EP1483816A4 - Header assembly having integrated cooling device - Google Patents

Header assembly having integrated cooling device

Info

Publication number
EP1483816A4
EP1483816A4 EP03707865A EP03707865A EP1483816A4 EP 1483816 A4 EP1483816 A4 EP 1483816A4 EP 03707865 A EP03707865 A EP 03707865A EP 03707865 A EP03707865 A EP 03707865A EP 1483816 A4 EP1483816 A4 EP 1483816A4
Authority
EP
European Patent Office
Prior art keywords
cooling device
header assembly
integrated cooling
integrated
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03707865A
Other languages
German (de)
French (fr)
Other versions
EP1483816A1 (en
Inventor
Paul K Rosenberg
Giorgio Giaretta
Stefano Schiaffino
James Stewart
Rudolf J Hofmeister
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Finisar Corp
Original Assignee
Finisar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/077,067 external-priority patent/US6586678B1/en
Priority claimed from US10/231,395 external-priority patent/US6703561B1/en
Application filed by Finisar Corp filed Critical Finisar Corp
Publication of EP1483816A1 publication Critical patent/EP1483816A1/en
Publication of EP1483816A4 publication Critical patent/EP1483816A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
EP03707865A 2002-02-14 2003-02-11 Header assembly having integrated cooling device Withdrawn EP1483816A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/077,067 US6586678B1 (en) 2002-02-14 2002-02-14 Ceramic header assembly
US77067 2002-02-14
US231395 2002-08-29
US10/231,395 US6703561B1 (en) 2001-09-06 2002-08-29 Header assembly having integrated cooling device
PCT/US2003/004261 WO2003069749A1 (en) 2002-02-14 2003-02-11 Header assembly having integrated cooling device

Publications (2)

Publication Number Publication Date
EP1483816A1 EP1483816A1 (en) 2004-12-08
EP1483816A4 true EP1483816A4 (en) 2006-08-30

Family

ID=27736836

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03707865A Withdrawn EP1483816A4 (en) 2002-02-14 2003-02-11 Header assembly having integrated cooling device

Country Status (6)

Country Link
EP (1) EP1483816A4 (en)
JP (1) JP2005518100A (en)
CN (1) CN100435438C (en)
AU (1) AU2003209132A1 (en)
CA (1) CA2476195A1 (en)
WO (1) WO2003069749A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1605560B1 (en) 2004-02-25 2016-08-03 OSRAM Opto Semiconductors GmbH Lightemitting semiconductor device and method for temperature stabilisation
JP5385116B2 (en) * 2009-12-17 2014-01-08 日本電信電話株式会社 Optical module
EP3410165B1 (en) 2016-02-26 2021-01-06 Huawei Technologies Co., Ltd. Optical assembly packaging structure, optical assembly, optical module and related devices and systems
FR3065348B1 (en) 2017-04-12 2022-06-24 Safran Electronics & Defense ELECTRONIC MODULE WITH IMPROVED PROTECTION AGAINST HUMIDITY
US10374386B1 (en) * 2018-06-07 2019-08-06 Finisar Corporation Chip on carrier

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953006A (en) * 1989-07-27 1990-08-28 Northern Telecom Limited Packaging method and package for edge-coupled optoelectronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL181963C (en) * 1979-06-26 1987-12-01 Philips Nv SEMICONDUCTOR LASER DEVICE.
JPS58145169A (en) * 1982-02-23 1983-08-29 Nec Corp Optical semiconductor device
US4769684A (en) * 1987-07-07 1988-09-06 Rca Inc. Angle mount header
CN2032364U (en) * 1987-09-10 1989-02-08 刘维 Double purpose safe plug and soket (preventing electric shock, explosion protection, anticorrosion, anticollision)
US5212345A (en) * 1992-01-24 1993-05-18 Pulse Engineering, Inc. Self leaded surface mounted coplanar header
US5545846A (en) * 1993-09-30 1996-08-13 Texas Instruments Incorporated Laser bond header

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953006A (en) * 1989-07-27 1990-08-28 Northern Telecom Limited Packaging method and package for edge-coupled optoelectronic device

Also Published As

Publication number Publication date
JP2005518100A (en) 2005-06-16
CN1647334A (en) 2005-07-27
CA2476195A1 (en) 2003-08-21
EP1483816A1 (en) 2004-12-08
WO2003069749A1 (en) 2003-08-21
CN100435438C (en) 2008-11-19
AU2003209132A1 (en) 2003-09-04

Similar Documents

Publication Publication Date Title
TW592347U (en) Cooling device
TW578992U (en) Heat sink assembly
TW545883U (en) Heat dissipating device
TW545884U (en) Heat dissipating assembly
TW586741U (en) Heat sink assembly
TW547707U (en) Heat dissipating device
TW545885U (en) Heat dissipation assembly
TW536139U (en) Dissipating assembly
EP1541830A4 (en) Engine cooling device
EP1688687A4 (en) Cooling device
AU2003288566A8 (en) Deformable-mirror cooling
TW566829U (en) Heat dissipating assembly
EP1637822A4 (en) Cooling device
TW540967U (en) Dissipating assembly
TW444877U (en) Conducted cooling device
EP1483816A4 (en) Header assembly having integrated cooling device
AU2003295133A8 (en) Deformable-mirror cooling
TW577581U (en) Heat sink assembly
TW549485U (en) Heat sink assembly
TW580243U (en) Cooling devices
TW516816U (en) Heat dissipating device
GB0226221D0 (en) Cooling device
GB0212363D0 (en) Cooling device
GB0211514D0 (en) Cooling device
AU149736S (en) An evaporative cooler

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20040909

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO

RIN1 Information on inventor provided before grant (corrected)

Inventor name: HOFMEISTER, RUDOLF, J.

Inventor name: STEWART, JAMES

Inventor name: SCHIAFFINO, STEFANO

Inventor name: GIARETTA, GIORGIO

Inventor name: ROSENBERG, PAUL, K.

A4 Supplementary search report drawn up and despatched

Effective date: 20060728

RIC1 Information provided on ipc code assigned before grant

Ipc: H01S 5/022 20060101ALI20060725BHEP

Ipc: H01L 23/055 20060101AFI20060725BHEP

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: FINISAR CORPORATION

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20081203