EP1502309A4 - Integrated circuit with internal impedance matching circuit - Google Patents
Integrated circuit with internal impedance matching circuitInfo
- Publication number
- EP1502309A4 EP1502309A4 EP03750119A EP03750119A EP1502309A4 EP 1502309 A4 EP1502309 A4 EP 1502309A4 EP 03750119 A EP03750119 A EP 03750119A EP 03750119 A EP03750119 A EP 03750119A EP 1502309 A4 EP1502309 A4 EP 1502309A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- integrated circuit
- transmission line
- die
- package
- internally matched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US427330 | 1995-04-24 | ||
US10/142,250 US6828658B2 (en) | 2002-05-09 | 2002-05-09 | Package for integrated circuit with internal matching |
US142250 | 2002-05-09 | ||
US10/427,330 US6903447B2 (en) | 2002-05-09 | 2003-05-01 | Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
PCT/US2003/014893 WO2003096439A1 (en) | 2002-05-09 | 2003-05-08 | Integrated circuit with internal impedance matching circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1502309A1 EP1502309A1 (en) | 2005-02-02 |
EP1502309A4 true EP1502309A4 (en) | 2008-08-20 |
Family
ID=29423047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03750119A Withdrawn EP1502309A4 (en) | 2002-05-09 | 2003-05-08 | Integrated circuit with internal impedance matching circuit |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1502309A4 (en) |
JP (1) | JP2005524995A (en) |
KR (1) | KR20050006241A (en) |
AU (1) | AU2003267226A1 (en) |
WO (1) | WO2003096439A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4702178B2 (en) | 2006-05-19 | 2011-06-15 | ソニー株式会社 | Semiconductor coupling device, semiconductor element, and high-frequency module |
JP4506722B2 (en) | 2006-05-19 | 2010-07-21 | ソニー株式会社 | Semiconductor element coupling device, semiconductor element, high-frequency module, and semiconductor element coupling method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3713006A (en) * | 1971-02-08 | 1973-01-23 | Trw Inc | Hybrid transistor |
US4200880A (en) * | 1978-03-28 | 1980-04-29 | Microwave Semiconductor Corp. | Microwave transistor with distributed output shunt tuning |
US5376909A (en) * | 1992-05-29 | 1994-12-27 | Texas Instruments Incorporated | Device packaging |
JPH10256850A (en) * | 1997-03-10 | 1998-09-25 | Fujitsu Ltd | Semiconductor device and high frequency power amplifier |
JPH11220344A (en) * | 1994-03-10 | 1999-08-10 | Matsushita Electric Ind Co Ltd | High frequency semiconductor device |
WO2000075990A1 (en) * | 1999-06-07 | 2000-12-14 | Ericsson Inc. | High impedance matched rf power transistor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5557144A (en) * | 1993-01-29 | 1996-09-17 | Anadigics, Inc. | Plastic packages for microwave frequency applications |
JP2541475B2 (en) * | 1993-09-16 | 1996-10-09 | 日本電気株式会社 | Resin mold type semiconductor device |
JPH07240645A (en) * | 1994-03-01 | 1995-09-12 | Fujitsu Ltd | Microwave integrated circuit |
JPH10294418A (en) * | 1997-04-21 | 1998-11-04 | Oki Electric Ind Co Ltd | Semiconductor device |
JP3706533B2 (en) * | 2000-09-20 | 2005-10-12 | 三洋電機株式会社 | Semiconductor device and semiconductor module |
-
2003
- 2003-05-08 AU AU2003267226A patent/AU2003267226A1/en not_active Abandoned
- 2003-05-08 JP JP2004504309A patent/JP2005524995A/en active Pending
- 2003-05-08 KR KR10-2004-7018046A patent/KR20050006241A/en not_active Application Discontinuation
- 2003-05-08 WO PCT/US2003/014893 patent/WO2003096439A1/en active Application Filing
- 2003-05-08 EP EP03750119A patent/EP1502309A4/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3713006A (en) * | 1971-02-08 | 1973-01-23 | Trw Inc | Hybrid transistor |
US4200880A (en) * | 1978-03-28 | 1980-04-29 | Microwave Semiconductor Corp. | Microwave transistor with distributed output shunt tuning |
US5376909A (en) * | 1992-05-29 | 1994-12-27 | Texas Instruments Incorporated | Device packaging |
JPH11220344A (en) * | 1994-03-10 | 1999-08-10 | Matsushita Electric Ind Co Ltd | High frequency semiconductor device |
JPH10256850A (en) * | 1997-03-10 | 1998-09-25 | Fujitsu Ltd | Semiconductor device and high frequency power amplifier |
WO2000075990A1 (en) * | 1999-06-07 | 2000-12-14 | Ericsson Inc. | High impedance matched rf power transistor |
Non-Patent Citations (1)
Title |
---|
See also references of WO03096439A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP1502309A1 (en) | 2005-02-02 |
JP2005524995A (en) | 2005-08-18 |
KR20050006241A (en) | 2005-01-15 |
AU2003267226A1 (en) | 2003-11-11 |
WO2003096439A1 (en) | 2003-11-20 |
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