US20030136545A1 - Heat sink for heat-susceptible electronic devices - Google Patents

Heat sink for heat-susceptible electronic devices Download PDF

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Publication number
US20030136545A1
US20030136545A1 US10/050,817 US5081702A US2003136545A1 US 20030136545 A1 US20030136545 A1 US 20030136545A1 US 5081702 A US5081702 A US 5081702A US 2003136545 A1 US2003136545 A1 US 2003136545A1
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United States
Prior art keywords
heat
heat sink
fins
electronic devices
lateral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/050,817
Inventor
Yu-sen Lin
Pei-Ching Lin
Chun-ming Shih
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Individual
Original Assignee
Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to US10/050,817 priority Critical patent/US20030136545A1/en
Publication of US20030136545A1 publication Critical patent/US20030136545A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/08—Fins with openings, e.g. louvers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink for heat-liable electronic devices, and more particularly, to one having provided multiples of lateral holes in each vertical fin to guide air currents for better heat dissipation effects.
  • the prior art of a heat sink as illustrated in FIG. 7 is essentially composed of a base (B) made of aluminum with excellent heat conduction performance that holds flush with the top surface of a chip (A), multiples of fins (B 1 ) vertically provided with a certain spacing on and integrated with the base (B), and a mini fan (C) provided over the fins (B 1 ) to force the heat transferred by the base (B) from the chip (A) and preliminarily dissipated by the large area of the fins (B 1 ) that contacts the air.
  • heat transfer and air current guidance structures are two critical elements that determine the efficiency of the heat sink.
  • the fins (B) in the prior art are arranged in one direction and there is the absence of mutually communicated longitudinal troughs. Therefore, the air current is guided only in one direction.
  • such heat sink is not an ideal design as it provides only one-way air current guidance thus to restrict improvement of heat dissipation efficiency.
  • the primary purpose of the present invention is to provide a heat sink with improved heat dissipation efficiency for heat-liable electronic devices.
  • lateral holes are provided in each fin vertically disposed on the heat sink to separately form a lateral passage in relation with longitudinal troughs to guide air currents in various directions.
  • FIG. 1 is a perspective view showing a structure of the present invention
  • FIG. 2 is a view showing an appearance of the present invention in use
  • FIG. 3 is a sectional view and air current flowing direction of the present invention.
  • FIG. 4 is a schematic view showing a preferred embodiment derived from the holes provided in heat sink fins of the present invention.
  • FIG. 5 is a schematic view showing another preferred embodiment varied from the holes provided in heat sink fins of the present invention.
  • FIG. 6 is a view of another preferred embodiment of the present invention.
  • FIG. 7 is a perspective view showing a prior art.
  • a heat sink of the present invention comprises multiples of vertical heat sink fins ( 2 ) separating from one another for a certain spacing on a body ( 1 ) of the heat sink.
  • the fins ( 2 ) are fixed to the body ( 1 ) of the heat sink by having a dovetail ( 21 ) provided to the lower end of each fin ( 2 ) inserted into a dovetail groove ( 11 ) on the body ( 1 ) of the heat sink.
  • Multiples of holes ( 22 ) are provided laterally in each of the fins ( 2 ) disposed on the body ( 1 ) of the heat sink to separately form a lateral passage in relation with a longitudinal trough defined by abutted fins to guide air currents flowing in various directions.
  • a mini fan ( 4 ) is provided at the top of the fins ( 2 ) of the heat sink.
  • Bolts ( 5 ) used to fasten the mini fan ( 4 ) penetrate into where between two abutted fins ( 2 ) for the bolts ( 5 ) to bite the fins to hold the mini fan ( 4 ) in position.
  • the mini fan ( 4 ) operates, air current flows upward due to the forced heat dissipating wind velocity. The heat is carried away through longitudinal troughs defined by the longitudinally disposed fins ( 2 ).
  • the lateral passages formed by the lateral holes ( 22 ) provided in each of the fins ( 2 ) in relation to the longitudinal troughs also guide air currents in various directions to expand the range of heat dissipation, thus to improve the heat dissipation efficiency of the heat sink.
  • a flange ( 23 ) by punching is formed on one side of each of the lateral holes ( 22 ) in each fin ( 2 ) so to increase the area of the fin ( 2 ) to contact the air for further improvement of the heating dissipation effects.
  • multiples of lateral holes ( 22 A) are made with opening upper ends ( 22 A) at the top of each fin ( 2 ) and each lateral hole ( 22 A) is punched to form a flange ( 23 A) at its one side.
  • an abutting end ( 24 ) horizontally extends from the lower end of each of the fins ( 2 ) is provided to hold against the side surface at the top of the body ( 1 ) of the heat sink. Then the abutting end ( 24 ) is welded to the top of the body ( 1 ) of the heat sink so to fix the fins ( 2 ) to the body ( 1 ) of the heat sink. Provided, however, that the abutting end ( 24 ) is not necessarily provided since the lower end of each of the fins ( 2 ) can be forthwith welded to the body ( 1 ) of the heat sink.
  • lateral holes ( 22 ) and ( 22 A) disclosed in the foresaid preferred embodiments shall not restrict the feasible shape of the lateral holes within the teaching of the present invention.
  • a lateral hole with any other geometric form can be used in the preferred embodiment of the present invention.
  • the present invention by providing an additional passage defined by multiples of lateral holes provided in each fin of a heat sink and longitudinally disposed fins to allow expanded conduction of air currents in various directions for increasing heat dissipation effects, thus for improved heat dissipation efficiency in general of the heat sink compared with the prior art, relates to a progressive, practical and innovative structure of the heat sink.

Abstract

A heat-sink for heat-liable electronic devices provides multiples of lateral holes in each vertical fin to separately create a lateral passage in relation with longitudinal troughs to guide air currents flowing in various directions to boost the air conduction thus to improve heat dissipation effects.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention [0001]
  • The present invention relates to a heat sink for heat-liable electronic devices, and more particularly, to one having provided multiples of lateral holes in each vertical fin to guide air currents for better heat dissipation effects. [0002]
  • (b) Description of the Prior Art [0003]
  • More compact CPU and faster operation rate have led to significantly reduced operation rate time required to yield better application efficiency of the computer thanks to advanced development of IC process. However, as a result of faster operation rate, more heat is generated due to upgraded time clock, and faster heat dissipation for the CPU is required. Accordingly, the performance of the adapted heat sink becomes more important as the CPU chip is smaller and the process rate is faster, or the computer is vulnerable to break down since the CPU may become unreliable if the heat fails to be dissipated in time. In such case, the faster process rate of the CPU means nothing at all. Generally, a heat sink is provided to the CPU chip to guide and to dissipate the heat generated by the CPU. Therefore, better heat sinking capability becomes crucial to cope with the much higher temperature rise resulted from upgraded time clock of the CPU to help secure a reliable operation of the CPU. [0004]
  • The prior art of a heat sink as illustrated in FIG. 7 is essentially composed of a base (B) made of aluminum with excellent heat conduction performance that holds flush with the top surface of a chip (A), multiples of fins (B[0005] 1) vertically provided with a certain spacing on and integrated with the base (B), and a mini fan (C) provided over the fins (B1) to force the heat transferred by the base (B) from the chip (A) and preliminarily dissipated by the large area of the fins (B1) that contacts the air.
  • However, heat transfer and air current guidance structures are two critical elements that determine the efficiency of the heat sink. The fins (B) in the prior art are arranged in one direction and there is the absence of mutually communicated longitudinal troughs. Therefore, the air current is guided only in one direction. In general, such heat sink is not an ideal design as it provides only one-way air current guidance thus to restrict improvement of heat dissipation efficiency. [0006]
    • SUMMARY OF THE INVENTION
  • The primary purpose of the present invention is to provide a heat sink with improved heat dissipation efficiency for heat-liable electronic devices. To achieve the purpose, lateral holes are provided in each fin vertically disposed on the heat sink to separately form a lateral passage in relation with longitudinal troughs to guide air currents in various directions.[0007]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view showing a structure of the present invention; [0008]
  • FIG. 2 is a view showing an appearance of the present invention in use; [0009]
  • FIG. 3 is a sectional view and air current flowing direction of the present invention; [0010]
  • FIG. 4 is a schematic view showing a preferred embodiment derived from the holes provided in heat sink fins of the present invention; [0011]
  • FIG. 5 is a schematic view showing another preferred embodiment varied from the holes provided in heat sink fins of the present invention; [0012]
  • FIG. 6 is a view of another preferred embodiment of the present invention; and [0013]
  • FIG. 7 is a perspective view showing a prior art. [0014]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIG. 1, a heat sink of the present invention comprises multiples of vertical heat sink fins ([0015] 2) separating from one another for a certain spacing on a body (1) of the heat sink. The fins (2) are fixed to the body (1) of the heat sink by having a dovetail (21) provided to the lower end of each fin (2) inserted into a dovetail groove (11) on the body (1) of the heat sink.
  • Multiples of holes ([0016] 22) are provided laterally in each of the fins (2) disposed on the body (1) of the heat sink to separately form a lateral passage in relation with a longitudinal trough defined by abutted fins to guide air currents flowing in various directions.
  • To dissipate the heat generated from a CPU chip ([0017] 3) as illustrated in FIGS. 2 and 3, a mini fan (4) is provided at the top of the fins (2) of the heat sink. Bolts (5) used to fasten the mini fan (4) penetrate into where between two abutted fins (2) for the bolts (5) to bite the fins to hold the mini fan (4) in position. Once the mini fan (4) operates, air current flows upward due to the forced heat dissipating wind velocity. The heat is carried away through longitudinal troughs defined by the longitudinally disposed fins (2). Furthermore, the lateral passages formed by the lateral holes (22) provided in each of the fins (2) in relation to the longitudinal troughs also guide air currents in various directions to expand the range of heat dissipation, thus to improve the heat dissipation efficiency of the heat sink.
  • In another feasible pattern derived from the present invention as illustrated in FIG. 4, a flange ([0018] 23) by punching is formed on one side of each of the lateral holes (22) in each fin (2) so to increase the area of the fin (2) to contact the air for further improvement of the heating dissipation effects.
  • Furthermore, in another preferred embodiment as illustrated in FIG. 5, multiples of lateral holes ([0019] 22A) are made with opening upper ends (22A) at the top of each fin (2) and each lateral hole (22A) is punched to form a flange (23A) at its one side.
  • Now referring to FIG. 6, an abutting end ([0020] 24) horizontally extends from the lower end of each of the fins (2) is provided to hold against the side surface at the top of the body (1) of the heat sink. Then the abutting end (24) is welded to the top of the body (1) of the heat sink so to fix the fins (2) to the body (1) of the heat sink. Provided, however, that the abutting end (24) is not necessarily provided since the lower end of each of the fins (2) can be forthwith welded to the body (1) of the heat sink.
  • It is to be noted that the lateral holes ([0021] 22) and (22A) disclosed in the foresaid preferred embodiments shall not restrict the feasible shape of the lateral holes within the teaching of the present invention. A lateral hole with any other geometric form can be used in the preferred embodiment of the present invention.
  • As disclosed above, the present invention by providing an additional passage defined by multiples of lateral holes provided in each fin of a heat sink and longitudinally disposed fins to allow expanded conduction of air currents in various directions for increasing heat dissipation effects, thus for improved heat dissipation efficiency in general of the heat sink compared with the prior art, relates to a progressive, practical and innovative structure of the heat sink. [0022]

Claims (3)

I claim,
1. A heat sink for heat-liable electronic devices comprising multiples of vertical fins separating from one another for a certain spacing being provided on a body of the heat sink characterized by that:
multiples of holes being laterally provided in each of said fins provided on the body of the heat sink to separately define a lateral passage in related to longitudinally troughs formed between abutted fins for guiding air currents flowing in various directions.
2. A heat sink for heat-liable electronic devices as claimed in claim 1, wherein, a flange is formed by punching on one side of each of said lateral holes provided in each of said fins.
3. A heat sink for heat-liable electronic devices as claimed in claim 1, wherein, each said lateral hole is formed an opening at an upper end of each of said fins.
US10/050,817 2002-01-18 2002-01-18 Heat sink for heat-susceptible electronic devices Abandoned US20030136545A1 (en)

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US10/050,817 US20030136545A1 (en) 2002-01-18 2002-01-18 Heat sink for heat-susceptible electronic devices

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US10/050,817 US20030136545A1 (en) 2002-01-18 2002-01-18 Heat sink for heat-susceptible electronic devices

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040244959A1 (en) * 2003-06-05 2004-12-09 Chao-Nan Chien Cooling fin structure and fin assembly
US20050072563A1 (en) * 2003-10-03 2005-04-07 Wang Chin Wen Heat sink structure
US20050117293A1 (en) * 2003-10-14 2005-06-02 Seiko Epson Corporation Reinforcing structure, display device, and electronic apparatus
US20050199368A1 (en) * 2004-03-11 2005-09-15 Gonzales Christopher A. Laminated fin heat sink for electronic devices
US20060120046A1 (en) * 2004-12-03 2006-06-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20060237166A1 (en) * 2005-04-22 2006-10-26 Otey Robert W High Efficiency Fluid Heat Exchanger and Method of Manufacture
US20060250776A1 (en) * 2005-05-05 2006-11-09 Abul-Haj Roxanne E Heatsink method and apparatus
US20070272438A1 (en) * 2006-05-08 2007-11-29 Gilliland Don A 3D checkerboard perforation pattern for increased shielding effectiveness
US20070297140A1 (en) * 2006-06-26 2007-12-27 International Business Machines Corporation Modular heat sink fin modules for cpu
EP1923914A1 (en) * 2005-08-11 2008-05-21 Mitsubishi Denki Kabushiki Kaisha Heat sink and method of producing the same
US20090139693A1 (en) * 2007-11-30 2009-06-04 University Of Hawaii Two phase micro-channel heat sink
US20100193162A1 (en) * 2009-02-05 2010-08-05 Wistron Corporation Heat dissipation device
US20110232885A1 (en) * 2010-03-26 2011-09-29 Kaslusky Scott F Heat transfer device with fins defining air flow channels
US20120211214A1 (en) * 2010-12-09 2012-08-23 Panasonic Avionics Corporation Heatsink Device and Method
US20120216996A1 (en) * 2011-02-25 2012-08-30 Asia Vital Components Co., Ltd. Thermal module and method of manufacturing same
ITMI20112332A1 (en) * 2011-12-21 2013-06-22 Bussolari Veronica HEAT SINK WITH HIGH RADIANT EFFICIENCY.
US20150305137A1 (en) * 2012-10-22 2015-10-22 Thomson Licensing Electronic device with combination heat sink/blower or fan assembly having air duct
CN107278093A (en) * 2017-07-24 2017-10-20 成都希塔科技有限公司 Porous type auxiliary radiating device
JP2018009465A (en) * 2016-07-12 2018-01-18 日本車輌製造株式会社 Engine generator
CN109443070A (en) * 2018-12-11 2019-03-08 江苏宏远管业有限公司 A kind of special LNG air accumulator radiation aluminium fin
US11073336B2 (en) * 2019-03-29 2021-07-27 Jess-Link Products Co., Ltd. Shell heat dissipating structure of small form-factor pluggable transceiver
TWI752800B (en) * 2020-01-29 2022-01-11 訊凱國際股份有限公司 Heat exchanger fin, heat exchanger and method for manufacturing heat exchanger fin
US20220290928A1 (en) * 2020-01-13 2022-09-15 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing method of the same

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040244959A1 (en) * 2003-06-05 2004-12-09 Chao-Nan Chien Cooling fin structure and fin assembly
US20050072563A1 (en) * 2003-10-03 2005-04-07 Wang Chin Wen Heat sink structure
US20050117293A1 (en) * 2003-10-14 2005-06-02 Seiko Epson Corporation Reinforcing structure, display device, and electronic apparatus
US7352582B2 (en) * 2003-10-14 2008-04-01 Seiko Epson Corporation Reinforcing structure, display device, and electronic apparatus
US20050199368A1 (en) * 2004-03-11 2005-09-15 Gonzales Christopher A. Laminated fin heat sink for electronic devices
US7269010B2 (en) * 2004-12-03 2007-09-11 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20060120046A1 (en) * 2004-12-03 2006-06-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20060237166A1 (en) * 2005-04-22 2006-10-26 Otey Robert W High Efficiency Fluid Heat Exchanger and Method of Manufacture
US20060250776A1 (en) * 2005-05-05 2006-11-09 Abul-Haj Roxanne E Heatsink method and apparatus
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
US8371367B2 (en) 2005-08-11 2013-02-12 Mitsubishi Denki Kabushiki Kaisha Heat sink and fabricating method of the same
EP1923914A1 (en) * 2005-08-11 2008-05-21 Mitsubishi Denki Kabushiki Kaisha Heat sink and method of producing the same
EP1923914A4 (en) * 2005-08-11 2010-01-27 Mitsubishi Electric Corp Heat sink and method of producing the same
US20070272438A1 (en) * 2006-05-08 2007-11-29 Gilliland Don A 3D checkerboard perforation pattern for increased shielding effectiveness
US7442882B2 (en) * 2006-05-08 2008-10-28 International Business Machines Corporation 3D checkerboard perforation pattern for increased shielding effectiveness
US7330353B2 (en) * 2006-06-26 2008-02-12 International Business Machines Corporation Modular heat sink fin modules for CPU
US20070297140A1 (en) * 2006-06-26 2007-12-27 International Business Machines Corporation Modular heat sink fin modules for cpu
US20090139701A1 (en) * 2007-11-30 2009-06-04 Qu Weilin Two-phase cross-connected micro-channel heat sink
US20090139693A1 (en) * 2007-11-30 2009-06-04 University Of Hawaii Two phase micro-channel heat sink
TWI405531B (en) * 2007-11-30 2013-08-11 Univ Hawaii Heat sink, two phase micro-channel heat sink, electronic device, method for providing a heat sink, and method for dissipating heat of at least one electronic device
US8479806B2 (en) 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink
US20100193162A1 (en) * 2009-02-05 2010-08-05 Wistron Corporation Heat dissipation device
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US20110232885A1 (en) * 2010-03-26 2011-09-29 Kaslusky Scott F Heat transfer device with fins defining air flow channels
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US20120211214A1 (en) * 2010-12-09 2012-08-23 Panasonic Avionics Corporation Heatsink Device and Method
US20120216996A1 (en) * 2011-02-25 2012-08-30 Asia Vital Components Co., Ltd. Thermal module and method of manufacturing same
ITMI20112332A1 (en) * 2011-12-21 2013-06-22 Bussolari Veronica HEAT SINK WITH HIGH RADIANT EFFICIENCY.
US20150305137A1 (en) * 2012-10-22 2015-10-22 Thomson Licensing Electronic device with combination heat sink/blower or fan assembly having air duct
US9750126B2 (en) * 2012-10-22 2017-08-29 Thomson Licensing Electronic device with combination heat sink/blower or fan assembly having air duct
JP2018009465A (en) * 2016-07-12 2018-01-18 日本車輌製造株式会社 Engine generator
CN107278093A (en) * 2017-07-24 2017-10-20 成都希塔科技有限公司 Porous type auxiliary radiating device
CN109443070A (en) * 2018-12-11 2019-03-08 江苏宏远管业有限公司 A kind of special LNG air accumulator radiation aluminium fin
US11073336B2 (en) * 2019-03-29 2021-07-27 Jess-Link Products Co., Ltd. Shell heat dissipating structure of small form-factor pluggable transceiver
US20220290928A1 (en) * 2020-01-13 2022-09-15 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing method of the same
US20220299271A1 (en) * 2020-01-13 2022-09-22 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing method of the same
US11598587B2 (en) * 2020-01-13 2023-03-07 Cooler Master Co., Ltd. Method of manufacturing a heat exchanger
US11598588B2 (en) * 2020-01-13 2023-03-07 Cooler Master Co., Ltd. Method of manufacturing a heat exchanger
TWI752800B (en) * 2020-01-29 2022-01-11 訊凱國際股份有限公司 Heat exchanger fin, heat exchanger and method for manufacturing heat exchanger fin

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