US20040046096A1 - Support apparatus - Google Patents

Support apparatus Download PDF

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Publication number
US20040046096A1
US20040046096A1 US10/409,984 US40998403A US2004046096A1 US 20040046096 A1 US20040046096 A1 US 20040046096A1 US 40998403 A US40998403 A US 40998403A US 2004046096 A1 US2004046096 A1 US 2004046096A1
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United States
Prior art keywords
support apparatus
supporting portion
base
fixing portion
retainer ring
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/409,984
Inventor
Chiu-Hung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AU Optronics Corp
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AU Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AU Optronics Corp filed Critical AU Optronics Corp
Assigned to AU OPTRONICS CORP. reassignment AU OPTRONICS CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIU-HUNG
Publication of US20040046096A1 publication Critical patent/US20040046096A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present invention relates in general to a support apparatus.
  • the present invention relates to a support apparatus for a semiconductor process.
  • the support apparatus supports and protects a substrate in a chemical vapor deposition (CVD) chamber.
  • CVD chemical vapor deposition
  • a conventional CVD mechanism is shown in FIG. 1.
  • a glass substrate 10 is placed on a mechanism 12 and a robot 14 transports the glass substrate 10 .
  • the CVD mechanism 10 is in a heating chamber.
  • the length of the glass substrate 10 is about 650 mm to 750 mm, and the width of the glass substrate 10 is about 550 mm to 650 mm.
  • the glass substrate 10 sags by its own weight. The transport of the glass substrate 10 by the robot 14 is thereby obstructed. The larger the glass substrate 10 , the more serious the sagging.
  • FIG. 2 is a schematic diagram showing a support apparatus placed in a CVD mechanism.
  • a glass substrate 20 is placed on a mechanism 22 , and a plurality of support apparatuses is disposed on the mechanism 22 .
  • the plurality of support apparatuses supports the glass substrate 20 , and the glass substrate 20 does not sag by weight.
  • the robot 24 transports the glass substrate 20 successfully.
  • the conventional support apparatus is usually produced of stainless steel or ceramic.
  • the support apparatus is ceramic, the support apparatus is integral and the top of the support apparatus is a plate.
  • a drawback of this support apparatus is its light weight. When the substrate moves, the support apparatus easily adheres to the substrate due to static electricity, damaging the substrate. Another drawback is that since the contact surface between the substrate and the support apparatus is plate, the substrate is more easily damaged.
  • the support apparatus is stainless steel, and the CVD mechanism is disposed in a high-temperature chamber, the stainless steel easily reacts with the glass, damaging the substrate.
  • the support apparatus of ceramic or stainless steel has many disadvantages; it can scratch and damage the substrate. During subsequent process, the glass substrate must be cut. When the cut line passes through scrape marks made by the support apparatus, the glass substrate is broken more easily. Thus, production and efficiency are negatively impacted.
  • An object of the present invention is to provide a support apparatus that protects the substrate and increases process efficiency and quality.
  • Another object of the present invention is to provide a support apparatus that comprises a base, a supporting portion, and a fixing portion.
  • the supporting portion is disposed on the base.
  • the fixing portion connects and fixes the base and the supporting portion.
  • the support apparatus of the present invention is utilized in an apparatus of a semiconductor process to support and protect a glass substrate.
  • Another object of the present invention is to provide a support apparatus utilized in a semiconductor process that comprises a base, a supporting portion, and a retainer ring.
  • the base defines a hole.
  • the supporting portion passes through the hole and protrudes from the base.
  • the retainer ring firmly connects the base and the supporting portion.
  • the present invention also provides a support apparatus utilized in a semiconductor process comprising a base, a supporting portion, and a cover.
  • the base provides a groove and a first fixing portion.
  • the supporting portion is disposed in the groove of the base.
  • the cover has a second fixing portion and connects to the first fixing portion of the base.
  • FIG. 1 is a schematic diagram showing a conventional CVD mechanism
  • FIG. 2 is a schematic diagram showing a conventional support apparatus in a CVD mechanism
  • FIG. 3 a is a cross section of a support apparatus of the present invention.
  • FIG. 3 b is a perspective exploded view of a support apparatus of the present invention.
  • FIG. 4 a is a cross section of a support apparatus of the present invention.
  • FIG. 4 b is a cross section of a support apparatus of the present invention.
  • a support apparatus of the present invention comprises a base, a supporting portion, and a fixing portion.
  • the supporting portion is disposed on the base.
  • the fixing portion connects and fixes the base and the supporting portion.
  • the support apparatus of the present invention is utilized in an apparatus of a semiconductor process to support and protect a glass substrate.
  • the supporting portion has a round top.
  • the supporting portion is placed on the base.
  • the base and the supporting portion are fastened by the fixing portion.
  • the support apparatus is placed on a shaft in the CVD chamber.
  • the supporting portion contacts the substrate and provides a supporting force thereto.
  • FIG. 3 a is a cross section of a support apparatus of the present invention and FIG. 3 b is a perspective exploded view of a support apparatus of the present invention.
  • a support apparatus 30 of the present invention comprises a base 32 , a supporting portion 34 , and a fixing portion 36 .
  • the fixing portion 36 is a retainer ring.
  • the base 32 has a hole 321 in whose cross-section of the top is smaller than the bottom.
  • the supporting portion 34 has a round top and a annular slot 341 .
  • the fixing portion 36 is a standard C-shaped retainer ring. During assembly of the support apparatus 30 , the supporting portion 34 passes through the hole 321 of the base 32 from the underside thereof, such that the supporting portion 34 protrudes from the top of the base 32 . The fixing portion 36 then clips onto the supporting portion 34 , fitting into the annular slot 341 to connect the base 32 and the supporting portion 34 .
  • the support apparatus 30 is placed on a shaft in the CVD chamber. The supporting portion 34 of the support apparatus 30 contacts a substrate and provides a supporting force thereto.
  • the base 32 mentioned above is stainless steel, having enough weight that the substrate does not adhere thereto due to static electricity.
  • the supporting portion 34 mentioned above is ceramic.
  • the design of the round top of the supporting portion 34 decreases the contact area between the substrate and the supporting portion 34 so that the substrate is not scratched.
  • the supporting portion 34 can be polybenzimidazole (PBI), quartz or a heat-resistant material not easily reactant with glass.
  • the base 32 and the supporting portion 34 are separable such that the supporting portion 34 can be different material for different requirement.
  • the support apparatus 30 does not require integral manufacture, thus, it can decrease the costs and provide a conveniently changeable method.
  • the support apparatus 30 of the present invention uses the fixing portion 36 to connect the base 32 and the supporting portion 34 without requiring a screw. Omitting, first, the inconvenience of a screw, and, second, the volume of the present invention is small, making screw operation difficult.
  • FIG. 4 a and FIG. 4 b are cross sections of a support apparatus of the present invention.
  • a support apparatus 40 of the present invention comprises a base 42 , a fixing portion, and a supporting portion 44 .
  • the fixing portion is a threaded cover 43 .
  • the base 42 provides a groove 421 and a first fixing portion 422
  • the supporting portion 44 has a round top
  • the cover 43 has a second fixing portion 432 .
  • the supporting portion 44 is placed in the groove 421 of the base 42 .
  • the second fixing portion 432 of the cover 43 connects to the first fixing portion 422 of the base 42 .
  • the support apparatus 40 is placed on a shaft in the CVD chamber.
  • the supporting portion 44 of the support apparatus 40 contacts a substrate and provides the substrate with a supporting force.
  • the first fixing portion 422 is male threaded and the second fixing portion 432 is female threaded, although the configuration can be easily reversed.
  • the base 42 and the cover 43 mentioned above are stainless steel.
  • the base 42 has enough weight that the substrate does not adhere thereon due to static electricity.
  • the supporting portion 44 mentioned above is ceramic.
  • the design of the round top of the supporting portion 44 decreases the contact area between the substrate and the supporting portion 44 so that the substrate is not scratched by the support apparatus 40 .
  • the supporting portion 44 can be polybenzimidazole (PBI), quartz or heat-resistant material not easily reactant with glass.
  • the base 42 and the supporting portion 44 are separable such that the supporting portion 44 can be different material for different requirements.
  • the support apparatus 40 of the present invention uses the first fixing portion 422 and the second fixing portion 432 to connect the base 42 and the supporting portion 44 without requiring a screw.

Abstract

A support apparatus. The apparatus is utilized in a semiconductor process and comprises a base, a supporting portion, and a retainer ring. The base defines a hole. The supporting portion passes through the hole and protrudes from the base. The retainer ring firmly connects the base and the supporting portion.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates in general to a support apparatus. In particular, the present invention relates to a support apparatus for a semiconductor process. The support apparatus supports and protects a substrate in a chemical vapor deposition (CVD) chamber. [0002]
  • 2. Description of the Prior Art [0003]
  • A conventional CVD mechanism is shown in FIG. 1. A [0004] glass substrate 10 is placed on a mechanism 12 and a robot 14 transports the glass substrate 10. The CVD mechanism 10 is in a heating chamber. In conventional LCD process, the length of the glass substrate 10 is about 650 mm to 750 mm, and the width of the glass substrate 10 is about 550 mm to 650 mm. As shown in FIG. 1, the glass substrate 10 sags by its own weight. The transport of the glass substrate 10 by the robot 14 is thereby obstructed. The larger the glass substrate 10, the more serious the sagging.
  • As mentioned above, to prevent sagging of the substrate to enable smooth transport, a support apparatus is used. FIG. 2 is a schematic diagram showing a support apparatus placed in a CVD mechanism. A [0005] glass substrate 20 is placed on a mechanism 22, and a plurality of support apparatuses is disposed on the mechanism 22. The plurality of support apparatuses supports the glass substrate 20, and the glass substrate 20 does not sag by weight. Thus, the robot 24 transports the glass substrate 20 successfully.
  • At this point, the profile and material of the support apparatus is very important. The conventional support apparatus is usually produced of stainless steel or ceramic. When the support apparatus is ceramic, the support apparatus is integral and the top of the support apparatus is a plate. A drawback of this support apparatus is its light weight. When the substrate moves, the support apparatus easily adheres to the substrate due to static electricity, damaging the substrate. Another drawback is that since the contact surface between the substrate and the support apparatus is plate, the substrate is more easily damaged. When the support apparatus is stainless steel, and the CVD mechanism is disposed in a high-temperature chamber, the stainless steel easily reacts with the glass, damaging the substrate. Thus, the support apparatus of ceramic or stainless steel has many disadvantages; it can scratch and damage the substrate. During subsequent process, the glass substrate must be cut. When the cut line passes through scrape marks made by the support apparatus, the glass substrate is broken more easily. Thus, production and efficiency are negatively impacted. [0006]
    • SUMMARY OF THE INVENTION
  • An object of the present invention is to provide a support apparatus that protects the substrate and increases process efficiency and quality. [0007]
  • Another object of the present invention is to provide a support apparatus that comprises a base, a supporting portion, and a fixing portion. The supporting portion is disposed on the base. The fixing portion connects and fixes the base and the supporting portion. The support apparatus of the present invention is utilized in an apparatus of a semiconductor process to support and protect a glass substrate. [0008]
  • Another object of the present invention is to provide a support apparatus utilized in a semiconductor process that comprises a base, a supporting portion, and a retainer ring. The base defines a hole. The supporting portion passes through the hole and protrudes from the base. The retainer ring firmly connects the base and the supporting portion. [0009]
  • The present invention also provides a support apparatus utilized in a semiconductor process comprising a base, a supporting portion, and a cover. The base provides a groove and a first fixing portion. The supporting portion is disposed in the groove of the base. The cover has a second fixing portion and connects to the first fixing portion of the base.[0010]
    • DESCRIPTION OF THE DRAWINGS
  • The present invention can be more fully understood by reading the subsequent detailed description in conjunction with the examples and references made to the accompanying drawings, wherein: [0011]
  • FIG. 1 is a schematic diagram showing a conventional CVD mechanism; [0012]
  • FIG. 2FIG. 2 is a schematic diagram showing a conventional support apparatus in a CVD mechanism; [0013]
  • FIG. 3[0014] a is a cross section of a support apparatus of the present invention;
  • FIG. 3[0015] b is a perspective exploded view of a support apparatus of the present invention;
  • FIG. 4[0016] a is a cross section of a support apparatus of the present invention;
  • FIG. 4[0017] b is a cross section of a support apparatus of the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • A support apparatus of the present invention comprises a base, a supporting portion, and a fixing portion. The supporting portion is disposed on the base. The fixing portion connects and fixes the base and the supporting portion. The support apparatus of the present invention is utilized in an apparatus of a semiconductor process to support and protect a glass substrate. The supporting portion has a round top. During assembly of the support apparatus, the supporting portion is placed on the base. The base and the supporting portion are fastened by the fixing portion. During use, the support apparatus is placed on a shaft in the CVD chamber. The supporting portion contacts the substrate and provides a supporting force thereto. [0018]
  • FIG. 3[0019] a is a cross section of a support apparatus of the present invention and FIG. 3b is a perspective exploded view of a support apparatus of the present invention. Referring to FIG. 3a and FIG. 3b, a support apparatus 30 of the present invention comprises a base 32, a supporting portion 34, and a fixing portion 36. In this embodiment, the fixing portion 36 is a retainer ring.
  • The [0020] base 32 has a hole 321 in whose cross-section of the top is smaller than the bottom. The supporting portion 34 has a round top and a annular slot 341. The fixing portion 36 is a standard C-shaped retainer ring. During assembly of the support apparatus 30, the supporting portion 34 passes through the hole 321 of the base 32 from the underside thereof, such that the supporting portion 34 protrudes from the top of the base 32. The fixing portion 36 then clips onto the supporting portion 34, fitting into the annular slot 341 to connect the base 32 and the supporting portion 34. During use, the support apparatus 30 is placed on a shaft in the CVD chamber. The supporting portion 34 of the support apparatus 30 contacts a substrate and provides a supporting force thereto.
  • Moreover, the base [0021] 32 mentioned above is stainless steel, having enough weight that the substrate does not adhere thereto due to static electricity.
  • The supporting [0022] portion 34 mentioned above is ceramic. The design of the round top of the supporting portion 34 decreases the contact area between the substrate and the supporting portion 34 so that the substrate is not scratched.
  • Otherwise, the supporting [0023] portion 34 can be polybenzimidazole (PBI), quartz or a heat-resistant material not easily reactant with glass.
  • As mentioned above, the [0024] base 32 and the supporting portion 34 are separable such that the supporting portion 34 can be different material for different requirement. The support apparatus 30 does not require integral manufacture, thus, it can decrease the costs and provide a conveniently changeable method. The support apparatus 30 of the present invention uses the fixing portion 36 to connect the base 32 and the supporting portion 34 without requiring a screw. Omitting, first, the inconvenience of a screw, and, second, the volume of the present invention is small, making screw operation difficult.
  • FIG. 4[0025] a and FIG. 4b are cross sections of a support apparatus of the present invention. A support apparatus 40 of the present invention comprises a base 42, a fixing portion, and a supporting portion 44. In this embodiment, the fixing portion is a threaded cover 43.
  • The [0026] base 42 provides a groove 421 and a first fixing portion 422, the supporting portion 44 has a round top, and the cover 43 has a second fixing portion 432. During assembly of the support apparatus 40, the supporting portion 44 is placed in the groove 421 of the base 42. After that, the second fixing portion 432 of the cover 43 connects to the first fixing portion 422 of the base 42. During use, the support apparatus 40 is placed on a shaft in the CVD chamber. The supporting portion 44 of the support apparatus 40 contacts a substrate and provides the substrate with a supporting force.
  • As mentioned above, the [0027] first fixing portion 422 is male threaded and the second fixing portion 432 is female threaded, although the configuration can be easily reversed.
  • Moreover, the [0028] base 42 and the cover 43 mentioned above are stainless steel. The base 42 has enough weight that the substrate does not adhere thereon due to static electricity.
  • The supporting [0029] portion 44 mentioned above is ceramic. The design of the round top of the supporting portion 44 decreases the contact area between the substrate and the supporting portion 44 so that the substrate is not scratched by the support apparatus 40.
  • Otherwise, the supporting [0030] portion 44 can be polybenzimidazole (PBI), quartz or heat-resistant material not easily reactant with glass.
  • As mentioned above, the [0031] base 42 and the supporting portion 44 are separable such that the supporting portion 44 can be different material for different requirements. The support apparatus 40 of the present invention uses the first fixing portion 422 and the second fixing portion 432 to connect the base 42 and the supporting portion 44 without requiring a screw.
  • Finally, while the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements. [0032]

Claims (25)

What is claimed is:
1. A support apparatus, comprising:
a base:
a supporting portion, disposed on the base; and
a fixing portion, connecting the base and the supporting portion.
2. The support apparatus as claimed in claim 1, wherein the fixing portion is a retainer ring.
3. The support apparatus as claimed in claim 2, wherein the supporting portion comprises an annular slot, and the retainer ring clips onto the supporting portion fitting into the annular slot.
4. The support apparatus as claimed in claim 1, wherein the base is male threaded and the fixing portion is female threaded connected with the male screw.
5. The support apparatus as claimed in claim 1, wherein the base is female threaded and the fixing portion is male threaded connected with the female thread.
6. The support apparatus as claimed in claim 1, wherein the base is stainless steel.
7. The support apparatus as claimed in claim 6, wherein the supporting portion is ceramic.
8. The support apparatus as claimed in claim 6, wherein the supporting portion is polybenzimidazole (PBI).
9. The support apparatus as claimed in claim 6, wherein the supporting portion is quartz.
10. A support apparatus utilized in semiconductor process, comprising:
a base, defining a hole;
a supporting portion, passed through the hole and protruding from the base; and
a retainer ring, firmly connecting the base and the supporting portion.
11. The support apparatus as claimed in claim 10, wherein the supporting portion comprises an annular slot and the retainer ring clips onto the supporting portion fitting into the annular slot.
12. The support apparatus as claimed in claim 10, wherein the retainer ring is a C-shaped retainer ring.
13. The support apparatus as claimed in claim 12, wherein the supporting portion comprises an annular slot and the C-shaped retainer ring clips onto the supporting portion fitting into the annular slot.
14. The support apparatus as claimed in claim 10, wherein the base is stainless steel.
15. The support apparatus as claimed in claim 14, wherein the supporting portion is ceramic.
16. The support apparatus as claimed in claim 14, wherein the supporting portion is polybenzimidazole (PBI).
17. The support apparatus as claimed in claim 14, wherein the supporting portion is quartz.
18. A support apparatus utilized in a semiconductor process, comprising:
a base, provided with a groove and a first fixing portion;
a supporting portion, placed in the groove of the base; and
a cover, having a second fixing portion connected to the first fixing portion of the base.
19. The support apparatus as claimed in claim 18, wherein the first fixing portion is male threaded and the second fixing portion is female threaded connected with the male screw.
20. The support apparatus as claimed in claim 18, wherein the first fixing portion is female threaded and the second fixing portion is male threaded connected with the female thread.
21. The support apparatus as claimed in claim 18, wherein the base is stainless steel.
22. The support apparatus as claimed in claim 21, wherein the supporting portion is ceramic.
23. The support apparatus as claimed in claim 21, wherein the supporting portion is polybenzimidazole (PBI).
24. The support apparatus as claimed in claim 21, wherein the supporting portion is quartz.
25. The support apparatus as claimed in claim 21, wherein the cover is stainless steel.
US10/409,984 2002-09-11 2003-04-08 Support apparatus Abandoned US20040046096A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW91120768 2002-09-11
TW091120768A TWI220786B (en) 2002-09-11 2002-09-11 Supporting structure

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105201A1 (en) * 2006-11-03 2008-05-08 Applied Materials, Inc. Substrate support components having quartz contact tips
US10094022B2 (en) * 2014-09-24 2018-10-09 Tokyo Electron Limited Substrate processing apparatus and method of fabricating substrate loading unit

Citations (12)

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US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
US5589003A (en) * 1996-02-09 1996-12-31 Applied Materials, Inc. Shielded substrate support for processing chamber
US6170479B1 (en) * 1998-05-02 2001-01-09 Schott Glas Arrangement for attaching an atmospheric gas burner to the burner opening of a cooking surface that is made of glass or glass ceramic as well as a cooking area with such an arrangement
US6318957B1 (en) * 1998-07-10 2001-11-20 Asm America, Inc. Method for handling of wafers with minimal contact
US20020076166A1 (en) * 2000-12-20 2002-06-20 Cheng-Sheng Hsu Optical fiber junction
US6494955B1 (en) * 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
US6528767B2 (en) * 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
US6623225B1 (en) * 2002-04-19 2003-09-23 Asm International N.V. Expandable bolt and use for fragile parts
US20040003780A1 (en) * 1999-12-10 2004-01-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
US20040005121A1 (en) * 2002-07-08 2004-01-08 Sunney Yang Optical connector assembly
US6676761B2 (en) * 2000-07-20 2004-01-13 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US6716287B1 (en) * 2002-10-18 2004-04-06 Applied Materials Inc. Processing chamber with flow-restricting ring

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
US5589003A (en) * 1996-02-09 1996-12-31 Applied Materials, Inc. Shielded substrate support for processing chamber
US6170479B1 (en) * 1998-05-02 2001-01-09 Schott Glas Arrangement for attaching an atmospheric gas burner to the burner opening of a cooking surface that is made of glass or glass ceramic as well as a cooking area with such an arrangement
US6318957B1 (en) * 1998-07-10 2001-11-20 Asm America, Inc. Method for handling of wafers with minimal contact
US20040003780A1 (en) * 1999-12-10 2004-01-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
US6494955B1 (en) * 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
US6676761B2 (en) * 2000-07-20 2004-01-13 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US20020076166A1 (en) * 2000-12-20 2002-06-20 Cheng-Sheng Hsu Optical fiber junction
US6528767B2 (en) * 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
US6623225B1 (en) * 2002-04-19 2003-09-23 Asm International N.V. Expandable bolt and use for fragile parts
US20040005121A1 (en) * 2002-07-08 2004-01-08 Sunney Yang Optical connector assembly
US6716287B1 (en) * 2002-10-18 2004-04-06 Applied Materials Inc. Processing chamber with flow-restricting ring

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105201A1 (en) * 2006-11-03 2008-05-08 Applied Materials, Inc. Substrate support components having quartz contact tips
US10094022B2 (en) * 2014-09-24 2018-10-09 Tokyo Electron Limited Substrate processing apparatus and method of fabricating substrate loading unit

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