EP1640320A3 - Method and system for packaging a micromechanical display - Google Patents

Method and system for packaging a micromechanical display Download PDF

Info

Publication number
EP1640320A3
EP1640320A3 EP05255634A EP05255634A EP1640320A3 EP 1640320 A3 EP1640320 A3 EP 1640320A3 EP 05255634 A EP05255634 A EP 05255634A EP 05255634 A EP05255634 A EP 05255634A EP 1640320 A3 EP1640320 A3 EP 1640320A3
Authority
EP
European Patent Office
Prior art keywords
packaging
backplane
transparent substrate
interferometric modulator
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05255634A
Other languages
German (de)
French (fr)
Other versions
EP1640320A2 (en
EP1640320B1 (en
Inventor
William J. Cummings
Brian J. Gally
Lauren Palmateer
Philip D. Floyd
Clarence Chui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm MEMS Technologies Inc
Original Assignee
IDC LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IDC LLC filed Critical IDC LLC
Publication of EP1640320A2 publication Critical patent/EP1640320A2/en
Publication of EP1640320A3 publication Critical patent/EP1640320A3/en
Application granted granted Critical
Publication of EP1640320B1 publication Critical patent/EP1640320B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/045—Optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Abstract

A package structure 800 and method of packaging for an interferometric modulator 830 is described. A transparent substrate 810 having an interferometric modulator 830 formed thereon is shown. A backplane 820 is joined to the transparent substrate 810 with a seal 840 where the interferometric modulator is exposed to the surrounding environment through an opening 850 in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure 800.
EP05255634A 2004-09-27 2005-09-14 Method for packaging a micromechanical display Not-in-force EP1640320B1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US61356304P 2004-09-27 2004-09-27
US61337704P 2004-09-27 2004-09-27
US61332004P 2004-09-27 2004-09-27
US61346704P 2004-09-27 2004-09-27
US61348404P 2004-09-27 2004-09-27
US61395604P 2004-09-27 2004-09-27
US11/150,496 US8124434B2 (en) 2004-09-27 2005-06-10 Method and system for packaging a display

Publications (3)

Publication Number Publication Date
EP1640320A2 EP1640320A2 (en) 2006-03-29
EP1640320A3 true EP1640320A3 (en) 2007-02-28
EP1640320B1 EP1640320B1 (en) 2011-05-04

Family

ID=35207614

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05255634A Not-in-force EP1640320B1 (en) 2004-09-27 2005-09-14 Method for packaging a micromechanical display

Country Status (11)

Country Link
US (2) US8124434B2 (en)
EP (1) EP1640320B1 (en)
JP (2) JP4535386B2 (en)
KR (2) KR101239270B1 (en)
AT (1) ATE508094T1 (en)
AU (1) AU2005203700A1 (en)
CA (1) CA2518805A1 (en)
DE (1) DE602005027785D1 (en)
MX (1) MXPA05010085A (en)
SG (1) SG155970A1 (en)
TW (1) TWI370102B (en)

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US7782522B2 (en) * 2008-07-17 2010-08-24 Qualcomm Mems Technologies, Inc. Encapsulation methods for interferometric modulator and MEMS devices
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US8410690B2 (en) * 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
US8379392B2 (en) * 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
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JP6260080B2 (en) 2013-01-07 2018-01-17 セイコーエプソン株式会社 Wavelength variable interference filter, method for manufacturing wavelength variable interference filter, optical module, and electronic device
KR101446414B1 (en) * 2013-02-20 2014-10-02 희성전자 주식회사 Method for manufacturing a display device
JP6070404B2 (en) * 2013-05-14 2017-02-01 富士通株式会社 MEMS device and method for manufacturing MEMS device
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US20060076637A1 (en) 2006-04-13
EP1640320A2 (en) 2006-03-29
KR20120117716A (en) 2012-10-24
KR20060092895A (en) 2006-08-23
TW200626483A (en) 2006-08-01
ATE508094T1 (en) 2011-05-15
TWI370102B (en) 2012-08-11
JP2010176140A (en) 2010-08-12
KR101239270B1 (en) 2013-03-07
MXPA05010085A (en) 2006-05-17
DE602005027785D1 (en) 2011-06-16
AU2005203700A1 (en) 2006-04-13
CA2518805A1 (en) 2006-03-27
JP2006099095A (en) 2006-04-13
JP4535386B2 (en) 2010-09-01
US20120127556A1 (en) 2012-05-24
SG155970A1 (en) 2009-10-29
EP1640320B1 (en) 2011-05-04

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