US20010048699A1 - Optical pickup device - Google Patents
Optical pickup device Download PDFInfo
- Publication number
- US20010048699A1 US20010048699A1 US09/845,927 US84592701A US2001048699A1 US 20010048699 A1 US20010048699 A1 US 20010048699A1 US 84592701 A US84592701 A US 84592701A US 2001048699 A1 US2001048699 A1 US 2001048699A1
- Authority
- US
- United States
- Prior art keywords
- short
- optical pickup
- pickup device
- housing
- laser diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
Definitions
- the present invention relates to an optical pickup device.
- FIG. 4 shows a circuit diagram of a laser diode 1 and a short-cut terminal 2 which are adopted in a conventional optical pickup device.
- the optical pickup device not only is it necessary to keep the electrostatic breakdown of the laser diode prevented in its manufacturing line, but it is also necessary to keep the electrostatic breakdown of the laser diode prevented in the processing of mounting the optical pickup device in an apparatus to which the optical pickup device is set.
- the aforementioned short-cut terminal is conventionally shortcircuited by soldering both during the passage of the manufacturing line and after its mounting in the setting apparatus.
- JP-A-5-335689 discloses an optical pickup device in which the terminals of a semiconductor laser are connected in advance in a shortcircuited state, and the shortcircuiting connection is broken when a voltage is applied to the semiconductor laser.
- the invention has been devised in view of the above-described problems, and its object is to provide an optical pickup device which is capable of overcoming the problem concerning the burning of the short-cut terminal, the problem concerning the operational efficiency at the time of soldering, and the problem concerning the coming off of the laser unit.
- an optical pickup device in which a short-cutting terminal is interposed between terminals of a laser diode mounted in a housing, characterized in that a first and a second short-cutting terminal are interposed in parallel between the terminals of the laser diode.
- the electrostatic breakdown of the laser diode can be prevented by shortcircuiting the other short-cut terminal by solder.
- the two short-cut terminals it is possible to effect soldering by selecting one which can be easily soldered, and effect soldering by selecting one which can be soldered without reversing the housing. Therefore, it becomes possible to readily perform the soldering operation of the short-cut terminals in the manufacturing line and in the stage after the mounting of the optical pickup device in the setting apparatus.
- first short-cut terminal and the second short-cut terminal be respectively disposed on two different surfaces of the housing.
- first short-cut terminal be disposed on a side surface of the housing, and that the second short-cut terminal be disposed on a rear surface of the housing.
- FIG. 1 is a side elevational view of an optical pickup device in accordance with an embodiment of the invention.
- FIG. 2 is a view taken in the direction of arrow II in FIG. 1;
- FIG. 3 is a circuit diagram of a laser diode and two short-cut terminals which are adopted in the optical pickup device in accordance with the embodiment;
- FIG. 4 is a circuit diagram of a laser diode and a short-cut terminal which are adopted in a conventional optical pickup device.
- FIG. 1 is a side elevational view of an optical pickup device
- FIG. 2 is a view taken in the direction of arrow II in FIG. 1.
- reference numeral 10 denotes a housing; 20 , a shield cover surrounding a photodiode mounted in the housing 10 ; and 30 , a flexible wiring board.
- a first short-cut terminal 40 for soldering is disposed on a side surface 12 of the housing 10 as shown in FIG. 1, while a second short-cut terminal 50 for soldering is disposed on a rear surface 13 of the housing 10 as shown in FIG. 2.
- FIG. 3 shows a circuit diagram of a laser diode 1 and the first and second two short-cut terminals 40 and 50 which are adopted in the optical pickup device in accordance with this embodiment.
- the first and second two short-cut terminals 40 and 50 are interposed in parallel between the terminals of the laser diode 1 .
- the electrostatic breakdown of the laser diode 1 is prevented by soldering and shortcircuiting in advance one of the first and second short-cut terminals 40 and 50 .
- the electrostatic breakdown of the laser diode 1 can be prevented by soldering and shortcircuiting the second short-cut terminal 50 .
- the electrostatic breakdown of the laser diode 1 can be prevented by soldering and shortcircuiting the first short-cut terminal 40 .
- the electrostatic breakdown of the laser diode is prevented by soldering and shortcircuiting the first short-cut terminal 40 which is disposed on the side surface 12 of the housing 10 and which can be easily soldered.
- the electrostatic breakdown of the laser diode can be prevented by soldering and shortcircuiting the second short-cut terminal 50 disposed on the rear surface 13 of the housing 10 where the soldering work is not hampered by other component parts on the setting apparatus side.
Abstract
In an optical pickup device, a first and a second short-cutting terminal 40 and 50 are interposed in parallel between terminals of a laser diode 1. The first short-cut terminal 40 is disposed on a side surface of a housing. The second short-cut terminal 50 is disposed on a rear surface of the housing.
Description
- 1. Field of the Invention
- The present invention relates to an optical pickup device.
- 2. Description of the Related Art
- In an optical pickup device in which a laser diode is mounted in a housing, a shortcut terminal for soldering is interposed between the terminals of the laser diode so as to prevent the electrostatic breakdown of the laser diode. FIG. 4 shows a circuit diagram of a
laser diode 1 and a short-cut terminal 2 which are adopted in a conventional optical pickup device. - In the conventional optical pickup device having the circuit shown in FIG. 4, the electrostatic breakdown of the
laser diode 1 is prevented by soldering the short-cut terminal 2 in advance for shortcircuiting. - With respect to the optical pickup device, not only is it necessary to keep the electrostatic breakdown of the laser diode prevented in its manufacturing line, but it is also necessary to keep the electrostatic breakdown of the laser diode prevented in the processing of mounting the optical pickup device in an apparatus to which the optical pickup device is set. For this purpose, when the laser diode is in an ungrounded state, the aforementioned short-cut terminal is conventionally shortcircuited by soldering both during the passage of the manufacturing line and after its mounting in the setting apparatus.
- In addition, JP-A-5-335689 discloses an optical pickup device in which the terminals of a semiconductor laser are connected in advance in a shortcircuited state, and the shortcircuiting connection is broken when a voltage is applied to the semiconductor laser.
- However, in the case where the short-
cut terminal 2 shown in FIG. 4 is disposed on the side surface of the housing of the optical pickup device, although the operation of soldering and shortcircuiting the short-cut terminal 2 can be effected easily in the manufacturing line where the optical pickup devices are handled as single pieces, after the mounting of the optical pickup device in the setting apparatus, there has been a problem in that the other component parts on the setting apparatus side get in the way, and it is not easy to bring a soldering iron close to the short-cut terminal 2 disposed on the side surface of the housing, causing a decline in the operational efficiency at the time of soldering. - To cope with this problem, it is conceivable to dispose the short-
cut terminal 2 on the rear surface of the housing of the optical pickup device. In this case, it is easy to solder and shortcircuit the short-cut terminal 2 after mounting the optical pickup device in the setting apparatus; however, in the manufacturing line where the optical pickup devices are handled as single pieces, there has arisen such a problem that, when the housing is reversed and the short-cut terminal on the rear surface is soldered, a lens unit attached by being merely inserted in a column on an obverse surface side of the housing becomes possibly dislocated from the column and comes off. - Furthermore, since only one short-cut terminal is conventionally provided, there has been a problem in that if the short-cut terminal burns, the optical pickup unit itself becomes unusable.
- The invention has been devised in view of the above-described problems, and its object is to provide an optical pickup device which is capable of overcoming the problem concerning the burning of the short-cut terminal, the problem concerning the operational efficiency at the time of soldering, and the problem concerning the coming off of the laser unit.
- To achieve the above object, according to the invention, there is provided an optical pickup device in which a short-cutting terminal is interposed between terminals of a laser diode mounted in a housing, characterized in that a first and a second short-cutting terminal are interposed in parallel between the terminals of the laser diode.
- According to this optical pickup device, in case where one short-cut terminal has burned, the electrostatic breakdown of the laser diode can be prevented by shortcircuiting the other short-cut terminal by solder. In addition, of the two short-cut terminals, it is possible to effect soldering by selecting one which can be easily soldered, and effect soldering by selecting one which can be soldered without reversing the housing. Therefore, it becomes possible to readily perform the soldering operation of the short-cut terminals in the manufacturing line and in the stage after the mounting of the optical pickup device in the setting apparatus.
- In this invention, it is preferred that the first short-cut terminal and the second short-cut terminal be respectively disposed on two different surfaces of the housing. In addition, it is preferred that the first short-cut terminal be disposed on a side surface of the housing, and that the second short-cut terminal be disposed on a rear surface of the housing. Through these arrangements as well, the above-described advantages ca be offered.
- FIG. 1 is a side elevational view of an optical pickup device in accordance with an embodiment of the invention;
- FIG. 2 is a view taken in the direction of arrow II in FIG. 1;
- FIG. 3 is a circuit diagram of a laser diode and two short-cut terminals which are adopted in the optical pickup device in accordance with the embodiment;
- FIG. 4 is a circuit diagram of a laser diode and a short-cut terminal which are adopted in a conventional optical pickup device.
- Now, a description will be given in more detail of an embodiment of the invention with reference to the accompanying drawings.
- FIG. 1 is a side elevational view of an optical pickup device, and FIG. 2 is a view taken in the direction of arrow II in FIG. 1. In these drawings,
reference numeral 10 denotes a housing; 20, a shield cover surrounding a photodiode mounted in thehousing 10; and 30, a flexible wiring board. In this optical pickup device, a first short-cut terminal 40 for soldering is disposed on aside surface 12 of thehousing 10 as shown in FIG. 1, while a second short-cut terminal 50 for soldering is disposed on arear surface 13 of thehousing 10 as shown in FIG. 2. - FIG. 3 shows a circuit diagram of a
laser diode 1 and the first and second two short-cut terminals cut terminals laser diode 1. In the optical pickup device having the circuit shown in FIG. 3, the electrostatic breakdown of thelaser diode 1 is prevented by soldering and shortcircuiting in advance one of the first and second short-cut terminals - Accordingly, in case where the first short-
cut terminal 40 has burned, the electrostatic breakdown of thelaser diode 1 can be prevented by soldering and shortcircuiting the second short-cut terminal 50. On the other hand, in case where the second short-cut terminal 50 has burned, the electrostatic breakdown of thelaser diode 1 can be prevented by soldering and shortcircuiting the first short-cut terminal 40. - In addition, in a manufacturing line where the optical pickup devices are handled as single pieces, the electrostatic breakdown of the laser diode is prevented by soldering and shortcircuiting the first short-
cut terminal 40 which is disposed on theside surface 12 of thehousing 10 and which can be easily soldered. After the optical pickup device is mounted in a setting apparatus, the electrostatic breakdown of the laser diode can be prevented by soldering and shortcircuiting the second short-cut terminal 50 disposed on therear surface 13 of thehousing 10 where the soldering work is not hampered by other component parts on the setting apparatus side. It should be noted that after the optical pickup device is mounted in the setting apparatus, since a cover and the like on the setting apparatus side are disposed on the lens unit described at the beginning, even if thehousing 10 is reversed together with the setting apparatus, a situation does not occur in which the lens unit becomes dislocated and comes off the column described at the beginning. - It should be noted that in the manufacturing line of the optical pickup device and in the stage after the incorporation of the optical pickup device into the setting apparatus, when the
laser diode 1 is grounded, since it is unnecessary to keep both first and second short-cut terminals laser diode 1 in an insulated state. - As described above, in accordance with this invention, with the optical pickup device it is possible to overcome the problem concerning the burning of the short-cut terminal, the problem concerning the operational efficiency at the time of soldering, and the problem concerning the coming off of the laser unit which have been described at the beginning.
Claims (3)
1. An optical pickup device, comprising:
a housing;
a laser diode having terminals and mounted in said housing;
first and second short-cutting terminals interposed in parallel between the terminals of said laser diode.
2. The optical pickup device according to , wherein said first short-cut terminal and said second short-cut terminal are disposed on two different surfaces of said housing, respectively.
claim 1
3. The optical pickup device according to , wherein said first short-cut terminal is disposed on a side surface of said housing, and said second short-cut terminal is disposed on a rear surface of said housing.
claim 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/689,341 US6997370B2 (en) | 2000-05-16 | 2003-10-20 | Optical pickup device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000003244U JP3073273U (en) | 2000-05-16 | 2000-05-16 | Optical pickup device |
JPU.2000-003244 | 2000-05-16 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/689,341 Continuation US6997370B2 (en) | 2000-05-16 | 2003-10-20 | Optical pickup device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20010048699A1 true US20010048699A1 (en) | 2001-12-06 |
Family
ID=18532223
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/845,927 Abandoned US20010048699A1 (en) | 2000-05-16 | 2001-04-30 | Optical pickup device |
US10/689,341 Expired - Lifetime US6997370B2 (en) | 2000-05-16 | 2003-10-20 | Optical pickup device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/689,341 Expired - Lifetime US6997370B2 (en) | 2000-05-16 | 2003-10-20 | Optical pickup device |
Country Status (3)
Country | Link |
---|---|
US (2) | US20010048699A1 (en) |
JP (1) | JP3073273U (en) |
CN (1) | CN1172300C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5355235B2 (en) * | 2009-06-09 | 2013-11-27 | アルパイン株式会社 | Optical electronics |
CN102576554A (en) * | 2010-06-16 | 2012-07-11 | 三洋电机株式会社 | Optical pickup device, optical disk device, and method of producing same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3558974A (en) * | 1968-04-30 | 1971-01-26 | Gen Electric | Light-emitting diode array structure |
US5293403A (en) * | 1992-09-30 | 1994-03-08 | The Unites States Of America As Represented By The Secretary Of The Navy | Pulse discharge laser with passive arc protection |
US5350946A (en) * | 1992-06-29 | 1994-09-27 | Fuji Electric Co., Ltd. | Semiconductor device with correct case placement feature |
US5444727A (en) * | 1992-10-05 | 1995-08-22 | France Telecom | Laser head |
US5616955A (en) * | 1993-04-23 | 1997-04-01 | Fuji Electric Co., Ltd. | Power transistor module wiring structure |
US5936264A (en) * | 1996-11-15 | 1999-08-10 | Rohm Co., Ltd. | Mounting technique for a chip light emitting device |
US5953222A (en) * | 1996-06-18 | 1999-09-14 | Kabushiki Kaisha Toshiba | Neutral point clamped converter |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3532967A (en) * | 1968-01-23 | 1970-10-06 | Mallory & Co Inc P R | Testing device for circuit breakers and electrical components associated therewith |
US4683422A (en) * | 1985-09-20 | 1987-07-28 | Goodson David R | Low voltage continuity tester |
JPH05335689A (en) * | 1992-06-01 | 1993-12-17 | Seiko Epson Corp | Connecting structure of flexible wiring board |
US5917795A (en) * | 1995-04-28 | 1999-06-29 | Mitsumi Electric Co., Ltd. | Disk device having a drive unit and a cam plate which moves up and down relative to a disk holder for providing a thin structure |
JPH09231598A (en) * | 1996-02-21 | 1997-09-05 | Sony Corp | Optical pickup device |
-
2000
- 2000-05-16 JP JP2000003244U patent/JP3073273U/en not_active Expired - Lifetime
-
2001
- 2001-04-30 US US09/845,927 patent/US20010048699A1/en not_active Abandoned
- 2001-05-14 CN CNB011176849A patent/CN1172300C/en not_active Expired - Fee Related
-
2003
- 2003-10-20 US US10/689,341 patent/US6997370B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3558974A (en) * | 1968-04-30 | 1971-01-26 | Gen Electric | Light-emitting diode array structure |
US5350946A (en) * | 1992-06-29 | 1994-09-27 | Fuji Electric Co., Ltd. | Semiconductor device with correct case placement feature |
US5293403A (en) * | 1992-09-30 | 1994-03-08 | The Unites States Of America As Represented By The Secretary Of The Navy | Pulse discharge laser with passive arc protection |
US5444727A (en) * | 1992-10-05 | 1995-08-22 | France Telecom | Laser head |
US5616955A (en) * | 1993-04-23 | 1997-04-01 | Fuji Electric Co., Ltd. | Power transistor module wiring structure |
US5953222A (en) * | 1996-06-18 | 1999-09-14 | Kabushiki Kaisha Toshiba | Neutral point clamped converter |
US5936264A (en) * | 1996-11-15 | 1999-08-10 | Rohm Co., Ltd. | Mounting technique for a chip light emitting device |
Also Published As
Publication number | Publication date |
---|---|
US6997370B2 (en) | 2006-02-14 |
CN1172300C (en) | 2004-10-20 |
JP3073273U (en) | 2000-11-14 |
US20040085653A1 (en) | 2004-05-06 |
CN1334559A (en) | 2002-02-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FUNAI ELECTRIC CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HARADA, SUEHIRO;REEL/FRAME:011749/0916 Effective date: 20010409 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |