US20040031784A1 - Hot plate unit - Google Patents
Hot plate unit Download PDFInfo
- Publication number
- US20040031784A1 US20040031784A1 US10/639,331 US63933103A US2004031784A1 US 20040031784 A1 US20040031784 A1 US 20040031784A1 US 63933103 A US63933103 A US 63933103A US 2004031784 A1 US2004031784 A1 US 2004031784A1
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- US
- United States
- Prior art keywords
- hot plate
- case
- plate unit
- seal element
- heat generator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
- B60N2/24—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles for particular purposes or particular vehicles
- B60N2/30—Non-dismountable or dismountable seats storable in a non-use position, e.g. foldable spare seats
- B60N2/3002—Non-dismountable or dismountable seats storable in a non-use position, e.g. foldable spare seats back-rest movements
- B60N2/3004—Non-dismountable or dismountable seats storable in a non-use position, e.g. foldable spare seats back-rest movements by rotation only
- B60N2/3009—Non-dismountable or dismountable seats storable in a non-use position, e.g. foldable spare seats back-rest movements by rotation only about transversal axis
- B60N2/3011—Non-dismountable or dismountable seats storable in a non-use position, e.g. foldable spare seats back-rest movements by rotation only about transversal axis the back-rest being hinged on the cushion, e.g. "portefeuille movement"
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
- B60N2/24—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles for particular purposes or particular vehicles
- B60N2/32—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles for particular purposes or particular vehicles convertible for other use
- B60N2/36—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles for particular purposes or particular vehicles convertible for other use into a loading platform
- B60N2/366—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles for particular purposes or particular vehicles convertible for other use into a loading platform characterised by the locking device
Definitions
- the present invention relates to a hot plate unit, and more particularly, to a hot plate unit for heating a silicon wafer during a semiconductor manufacturing process.
- a hot plate unit is normally used to dry photosensitive resin, which is applied to silicon wafers.
- the hot plate unit is incorporated in a semiconductor manufacturing apparatus.
- Japanese Examined Patent Publication 4-13873 describes a first example of a prior art hot plate unit.
- the hot plate unit includes a hot plate, which is made of an aluminum nitride sintered body, and a resistor arranged in the plate. The two ends of the resistor project from the sides of the plate and are connected to a power supply via wires.
- a silicon wafer which is the heating subject, is placed on the hot plate.
- the resistor is supplied with current, the resistor is heated for a predetermined time period to heat the silicon wafer and dry the photosensitive resin.
- the flow of current is then stopped to gradually cool the hot plate and the silicon wafer.
- the silicon wafer is removed from the hot plate to undergo the next process. Since the time period for cooling the hot plate is relatively long, it is difficult to improve productivity.
- the plate may be cooled by, for example, forcing cooling air against the lower surface of the hot plate.
- the moisture and dust in the forced air may contaminate the semiconductor manufacturing apparatus and its environment.
- Japanese Examined Patent Publication No. 8-8246 describes a second example of a prior art hot plate.
- the hot plate includes a cooling body provided with cooling fins.
- the cooling body cools the hot plate locally, the hot plate cannot be cooled entirely.
- FIG. 1 shows a third example of a prior art hot plate unit 41 .
- the hot plate unit 41 includes a cup-like casing 42 and a hot plate 43 made of a ceramic sintered body.
- the casing 42 is made of a metal material, such as aluminum, and has a lip 44 located at its upper portion.
- the casing 42 has an opening encompassed by the lip 44 .
- Resistors 45 are arranged in a predetermined pattern at the lower surface of the hot plate 43 .
- a plurality of screw holes 46 extend through the peripheral portion of the hot plate 43 .
- a plurality of threaded holes 47 extend through the lip 44 .
- the screw holes 46 of the hot plate 43 are aligned with the threaded holes 47 of the lip 44 .
- a screw 48 is inserted into each set of aligned holes 46 , 47 to fasten the hot plate 43 to the casing 42 .
- the hot plate unit 41 uses fasteners, such as the screws 48 , to fasten the hot plate 43 directly to the metal casing 42 .
- the heat of the hot plate 43 is transmitted to the casing 42 through the screws 48 .
- the temperature at the periphery of the hot plate 43 tends to be lower.
- the hot plate 43 cannot be cooled in a uniform manner.
- the fastening force of the screws 48 may damage the hot plate 43 since the force is applied directly to the hot plate 43 . Further, it is difficult to machine threaded holes in the hot plate 43 , which is made of a hard material.
- the present invention provides a hot plate unit including a case and a hot plate having a heat generator.
- the case and the hot plate define a space in which a fluid flows.
- a hot plate unit including a case having a lip, a hot plate having a heat generator, and a holder for securing the hot plate to the case.
- the hot plate is made of sintered ceramic.
- the holder contacts a peripheral portion of the upper surface of the hot plate when the holder is fixed to the case.
- a hot plate unit including a case having a lip, a hot plate having a heat generator, and a seal element.
- the hot plate is made of sintered ceramic.
- the hot plate is secured to the case via the seal element.
- the seal element is heat insulative.
- a hot plate unit including a case having a lip, a hot plate having a heat generator, and at least one intake port extending through the case.
- FIG. 1 is a cross-sectional view partially showing a prior art hot plate unit
- FIG. 2 is an exploded perspective view showing a hot plate unit according to a first embodiment of the present invention
- FIG. 3 is a cross-sectional view showing the hot plate unit of FIG. 2;
- FIG. 4 is an enlarged cross-sectional view showing the periphery of the hot plate unit of FIG. 3;
- FIG. 5 is a cross-sectional view showing a hot plate unit according to a second embodiment of the present invention.
- FIG. 6 is a cross-sectional view showing a hot plate unit according to a third embodiment of the present invention.
- FIG. 7( a ) is a plan view showing a resistor pattern formed in a hot plate unit according to a fourth embodiment of the present invention.
- FIG. 7( b ) is a plan view showing the locations of a intake port and a discharge port in the hot plate unit of FIG. 7( a );
- FIG. 8 is an exploded perspective view showing a hot plate unit according to a sixth embodiment of the present invention.
- FIG. 9 is a cross-sectional view showing a hot plate unit according to another example of the present invention.
- a hot plate unit 1 according to a first embodiment of the present invention will now be described with reference to FIGS. 2 to 4 .
- the hot plate unit 1 includes a hot plate 3 and a metal (e.g., aluminum) case 2 .
- the case 2 has a bottom wall 2 a and a lip 4 .
- Three guide sleeves 5 (only two shown) are arranged at the central portion of the bottom wall 2 a .
- a lift pin (not shown) is inserted into each of the three lift pin holes 11 .
- the three lift pins support a silicon wafer WI at three points and lift the silicon wafer WI to a predetermined height from the upper surface of the hot plate 3 .
- a lead wire hole 7 extends through a peripheral portion of the bottom wall 2 a .
- Lead wires 6 for supplying current to the hot plate 3 extend from the case 2 through the lead wire hole 7 .
- the hot plate 3 includes a base plate 9 made of a ceramic sintered body and a heat generator 10 formed on the base plate 9 .
- the heat generator 10 is a resistor that is formed in a predetermined pattern.
- the pattern is arranged for uniformly heating the entire base plate 9 .
- the pattern is preferably one of concentric circles or a spiral.
- a silicon wafer WI to which a photosensitive resin has been applied, is placed on the hot plate 3 and heated to a predetermined temperature (e.g., 200° C. to 300° C.) to dry the photosensitive resin.
- a predetermined temperature e.g. 200° C. to 300° C.
- the case 2 and the base plate 9 are both circular.
- the diameter of the base plate 9 is slightly smaller than that of the case 2 .
- the base plate 9 is secured to the top of the lip 4 with an attachment or a seal element 14 .
- Three lift pin holes 11 extend through the central portion of the hot plate 3 .
- the thickness 1 of the base plate 9 is preferably three millimeters but may be changed to an arbitrary thickness within a range of one to ten millimeters.
- a nitride ceramic sintered body having superior heat resistance and high heat conductivity may be used as the material of the base plate 9 .
- a preferred nitride ceramic body is a ceramic sintered body made of a metal nitride, such as aluminum nitride, silicon nitride, boron nitride, or titanium nitride.
- a ceramic sintered body made of a metal carbide, such as silicon carbide, zirconium carbide, titanium carbide, tantalum carbide, or tungsten carbide, may also be used.
- aluminum nitride has the highest heat conductivity and is thus especially preferred as the material forming the ceramic sintered body.
- the heat generator 10 is formed by printing a conductive paste on the base plate 9 .
- the conductive paste includes metal particles, metal oxides, resin, and a solvent. It is preferred that the metal particles resist oxidation at high temperatures and have a high resistance so that sufficient heat is produced when a current is passed through the heat generator 10 .
- gold, silver, platinum, palladium, copper, tungsten, and nickel may be used.
- Metal oxides e.g., lead oxide, zinc oxide, silica, boron oxide, alumina, yttria, or titania may also be used.
- two pads 10 a which serve as external connection terminals, are connected to one end of the heat generator 10 .
- a terminal pin 12 made of a conductive material is soldered to each pad 10 a .
- a socket 6 a which is attached to the distal end of each lead wire 6 , is connected to each terminal pin 12 .
- Current is supplied to the heat generator 10 via the lead wires 6 and the terminal pins 12 .
- a plurality of equally spaced threaded holes 13 extend through the lip 4 .
- An elastic seal element 14 is arranged on the lip 4 to seal the space between the case 2 and the hot plate 3 .
- a threaded bore 15 extends through the seal element 14 in correspondence with each threaded hole 13 of the lip 4 .
- a step 16 extends along the inner surface of the annular seal element 14 to horizontally support the hot plate 3 . When the hot plate 3 is supported on the step 16 , the top surface of the seal element 14 is flush with the upper surface of the hot plate 3 .
- the dimension L between the step 16 and the lower surface of the seal element 14 is preferably seven millimeters but may be changed arbitrarily within a range of one to ten millimeters.
- the depth from the top surface of the seal element 14 to the step 16 is three millimeters to correspond with the thickness 1 of the base plate 9 .
- the depth is changed in accordance with the thickness 1 of the base plate 9 .
- An intake port 17 and a discharge port 18 each extend through the bottom wall 2 a of the case 2 . Air is sent through the intake port 17 into a space S 1 defined in the case 2 . The air is discharged externally from the space S 1 through the discharge port 18 .
- the intake and discharge ports 17 , 18 are separated from each other by a predetermined distance.
- the internal surface of the inlet of the intake port 17 is threaded in order to receive a cooling air supply pipe (not shown), which is connected to a fluid pump (not shown).
- the pump sends air, which serves as a cooling fluid, into the space S 1 through the supply pipe.
- the internal surface of the outlet of the discharge port 18 is threaded in order to receive an air discharge pipe (not shown).
- the cooling air in the space S 1 is discharged through the discharge pipe to a separate location.
- a packing 8 is fitted to the lead wire hole 7 .
- the packing 8 is annular and made of an elastic material such as rubber.
- the lead wires 6 extend out of the case 2 through the hollow portion of the packing 8 .
- the packing 8 seals the space between the lead wires 6 and the lead wire hole 7 .
- the hot plate unit 1 includes a holding frame, or holding ring 21 , which serves as a holder.
- the holding ring 21 includes a ring body 22 and a plurality of projections 24 (six in the first embodiment).
- the projections 24 are planar tabs.
- the ring body 22 is made of spring steel and has a dimension corresponding to that of the lip 4 .
- a plurality of equally spaced screw holes 23 extend through the ring body 22 .
- the screw holes 23 of the holding ring 21 are formed in correspondence with the threaded bores 15 of the seal element 14 .
- the projections 24 contact the upper surface of the hot plate 3 and project inward from the ring body 22 . As shown by the broken line in FIG.
- each of the projections 24 is inclined relative to the ring body 22 towards the bottom surface of the holding ring 21 .
- the holding ring 21 can be produced in a relatively simple manner by, for example, punching a sheet of spring steel having a thickness of one to three millimeters into the predetermined shape.
- the process for installing the hot plate 3 will now be described.
- the terminal pins 12 are soldered to the pads 10 a , and the lead wire sockets 6 a are connected to the terminal pins 12 .
- the lead wires 6 are extended from the case through the lead wire hole 7 .
- the seal element 14 is then arranged on the lip 4 of the case 2 .
- the peripheral portion of the hot plate 3 is placed on the step 16 .
- the holding ring 21 is arranged on the top surface of the seal element 14 .
- the corresponding screw holes 23 of the holding ring 21 , the threaded bores 15 of the seal element 14 , and the threaded holes 13 are aligned with one another.
- the screws 25 are inserted into the aligned holes and bores 13 , 15 , 23 to fasten the holding ring 21 , the seal element 14 , and the lip 4 to one another.
- the projections 24 are elastically deformed when they contact the hot plate 3 .
- the hot plate 3 is pressed against the step 16 by the projections 24 and clamped between the projections 24 and the seal element 14 (the upper surface of the step 16 ). This fixes the hot plate 3 to the case 2 by way of the seal element 14 .
- the holding ring 21 , the hot plate 3 , and the case 2 are fixed to one another. Accordingly, the screws 25 serve to fasten the seal element 14 to the case 2 and the holding ring 21 to the case 2 .
- the method for using the hot plate unit 1 will now be described.
- the silicon wafer W 1 to which a photosensitive resin is applied, is placed on the hot plate 3 .
- Current is then supplied to the heat generator 10 .
- the silicon wafer W 1 is heated. Heating over a predetermined time dries the photosensitive resin.
- the flow of current to the heat generator (resistor) 10 is then stopped.
- the fluid pump is driven to send cooling air into the space S 1 through the intake port 17 .
- the flow of the cooling air is shown schematically by the arrows in FIG. 3.
- the cooling air flows toward the discharge port 18 , the air contacts the lower surface of the hot plate 3 in the space S 1 .
- Heat is exchanged between the hot plate 3 and the cooling air that contacts the hot plate 3 .
- the heated air flows through the discharge port 18 and out of the space SI to a location where contamination is not a problem.
- the silicon wafer W 1 is removed from the hot plate 3 .
- the first embodiment has the advantages described below.
- the hot plate 3 is cooled by forcing cooling air into the space S 1 between the case 2 and the hot plate 3 . Accordingly, the time required for cooling is decreased in comparison to spontaneous cooling. Thus, the hot plate unit 1 decreases the drying time and improves productivity. Furthermore, leakage of air into the environment of the hot plate unit 1 is substantially prevented. Hence, the semiconductor manufacturing apparatus incorporating the hot plate unit 1 and its environment are not contaminated.
- the cooling air is efficiently circulated through the intake port 17 and the discharge port 18 . That is, the forced cooling air cools the hot plate 3 in the space S 1 and returns the temperature to a low value within a relatively short time.
- the substantially sealed space S 1 is defined between the case 2 and the hot plate 3 .
- Projections such as the terminal pins 12 are provided at the lower surface of the hot plate 3 .
- these projections are located in the space S 1 .
- the projections are protected by the case 2 and are not exposed externally from the hot plate unit 1 . Accordingly, the bottom surface of the case 2 can easily be attached to a support stage (not shown).
- the ring packing 8 at the lead wire hole 7 is arranged in the bottom wall 2 a , and the lead wires 6 are inserted through the packing 8 . Accordingly, air is prevented from leaking out of the apparatus through the lead wire hole 7 . This prevents contamination of the environment of the apparatus.
- the hot plate 3 is attached to the case 2 using the holding ring 21 .
- screw holes need not be provided in the periphery of the hot plate 3 . That is, when the hot plate 3 is manufactured, holes need not be machined into the hard ceramic sintered body. This facilitates production of the hot plate unit 1 and decreases the production cost of the hot plate unit 1 .
- the holding ring 21 used in the first embodiment includes the ring body 22 , which is made of a spring steel and has a diameter substantially equal to that of the lip 4 , and the projections 24 , which are spaced apart from one another. Accordingly, the projections 24 contact the hot plate 3 at different locations. In this state, an acceptable spring force acts on the projections 24 and securely fixes the hot plate 3 to the lip 4 of the case 2 .
- the hot plate 3 is fastened by a single holding ring 21 .
- the number of components is decreased in comparison to when using a plurality of holders. Accordingly, the assembly of the hot plate 3 is facilitated.
- Second to seventh embodiments according to the present invention will now be described.
- the description centers on parts differing from the first embodiment.
- like or same reference numerals are given to those components that are the same as the corresponding components of the first embodiment.
- two intake ports 17 and two discharge ports 18 are respectively defined in four sleeves fastened to the bottom wall 2 a of the case 2 .
- the two intake ports 17 are located at the central portion of the bottom wall 2 a .
- the discharge ports 18 are located outward from the intake ports 17 .
- the second embodiment has the advantages described below.
- the hot plate unit 1 has two intake ports 17 at the bottom wall 2 a of the case 2 . This structure improves the circulation of the cooling air in the space S 1 . The time required to cool the hot plate 3 , with air that contacts the lower surface of the hot plate 3 is further decreased. Accordingly, the entire hot plate 3 is cooled within a short period of time.
- the intake ports 17 are located at the bottom wall 2 a of the case 2 .
- the air that flows into the case 2 through the intake ports 17 is directed vertically against the lower surface of the hot plate 3 . This cools the hot plate 3 within a relatively short period of time.
- the two intake ports 17 cause the cooling air to contact the entire hot plate 3 .
- the hot plate 3 is cooled in a uniform manner.
- a hot plate unit 1 according to a third embodiment of the present invention will now be described with reference to FIG. 6.
- the hot plate unit 1 of the third embodiment does not have the discharge ports 18 of the second embodiment.
- a plurality of apertures 19 are formed in lieu of the discharge ports 18 in the bottom wall 2 a .
- the simplified structure of the hot plate unit 1 of FIG. 6 saves production costs.
- the heat generator 10 includes three resistors 32 - 34 .
- Three heating circuits 30 are provided to heat the three-part heat generator 10 .
- the three heating circuits 30 independently supply the associated resistor 32 - 34 with power.
- three heat zones Al-A 3 are defined in the hot plate 3 .
- a plurality of intake ports 17 are arranged in each heat zone A 1 -A 3 , as indicated by the circles.
- a plurality of discharge ports 18 are also arranged in each heat zone A 1 -A 3 , as indicated by the triangles.
- the three intake ports 17 and the three discharge ports 18 in each heat zone A 1 -A 3 are equally spaced from one another. More specifically, the three intake ports 17 are located at the corners of a right triangle, and the three discharge ports 18 are located at the corners of another right triangle.
- a hot plate unit 1 according to a fifth embodiment of the present invention will now be described.
- the fifth embodiment differs from the first embodiment in that the seal element 14 is made of a heat insulating material. Otherwise, the hot plate unit 1 of the fifth embodiment has the same appearance as the hot plate unit 1 of FIGS. 2 to 4 .
- the seal element 14 may be made of, for example, an inorganic fiber heat insulating material, such as ceramic fiber or glass wool, a porous resin, such as foam urethane resin or foam styrene resin, or fluororesin.
- an inorganic fiber heat insulating material such as ceramic fiber or glass wool
- a porous resin such as foam urethane resin or foam styrene resin, or fluororesin.
- the seal element 14 be made of a ceramic fiber solidified by an inorganic binder since the heat conductivity is low. More specifically, it is preferred that the seal element 14 be made of a ceramic fiber, such as IBI WOOL (available from IBIDEN CO., LTD.), that is solidified by silica gel or alumina sol.
- the seal element 14 has superior heat resisting, insulating, and flame-resisting properties. Fluororesin is used in a temperature range that is wider than general-purpose synthetic resins and thus is heat resistant. Fluororesin also has a small dielectric loss and is thus a good insulator. Furthermore, fluororesin does not burn in air or in a gas where the oxygen concentration is 95% or less and thus has good flame-resistance.
- the preferred fluororesins are polytetrafluoroethylene resin (PTFE), tetrafluoroethylene-perfluoroalkylvinylether copolymer (PFA), fluorinated ethylene propylene copolymer resin (FEP), ethylene tetrafluoro ethylene resin (ETFE), polyvinylidene fluoride (PVDF), and ethylene chloride trifluoride (PCTFE).
- PTFE polytetrafluoroethylene resin
- PFA tetrafluoroethylene-perfluoroalkylvinylether copolymer
- FEP fluorinated ethylene propylene copolymer resin
- ETFE ethylene tetrafluoro ethylene resin
- PVDF polyvinylidene fluoride
- PCTFE ethylene chloride trifluoride
- the fifth embodiment has the advantages described below.
- the hot plate 3 is fastened to the case 2 by way of the heat insulative seal element 14 . This suppresses the transfer of heat from the hot plate 3 to the case 2 , especially at the periphery of the hot plate 3 . Accordingly, the hot plate unit I heats the silicon wafer WI in a uniform manner since high temperatures at the periphery of the hot plate 3 can be suppressed.
- Fluororesin is one of the materials used to form the seal element 14 . This improves the heat and flame resistance and the insulative characteristics of the seal element 14 .
- a hot plate unit 1 according to a sixth embodiment of the present invention will now be described with reference to FIG. 8.
- a plurality of holding plates 31 are used in lieu of the holding ring 21 of the fifth embodiment.
- Each holding plate 31 is arcuate and is formed as if it were cut from the holding ring 21 .
- Each holding plate 31 is made of spring steel and has a length that is a fraction of the circumference of the lip 4 (the circumference of the hot plate 3 ). In the embodiment of FIG. 8, the circumferential length of each holding plate is approximately one twelfth of the circumference of the holding ring 21 . Screw holes 23 are formed at each end of the holding plates 31 . The projections 24 are each formed at one end of each holding plate 31 . The holding plates 31 are equally spaced from one another, and the six projections 24 , or tabs, press the upper surface of the hot plate 3 .
- the sixth embodiment has the advantages described below.
- the six holding plates 31 are used to fasten the hot plate 3 .
- the spring force of the projections 24 of the holding plates 31 is used to clamp the seal element 14 between the lip 4 of the case 2 and the projections 24 .
- a short intake port 17 a and a short discharge port 18 a can be provided instead of the intake port 17 and the discharge port 18 in the first to sixth embodiments.
- a fluid flown through the intake port 17 a contacts the hot plate 3 at relatively broader area. Accordingly, the hot plate 3 is cooled more uniformly.
- the guide sleeves 5 in the first to sixth embodiments may be omitted.
- the number of projections 24 in the first to sixth embodiments may be changed arbitrarily.
- the shape and number of the engaging holding plates 31 in the sixth embodiment may be changed arbitrarily.
- the holding ring 21 and the holding plates 31 may be fastened to the seal element 14 or the case 2 using fasteners other than the screws 25 .
- the material of the holding ring 21 and the holding plates 31 need not have elasticity. Furthermore, the holding ring 21 and the holding plates 31 may be formed integrally with the seal element 14 .
- the shape of the projections 24 need not be plate-like.
- the projections 24 may be rod-like.
- the seal element 14 may be eliminated as long as a relatively tight seal is maintained.
- the lead wire hole 7 may be formed at sections other than the bottom wall 2 a of the case 2 , such as in the side walls of the case 2 . Furthermore, the ports 17 , 18 may also be provided at the side walls of the case 2 .
- a liquid that does not affect the electric circuits and wiring may be sent into the space S 1 as a cooling fluid as long as the space S 1 remains tightly sealed.
- thermocouple for measuring temperatures may be embedded in the base plate 9 .
- the thermocouple is used to measure the temperature of the hot plate 3 in order to adjust the values of the voltage or current supplied to the heating circuit accordingly and control the temperature.
- the lead wire of the thermocouple also extends from the case 2 through the packing 8 .
- the number of the intake ports 17 may be altered. A larger number of intake ports 17 speeds up the cooling of the hot plate 3 and cools the hot plate 3 in a more uniform manner. Furthermore, the number of discharge ports 18 may be three or more.
- the intake ports 17 and the discharge ports 18 need not be located at the corners of right triangles and may be located at arbitrary positions.
- the number of each of the ports 17 , 18 may be only one in the same heat zone.
- the number of heating circuits is not limited to three.
- one or more intake ports 17 need not be provided for each heating circuit as long as the total number of the intake ports 17 is 70 percent of the number of the heating circuits.
- the number of the intake ports 17 may be seven or more if the number of the heating circuits is ten. If the number of the heating circuits is four, the number of the intake ports 17 may be three or more.
- the circular hot plate 3 may be changed to a polygonal one.
- the shape of the lip 4 , the seal element 14 , the holding ring 21 (or the holding plates 31 ) are changed in accordance with the shape of the hot plate 3 .
Abstract
A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.
Description
- This application is a continuation of U.S. patent application Ser. No. 09/880,359, filed Jun. 13, 2001, which was a continuation of U.S. patent application Ser. No. 09/471,759, filed Dec. 23, 1999 and entitled “HOT PLATE UNIT”.
- The present invention relates to a hot plate unit, and more particularly, to a hot plate unit for heating a silicon wafer during a semiconductor manufacturing process.
- In a semiconductor manufacturing process, a hot plate unit is normally used to dry photosensitive resin, which is applied to silicon wafers. The hot plate unit is incorporated in a semiconductor manufacturing apparatus.
- Japanese Examined Patent Publication 4-13873 describes a first example of a prior art hot plate unit. The hot plate unit includes a hot plate, which is made of an aluminum nitride sintered body, and a resistor arranged in the plate. The two ends of the resistor project from the sides of the plate and are connected to a power supply via wires.
- A silicon wafer, which is the heating subject, is placed on the hot plate. When the resistor is supplied with current, the resistor is heated for a predetermined time period to heat the silicon wafer and dry the photosensitive resin. The flow of current is then stopped to gradually cool the hot plate and the silicon wafer. After the hot plate and the silicon wafer are cooled to a relatively low temperature, the silicon wafer is removed from the hot plate to undergo the next process. Since the time period for cooling the hot plate is relatively long, it is difficult to improve productivity.
- To decrease the cooling time of the hot plate, the plate may be cooled by, for example, forcing cooling air against the lower surface of the hot plate. However, the moisture and dust in the forced air may contaminate the semiconductor manufacturing apparatus and its environment.
- Japanese Examined Patent Publication No. 8-8246 describes a second example of a prior art hot plate. The hot plate includes a cooling body provided with cooling fins. However, although the cooling body cools the hot plate locally, the hot plate cannot be cooled entirely.
- FIG. 1 shows a third example of a prior art
hot plate unit 41. Thehot plate unit 41 includes a cup-like casing 42 and ahot plate 43 made of a ceramic sintered body. Thecasing 42 is made of a metal material, such as aluminum, and has alip 44 located at its upper portion. Thecasing 42 has an opening encompassed by thelip 44.Resistors 45 are arranged in a predetermined pattern at the lower surface of thehot plate 43. A plurality ofscrew holes 46 extend through the peripheral portion of thehot plate 43. A plurality of threadedholes 47 extend through thelip 44. Thescrew holes 46 of thehot plate 43 are aligned with the threadedholes 47 of thelip 44. Ascrew 48 is inserted into each set of alignedholes hot plate 43 to thecasing 42. - The
hot plate unit 41 uses fasteners, such as thescrews 48, to fasten thehot plate 43 directly to themetal casing 42. Thus, the heat of thehot plate 43 is transmitted to thecasing 42 through thescrews 48. As a result, the temperature at the periphery of thehot plate 43 tends to be lower. Furthermore, thehot plate 43 cannot be cooled in a uniform manner. - In addition, the fastening force of the
screws 48 may damage thehot plate 43 since the force is applied directly to thehot plate 43. Further, it is difficult to machine threaded holes in thehot plate 43, which is made of a hard material. - Accordingly, it is a first object of the present invention to provide a hot plate unit that adjusts the temperature of a heating subject in a uniform manner. It is a second object of the present invention to provide a hot plate unit that is easily secured to a supporting body.
- To achieve the above objects, the present invention provides a hot plate unit including a case and a hot plate having a heat generator. The case and the hot plate define a space in which a fluid flows.
- Another aspect of the present invention provides a hot plate unit including a case having a lip, a hot plate having a heat generator, and a holder for securing the hot plate to the case. The hot plate is made of sintered ceramic. The holder contacts a peripheral portion of the upper surface of the hot plate when the holder is fixed to the case.
- Further aspect of the present invention provides a hot plate unit including a case having a lip, a hot plate having a heat generator, and a seal element. The hot plate is made of sintered ceramic. The hot plate is secured to the case via the seal element. The seal element is heat insulative.
- Further aspect of the present invention provides a hot plate unit including a case having a lip, a hot plate having a heat generator, and at least one intake port extending through the case.
- Other aspects and advantages of the present invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
- The features of the present invention that are believed to be novel are set forth with particularity in the appended claims. The invention, together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
- FIG. 1 is a cross-sectional view partially showing a prior art hot plate unit;
- FIG. 2 is an exploded perspective view showing a hot plate unit according to a first embodiment of the present invention;
- FIG. 3 is a cross-sectional view showing the hot plate unit of FIG. 2;
- FIG. 4 is an enlarged cross-sectional view showing the periphery of the hot plate unit of FIG. 3;
- FIG. 5 is a cross-sectional view showing a hot plate unit according to a second embodiment of the present invention;
- FIG. 6 is a cross-sectional view showing a hot plate unit according to a third embodiment of the present invention;
- FIG. 7(a) is a plan view showing a resistor pattern formed in a hot plate unit according to a fourth embodiment of the present invention;
- FIG. 7(b) is a plan view showing the locations of a intake port and a discharge port in the hot plate unit of FIG. 7(a);
- FIG. 8 is an exploded perspective view showing a hot plate unit according to a sixth embodiment of the present invention; and
- FIG. 9 is a cross-sectional view showing a hot plate unit according to another example of the present invention.
- A
hot plate unit 1 according to a first embodiment of the present invention will now be described with reference to FIGS. 2 to 4. - As shown in FIGS.2 to 4, the
hot plate unit 1 includes ahot plate 3 and a metal (e.g., aluminum)case 2. Thecase 2 has abottom wall 2 a and alip 4. Three guide sleeves 5 (only two shown) are arranged at the central portion of thebottom wall 2 a. A lift pin (not shown) is inserted into each of the three lift pin holes 11. The three lift pins support a silicon wafer WI at three points and lift the silicon wafer WI to a predetermined height from the upper surface of thehot plate 3. Alead wire hole 7 extends through a peripheral portion of thebottom wall 2 a.Lead wires 6 for supplying current to thehot plate 3 extend from thecase 2 through thelead wire hole 7. - The
hot plate 3 includes abase plate 9 made of a ceramic sintered body and aheat generator 10 formed on thebase plate 9. In this embodiment, theheat generator 10 is a resistor that is formed in a predetermined pattern. The pattern is arranged for uniformly heating theentire base plate 9. The pattern is preferably one of concentric circles or a spiral. A silicon wafer WI, to which a photosensitive resin has been applied, is placed on thehot plate 3 and heated to a predetermined temperature (e.g., 200° C. to 300° C.) to dry the photosensitive resin. As shown in FIG. 2, thecase 2 and thebase plate 9 are both circular. The diameter of thebase plate 9 is slightly smaller than that of thecase 2. Thebase plate 9 is secured to the top of thelip 4 with an attachment or aseal element 14. Three lift pin holes 11 extend through the central portion of thehot plate 3. With reference to FIG. 4, thethickness 1 of thebase plate 9 is preferably three millimeters but may be changed to an arbitrary thickness within a range of one to ten millimeters. - A nitride ceramic sintered body having superior heat resistance and high heat conductivity may be used as the material of the
base plate 9. A preferred nitride ceramic body is a ceramic sintered body made of a metal nitride, such as aluminum nitride, silicon nitride, boron nitride, or titanium nitride. A ceramic sintered body made of a metal carbide, such as silicon carbide, zirconium carbide, titanium carbide, tantalum carbide, or tungsten carbide, may also be used. Among these materials, aluminum nitride has the highest heat conductivity and is thus especially preferred as the material forming the ceramic sintered body. - The
heat generator 10 is formed by printing a conductive paste on thebase plate 9. The conductive paste includes metal particles, metal oxides, resin, and a solvent. It is preferred that the metal particles resist oxidation at high temperatures and have a high resistance so that sufficient heat is produced when a current is passed through theheat generator 10. For example, gold, silver, platinum, palladium, copper, tungsten, and nickel may be used. Metal oxides (e.g., lead oxide, zinc oxide, silica, boron oxide, alumina, yttria, or titania) may also be used. - As shown in FIG. 4, two
pads 10 a, which serve as external connection terminals, are connected to one end of theheat generator 10. Aterminal pin 12 made of a conductive material is soldered to eachpad 10 a. Asocket 6 a, which is attached to the distal end of eachlead wire 6, is connected to eachterminal pin 12. Current is supplied to theheat generator 10 via thelead wires 6 and the terminal pins 12. - Referring to FIG. 4, a plurality of equally spaced threaded
holes 13 extend through thelip 4. Anelastic seal element 14 is arranged on thelip 4 to seal the space between thecase 2 and thehot plate 3. A threaded bore 15 extends through theseal element 14 in correspondence with each threadedhole 13 of thelip 4. Astep 16 extends along the inner surface of theannular seal element 14 to horizontally support thehot plate 3. When thehot plate 3 is supported on thestep 16, the top surface of theseal element 14 is flush with the upper surface of thehot plate 3. - The dimension L between the
step 16 and the lower surface of theseal element 14 is preferably seven millimeters but may be changed arbitrarily within a range of one to ten millimeters. The depth from the top surface of theseal element 14 to thestep 16 is three millimeters to correspond with thethickness 1 of thebase plate 9. The depth is changed in accordance with thethickness 1 of thebase plate 9. - An
intake port 17 and adischarge port 18 each extend through thebottom wall 2 a of thecase 2. Air is sent through theintake port 17 into a space S1 defined in thecase 2. The air is discharged externally from the space S1 through thedischarge port 18. The intake anddischarge ports - The internal surface of the inlet of the
intake port 17 is threaded in order to receive a cooling air supply pipe (not shown), which is connected to a fluid pump (not shown). The pump sends air, which serves as a cooling fluid, into the space S1 through the supply pipe. The internal surface of the outlet of thedischarge port 18 is threaded in order to receive an air discharge pipe (not shown). The cooling air in the space S1 is discharged through the discharge pipe to a separate location. - With reference to FIG. 3, a
packing 8 is fitted to thelead wire hole 7. Thepacking 8 is annular and made of an elastic material such as rubber. Thelead wires 6 extend out of thecase 2 through the hollow portion of thepacking 8. The packing 8 seals the space between thelead wires 6 and thelead wire hole 7. - The
hot plate unit 1 includes a holding frame, or holdingring 21, which serves as a holder. The holdingring 21 includes aring body 22 and a plurality of projections 24 (six in the first embodiment). In this embodiment, theprojections 24 are planar tabs. Thering body 22 is made of spring steel and has a dimension corresponding to that of thelip 4. A plurality of equally spaced screw holes 23 extend through thering body 22. The screw holes 23 of the holdingring 21 are formed in correspondence with the threaded bores 15 of theseal element 14. Theprojections 24 contact the upper surface of thehot plate 3 and project inward from thering body 22. As shown by the broken line in FIG. 4, each of theprojections 24 is inclined relative to thering body 22 towards the bottom surface of the holdingring 21. The holdingring 21 can be produced in a relatively simple manner by, for example, punching a sheet of spring steel having a thickness of one to three millimeters into the predetermined shape. - The process for installing the
hot plate 3 will now be described. Before installing thehot plate 3, the terminal pins 12 are soldered to thepads 10 a, and thelead wire sockets 6 a are connected to the terminal pins 12. Thelead wires 6 are extended from the case through thelead wire hole 7. - The
seal element 14 is then arranged on thelip 4 of thecase 2. The peripheral portion of thehot plate 3 is placed on thestep 16. The holdingring 21 is arranged on the top surface of theseal element 14. The corresponding screw holes 23 of the holdingring 21, the threaded bores 15 of theseal element 14, and the threadedholes 13 are aligned with one another. Thescrews 25 are inserted into the aligned holes and bores 13, 15, 23 to fasten the holdingring 21, theseal element 14, and thelip 4 to one another. As a result, theprojections 24 are elastically deformed when they contact thehot plate 3. Thehot plate 3 is pressed against thestep 16 by theprojections 24 and clamped between theprojections 24 and the seal element 14 (the upper surface of the step 16). This fixes thehot plate 3 to thecase 2 by way of theseal element 14. The holdingring 21, thehot plate 3, and thecase 2 are fixed to one another. Accordingly, thescrews 25 serve to fasten theseal element 14 to thecase 2 and the holdingring 21 to thecase 2. - The method for using the
hot plate unit 1 will now be described. The silicon wafer W1, to which a photosensitive resin is applied, is placed on thehot plate 3. Current is then supplied to theheat generator 10. As the temperature of thehot plate 3 increases, the silicon wafer W1 is heated. Heating over a predetermined time dries the photosensitive resin. The flow of current to the heat generator (resistor) 10 is then stopped. - In this state, the fluid pump is driven to send cooling air into the space S1 through the
intake port 17. The flow of the cooling air is shown schematically by the arrows in FIG. 3. As the cooling air flows toward thedischarge port 18, the air contacts the lower surface of thehot plate 3 in the space S1. Heat is exchanged between thehot plate 3 and the cooling air that contacts thehot plate 3. The heated air flows through thedischarge port 18 and out of the space SI to a location where contamination is not a problem. When thehot plate 3 is cooled to a certain temperature, the silicon wafer W1 is removed from thehot plate 3. - The first embodiment has the advantages described below.
- (1) The
hot plate 3 is cooled by forcing cooling air into the space S1 between thecase 2 and thehot plate 3. Accordingly, the time required for cooling is decreased in comparison to spontaneous cooling. Thus, thehot plate unit 1 decreases the drying time and improves productivity. Furthermore, leakage of air into the environment of thehot plate unit 1 is substantially prevented. Hence, the semiconductor manufacturing apparatus incorporating thehot plate unit 1 and its environment are not contaminated. - (2) In the first embodiment, the cooling air is efficiently circulated through the
intake port 17 and thedischarge port 18. That is, the forced cooling air cools thehot plate 3 in the space S1 and returns the temperature to a low value within a relatively short time. - (3) In the
hot plate unit 1, the space between thelip 4 and the lower peripheral surface of thehot plate 3 is sealed by theseal element 14. Thus, air does not leak between thelip 4 and thehot plate 3. This ensures that the ambient environment of thehot plate unit 1 is prevented from being contaminated. - (4) In the
hot plate unit 1, the substantially sealed space S1 is defined between thecase 2 and thehot plate 3. Projections such as the terminal pins 12 are provided at the lower surface of thehot plate 3. However, these projections are located in the space S1. In other words, the projections are protected by thecase 2 and are not exposed externally from thehot plate unit 1. Accordingly, the bottom surface of thecase 2 can easily be attached to a support stage (not shown). - (5) In the
hot plate unit 1, the ring packing 8 at thelead wire hole 7 is arranged in thebottom wall 2 a, and thelead wires 6 are inserted through thepacking 8. Accordingly, air is prevented from leaking out of the apparatus through thelead wire hole 7. This prevents contamination of the environment of the apparatus. - (6) In the
hot plate unit 1 of the first embodiment, thehot plate 3 is attached to thecase 2 using the holdingring 21. Thus, screw holes need not be provided in the periphery of thehot plate 3. That is, when thehot plate 3 is manufactured, holes need not be machined into the hard ceramic sintered body. This facilitates production of thehot plate unit 1 and decreases the production cost of thehot plate unit 1. - (7) Although the
hot plate 3 is fastened by fasteners, such as thescrews 25, theseal element 14 arranged between thehot plate 3 and thecase 2 absorbs the fastening force applied to thehot plate 3. Thus, the fastening force does not damage thehot plate 3. - (8) The
hot plate 3 is clamped between theseal element 14 and the holdingring 21. Thus, thehot plate 3 is fixed to thecase 2 and is prevented from being loosened. - (9) The holding
ring 21 used in the first embodiment includes thering body 22, which is made of a spring steel and has a diameter substantially equal to that of thelip 4, and theprojections 24, which are spaced apart from one another. Accordingly, theprojections 24 contact thehot plate 3 at different locations. In this state, an acceptable spring force acts on theprojections 24 and securely fixes thehot plate 3 to thelip 4 of thecase 2. - (10) The
hot plate 3 is fastened by asingle holding ring 21. Thus, the number of components is decreased in comparison to when using a plurality of holders. Accordingly, the assembly of thehot plate 3 is facilitated. - Second to seventh embodiments according to the present invention will now be described. The description centers on parts differing from the first embodiment. To avoid redundancy, like or same reference numerals are given to those components that are the same as the corresponding components of the first embodiment.
- As shown in FIG. 5, two
intake ports 17 and twodischarge ports 18 are respectively defined in four sleeves fastened to thebottom wall 2 a of thecase 2. The twointake ports 17 are located at the central portion of thebottom wall 2 a. Thedischarge ports 18 are located outward from theintake ports 17. - When the cooling air is sent into the space S1 through the
intake port 17 from the fluid pump (not shown), the air is directed vertically against the lower surface of thehot plate 3. The flow of air is schematically shown by the arrows in FIG. 5. The air is heated by the entirehot plate 3 in a substantially uniform manner. The heated air flows out through thedischarge ports 18 to a location where contamination is no longer a problem. - In addition to the advantages of the first embodiment, the second embodiment has the advantages described below.
- (11) The
hot plate unit 1 has twointake ports 17 at thebottom wall 2 a of thecase 2. This structure improves the circulation of the cooling air in the space S1. The time required to cool thehot plate 3, with air that contacts the lower surface of thehot plate 3 is further decreased. Accordingly, the entirehot plate 3 is cooled within a short period of time. - (12) The
intake ports 17 are located at thebottom wall 2 a of thecase 2. Thus, the air that flows into thecase 2 through theintake ports 17 is directed vertically against the lower surface of thehot plate 3. This cools thehot plate 3 within a relatively short period of time. - (13) The two
intake ports 17 cause the cooling air to contact the entirehot plate 3. Thus, thehot plate 3 is cooled in a uniform manner. - A
hot plate unit 1 according to a third embodiment of the present invention will now be described with reference to FIG. 6. As shown in FIG. 6, thehot plate unit 1 of the third embodiment does not have thedischarge ports 18 of the second embodiment. A plurality ofapertures 19 are formed in lieu of thedischarge ports 18 in thebottom wall 2 a. The simplified structure of thehot plate unit 1 of FIG. 6 saves production costs. - A
hot plate unit 1 according to a fourth embodiment of the present invention will now be described. As shown in FIG. 7(a), theheat generator 10 includes three resistors 32-34. Threeheating circuits 30 are provided to heat the three-part heat generator 10. The threeheating circuits 30 independently supply the associated resistor 32-34 with power. In this case, as shown by the diagonal lines in FIG. 7(b), three heat zones Al-A3 are defined in thehot plate 3. - Referring to FIG. 7(b), a plurality of intake ports 17 (three in the fourth embodiment) are arranged in each heat zone A1-A3, as indicated by the circles. A plurality of discharge ports 18 (three in the fourth embodiment) are also arranged in each heat zone A1-A3, as indicated by the triangles. The three
intake ports 17 and the threedischarge ports 18 in each heat zone A1-A3 are equally spaced from one another. More specifically, the threeintake ports 17 are located at the corners of a right triangle, and the threedischarge ports 18 are located at the corners of another right triangle. - A
hot plate unit 1 according to a fifth embodiment of the present invention will now be described. - The fifth embodiment differs from the first embodiment in that the
seal element 14 is made of a heat insulating material. Otherwise, thehot plate unit 1 of the fifth embodiment has the same appearance as thehot plate unit 1 of FIGS. 2 to 4. - The
seal element 14 may be made of, for example, an inorganic fiber heat insulating material, such as ceramic fiber or glass wool, a porous resin, such as foam urethane resin or foam styrene resin, or fluororesin. However, it is preferred that theseal element 14 be made of a ceramic fiber solidified by an inorganic binder since the heat conductivity is low. More specifically, it is preferred that theseal element 14 be made of a ceramic fiber, such as IBI WOOL (available from IBIDEN CO., LTD.), that is solidified by silica gel or alumina sol. - When fluororesin is used to form the
seal element 14, theseal element 14 has superior heat resisting, insulating, and flame-resisting properties. Fluororesin is used in a temperature range that is wider than general-purpose synthetic resins and thus is heat resistant. Fluororesin also has a small dielectric loss and is thus a good insulator. Furthermore, fluororesin does not burn in air or in a gas where the oxygen concentration is 95% or less and thus has good flame-resistance. The preferred fluororesins are polytetrafluoroethylene resin (PTFE), tetrafluoroethylene-perfluoroalkylvinylether copolymer (PFA), fluorinated ethylene propylene copolymer resin (FEP), ethylene tetrafluoro ethylene resin (ETFE), polyvinylidene fluoride (PVDF), and ethylene chloride trifluoride (PCTFE). - In addition to the advantages of the first embodiment, the fifth embodiment has the advantages described below.
- (14) In the fifth embodiment, the
hot plate 3 is fastened to thecase 2 by way of the heatinsulative seal element 14. This suppresses the transfer of heat from thehot plate 3 to thecase 2, especially at the periphery of thehot plate 3. Accordingly, the hot plate unit I heats the silicon wafer WI in a uniform manner since high temperatures at the periphery of thehot plate 3 can be suppressed. - (15) Fluororesin is one of the materials used to form the
seal element 14. This improves the heat and flame resistance and the insulative characteristics of theseal element 14. - A
hot plate unit 1 according to a sixth embodiment of the present invention will now be described with reference to FIG. 8. - In the
hot plate unit 1 of the sixth embodiment, a plurality of holding plates 31 (six in this embodiment) are used in lieu of the holdingring 21 of the fifth embodiment. Each holdingplate 31 is arcuate and is formed as if it were cut from the holdingring 21. - Each holding
plate 31 is made of spring steel and has a length that is a fraction of the circumference of the lip 4 (the circumference of the hot plate 3). In the embodiment of FIG. 8, the circumferential length of each holding plate is approximately one twelfth of the circumference of the holdingring 21. Screw holes 23 are formed at each end of the holdingplates 31. Theprojections 24 are each formed at one end of each holdingplate 31. The holdingplates 31 are equally spaced from one another, and the sixprojections 24, or tabs, press the upper surface of thehot plate 3. - Accordingly, in addition to the advantages of the fifth embodiment, the sixth embodiment has the advantages described below.
- (16) In the sixth embodiment, the six holding
plates 31 are used to fasten thehot plate 3. The spring force of theprojections 24 of the holdingplates 31 is used to clamp theseal element 14 between thelip 4 of thecase 2 and theprojections 24. - (17) Since the holding
plates 31 have a relatively short length, deformation of theplates 31, due to mishandling or other reasons, seldom occurs. Accordingly, the usage of the plurality of holdingplates 31 to fasten thehot plate 3 maintains the elastic force of theprojections 24 at an appropriate level. - Each of the above embodiments may be modified as described below.
- As shown in FIG. 9, a
short intake port 17 a and ashort discharge port 18 a can be provided instead of theintake port 17 and thedischarge port 18 in the first to sixth embodiments. In this case, a fluid flown through theintake port 17 a contacts thehot plate 3 at relatively broader area. Accordingly, thehot plate 3 is cooled more uniformly. - As shown in FIG. 9, the
guide sleeves 5 in the first to sixth embodiments may be omitted. - The number of
projections 24 in the first to sixth embodiments may be changed arbitrarily. - The shape and number of the
engaging holding plates 31 in the sixth embodiment may be changed arbitrarily. - In the first to sixth embodiments, the holding
ring 21 and the holdingplates 31 may be fastened to theseal element 14 or thecase 2 using fasteners other than thescrews 25. - In the first to sixth embodiments, the material of the holding
ring 21 and the holdingplates 31 need not have elasticity. Furthermore, the holdingring 21 and the holdingplates 31 may be formed integrally with theseal element 14. - In the first to sixth embodiments, the shape of the
projections 24 need not be plate-like. For example, theprojections 24 may be rod-like. - In the first embodiment, the
seal element 14 may be eliminated as long as a relatively tight seal is maintained. - In the first to sixth embodiments, the
lead wire hole 7 may be formed at sections other than thebottom wall 2 a of thecase 2, such as in the side walls of thecase 2. Furthermore, theports case 2. - In the first, second, and fourth to sixth embodiments, a liquid that does not affect the electric circuits and wiring may be sent into the space S1 as a cooling fluid as long as the space S1 remains tightly sealed.
- In the first to sixth embodiments, a thermocouple for measuring temperatures may be embedded in the
base plate 9. The thermocouple is used to measure the temperature of thehot plate 3 in order to adjust the values of the voltage or current supplied to the heating circuit accordingly and control the temperature. In this case, the lead wire of the thermocouple also extends from thecase 2 through thepacking 8. - In the first to sixth embodiments, the number of the
intake ports 17 may be altered. A larger number ofintake ports 17 speeds up the cooling of thehot plate 3 and cools thehot plate 3 in a more uniform manner. Furthermore, the number ofdischarge ports 18 may be three or more. - In the fourth embodiment, the
intake ports 17 and thedischarge ports 18 need not be located at the corners of right triangles and may be located at arbitrary positions. - In the fourth embodiment, the number of each of the
ports - In the fourth embodiment, the number of heating circuits is not limited to three. In this case, one or
more intake ports 17 need not be provided for each heating circuit as long as the total number of theintake ports 17 is 70 percent of the number of the heating circuits. For example, the number of theintake ports 17 may be seven or more if the number of the heating circuits is ten. If the number of the heating circuits is four, the number of theintake ports 17 may be three or more. - In the first to sixth embodiments, the circular
hot plate 3 may be changed to a polygonal one. In this case, the shape of thelip 4, theseal element 14, the holding ring 21 (or the holding plates 31) are changed in accordance with the shape of thehot plate 3. - It should be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention. Therefore, the present examples and embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalence of the appended claims.
Claims (5)
1. A hot plate unit comprising:
a hot plate having a heat generator;
a case having a hole for a wire that supplies electric current to the heat generator , wherein the case and the hot plate define a space in which a cooling fluid flows; and a seal element for sealing the hole.
2. The hot plate unit according to claim 1 , wherein the seal element for sealing the hole includes a ring packing made of elastic material.
3. A hot plate unit comprising:
a hot plate having a heat generator;
a case having a lip, wherein the case has a hole for a wire that supplies electric current to the heat generator, and wherein the case and the hot plate define a space in which a cooling fluid flows;
at least one intake port extending through the case; and
a seal element for sealing the hole.
4. A hot plate unit comprising:
a hot plate having a heat generator;
a case having a lip, wherein the case has a hole for a wire that su pplies electric current to the heat generator, and wherein the case and the hot plate define a space in which a cooling fluid flows;
at least one intake port extending through the case; and
a seal element for sealing the hole, wherein the seal element includes a ring packing made of elastic material.
5. The hot plate unit according to claim 1 , wherein the heat generator is printed on a lower surface of the hot plate and is exposed to the space.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/639,331 US20040031784A1 (en) | 1999-01-25 | 2003-08-12 | Hot plate unit |
US10/931,903 US20050031323A1 (en) | 1999-01-25 | 2004-09-01 | Hot plate unit |
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-016163 | 1999-01-25 | ||
JP11016163A JP2000215966A (en) | 1999-01-25 | 1999-01-25 | Hot plate unit |
JP11-032891 | 1999-02-10 | ||
JP3289199 | 1999-02-10 | ||
JP22533599A JP4330717B2 (en) | 1999-08-09 | 1999-08-09 | Hot plate unit and method of using hot plate unit |
JP11-225335 | 1999-08-09 | ||
JP11-228457 | 1999-08-12 | ||
JP22845799 | 1999-08-12 | ||
JP11-234171 | 1999-08-20 | ||
JP23417199 | 1999-08-20 | ||
US09/471,379 US6435616B1 (en) | 1999-12-23 | 1999-12-23 | Latching device for articulated elements, in particular, elements forming vehicle seats |
US09/880,359 US6646236B1 (en) | 1999-01-25 | 2001-06-13 | Hot plate unit |
US10/639,331 US20040031784A1 (en) | 1999-01-25 | 2003-08-12 | Hot plate unit |
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US09/880,359 Continuation US6646236B1 (en) | 1999-01-25 | 2001-06-13 | Hot plate unit |
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Application Number | Title | Priority Date | Filing Date |
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US10/931,903 Continuation US20050031323A1 (en) | 1999-01-25 | 2004-09-01 | Hot plate unit |
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US20040031784A1 true US20040031784A1 (en) | 2004-02-19 |
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US09/880,359 Expired - Lifetime US6646236B1 (en) | 1999-01-25 | 2001-06-13 | Hot plate unit |
US09/880,742 Expired - Lifetime US6639191B2 (en) | 1999-01-25 | 2001-06-13 | Hot plate unit |
US09/880,379 Expired - Lifetime US6635853B2 (en) | 1909-08-09 | 2001-06-13 | Hot plate unit |
US10/639,331 Abandoned US20040031784A1 (en) | 1999-01-25 | 2003-08-12 | Hot plate unit |
US10/639,063 Abandoned US20040031783A1 (en) | 1999-01-25 | 2003-08-12 | Hot plate unit |
US10/931,903 Abandoned US20050031323A1 (en) | 1999-01-25 | 2004-09-01 | Hot plate unit |
US10/931,906 Abandoned US20050023271A1 (en) | 1999-01-25 | 2004-09-01 | Hot plate unit |
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Application Number | Title | Priority Date | Filing Date |
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US09/880,359 Expired - Lifetime US6646236B1 (en) | 1999-01-25 | 2001-06-13 | Hot plate unit |
US09/880,742 Expired - Lifetime US6639191B2 (en) | 1999-01-25 | 2001-06-13 | Hot plate unit |
US09/880,379 Expired - Lifetime US6635853B2 (en) | 1909-08-09 | 2001-06-13 | Hot plate unit |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
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US10/639,063 Abandoned US20040031783A1 (en) | 1999-01-25 | 2003-08-12 | Hot plate unit |
US10/931,903 Abandoned US20050031323A1 (en) | 1999-01-25 | 2004-09-01 | Hot plate unit |
US10/931,906 Abandoned US20050023271A1 (en) | 1999-01-25 | 2004-09-01 | Hot plate unit |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070025708A1 (en) * | 2005-08-01 | 2007-02-01 | Samsung Electronics Co., Ltd. | Wafer heating apparatus and method of setting the apparatus |
US20110139399A1 (en) * | 2009-12-15 | 2011-06-16 | Sumitomo Electric Industries, Ltd. | Heater unit, heating and cooling device, and apparatus comprising same |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6646236B1 (en) * | 1999-01-25 | 2003-11-11 | Ibiden Co., Ltd. | Hot plate unit |
WO2001013423A1 (en) * | 1999-08-10 | 2001-02-22 | Ibiden Co., Ltd. | Semiconductor production device ceramic plate |
EP1249433A4 (en) * | 1999-09-06 | 2005-01-05 | Ibiden Co Ltd | Carbon-containing aluminium nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor |
EP1191002A4 (en) * | 2000-02-24 | 2005-01-26 | Ibiden Co Ltd | Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck |
JP2001247382A (en) * | 2000-03-06 | 2001-09-11 | Ibiden Co Ltd | Ceramic substrate |
WO2001078456A1 (en) * | 2000-04-07 | 2001-10-18 | Ibiden Co., Ltd. | Ceramic heater |
JP2002025758A (en) * | 2000-05-02 | 2002-01-25 | Ibiden Co Ltd | Hot plate unit |
EP1296360A1 (en) * | 2000-05-26 | 2003-03-26 | Ibiden Co., Ltd. | Semiconductor manufacturing and inspecting device |
JP3516392B2 (en) * | 2000-06-16 | 2004-04-05 | イビデン株式会社 | Hot plate for semiconductor manufacturing and inspection equipment |
EP1229572A1 (en) * | 2000-07-04 | 2002-08-07 | Ibiden Co., Ltd. | Hot plate for semiconductor manufacture and testing |
US6815646B2 (en) * | 2000-07-25 | 2004-11-09 | Ibiden Co., Ltd. | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober |
US20040185237A1 (en) * | 2001-08-07 | 2004-09-23 | Kohichiro Kawate | Sheet for sealing electrical wiring |
US20050224978A1 (en) * | 2002-06-24 | 2005-10-13 | Kohichiro Kawate | Heat curable adhesive composition, article, semiconductor apparatus and method |
JP2005166354A (en) * | 2003-12-01 | 2005-06-23 | Ngk Insulators Ltd | Ceramic heater |
US7105430B2 (en) * | 2004-03-26 | 2006-09-12 | Freescale Semiconductor, Inc. | Method for forming a semiconductor device having a notched control electrode and structure thereof |
US6949720B1 (en) * | 2004-04-01 | 2005-09-27 | Distintive Applicances, Inc. | Bottom electric heating element system for ovens |
US20060088692A1 (en) * | 2004-10-22 | 2006-04-27 | Ibiden Co., Ltd. | Ceramic plate for a semiconductor producing/examining device |
US20070000441A1 (en) * | 2005-07-01 | 2007-01-04 | Applied Materials, Inc. | Scalable uniform thermal plate |
US20090001071A1 (en) * | 2007-06-28 | 2009-01-01 | Sokudo Co., Ltd | Method and System for Cooling a Bake Plate in a Track Lithography Tool |
EP2065177B1 (en) * | 2007-11-30 | 2010-08-18 | Komax Holding AG | Hotplate with lifting element |
US10537013B2 (en) * | 2012-04-23 | 2020-01-14 | Applied Materials, Inc. | Distributed electro-static chuck cooling |
DE102013110530A1 (en) * | 2013-09-24 | 2015-03-26 | Tmd Friction Services Gmbh | Apparatus and method for the production of friction and brake linings |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2563875A (en) * | 1949-10-10 | 1951-08-14 | Lewis L Salton | Warming tray |
US2715173A (en) * | 1951-06-14 | 1955-08-09 | Farquharson William James | Pancake grill control housing construction |
US3386853A (en) * | 1965-12-28 | 1968-06-04 | Paul E. Oberg | Spiral vacuum deposition apparatus and method |
US3717439A (en) * | 1970-11-18 | 1973-02-20 | Tokyo Shibaura Electric Co | Vapour phase reaction apparatus |
US3997760A (en) * | 1974-12-06 | 1976-12-14 | Electro-Therm, Inc. | Electric heating element with bulkhead mounting means |
US4453533A (en) * | 1981-02-06 | 1984-06-12 | Schott Glaswerke | Frame for plates of glass, vitreous ceramic or similar material, particularly for cooker hobs |
US4525375A (en) * | 1983-03-28 | 1985-06-25 | Rca Corporation | Method of controllong the deposition of hydrogenated amorphous silicon and apparatus therefor |
US4960978A (en) * | 1987-08-26 | 1990-10-02 | E.G.O. Elektro-Gerate Blanc U. Fischer | Cooking appliance |
US5026970A (en) * | 1988-07-29 | 1991-06-25 | Emaco Ltd. | Cooking appliances |
US5063031A (en) * | 1989-08-24 | 1991-11-05 | Kabushiki Kaisha Toshiba | Apparatus for growing vapor phase layer on semiconductor substrate |
USH1145H (en) * | 1990-09-25 | 1993-03-02 | Sematech, Inc. | Rapid temperature response wafer chuck |
US5231690A (en) * | 1990-03-12 | 1993-07-27 | Ngk Insulators, Ltd. | Wafer heaters for use in semiconductor-producing apparatus and heating units using such wafer heaters |
US5306895A (en) * | 1991-03-26 | 1994-04-26 | Ngk Insulators, Ltd. | Corrosion-resistant member for chemical apparatus using halogen series corrosive gas |
US5317129A (en) * | 1992-03-27 | 1994-05-31 | Schott Glaswerke | Cooking range |
US5399839A (en) * | 1993-09-04 | 1995-03-21 | Schott Glaswerke | Device for holding a built-in cooking apparatus |
US5683606A (en) * | 1993-12-20 | 1997-11-04 | Ngk Insulators, Ltd. | Ceramic heaters and heating devices using such ceramic heaters |
US5891538A (en) * | 1993-10-29 | 1999-04-06 | Baikin Industries, Ltd. | Thermoplastic resin composition and laminate comprising the same |
US5904872A (en) * | 1994-09-29 | 1999-05-18 | Tokyo Electron Limited | Heating device, method of manufacturing the same, and processing apparatus using the same |
US6034863A (en) * | 1997-11-12 | 2000-03-07 | Applied Materials, Inc. | Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system |
US6359264B1 (en) * | 1998-03-11 | 2002-03-19 | Applied Materials, Inc. | Thermal cycling module |
US6635853B2 (en) * | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19637784C1 (en) * | 1996-09-17 | 1997-10-16 | Schott Glaswerke | Retainer for connection of cooking surface in section of work-top |
JPS6214489A (en) | 1985-07-12 | 1987-01-23 | 大倉電気株式会社 | High frequency connection line for printed wiring board |
JPS63149089A (en) | 1986-12-10 | 1988-06-21 | Nec Corp | Electron beam welding method |
JPS62169330A (en) | 1986-12-19 | 1987-07-25 | Canon Inc | Semiconductor exposure apparatus |
US5223113A (en) | 1990-07-20 | 1993-06-29 | Tokyo Electron Limited | Apparatus for forming reduced pressure and for processing object |
JPH088215B2 (en) | 1990-07-27 | 1996-01-29 | 日本碍子株式会社 | Semiconductor wafer heating device |
JPH088246B2 (en) | 1990-11-16 | 1996-01-29 | 日本碍子株式会社 | Heating device |
JPH0637039A (en) | 1992-07-16 | 1994-02-10 | Fujitsu Ltd | Sputter apparatus |
JPH0669326A (en) | 1992-08-21 | 1994-03-11 | Sanyo Electric Co Ltd | Wafer holder |
JP3297771B2 (en) | 1993-11-05 | 2002-07-02 | ソニー株式会社 | Semiconductor manufacturing equipment |
JPH08315965A (en) | 1994-09-29 | 1996-11-29 | Tokyo Electron Ltd | Heating device, its manufacture, and treatment device |
JP2987085B2 (en) | 1995-06-28 | 1999-12-06 | 日本碍子株式会社 | Semiconductor wafer holding device, method of manufacturing the same, and method of using the same |
JPH09167794A (en) | 1995-12-15 | 1997-06-24 | Sony Corp | Electrostatic chuck and plasma processing method |
JPH10312943A (en) | 1997-05-12 | 1998-11-24 | Komatsu Ltd | Temperature controller |
JPH10284382A (en) | 1997-04-07 | 1998-10-23 | Komatsu Ltd | Temperature control equipment |
JP3683788B2 (en) | 1999-08-11 | 2005-08-17 | 東京エレクトロン株式会社 | Heat treatment apparatus cooling method and heat treatment apparatus |
-
2001
- 2001-06-13 US US09/880,359 patent/US6646236B1/en not_active Expired - Lifetime
- 2001-06-13 US US09/880,742 patent/US6639191B2/en not_active Expired - Lifetime
- 2001-06-13 US US09/880,379 patent/US6635853B2/en not_active Expired - Lifetime
-
2003
- 2003-08-12 US US10/639,331 patent/US20040031784A1/en not_active Abandoned
- 2003-08-12 US US10/639,063 patent/US20040031783A1/en not_active Abandoned
-
2004
- 2004-09-01 US US10/931,903 patent/US20050031323A1/en not_active Abandoned
- 2004-09-01 US US10/931,906 patent/US20050023271A1/en not_active Abandoned
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6635853B2 (en) * | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
US2563875A (en) * | 1949-10-10 | 1951-08-14 | Lewis L Salton | Warming tray |
US2715173A (en) * | 1951-06-14 | 1955-08-09 | Farquharson William James | Pancake grill control housing construction |
US3386853A (en) * | 1965-12-28 | 1968-06-04 | Paul E. Oberg | Spiral vacuum deposition apparatus and method |
US3717439A (en) * | 1970-11-18 | 1973-02-20 | Tokyo Shibaura Electric Co | Vapour phase reaction apparatus |
US3997760A (en) * | 1974-12-06 | 1976-12-14 | Electro-Therm, Inc. | Electric heating element with bulkhead mounting means |
US4453533A (en) * | 1981-02-06 | 1984-06-12 | Schott Glaswerke | Frame for plates of glass, vitreous ceramic or similar material, particularly for cooker hobs |
US4525375A (en) * | 1983-03-28 | 1985-06-25 | Rca Corporation | Method of controllong the deposition of hydrogenated amorphous silicon and apparatus therefor |
US4960978A (en) * | 1987-08-26 | 1990-10-02 | E.G.O. Elektro-Gerate Blanc U. Fischer | Cooking appliance |
US5026970A (en) * | 1988-07-29 | 1991-06-25 | Emaco Ltd. | Cooking appliances |
US5063031A (en) * | 1989-08-24 | 1991-11-05 | Kabushiki Kaisha Toshiba | Apparatus for growing vapor phase layer on semiconductor substrate |
US5490228A (en) * | 1990-03-12 | 1996-02-06 | Ngk Insulators, Ltd. | Heating units for use in semiconductor-producing apparatuses and production thereof |
US5231690A (en) * | 1990-03-12 | 1993-07-27 | Ngk Insulators, Ltd. | Wafer heaters for use in semiconductor-producing apparatus and heating units using such wafer heaters |
USH1145H (en) * | 1990-09-25 | 1993-03-02 | Sematech, Inc. | Rapid temperature response wafer chuck |
US5306895A (en) * | 1991-03-26 | 1994-04-26 | Ngk Insulators, Ltd. | Corrosion-resistant member for chemical apparatus using halogen series corrosive gas |
US5317129A (en) * | 1992-03-27 | 1994-05-31 | Schott Glaswerke | Cooking range |
US5399839A (en) * | 1993-09-04 | 1995-03-21 | Schott Glaswerke | Device for holding a built-in cooking apparatus |
US5891538A (en) * | 1993-10-29 | 1999-04-06 | Baikin Industries, Ltd. | Thermoplastic resin composition and laminate comprising the same |
US5683606A (en) * | 1993-12-20 | 1997-11-04 | Ngk Insulators, Ltd. | Ceramic heaters and heating devices using such ceramic heaters |
US5904872A (en) * | 1994-09-29 | 1999-05-18 | Tokyo Electron Limited | Heating device, method of manufacturing the same, and processing apparatus using the same |
US6034863A (en) * | 1997-11-12 | 2000-03-07 | Applied Materials, Inc. | Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system |
US6359264B1 (en) * | 1998-03-11 | 2002-03-19 | Applied Materials, Inc. | Thermal cycling module |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070025708A1 (en) * | 2005-08-01 | 2007-02-01 | Samsung Electronics Co., Ltd. | Wafer heating apparatus and method of setting the apparatus |
US20110139399A1 (en) * | 2009-12-15 | 2011-06-16 | Sumitomo Electric Industries, Ltd. | Heater unit, heating and cooling device, and apparatus comprising same |
Also Published As
Publication number | Publication date |
---|---|
US20010040158A1 (en) | 2001-11-15 |
US20040031783A1 (en) | 2004-02-19 |
US20010042745A1 (en) | 2001-11-22 |
US6635853B2 (en) | 2003-10-21 |
US6639191B2 (en) | 2003-10-28 |
US20050031323A1 (en) | 2005-02-10 |
US6646236B1 (en) | 2003-11-11 |
US20050023271A1 (en) | 2005-02-03 |
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