EP2359389A4 - Laser ablation tooling via sparse patterned masks - Google Patents

Laser ablation tooling via sparse patterned masks

Info

Publication number
EP2359389A4
EP2359389A4 EP09827940.9A EP09827940A EP2359389A4 EP 2359389 A4 EP2359389 A4 EP 2359389A4 EP 09827940 A EP09827940 A EP 09827940A EP 2359389 A4 EP2359389 A4 EP 2359389A4
Authority
EP
European Patent Office
Prior art keywords
laser ablation
patterned masks
via sparse
tooling via
sparse patterned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09827940.9A
Other languages
German (de)
French (fr)
Other versions
EP2359389A2 (en
Inventor
Thomas R Corrigan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2359389A2 publication Critical patent/EP2359389A2/en
Publication of EP2359389A4 publication Critical patent/EP2359389A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
EP09827940.9A 2008-11-21 2009-10-13 Laser ablation tooling via sparse patterned masks Withdrawn EP2359389A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/275,669 US20100129617A1 (en) 2008-11-21 2008-11-21 Laser ablation tooling via sparse patterned masks
PCT/US2009/060402 WO2010059310A2 (en) 2008-11-21 2009-10-13 Laser ablation tooling via sparse patterned masks

Publications (2)

Publication Number Publication Date
EP2359389A2 EP2359389A2 (en) 2011-08-24
EP2359389A4 true EP2359389A4 (en) 2014-08-20

Family

ID=42196564

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09827940.9A Withdrawn EP2359389A4 (en) 2008-11-21 2009-10-13 Laser ablation tooling via sparse patterned masks

Country Status (6)

Country Link
US (2) US20100129617A1 (en)
EP (1) EP2359389A4 (en)
JP (2) JP2012509194A (en)
KR (1) KR101716908B1 (en)
CN (1) CN102217036B (en)
WO (1) WO2010059310A2 (en)

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US20100129617A1 (en) * 2008-11-21 2010-05-27 Corrigan Thomas R Laser ablation tooling via sparse patterned masks
US20110070398A1 (en) * 2009-09-18 2011-03-24 3M Innovative Properties Company Laser ablation tooling via distributed patterned masks
KR101135537B1 (en) * 2010-07-16 2012-04-13 삼성모바일디스플레이주식회사 Laser irradiation apparatus
CN102789125B (en) * 2012-07-27 2013-11-13 京东方科技集团股份有限公司 Mask plate, mat manufacturing method and LCD panel
US9142778B2 (en) * 2013-11-15 2015-09-22 Universal Display Corporation High vacuum OLED deposition source and system
CN107532275B (en) * 2015-02-05 2019-09-13 迈康尼股份公司 It is shifted forward for induced with laser and the repetition methods of high yield and the donor material shifted forward by reusing multiple target backing material plates or discrete donor dot pattern recycles
WO2018006416A1 (en) * 2016-07-08 2018-01-11 华为技术有限公司 Method and apparatus for performing optical treatment on housing surface
KR20190126780A (en) * 2017-02-09 2019-11-12 유에스 신써틱 코포레이션 Energy processed polycrystalline diamond compacts and related methods
US11097950B2 (en) * 2017-05-15 2021-08-24 Korea Electronics Technology Institute Graphene fabrication method
CN108907482B (en) * 2018-09-26 2024-01-02 无锡先导智能装备股份有限公司 Using method of laser jump type tab cutting and forming device and laser die cutting machine
US11353995B2 (en) * 2019-04-15 2022-06-07 Elo Touch Solutions, Inc. Laser-ablated gradient region of a touchscreen
KR20210142049A (en) 2020-05-15 2021-11-24 삼성디스플레이 주식회사 Display device, mask assembly, apparatus and method for manufacturing a display device

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WO2007029028A1 (en) * 2005-09-06 2007-03-15 Plastic Logic Limited Laser ablation of electronic devices
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WO2009115785A1 (en) * 2008-03-18 2009-09-24 M-Solv Ltd. Method and apparatus for laser processing the surface of a drum

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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010006414A1 (en) * 1998-06-19 2001-07-05 Daniel Gelbart High resolution optical stepper
GB2409765A (en) * 2003-12-29 2005-07-06 Lg Philips Lcd Co Ltd Mask for three-shot sequential lateral solidification
US20060216649A1 (en) * 2005-03-23 2006-09-28 Asml Netherlands B.V. Reduced pitch multiple exposure process
EP1712954A1 (en) * 2005-04-12 2006-10-18 ASML MaskTools B.V. A method, program product and apparatus for performing double exposure lithography
WO2007029028A1 (en) * 2005-09-06 2007-03-15 Plastic Logic Limited Laser ablation of electronic devices
WO2007115028A2 (en) * 2006-03-31 2007-10-11 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
WO2009115785A1 (en) * 2008-03-18 2009-09-24 M-Solv Ltd. Method and apparatus for laser processing the surface of a drum

Also Published As

Publication number Publication date
WO2010059310A2 (en) 2010-05-27
US20170285457A1 (en) 2017-10-05
JP6117881B2 (en) 2017-04-19
KR101716908B1 (en) 2017-03-17
US20100129617A1 (en) 2010-05-27
KR20110095365A (en) 2011-08-24
CN102217036A (en) 2011-10-12
JP2012509194A (en) 2012-04-19
EP2359389A2 (en) 2011-08-24
WO2010059310A3 (en) 2010-07-15
JP2015231638A (en) 2015-12-24
CN102217036B (en) 2014-04-23

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