EP2469596A3 - Light module for a lighting device of a motor vehicle with semiconductor light sources arranged on a silicon substrate - Google Patents

Light module for a lighting device of a motor vehicle with semiconductor light sources arranged on a silicon substrate Download PDF

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Publication number
EP2469596A3
EP2469596A3 EP11192865.1A EP11192865A EP2469596A3 EP 2469596 A3 EP2469596 A3 EP 2469596A3 EP 11192865 A EP11192865 A EP 11192865A EP 2469596 A3 EP2469596 A3 EP 2469596A3
Authority
EP
European Patent Office
Prior art keywords
silicon substrate
semiconductor light
motor vehicle
lighting device
light sources
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11192865.1A
Other languages
German (de)
French (fr)
Other versions
EP2469596A2 (en
Inventor
Martin Gottheil
Michael Hiegler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP2469596A2 publication Critical patent/EP2469596A2/en
Publication of EP2469596A3 publication Critical patent/EP2469596A3/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Abstract

Vorgestellt wird ein Leuchtmodul (12) für eine Beleuchtungseinrichtung (10) eines Kraftfahrzeugs, mit einer Anordnung von mehreren Halbleiterlichtquellen-Chips (14,16,18,20), die auf einer ersten Seite (22) eines Silizium-Substrates (24) angeordnet sind, sowie mit zur Steuerung der Halbleiterlichtquellen dienenden elektronischen Bauelementen, die monolithisch in das Silizium-Substrat (24) integriert sind. Das Leuchtmodul zeichnet sich dadurch aus, dass zumindest ein elektrischer Kontakt des Halbleitermaterials des Halbleiterlichtquellen-Chips (14,16,18,20) über eine zwischen dem Halbleiterlichtquellen-Chip (14,16,18,20) und dem Silizium-Substrat (24) liegende Lötstelle (62) erfolgt, die von einer der ersten Seite (22) gegenüberliegenden zweiten Seite (30) des Silizium-Substrates (24) her durch einen Laserstrahl aufgeschmolzen wurde.

Figure imgaf001
A light module (12) for an illumination device (10) of a motor vehicle is presented, with an arrangement of a plurality of semiconductor light source chips (14, 16, 18, 20) arranged on a first side (22) of a silicon substrate (24) are, as well as serving to control the semiconductor light sources electronic components that are monolithically integrated into the silicon substrate (24). The lighting module is characterized in that at least one electrical contact of the semiconductor material of the semiconductor light source chip (14,16,18,20) via a between the semiconductor light source chip (14,16,18,20) and the silicon substrate (24 ) located soldering point (62) which has been melted by a first side (22) opposite the second side (30) of the silicon substrate (24) ago by a laser beam.
Figure imgaf001
EP11192865.1A 2010-12-23 2011-12-09 Light module for a lighting device of a motor vehicle with semiconductor light sources arranged on a silicon substrate Withdrawn EP2469596A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202010016958U DE202010016958U1 (en) 2010-12-23 2010-12-23 Luminous module for a lighting device of a motor vehicle with arranged on a silicon substrate semiconductor light sources

Publications (2)

Publication Number Publication Date
EP2469596A2 EP2469596A2 (en) 2012-06-27
EP2469596A3 true EP2469596A3 (en) 2014-02-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP11192865.1A Withdrawn EP2469596A3 (en) 2010-12-23 2011-12-09 Light module for a lighting device of a motor vehicle with semiconductor light sources arranged on a silicon substrate

Country Status (2)

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EP (1) EP2469596A3 (en)
DE (1) DE202010016958U1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9347642B2 (en) 2011-09-07 2016-05-24 Terralux, Inc. Faceted optics for illumination devices
US9470406B2 (en) 2012-09-24 2016-10-18 Terralux, Inc. Variable-beam light source and related methods
EP3019788A1 (en) 2013-07-09 2016-05-18 Terralux, Inc. Variable-beam light source and related methods
FR3025859A1 (en) * 2014-09-15 2016-03-18 Valeo Vision LUMINOUS MODULE SUBSTRATE WITH METALLIC TRACK FOR SHIELDING, THERMAL SCREEN AND / OR OPTICAL REFLECTOR
US10072819B2 (en) 2014-10-02 2018-09-11 Ledvance Llc Light source for uniform illumination of a surface
US10036535B2 (en) 2014-11-03 2018-07-31 Ledvance Llc Illumination device with adjustable curved reflector portions
US10405388B2 (en) 2014-12-11 2019-09-03 Ledvance Llc Variable-beam light source with mixing chamber
DE102015224918A1 (en) 2015-12-10 2017-06-14 Automotive Lighting Reutlingen Gmbh Switching arrangement for a light module of a lighting device of a motor vehicle

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2244374A (en) * 1990-05-22 1991-11-27 Stc Plc Radiation beam bonding of semiconductor device contacts
US5481082A (en) * 1993-07-19 1996-01-02 Mitsubishi Denki Kabushiki Kaisha Apparatus and method for die bonding semiconductor element
US20060001055A1 (en) * 2004-02-23 2006-01-05 Kazuhiko Ueno Led and fabrication method of same
WO2006033040A1 (en) * 2004-09-20 2006-03-30 Koninklijke Philips Electronics N.V. Led collimator element with a semiparabolic reflector
US20070170450A1 (en) * 2006-01-20 2007-07-26 Thomas Murphy Package for a light emitting element with integrated electrostatic discharge protection
DE102006040641A1 (en) * 2006-08-30 2008-03-13 Robert Bosch Gmbh light module
US20090267096A1 (en) * 2008-04-25 2009-10-29 Samsung Electronics Co., Ltd. Luminous devices, packages and systems containing the same, and fabricating methods thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2244374A (en) * 1990-05-22 1991-11-27 Stc Plc Radiation beam bonding of semiconductor device contacts
US5481082A (en) * 1993-07-19 1996-01-02 Mitsubishi Denki Kabushiki Kaisha Apparatus and method for die bonding semiconductor element
US20060001055A1 (en) * 2004-02-23 2006-01-05 Kazuhiko Ueno Led and fabrication method of same
WO2006033040A1 (en) * 2004-09-20 2006-03-30 Koninklijke Philips Electronics N.V. Led collimator element with a semiparabolic reflector
US20070170450A1 (en) * 2006-01-20 2007-07-26 Thomas Murphy Package for a light emitting element with integrated electrostatic discharge protection
DE102006040641A1 (en) * 2006-08-30 2008-03-13 Robert Bosch Gmbh light module
US20090267096A1 (en) * 2008-04-25 2009-10-29 Samsung Electronics Co., Ltd. Luminous devices, packages and systems containing the same, and fabricating methods thereof

Also Published As

Publication number Publication date
DE202010016958U1 (en) 2011-06-27
EP2469596A2 (en) 2012-06-27

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