilayer modules |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1436834A2 true EP1436834A2 (en) | 2004-07-14 |
EP1436834A4 EP1436834A4 (en) | 2009-12-02 |
Family
ID=27420722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02798173A Withdrawn EP1436834A4 (en) | 2001-09-07 | 2002-09-09 | Stacking of multilayer modules |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1436834A4 (en) |
AU (1) | AU2002332937A1 (en) |
WO (1) | WO2003023823A2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270261A (en) * | 1991-09-13 | 1993-12-14 | International Business Machines Corporation | Three dimensional multichip package methods of fabrication |
WO1994015358A1 (en) * | 1992-12-24 | 1994-07-07 | Irvine Sensors Corporation | Fabricating stacks of ic chips by segmenting a larger stack |
US5517754A (en) * | 1994-06-02 | 1996-05-21 | International Business Machines Corporation | Fabrication processes for monolithic electronic modules |
US5800761A (en) * | 1996-10-08 | 1998-09-01 | International Business Machines Corporation | Method of making an interface layer for stacked lamination sizing and sintering |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5790380A (en) * | 1995-12-15 | 1998-08-04 | International Business Machines Corporation | Method for fabricating a multiple chip module using orthogonal reorientation of connection planes |
US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
US5781413A (en) * | 1996-09-30 | 1998-07-14 | International Business Machines Corporation | Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations |
-
2002
- 2002-09-09 EP EP02798173A patent/EP1436834A4/en not_active Withdrawn
- 2002-09-09 WO PCT/US2002/028628 patent/WO2003023823A2/en not_active Application Discontinuation
- 2002-09-09 AU AU2002332937A patent/AU2002332937A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270261A (en) * | 1991-09-13 | 1993-12-14 | International Business Machines Corporation | Three dimensional multichip package methods of fabrication |
WO1994015358A1 (en) * | 1992-12-24 | 1994-07-07 | Irvine Sensors Corporation | Fabricating stacks of ic chips by segmenting a larger stack |
US5517754A (en) * | 1994-06-02 | 1996-05-21 | International Business Machines Corporation | Fabrication processes for monolithic electronic modules |
US5800761A (en) * | 1996-10-08 | 1998-09-01 | International Business Machines Corporation | Method of making an interface layer for stacked lamination sizing and sintering |
Non-Patent Citations (1)
Title |
---|
See also references of WO03023823A2 * |
Also Published As
Publication number | Publication date |
---|---|
AU2002332937A1 (en) | 2003-03-24 |
EP1436834A4 (en) | 2009-12-02 |
WO2003023823A2 (en) | 2003-03-20 |
WO2003023823A3 (en) | 2003-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7127807B2 (en) | Process of manufacturing multilayer modules | |
US6560109B2 (en) | Stack of multilayer modules with heat-focusing metal layer | |
US6717061B2 (en) | Stacking of multilayer modules | |
US6803324B2 (en) | Semiconductor device and its manufacturing method | |
JP3908157B2 (en) | Method of manufacturing flip chip type semiconductor device | |
EP0586888B1 (en) | Three-dimensional multichip module | |
JP4906994B2 (en) | Method for transferring ultrathin substrate and method for manufacturing multilayer thin film device using the method | |
EP0450950B1 (en) | A flexible high density interconnect structure | |
EP2469591B1 (en) | Semiconductor device package and method for fabricating the same | |
AU648412B2 (en) | Three-dimensional multichip module systems and methods of fabrication | |
US7923302B2 (en) | Method for manufacturing a semiconductor package | |
KR101944477B1 (en) | Semiconductor device package and method of manufacturing thereof | |
EP2019574B1 (en) | Electronic component-embedded board and method of manufacturing the same | |
KR101494988B1 (en) | Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices | |
US6951811B2 (en) | Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor wafer | |
KR20070019696A (en) | System comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system | |
WO2019222330A2 (en) | Singulated electronic substrates on a flexible or rigid carrier and related methods | |
CN1755927A (en) | Semiconductor device and method of manufacturing semiconductor device | |
US20110216515A1 (en) | Electro device embedded printed circuit board and manufacturing method thereof | |
WO2004064150A1 (en) | Method for manufacturing electronic component mount board and electronic mount board manufactured by this method | |
US20030049889A1 (en) | Method of manufacturing multilayer modules | |
WO2003023823A2 (en) | Stacking of multilayer modules | |
EP1041620A2 (en) | Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device | |
US20220225510A1 (en) | Circuit board and method for manufacturing the same | |
KR100785731B1 (en) | A method of forming an opening or cavity in a substrate for receiving an electronic component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20040407 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: CAMIEN, ANDREW, NELSON Inventor name: OZGUZ, VOLKAN, H. Inventor name: PEPE, ANGEL, ANTONIO Inventor name: YAMAGUCHI, JAMES, SATSUO |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: APROLASE DEVELOPMENT CO., LLC |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20091103 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 3/00 20060101ALI20091028BHEP Ipc: H01L 21/98 20060101ALI20091028BHEP Ipc: H01L 25/10 20060101ALI20091028BHEP Ipc: H01L 25/065 20060101AFI20091028BHEP |
|
17Q | First examination report despatched |
Effective date: 20110118 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150227 |