US20040060689A1 - Compact liquid cooled heat sink - Google Patents
Compact liquid cooled heat sink Download PDFInfo
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- US20040060689A1 US20040060689A1 US10/260,056 US26005602A US2004060689A1 US 20040060689 A1 US20040060689 A1 US 20040060689A1 US 26005602 A US26005602 A US 26005602A US 2004060689 A1 US2004060689 A1 US 2004060689A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/10—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overheating, e.g. heat shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising a first sink member having first and second substantially oppositely facing surfaces, the second surface for receiving at least one heat generating component, a second sink member having at least a first surface, the first surface of the second sink member secured to the first surface of the first sink member, the first surface of one of the sink members forming a cavity extending between first and second cavity ends and including a cavity surface, the first side of the other of the sink members including a cover surface that substantially covers the cavity and substantially oppositely faces the cavity surface so as to form a channel, at least one of the cavity surface and the cover surface forming a plurality of protuberances between the first and second cavity ends that extend into the cavity, the protuberances increasing turbidity of the liquid flowing therethrough such that channel surface air pockets are substantially eliminated, at least one of the first and second sink members forming an inlet at the first end of the channel and at least one of the first and second sink members forming an outlet at the second end of the channel.
Description
- Not applicable.
- Not applicable.
- The field of the invention is power converters and more specifically converter configurations including heat sinks that reduce the overall space required to accommodate the configurations.
- It is well known that variable speed drives of the type used to control industrial electric motors include numerous electronic components. Among the various electronic components used in typical variable-speed drives, all generate heat to a varying degree during operation. Typically, high-power switching devices such as IGBTs, diodes, SCRs and the like as well as storage devices such as capacitors are responsible for generating most of the heat in a variable-speed drive. It is for this reason, therefore, that most variable-speed drives include a heat sink(s) upon which the power switching devices are mounted. The heat sink(s) conducts potentially damaging heat from assembly components.
- Selecting the size and design of a heat sink for a particular variable speed drive is somewhat of a challenge. First, a designer must be aware of the overall characteristics of the motor and drive pair. Second, the designer must understand the industrial application in which the motor and drive pair will be used, including the continuous and peak demands that will likely be placed on the motor and drive by the load. Third, the designer must accommodate, in the design, certain unexpected conditions that would deleteriously affect the heat transfer capability of the heat sink such as unexpectedly high ambient temperatures, physical damage to the heat sink such as mechanical damage, or a build up of a debris layer, as examples. Fourth, the heat sink(s) must be physically dimensioned so as to fit into the space allotted per customer requirements, cabinet or enclosure size, or the like.
- In the past, air-cooled heat conducting plates were used to transfer thermal energy from electronic parts to the ambient air. These were passive heat-transfer devices and were generally formed of a light-weight aluminum extrusion including a set of fins. As a general rule, heat transfer effectiveness is based on the temperature differential between the power devices and the ambient air temperature. Of course, in order to provide adequate heat conduction, heat sinks of this type oftentimes are necessarily large and, therefore, bulky and expensive. If high ambient conditions exist, the heat sink becomes ineffective or useless as heat removal cannot be accomplished regardless of the size of the heat sink. If the variable speed drive was in an enclosed space the heat removed from the drive would need to be exhausted or conditioned for recirculation.
- By forcing air over fins defined on the heat-conducting plate (e.g., an aluminum extrusion), improved cooling efficiency can be realized. Large blower motors are often used for this purpose. However, as the fins defined in the aluminum extrusions become dirty or corroded during use, the heat sinks become less effective or useless altogether. Blower motors cannot be used in environments where air cleanliness would clog filtration. Therefore, air conditioning equipment is often added to internally circulate and cool the air that is passed over the heat sink fins.
- Liquid cooled heat sinks or cold plates have also been used for some applications but with limited success. Generally, a liquid cooled heat sink includes a series of chambers or channels that are formed internally within a sink body member that is formed of material (e.g., copper or aluminum) that readily conducts heat. The body member includes at least one mounting surface for receiving heat generating devices. The channels are typically configured so that at least one channel section is formed adjacent each surface segment to which a heat generating device is mounted—typical channel configurations are serpentine. A coolant liquid is pumped through the channels from one or more inlet ports to one or more outlet ports to cool the sink member and hence conduct heat away form the heat generating devices.
- The industry has developed several ways in which to manufacture liquid cooled heat sinks and, each of the different ways to manufacture has different costs associated therewith. For instance, a liquid cooled sink can be constructed by forming a desired serpentine copper conduit path for liquid flow, placing the serpentine conduit construct within a sink mold, pouring molten liquid aluminum into the mold and allowing the molten aluminum to cool. While this manufacturing process has been used successfully, liquid molding processes are very difficult to control and the incidences of imperfect and or non-functioning product have been relatively high.
- One other sink manufacturing process that has proven useful includes cutting a at least one channel out of a sink body member, hermetically sealing (e.g., vacuum brazing) a cover member to the body member to cover the channel and then forming an inlet and an outlet that open into opposite ends of the channel. This two part sealing process is much less expensive than the conduit-molten process described above.
- When designing any liquid cooled heat sink several factors have to be considered including heat dissipating effectiveness, volume required to accommodate a resulting converter, and cost. With respect to heat dissipation, in the case of a power conversion assembly, there are typically several different heat generating devices that are similarly constructed and that operate in a similar fashion to convert power. For instance, as well known in the controls arts, an AC to DC rectifier typically includes a plurality of power switching devices that are arranged to form a bridge assembly. In the case of a three phase supply and load, the bridge assembly includes three phases, a separate switching phase for each of the three supply and load phases. Here, an exemplary phase may include first and second power switching devices linked at a common node to an associated supply line where the other terminals of the first and second switches are linked to positive and negative DC busses, respectively. A controller is configured to control all of the three phases of the bridge together to convert the three phase AC supply voltage to a DC potential across the positive and negative DC busses.
- In a similar fashion, a three phase inverter assembly typically includes three separate phases that link positive and negative DC busses to three load supply lines. In the case of an inverter, each phase typically includes first and second power switching devices that are linked in series between the positive and negative DC busses with the common node between the first and second inverter switches linked to an associated phase of the load. Where the supply and load voltages are large, some rectifier/inverter converter assemblies may include several three phase bridges linked together thereby reducing the load handling of each switching device.
- In the case of a rectifier-inverter conversion assembly, a drive circuit is provided that controls all of the switching devices together to create desired three phase output voltages to drive a load linked thereto. In this case, it is imperative that the switching devices operate in characteristic and substantially similar ways to simplify what is, by its very nature, an already complex switching scheme. For this reason, converter designers typically select switching devices having known operating characteristics to configure their conversion assemblies.
- Nevertheless, as also well known, most switching devices have operating characteristics that are, at least in part, affected by the environments in which the devices operate. Specifically, for the purposes of the present invention, it should be appreciated that switching device operating characteristics change as a function of temperature. For instance, an internal switch resistance has been known to change as a function of temperature which in turn affects the voltage drop across the switch. While each voltage drop change that occurs may seem insignificant, because rectifier and inverter switches are typically turned on and off very rapidly, the affect of changing device drop has been shown to be appreciable.
- The problems associated with voltage drop variance are compounded where similar switching devices are operated at different temperatures and is especially acute where control schemes operate to simultaneously control all three conversion assembly phases together to generate load voltages. Thus, for instance, where one switching device is several degrees hotter than another switching device, the result may be unbalanced phase voltages and hence imperfect load control (e.g., non-smooth motor rotation) which increases overall system wear and can cause system damage over time.
- For this reason, one challenge when designing a heat sink for use with a converter assembly has been to provide essentially identical heat dissipating capacity to each converter switching device so that device temperatures are essentially identical during system operation. The problem here is that coolant temperature rises as the coolant absorbs heat along its path through a sink member so that power switching devices relatively near an inlet port along a serpentine coolant path are cooled to a greater degree than switching devices down stream from the inlet port. One solution that reduces the heat dissipating capacity differential between similar switching devices has been to provide a heat sink where the spacing between a cooling liquid inlet and each of the sink surfaces to which switching devices are mounted is similar. For instance, where a configuration includes twenty four power switching devices, instead of mounting the switching devices to the sink in a pattern that tracks a single serpentine cooling conduit path, the switching devices may be mounted on sink member mounting surface to form six rows of four switching devices each where each of the six rows is fed by a separate one of six liquid coolant inlet ports—here a manifold may serve each of the six inlet ports (see generally FIG. 23 in U.S. Pat. No. 6,031,751 (hereinafter “the '751 patent”) entitled “Small Volume Heat Sink/Electronic Assembly” which issued on Feb. 29, 2000 and which is incorporated herein by reference). Thus, in this case, coolant from each of the six inlet ports passes by four separate heat generating devices and device cooling will be relatively more uniform. This solution to reduce the device temperature differential will be referred to hereinafter as a matrix spacing solution.
- One other solution that reduces the heat dissipating capacity differential between switching devices mounted to a sink member has been to provide a serpentine path that passes by each heat generating device more than once so that the overall cooling affect of devices is similar. For instance, assume twelve switching devices are mounted to a sink member mounting surface to form two rows of six devices each and that a single serpentine path is configured to include a first linear run that passes adjacent the first row of devices, a first 180 degree turn, a second linear run that passes adjacent the second row of devices, a second 180 degree turn, a third linear run that again passes adjacent the second row of devices, a third 180 degree turn and a fourth linear run that passes a second time by the first row of devices to an outlet.
- Here, in theory, the first linear run should include the coolest coolant, the second linear run should include the second coolest coolant and so on so that the coolant temperatures through the first and fourth linear runs (i.e., adjacent the devices in the first row) should average and the coolant temperatures though the second and third linear runs (i.e., adjacent the devices in the second row) should also average and the two average temperatures should be similar (see generally FIG. 2 in the '751 patent). This solution to reduce the device temperature differential will be referred to hereinafter as an averaging solution.
- While the averaging solution and the matrix spacing solution work in theory, in reality, each of these solutions have had some problems regarding temperature differential. With respect to the matrix spacing solution, in the example above, the fourth device along each of the six separate coolant paths is warmer than the first device along the same path as liquid passing by the first three devices along the path heats up when heat is absorbed along the path. Thus, while better than sinks that align devices along a single serpentine cooling conduit path, the matrix solution still results in a temperature differential.
- With respect to the averaging solution, it has been determined that, despite multi-pass designs, at least some temperature differential still exists between devices spaced at different locations along the coolant conduit path. In addition, in some cases, cooling capacity may vary over the heat dissipating surface of each heat generating device. This intra-device dissipating differential may occur as a multi pass path necessarily requires that the coolest pass (i.e., the first pass by a device) be positioned along one side of a dissipating surface so that another one or more passes that include relatively warmer coolant can be positioned along the other side of the dissipating surface.
- With respect to volume (i.e., the second factor above to consider when designing a heat sink), as with most electronics designs, all other things being equal, smaller is typically considered better. Thus, some prior converter configurations have provided sink members that either facilitate stacking of relatively short devices adjacent elongated devices (see FIG. 19 in the '751 patent) or, in the alternative, aligning similar dimensions of different devices (see FIG. 13 in the '751 patent).
- For instance, the '751 patent recognizes that, in addition to power switching devices, converter configuration capacitors also often generate excessive heat that should be dissipated to ensure proper operation. The '751 patent also recognizes that capacitors typically have a length dimension perpendicular to their heat dissipating surface that is much longer than the thickness dimensions of typical switching devices perpendicular to the device dissipating surfaces and that the switching devices typically have a length dimension that is similar to the capacitor length dimension. In this case, in one embodiment, the '751 patent recognizes that overall converter configuration size can be reduced by providing an L shaped sink member having two legs that form a 90° angle, mounting the capacitors to an inside surface of one of the legs and within the space defined by the two leg members and mounting the switching devices to the outside surface of the other of the leg members thereby aligning the similar capacitor and device length dimensions.
- With respect to cost, unfortunately, where an L shaped heat sink member or, for that matter, where a sink member having sections that reside along other than a single plane is required to stack or align capacitors with switching devices, the relatively inexpensive two part sealing process described above becomes much more difficult to use. This is because the two part sealing process generally includes vacuum sealing a flat cover member over a channel forming body member, When the channel must reside in more than one plane and requires a more complex cover member, tolerances required to provide a suitable cover member would be extremely difficult to meet and the sealing process would be difficult to perform effectively.
- Thus, where the sink member must reside in two or more planes to facilitate stacking and/or aligning, the more expensive molten-conduit process would likely be employed where the conduit is formed into the desired channel shape and molten aluminum or the like is poured into a mold there around. For this reason prior stacking and aligning configurations have proven to be relatively expensive to manufacture and often are not suitable given cost constraints.
- Also, with respect to cost, often the last converter design consideration is how system components will be electrically linked together to form a converter topology. One particularly advantageous and robust type of linking assembly is referred to generally as a laminated bus bar. As its label implies, a laminated bus bar typically includes a plurality of metallic sheets of laminate that are layered together with insulators between adjacent laminate sheets. Vias are formed within the laminated assembly where links are to be made to capacitor and switching device terminals. The vias automatically link the devices and capacitors up in a desired fashion to provide an intended converter topology (e.g., rectifier, inverter, rectifier-inverter, etc.).
- Laminated bus bar cost is generally a function of the amount of material required to construct the bus, the number of laminate layers required to support a configuration and the overall complexity of the required laminate member where minimal material, minimal layers and minimal contours (i.e., bends in the laminates) are all advantageous. Unfortunately, providing a configuration that uses minimal laminate material, requires minimal layering and restricts the laminate to a single plane is extremely difficult given the sink member configurations required to minimize overall configuration size and provide essentially uniform heat dissipating capacity to all switching devices mounted to the sink. For example, where devices are arranged in rows and columns to provide similar distances between channel inlets and devices down stream therefrom, typically a large number of laminate layers and a correspondingly complex labyrinth of vias are required to link components together. As another instance, where switching device lengths are aligned with similarly dimensioned capacitor lengths the lamination bus typically requires one or, more often, several bends to accommodate connection terminals that reside in disparate planes. In either of these two cases (i.e., many layers or several laminate bends) the amount of material required to configure a laminated bus bar can be excessive and hence unsuitable for certain applications.
- Yet one other cost consideration related to converter configurations has to do with component versatility or the ability to use converter components in more than one converter configuration. Component versatility is particularly important with respect to the more expensive component types such as, for example, the heat sink assembly, the laminated bus bar, etc. In this regard, overall system costs can be reduced by designing sinks and laminated bus bars that can be used with various device and capacitor types. For instance, assume that a first converter configuration includes a first type of switching device, a first type of capacitor, a first type of sink member and a first type of laminate bar. Also assume that the sink, devices and a capacitors are dimensioned such that when the capacitors and devices are mounted to the sink, the capacitors connection terminals are on the same plane as the device connection terminals. Here, the first laminate bus bar type can be planar and hence relatively.
- Next assume that a designer wants to swap out a second capacitor type for the first type in the configuration where the second capacitor type has a thickness between its dissipating surface and its connection terminals that is different than a similarly measures thickness of the first capacitor type. In this case, when the capacitors are swapped, the capacitor and device terminals will no longer reside within the same plane and a different, perhaps custom designed, laminate will be required to accommodate the change. In the alternative, the sink design may be altered to accommodate the change in device and capacitor terminal planes although this solution would be relatively expensive. Similar problems occur when different switching devices are swapped into configurations.
- Thus, it would be advantageous to have a heat sink assembly that is relatively inexpensive to manufacture and yet provides substantially similar heat dissipating capacity to all devices mounted thereto. In addition, it would be advantageous if a sink assembly of the above kind could be used with a simplified laminate design and be used to configure relatively compact converter assemblies. Moreover, it would be advantageous if the sink assembly could be versatile and hence used with other converter components that have many different dimensions.
- It has been recognized that relatively compact and inexpensive converter configurations can be configured by using an elongated liquid cooled heat sink to cool power switching devices. More specifically, it has been recognized that, where switching devices are mounted in a single row to a sink member mounting surface, the sink can be used to configure minimal volume converter configurations. In at least one embodiment of the invention, the sink mounting surface has a width dimension that is substantially similar to a width dimension of switching devices to be mounted thereto with the device width dimensions aligned with the mounting surface width dimension. This single row limitation has several configuration advantages described below.
- It has also been recognized that, with certain types of refrigerant, the cooling capacity differential along a cooling channel appears to be exacerbated along the channel length. For instance, the cooling capacity differential appears to be relatively pronounced in the case of two phase refrigerants such as R-134a and R-123. As the label implies, two phase refrigerants change from a liquid to a gas when heat is absorbed and hence, generally, absorb a greater amount of heat, due to the endothermic nature of the phase change, than conventional single-phase liquid refrigerants such as water -hence two phase refrigerants are generally preferred in high efficiency heat sinks.
- Moreover, it has been recognized that, unfortunately, as two-phase refrigerants absorb heat and change phase from liquid to gas, vapor bubbles are formed within the liquid that accumulate on the internal surfaces of the heat sink and form gas pockets. The gas pockets on the surface of the channel block refrigerant from contacting the channel surface and hinder device heat absorption by the refrigerant. Thus, the channel surfaces on which gas pockets form end up becoming hot spots on the channel surfaces and the temperatures of devices attached adjacent thereto rise.
- Because the vapor bubbles are formed by heat absorption and because coolant relatively further down stream from an inlet is warmer than coolant more proximate the inlet, relatively more vapor bubbles are formed down stream from the inlet than proximate the inlet thereby causing more gas pockets to form down stream which increases the temperature differential along the channel length. Thus, it has been determined that, while coolant temperature accounts for some of the temperature differential along a coolant channel length, much of the temperature differential is actually due to different amounts of gas accumulating along different sections of the channel - the gas having an insulating effect between the channel surfaces and the coolant passing thereby. Based on these realizations it should be appreciated that the temperature differential problem is exacerbated where sink channels are extended.
- According to several embodiments of the invention, protuberances of a character, quantity and size that increase turbulence within sink channels to a point where the turbulence either prohibits gas pockets from forming on the channel surfaces or dislodges or breaks up gas pockets that form on the channel surfaces, are provided on at least one of the channel surfaces. It has been found that when such protuberances are provided within a channel, the channel can have an extended length without causing excessive temperature differentials there along. More specifically, it has been determined that the channel length can, in at least one embodiment, extend substantially along an entire sink length where the sink, as indicated above, has a length to accommodate a single row of switching devices. For instance, where a converter configuration includes twenty four switching devices, the twenty four devices can be arranged in a single row along the sink member mounting surface where the channel extends along substantially the entire sink length from an inlet to an outlet.
- It has also been determine that, in at least some embodiments of the invention, the sink member can be juxtaposed so that the channel inlet is below the channel outlet and, more specifically, so that the channel inlet is directly vertically below the channel outlet. Here, dislodged or broken up gas pockets, being lighter than the refrigerant, are aided by buoyancy in their movement toward the outlet at the top of the sink channel.
- By providing an elongated sink-device assembly including devices mounted in a single row to an elongated sink member, overall converter cost can be reduced. In this regard, the single channel sink member can be manufactured using the two piece sealing method described above where the channel is bore out of a body member, a cover member is hermetically sealed over the channel and inlet and outlet ports that open into the channel are formed.
- In addition, cost is reduced with the inventive elongated sink-device assembly as a simplified laminated bus bar can be used with the sink-device assembly. In this regard, where capacitors are juxtaposed to one side of the switching devices and with capacitor terminals and device terminals positioned within a common connection plane, the distances between capacitor terminals and the device terminals that the capacitor terminals are to be linked to are reduced appreciably so that less material is required to make terminal connections. Moreover, because capacitor terminals and the device terminals to which the capacitor terminals are to be linked may be positioned proximate each other, none of the laminates have to pass over other devices disposed intermediate the connecting terminals and therefore simpler laminate and associated via designs can be employed that include relatively small numbers (e.g., 3) of laminate layers.
- Consistent with the above teachings, at least one embodiment of the invention includes a heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising a first sink member having first and second substantially oppositely facing surfaces, the second surface for receiving at least one heat generating component, a second sink member having at least a first surface, the first surface of the second sink member secured to the first surface of the first sink member, the first surface of one of the sink members forming a cavity extending between first and second cavity ends and including a cavity surface, the first side of the other of the sink members including a cover surface that substantially covers the cavity and substantially oppositely faces the cavity surface so as to form a channel, at least one of the cavity surface and the cover surface forming a plurality of protuberances between the first and second cavity ends that extend into the cavity, the protuberances increasing turbidity of the liquid flowing therethrough such that channel surface air pockets are substantially eliminated, at least one of the first and second sink members forming an inlet at the first end of the channel; and at least one of the first and second sink members forming an outlet at the second end of the channel.
- In some embodiments the first sink member forms the cavity. In some embodiments the first sink member also forms the protuberances. In at least some embodiments the cavity includes a substantially elongated cavity and the protuberances are formed substantially along the entire length of the cavity. In more specific embodiments the channel is a first channel and wherein at least one of the first and second sink members forms a channel divider member that extends into the cavity substantially along the entire length of the cavity so that the cavity also forms a second channel that is substantially parallel to the first channel, the first sink member forming protuberances along the lengths of each of the first and second channels.
- The first sink member may form the channel divider. In addition, the protuberances may include first and second protuberance sets, the first protuberance set includes protuberances arranged in a line substantially along the center of the first channel and the second protuberance set includes protuberances arranged in a line substantially along the center of the second channel. Here, the protuberances may be separated by spaces therebetween and the protuberances are equi-spaced along the channel lengths. The dimension between the first surface of the first sink member and the channel surface may be a channel depth and each of the protuberances and the divider member may substantially extend the channel depth from the channel surface.
- The first sink member may also forms a manifold that links the inlet to each of the first and second channels. Here, the manifold may include a receiving chamber and restricted first and second nozzle passages, the inlet may open into the receiving chamber and the first and second nozzles may separately link the receiving chamber to the first and second channels, respectively. More specifically, the receiving chamber may have a cross sectional dimension that is greater than the cross sectional dimensions of each of the first and second nozzle passageways.
- In one aspect the receiving chamber may have a cross sectional dimension that is greater than the combined cross sectional dimensions of the first and second nozzle passageways. In addition, the cross sectional dimensions of the first and second channels may be greater than the cross sectional areas of the first and second nozzle passageways, respectively.
- In several embodiments the divider member terminates before the outlet end of the cavity so that the outlet ends of the first and second channels are linked. In several embodiments the second surface has a width dimension that is similar to a width dimension of the devices to be mounted thereto and has a length dimension substantially parallel to a length dimension of the channels, the length dimension of the second surface substantially perpendicular to the width dimension of the second surface.
- In some embodiments the sink is to be used with devices that have a heat generating footprint, the footprint having a footprint width, the channels together having a channel width dimension that is similar to the footprint width.
- Some embodiments of the invention also include a heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising a sink member having a receiving surface for receiving at least one heat generating component, the sink member internally forming an elongated channel that extends from an inlet end to an outlet end and forming an inlet and an outlet that open into the inlet and outlet ends, respectively, the channel including at least first and second oppositely facing surfaces and forming a plurality of protuberances between the first and second channel ends that extend into the channel, the protuberances increasing turbidity of the liquid flowing therethrough such that channel surface air pockets are substantially eliminated.
- Moreover, at least some embodiments of the invention include a heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising a body member having first and second substantially oppositely facing surfaces, the first surface forming an elongated cavity that extends from an inlet end to an outlet end, forming a first divider member that extends substantially along the length of the cavity and forming second and third divider members juxtaposed on opposite sides of the first divider member such that the divider members separate the cavity into four substantially parallel channels, the second and third divider members forming openings that facilitate passage between adjacent channels, the second surface for receiving at least one heat generating component, a cover member having a first surface secured to the first surface of the body member such that the first surface substantially covers the first and second channels and such that distal ends of each of the divider members contacts the first surface of the cover member, the cover member forming an inlet and an outlet that open into the inlet and outlet ends of the cavity, respectively and a liquid refrigerant source linked to the inlet end of the sink for providing liquid refrigerant thereto.
- These and other objects, advantages and aspects of the invention will become apparent from the following description. In the description, reference is made to the accompanying drawings which form a part hereof, and in which there is shown a preferred embodiment of the invention. Such embodiment does not necessarily represent the full scope of the invention and reference is made therefor, to the claims herein for interpreting the scope of the invention.
- FIG. 1a is a schematic diagram of a rectifier configuration and corresponding controller while FIG. 1b is a schematic diagram of an inverter configuration;
- FIG. 2 is an exploded perspective view of a converter assembly according to one embodiment of the present invention;
- FIG. 3 is an exploded perspective view of the heat sink member and switch packages of FIG. 2;
- FIG. 4 is a side plan view of an assembled configuration consistent with FIG. 2;
- FIG. 5 is a bottom plan view of the conversion configuration of FIG. 4;
- FIG. 6 is a plan view of the body member of the heat sink member of FIG. 3 and, in particular, showing the surface of the body member in which a coolant channel is formed;
- FIG. 7 is similar to FIG. 6, albeit illustrating a second embodiment of the body member;
- FIG. 8 is similar to FIG. 6, albeit illustrating yet one other embodiment of the body member; and
- FIG. 9 is a flow chart according to one aspect of the present invention.
- Referring now to the drawings where in like numerals correspond to similar elements throughout the several views and, more specifically, referring to FIGS. 1a and 1 b, the present invention will be described in the context of exemplary
motor control system 10 including a rectifier assembly generally illustrated in FIG. 1a which feeds an inverter assembly generally illustrated in FIG. 1b where each of the rectifier and inverter are controlled by acontroller 22. As known in the controls industry, rectifier (FIG. 1a) receives three-phase AC voltage oninput lines negative DC buses DC buses inverter output lines - The rectifier assembly includes twelve separate switching devices identified by numerals30-41. The switching devices 30-41 are arranged between the positive and
negative DC buses negative DC buses switches positive bus 18 andnegative bus 20, a second rectifier leg includesswitches buses switches buses switches numeral 46. - Each of
input lines line 14 is linked tocommon node 46 betweenswitches switches input line 12 is linked to the common node betweenswitches switches line 16 is linked to the common node betweenswitches switches switches - A
control bus 48 which represents a plurality of different controllines links controller 22 separately to each one of the rectifier switches 30-41 for independent control.Controller 22 controls when each of the switches 30-41 turns on and when each of the switches 30-41 turns off. Control schemes that may be used bycontroller 22 to convert the three-phase voltages onlines DC buses controller 22. For example, referring still to FIG.1 a, each ofswitches controller 22 and each ofswitches controller 22 as the corresponding rectifier legs have the samecommon node 46 linked toline 14. - In addition to the components described above, the rectifier configuration illustrated in FIG. 1a also includes capacitors between
DC buses numeral 50. Although only two capacitors are illustrated, it should be appreciated that a larger number of capacitors would typically be employed in any type of rectifier configuration.Capacitors 50 reduce the ripple in the potential betweenlines - Referring now to FIG. 1b, the inverter configuration illustrated, like the rectifier configuration of FIG. 1a, includes twelve separate switching devices identified by numerals 61-72. The switching devices 61-72 are arranged to form six separate inverter legs. Each inverter leg includes a pair of the switching devices 61-72 that is series arranged between the
positive DC bus 18 and thenegative DC bus 20. For example, a first inverter leg includesswitches buses switches buses switches buses - Common nodes between inverter leg switch pairs are referred to hereinafter as common nodes. In FIG. 1 b, an exemplary common node between
switches numeral 80. In the illustrated embodiment, eachoutput line output line 28 is linked tocommon node 80 betweenswitches switches output line 26 is linked to the common node betweenswitches switches 64 and 70 whileoutput line 24 is linked to the common node betweenswitches switches - The
control bus 48 linked tocontroller 22 is also linked separate to each of the inverter switches 61-72 to independently control the turn on and turn off times of those switches. As in the case of the rectifier switches of FIG. 1a,controller 22 controls the switches of the inverter legs that have common nodes linked to the same output line in an identical fashion. To this end, referring still to FIG. 1b, because the common nodes (e.g., 80) corresponding to the first inverterleg including switches leg including switches output line 28, the first and second inverter legs are controlled in a similar fashion so that each ofswitches switches - Referring to FIGS. 1a and 1 b, the rectifier-inverter configuration includes commonly controlled switches so that the configuration can handle relatively high currents that may otherwise destroy the types of devices employed to configure the converters. In this manner relatively less expensive switches can be used to construct the converter assembly. The switches 30-41 used to configure the rectifier are typically identical and the switches 61-72 used to configure the inverter are typically identical. Depending on the configuration design, switches 30-41 may or may not be identical to switches 61-72.
- Referring still to FIGS. 1a and 1 b, switch manufacturers often provide power switching devices in prepackaged modules suitable to construct inverters and rectifiers. To this end, often, a complete 6-switch bridge will be provided as a separate and unique switching power package. Hereinafter it will be assumed that the 24 switches that comprise the rectifier and inverter in FIGS. 1a and 1 b are provided in four separate 6-switch bridge packets where the first switching package includes
switches switches switches switches numerals Exemplary switch packets - Referring now to FIG. 2, an exploded perspective view of an exemplary rectifier/
inverter converter assembly 100 is illustrated.Configuration 100 includes aheat sink member 102, the four-switchingmodules bracket member 104, a plurality of capacitors collectively identified bynumeral 50, alaminated bus bar 106 and a plurality of input and output bus bars identified bynumerals 12′, 14′, 16′, 28′, 26′, and 24′. - Each of switch packages90, 92, 94 and 96 is similarly constructed and therefore, in the interest of simplifying this explanation, unless indicated otherwise, only switch
package 90 will be described here in detail. Referring also to FIGS. 3 and 5,package 90 has a generally rectilinear shape having a length dimension L3, a width dimension W1 and a thickness dimension (not separately labeled). Although not illustrated in any of the drawings,device package 90 is characterized by a device thickness dimension that will be referred to herein by label T1 that is formed between the mounting or dissipating surface 122 (see FIG. 3) of the device and a connection plane defined by the top surfaces of the emitter and capacitor connection terminals that extend from the package housing.Package 90 has a first device or first linkingedge 130 and a second device orsecond linking edge 132 that face in opposite directions and are separated by device width W1 as illustrated. - Referring still to FIG. 1a and also to FIG. 2,
package 90 includes switchingdevices package 90 and are generally separated by the device width W1. For example, the emitter E1 and collector C1 extend from opposite sides ofpackage 90 while emitter E2 and collector C2 forswitch 36 extend in opposite directions. Adjacent switches withinpackage 90 have their emitters and collectors extending in different directions. For example, referring to FIG. 1a and FIG. 2, switch 36 in FIG. 1a has its emitter E2 and its collector C2 extending in directions opposite those of emitter E1 and collector C1 of thefirst switch 30 adjacent thereto in thepackage 90. Referring still to FIG. 3,package 90 is designed so that all of the emitter and collector terminals extend from the package housing within a single connection plane. - Hereinafter, unless indicated otherwise, switching device connection terminals that are linked to any of
bus bars 12′, 14′, 16′, 24′, 26′ or 28′ will be referred to as inter-converter terminals because those terminals are connected through their respective bus bars to components outside the converter configuration. Similarly, any device package terminals that are linked tolaminated bus bar 106 will be referred to hereinafter generally as intra-converter terminals as those terminals are linked to other components within the converter assembly. - As illustrated and described hereinafter, all of the inter-converter terminals extend from one side of
package 90 while all of the intra-converter terminals extend from the opposite side ofpackage 90 after the configuration in FIGS. 2 and 4 is assembled. In addition, after assembly, all of the intra-converter terminals for all ofpackages packages - Control ports are provided on a top surface of
package 90 to facilitate linking ofcontrol bus 48 to the devices provided withinpackage 90. An exemplary control port in FIG. 2 is identified bynumeral 120. -
Package 90 has anundersurface 122 that is in thermal contact with the components inside the package housing that generate heat.Package 90 is designed so thatsurface 122 is substantially flat and can make substantially full contact with a heat sink surface when mounted thereto. It should be appreciated that, typically, only a portion ofsurface 122 may generate a relatively large percentage of the total amount of heat generated by the package and that the primary heat generating surface will likely be the central portion ofsurface 122. Aheat generating segment 124 or dissipating surface ofpackage 92 is illustrated and includes a space that is framed by anouter space 126 that surrounds theheat generating space 124.Space 124 generally corresponds to a space that is in direct contact with thepackage 90 components that conduct current and hence generate heat.Space 124 has a dissipating surface width dimension W2 associated therewith. - As best in seen in FIGS. 2 and 3, each
package 90 includes a plurality of small apertures, two of which are identified bynumber 128, provided through theouter space 126 that frames the heat generating segment 124 (e.g., see device 92) as illustrated.Apertures 128 are provided to facilitate mountingpackages member 102. - Referring still to FIG. 2, bus bars12′, 14′, 16′, 28′, 26′ and 24′ are to be linked to input
lines output lines - Each of input and output bus bars12′, 14′, 16′, 24′, 26′ and 28′ are simply steel bars that either have an “L” shape or a “T” shape. Each
bar 12′, 14′, 16′, 24′, 26′ and 28′ is designed to link input or output lines to a subset of four of the inter-converter terminals. For example, referring to FIGS. 1a and 2, L-shapedbus bar 16′ is constructed and dimensioned so as to link together each of the emitter E1 forswitch 30, the collector C2 forswitch 36, the emitter forswitch 31 and the collector forswitch 37 and, to this end, includes four separate apertures for receiving some type of mechanical securing component (e.g., a bolt), a separate aperture corresponding to each one the emitters and collectors to be connect bybar 16′. Each of theother bus bars 12′, 14′, 24′, 26′ and 28′ has a construction similar tobus bar 16′ and therefore, in the interest of simplifying this explanation, the other bars will not be described here in detail. It should suffice to say that the bus bars link emitters and collectors among the switch packages 90, 92, 94 and 96 in a manner that is consistent with the schematics illustrated in FIGS. 1a and 1 b. - Referring once again to FIG. 3 and also to FIG. 4,
heat sink member 102 is an elongated and, in the illustrated embodiment, substantially rectilinear metallic (e.g., aluminum, copper, etc.) member that extends from afirst end 144 to asecond end 146, has first and second lateral surfaces 148 and 150, respectively, that face in opposite directions and extend along the entire length between ends 144 and 146 and also includes a first or first mountingsurface 140 and a second oppositely facing mountingsurface 142. As best illustrated in FIG. 2 (and also illustrated in FIG. 6), mountingsurface 140 has a width dimension W3 that separates thelateral surfaces surface 140 andlateral surfaces lateral edges 149 and 151, respectively. In at least one embodiment of the present invention, sink width W3 is substantially similar to the device package width W1 so that, as illustrated in FIG. 2, device packages 90, 92, 94 and 96 are mounted in a side-by-side single row fashion to be accommodated on mountingsurface 140. - As best seen in FIG. 3, in at least one embodiment,
sink member 102 includes two separate components that are secured together. The two components including abody member 160 and acover member 162. Referring also to FIG. 5,body member 160 has thickness dimension T2 which is generally greater than the thickness dimension (not separately identified) ofmember 162. Together,body member 160 andcover member 162 have a thickness dimension T3. - As illustrated in FIGS. 3 and 6,
body member 160 includes asecond surface 164 opposite mountingsurface 140 and forms acavity 166 therein which extends substantially along the length ofbody member 160 from thefirst end 144 of the sink member to thesecond end 146.Cavity 166 has a cavity or channel depth Dc and forms a cavity orchannel surface 69. In the illustrated embodiment,cavity 166 stops short of each of theends cavity 166 that have a thickness that is similar to the width dimension of the framing (i.e., the mounting flange)portion 126 of device surface 122 (see FIG. 3). The cavity width dimension W4, in at least some embodiments, is similar to the width dimension W2 of the primary heat generating portion orsegment 124 of thepackage dissipating surface 122. - Cavity length dimension L4, in some embodiments, is substantially similar to a dimension formed by the oppositely facing edges of the dissipating surfaces of the device packages at the ends of the device row attached to the sink member. This dimension will be slightly smaller than the combined lengths (e.g., L3) of the device packages90, 92, 94 and 96 in most cases. When
cavity 160 is so dimensioned, a relatively small sink assembly is constructed which still provides effective cooling to devices attached thereto. - Referring still to FIGS. 3 and 6, within
cavity 166,body member 160 includes three separate cavity dividing members including a central or first dividingmember 180 and second and third lateral dividing members collectively identified bynumeral 182. As its label implies, central dividingmember 180 is positioned centrally withincavity 166 and generally divides the cavity into two separate channels. Central dividingmember 180, in the illustrated embodiment, extends such that its distal end is flush withsurface 164 ofbody member 160. In addition, central dividingmember 180 extends all the way to afirst end 184 ofcavity 166 but stops short of asecond end 186 of the cavity, thesecond end 186 being oppositefirst end 184. - Each of the second and
third dividing members 182 is positioned on a different side ofcentral member 180 and each stops short of both thefirst cavity end 184 and thesecond cavity end 186. In addition, each of dividingmembers 182 forms a plurality of openings so that liquid flowing on either side of the member can pass to the opposite side of the member. Exemplary openings are identified by numeral 190 in FIG. 3. Likecentral member 180, in the illustrated embodiment, each of the second and thirdlateral members 182 extends such that its distal end is flush withsurface 164 ofbody member 160. - With
openings 190 formed in each of dividingmembers 182, what remains ofmembers 182 includesprotuberances 290 that essentially break up the flow of coolant through the two channels formed within thecavity 166 as described in greater detail below. In the illustrated embodiment theprotuberances 290 are essentially equi-spaced along the channel lengths. - At the
first end 144 of the sink member, in the illustrated embodiment,body member 160 forms an inlet or receivingchamber 192 and first andsecond nozzle passageways Inlet chamber 192 is formed betweenend 144 andcavity 166 and is connected tocavity 166 on one side ofcentral member 180 byfirst nozzle passageway 194 and is connected tocavity 166 on the other side ofcentral dividing member 180 bysecond nozzle passageway 196.Inlet chamber 192 has a relatively large cross-sectional area when compared to either ofnozzle passageways inlet chamber 192 can act as a reservoir for providing liquid under pressure tocavity 166 through thenozzle passageways lateral dividing members 182 is positioned such that theprotuberance 290 closest to theinlet nozzle passageway second end 146 ofbody member 160,body member 160 forms achannel extension 210 having a width dimension that is less than the cavity width W4. -
Body member 160 can be formed in any manner known in the art. One method for providingmember 160 includes providing the member withoutcavity 166 and scraping metal out ofsurface 164 to provide a suitable cavity. Another method may be to formbody member 160 in a mold. Other manufacturing processes are contemplated. -
Cover member 162 is a substantially planar and rigid rectilinear member having a shape which mirrors the shape ofsurface 164.Member 162 forms aninlet opening 200 at afirst end 204 and anoutlet opening 202 at a second 206. Theinlet 200 andoutlet 202 are formed such that, whencover member 162 is secured to surface 164,inlet 200 opens intoinlet channel 192 andoutlet 202 opens intoextension 210. - To
secure cover member 162 in a hermetically sealed manner to surface 164, any method known in the industry can be employed. One method which has been shown to be particularly useful in providing a hermetic seal betweencover member 162 andbody member 160 has been to use a vacuum brazing technique where a bead of brazing material is provided alongsurface 164 ofbody member 160,cover member 162 is provided onsurface 164 with the brazing bead sandwiched betweenmembers - As illustrated, each of
body member 160 andcover member 162 form a plurality of apertures (not separately numbered) for receiving mechanical components such as screws, bolts, etc., for mountingdevice packages sink member 102. In addition,body member 160 and/orcover member 162 may include other apertures for mounting other converter components (e.g., the bracket described below) to sinkmember 102 and/or to mount thesink member 102 within a converter housing for support. - Referring once again to FIG. 2 and also to FIG. 5,
capacitors 50 are standard types of capacitors and, to that end, generally include a cylindrical body member having afirst end 220 and asecond end 222 opposite thefirst end 220 whereterminals first end 220 and a heat conducting extension 228 (see FIG. 5) extends centrally from eachsecond end 222. Theheat conducting extensions 228, as the label implies, conducts most of the heat from the central core of the capacitor. Eachcapacitor 50 has a length dimension L1 which separates the first and second ends 220 and 222. - Referring now to FIGS. 2, 4 and5,
bracket member 104 is, in at least one embodiment, formed of a heat conducting, rigid material such as aluminum or copper.Bracket member 104 includes aproximal member 230, anintermediate member 232 and adistal member 234.Proximal member 230 includes a flat elongated member which has a length substantially equal to the length ofsink member 102.Proximal member 230 forms a plurality of mounting apertures along its length which align with similar apertures (not illustrated) in thesurface 142 formed by cover member 162 (see again FIG. 3). -
Intermediate member 232 forms a 90° angle withproximal member 230 and extends from one of the long edges ofmember 230. Similarly,distal member 234 extends from the long edge ofintermediate member 232 opposite the edge linked toproximal member 230 and forms a 90° angle withintermediate member 232. The 90° angle formed betweenintermediate member 232 anddistal member 234 is in the direction opposite the angle formed betweenproximal member 230 andintermediate member 232 so thatdistal member 234 extends, generally, in a direction opposite the direction in whichproximal member 230 extends. Although not illustrated,distal member 234 forms a plurality of apertures through which the heat dissipatingcapacitor extension members 228 extend for mounting thecapacitors 50 thereto. In the illustrated embodiment,distal member 234 forms two rows of substantially equi-spaced apertures for receiving thecapacitors 50 and arranging thecapacitors 50 in two separate rows. - Referring again to FIGS. 2, 4 and5,
laminated bus bar 106 includes a substantially planar member having a general shape similar to the shape of distal member 134. Although not illustrated, it should be appreciated by one of ordinary skill in the art that laminatedbus bar 106 includes several metallic conducting layers where adjacent layers are separated by insulating layers and wherein different ones of a conducting layers are linked to connecting terminals along one edge of the bus bar. Exemplary connecting terminals are identified by numeral 240 in FIGS. 2 and 4. - In addition, although not illustrated, separate vias are provided in an underside of
bus bar 106 which facilitate connection of particular points and particular conducting laminations withinbar 106 to the capacitors juxtaposed hereunder when the converter assembly is configured. More specifically, referring to FIGS. 1a and 1 b once again,bus bar 106 links various emitters and collectors of the switching devices 30-41 and 61-72 to the positive and negative DC buses separated by thecapacitors 50 as illustrated. Thus, for example,bus bar 106 links the collector ofswitch 30 to thepositive DC bus 18, the emitter ofswitch 36 to the negative DC bus, the collector ofswitch 31 to thepositive DC bus 18, the emitter ofswitch 37 to thenegative DC bus 20, and so on. - It should be appreciated that
bus bar 106 can have an extremely simple and hence minimally expensive construction when used with a sink and switching device configuration that aligns all intra-converter connection terminals in a single line and in a single connection plane. Here only a minimal number of laminate layers are required and no vias are required to link to the switching devices asconnection terminals 240 are within the same plane as the device terminals. - With the converter components configured as described above, a particularly advantageous converter assembly can be assembled as follows. First, after the
cover member 62 has been hermetically sealed tobody member 160, device packages 90, 92, 94 and 96 are mounted to mountingsurface 140 ofsink member 102 so as to form a single device row as illustrated best in FIG. 4. Next,bracket member 104 is secured to surface 142 ofcover member 102 so thatintermediate member 232 generally extends away fromsink member 102 and so thatdistal member 234 also extends generally away fromsink member 102.Capacitors 50 are next mounted todistal member 234 with their extendingheat dissipating extensions 228 passing through apertures inmember 234 and so that thecapacitors 50 form two capacitive rows as illustrated in FIGS. 2 and 5. - At this point, it should be appreciated that, when
bracket member 104 is suitably dimensioned, theconnection terminals capacitors 50 should be within the same connection plane as the intra-converter connection terminals extending toward thecapacitors 50 from each of device packages 90, 92, 94 and 96. To this end, thebracket member 232 should be chosen such that the length dimension L2 ofintermediate member 232, when added to the sink member thickness T3 and the device thickness T1 (not illustrated), essentially equals the capacitor length L1. When any of thesink member 102, thecapacitors 50 or the device packages (e.g., 90) are replaced by other components having different dimensions, the differently dimensioned components can be accommodated and the capacitor and device package connecting terminals can be kept within the same plane by selecting abracket member 104 having a differentintermediate member 232 length dimension L2. Thus, the bracket-sink member assembly renders the sink member extremely versatile when compared to previous sink configurations that required multi-plane serpentine coolant paths. - With the capacitor connecting terminals and the intra-converter terminals extending from the device packages within the same connection plane, planar and relatively
simple bus bar 106 is attached to the capacitor and intra-converter terminals thereby linking the various terminals to the positive andnegative buses - Continuing, the input and output bus bars12′, 14′, 16′, 24′, 26′ and 28′ are next linked to the inter-converter connection terminals as illustrated in FIG. 4 and to link the emitters and capacitors of the switching devices 30-41 and 61-72 at the common nodes (e.g., 46, 80, etc.) as illustrated in FIGS. 1a and 1 b.
- Referring now to FIG. 5, when all of the components described above are secured together in the manner taught, an extremely compact converter assembly that requires a relatively small volume is configured. In fact, as illustrated, a space280 is formed
adjacent surface 142 ofcover member 162 and adjacentintermediate member 232 where additional components such as the components required to configurecontroller 22 can be mounted. In some embodiments, at least some of the components ofcontroller 22 will be mounted within cooling space 280 to a second mounting surface formed bysurface 142 ofcover member 162 so that the mounted components dissipate heat intosink member 102. - Referring again to FIGS. 3 and 6, with
cover member 162 secured to surface 164, when liquid is pumped throughinlet 200 and intoinlet chamber 192, afterchamber 192 fills with liquid, the liquid is forced through each of restrictednozzle inlets cavity 166 where the halves are separated by central dividing member 180). Because thenozzle passageways cavity 166. As the liquid passes throughcavity 166 on its way to and outoutlet 202, the liquid heats up betweenfirst channel end 184 andsecond channel end 186 and a phase change occurs wherein at least a portion of the liquid, as heat is absorbed, changes from the liquid state the state gas thereby forming bubbles withincavity 166. - Protuberances290 cause excessive amounts of turbulence within
cavity 166 as theprotuberances 290 redirect liquid along random trajectories within the channels. The excessive turbulence withincavity 166 is such that essentially no gas pockets form on the internal surfaces of thecavity 166 or the portion ofcover member 162enclosing cavity 166. In embodiments wheresink member 102 is vertically aligned, bubbles that form within the cavity float upward under the force of liquid flow and the force of their own buoyancy. The bubbles proceed out theoutlet 202 and are thereafter condensed by the cooling system attached thereto as the refrigerant is cooled. - In FIG. 6, as indicated above,
cavity 166 has a width dimension W4 that is, at least in one embodiment, similar to the width dimension W2 of the heat generating portion of device or package surface 122 (see also FIG. 3). Where dimension W2 is smaller, it is contemplated that the dual channel aspect ofcavity 166 may not be required. For example, assume dimension W2 is half the dimension illustrated in the figures. In this case, thecavity 166 may be made approximately half the illustrated dimension and hencecentral member 180 may not be needed. - Experiments have shown that if width dimension W4 is too large and no
dividers 180 are provided along the cavity length L4, the turbulence generated by theprotuberances 290 is substantially reduced. Thus, for instance, assumemember 180 were removed fromcavity 166. In this case much of the coolant pumped intocavity 166 throughpassageways outlet end 186 ofcavity 166. The maximum width of each channel formed withincavity 166 is going to be a function of various factors including cavity depth, coolant employed, coolant pressure, the quantum of heat generated by device packages mounted to the sink, etc. - It should be appreciated that the
protuberances 290 anddivider 180 withincavity 166 are specifically provided to increase channel turbulence to a level that eliminates gas pockets on channel surfaces. Without gas pockets on the channel surfaces, refrigerant/coolant is in substantially full contact with all channel surfaces and the temperature differential between the first and second channel ends 184 and 186 is substantially reduced. The smaller channel temperature differential means that devices mounted to sinkmember 102 have more similar operating characteristics as desired. - Referring now to FIG. 9 a
method 300 according to one aspect of the present invention is illustrated. Here, atblock 302, a body member 160 (see again FIG. 3) having a limited width dimension W3 and a length L5 is provided where the limited width dimension is substantially similar to or identical to the width dimension W1 of the devices to be attached thereto. Atblock 304, a cavity is formed in a first surface of thebody member 160 that extends substantially along the entire length dimension L5. The cavity is illustrated as 166 in FIG. 3. Atblock 306, acover member 162 is provided that is consistent with the teachings above. Atblock 308 an inlet is formed in one of the body member and the cover member. Atblock 310 an outlet is formed in one of the body member and the cover member. As above, the inlet and outlet formed should open into opposite ends of the cavity orchannel 166. Atblock 312, thecover member 162 is hermetically sealed in any manner known in the art to thebody member 160 thereby providing an enclosed channel having only a single inlet and a single outlet at opposite ends. Continuing, atblock 314, power switching devices forpackages - It should be understood that the methods and apparatuses described above are only exemplary and do not limit the scope of the invention, and that various modifications could be made by those skilled in the art that would fall under the scope of the invention. For example, while the
sink member 102 is described as being formed of two components other configurations are contemplated. In addition, theprotuberances 290 may take other forms that cause a suitable amount of turbulence within the channel. For instance, in FIG. 7 another embodiment of the body member is illustrated. In FIG. 7 components similar to the components of FIG. 6 are identified by identical numbers followed by an “a” qualifier. In FIG. 7, instead of providing substantially rectilinear protuberances as in FIG. 6,triangular protuberances 290a are provided on either side of member 280. Moreover, the protuberances may be formed by any channel surface although forming the protuberances on the surface opposite the heat generating devices (i.e., opposite the mounting surface) increases the total surface area proximate the heat generating device that is in contact with the coolant. Furthermore, both the cover and the body member may form protuberances and, in some embodiments, the cover member may form part or all of thecavity 166. - In addition, while the
protuberances 290 are illustrated as being equi-spaced, equi-spacing is not required and, in fact, it may be advantageous to provide protuberances that cause a greater amount of turbulence at the outlet end of the channel than at the inlet end as the coolant at the outlet end could be slightly warmer and hence could generate more problematic vapor bubbles. - Moreover, more than one divider may be provided in a cavity. In this regard, referring to FIG. 8, another
inventive embodiment 160 b of the body member is illustrated. In FIG. 8 components similar to components described above are identified by the same number followed by a “b” qualifier. In FIG. 8 cavity 166 b is twice as wide as thecavity 166 in FIG. 6. Here, to ensure sufficient turbulence to eliminate stagnant gas pockets from the cavity surface, threeseparate divider members separate inlet passageways protuberances - To apprise the public of the scope of this invention, the following claims are made:
Claims (46)
1. A heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising:
a first sink member having first and second substantially oppositely facing surfaces, the second surface for receiving at least one heat generating component;
a second sink member having at least a first surface, the first surface of the second sink member secured to the first surface of the first sink member, the first surface of one of the sink members forming a cavity extending between first and second cavity ends and including a cavity surface, the first side of the other of the sink members including a cover surface that substantially covers the cavity and substantially oppositely faces the cavity surface so as to form a channel;
at least one of the cavity surface and the cover surface forming a plurality of protuberances between the first and second cavity ends that extend into the cavity, the protuberances increasing turbidity of the liquid flowing therethrough such that channel surface air pockets are substantially eliminated;
at least one of the first and second sink members forming an inlet at the first end of the channel; and
at least one of the first and second sink members forming an outlet at the second end of the channel.
2. The apparatus of claim 1 wherein the first sink member forms the cavity.
3. The apparatus of claim 2 wherein the first sink member forms the protuberances.
4. The apparatus of claim 3 wherein the cavity includes a substantially elongated cavity and wherein the protuberances are formed substantially along the entire length of the cavity.
5. The apparatus of claim 4 wherein the channel is a first channel and wherein at least one of the first and second sink members forms a channel divider member that extends into the cavity substantially along the entire length of the cavity so that the cavity also forms a second channel that is substantially parallel to the first channel, the first sink member forming protuberances along the lengths of each of the first and second channels.
6. The apparatus of claim 5 wherein each of the first and second channels are substantially rectilinear.
7. The apparatus of claim 6 wherein the first sink member forms the channel divider.
8. The apparatus of claim 7 wherein the protuberances include first and second protuberance sets, the first protuberance set includes protuberances arranged in a line substantially along the center of the first channel and the second protuberance set includes protuberances arranged in a line substantially along the center of the second channel.
9. The apparatus of claim 8 wherein the protuberances are separated by spaces therebetween and the protuberances are equi-spaced along the channel lengths.
10. The apparatus of claim 9 wherein the dimension between the first surface of the first sink member and the channel surface is a channel depth and wherein each of the protuberances and the divider member substantially extend the channel depth from the channel surface.
11. The apparatus of claim 10 wherein the first sink member also forms a manifold that links the inlet to each of the first and second channels.
12. The apparatus of claim 11 wherein the manifold includes a receiving chamber and restricted first and second nozzle passages, the inlet opens into the receiving chamber and the first and second nozzles separately link the receiving chamber to the first and second channels, respectively.
13. The apparatus of claim 12 wherein the receiving chamber has a cross sectional dimension that is greater than the cross sectional dimensions of each of the first and second nozzle passageways.
14. The apparatus of claim 13 wherein the receiving chamber has a cross sectional dimension that is greater than the combined cross sectional dimensions of the first and second nozzle passageways.
15. The apparatus of claim 14 wherein the cross sectional dimensions of the first and second channels are greater than the cross sectional areas of the first and second nozzle passageways, respectively.
16. The apparatus of claim 10 wherein the divider member terminates before the outlet end of the cavity so that the outlet ends of the first and second channels are linked.
17. The apparatus of claim 16 wherein the second surface has a width dimension that is similar to a width dimension of the devices to be mounted thereto and has a length dimension substantially parallel to a length dimension of the channels, the length dimension of the second surface substantially perpendicular to the width dimension of the second surface.
18. The apparatus of claim 17 for use with devices that have a heat generating footprint, the footprint having a footprint width, the channels together having a channel width dimension that is similar to the footprint width.
19. The apparatus of claim 1 wherein the first and second sink members are each formed of one of aluminum and copper.
20. The apparatus of claim 1 wherein the second sink member forms the inlet.
21. The apparatus of claim 20 wherein the second sink member forms the outlet.
22. The apparatus of claim 1 wherein the first surfaces of the first and second sink members are hermetically sealed together.
23. The apparatus of claim 22 wherein the first surfaces are vacuum brazed together.
24. The apparatus of claim 1 further including a high pressure fluid source linked to the inlet and wherein the fluid is one of R-134a refrigerant and R123 refrigerant.
25. The apparatus of claim 1 wherein the first sink member forms the protuberances.
26. The apparatus of claim 1 wherein the cavity includes a substantially elongated channel and wherein the protuberances are provided substantially along the entire length of the channel.
27. The apparatus of claim 1 wherein the channel is a first channel and wherein at least one of the first and second sink members forms a channel divider member that extends into the cavity substantially along the entire length of the cavity so that the cavity also forms a second channel that is substantially parallel to the first channel, the protuberances formed extending into the channels along the lengths of each of the first and second channels.
28. The apparatus of claim 27 wherein the fist sink member forms the channel divider.
29. The apparatus of claim 27 wherein the divider member is a first divider member and at least one of the first and second sink members forms a second divider member and a third divider member juxtaposed on opposite sides of the first divider member within the cavity so as to form additional channels and wherein each of the second and third divider members forms a plurality of openings, the divider member sections between the openings comprising the protuberances.
30. The apparatus of claim 29 wherein the openings are equi-spaced along the divider member lengths.
31. The apparatus of claim 30 wherein the divider members terminate before the outlet end of the cavity so that the outlet ends of the first and second channels are linked.
32. The apparatus of claim 1 wherein the dimension between the cover surface and the channel surface is a channel depth and wherein each of the protuberances substantially extend the channel depth.
33. The apparatus of claim 1 wherein the second surface has a width dimension that is similar to a width dimension of the devices to be mounted thereto and has a length dimension substantially parallel to a length dimension of the channel, the length dimension of the second surface substantially perpendicular to the width dimension of the second surface.
34. The apparatus of claim 1 wherein the apparatus is juxtaposed so that the outlet is vertically above the inlet.
35. The apparatus of claim 1 wherein the protuberances form a texture on at least part of at least one of the cavity surface and the cover surface.
36. A heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising:
a sink member having a receiving surface for receiving at least one heat generating component, the sink member internally forming an elongated channel that extends from an inlet end to an outlet end and forming an inlet and an outlet that open into the inlet and outlet ends, respectively, the channel including at least first and second oppositely facing surfaces and forming a plurality of protuberances between the first and second channel ends that extend into the channel, the protuberances increasing turbidity of the liquid flowing therethrough such that channel surface air pockets are substantially eliminated.
37. The apparatus of claim 36 wherein the protuberances are spaced out along the length of the channel between the inlet and outlet ends.
38. The apparatus of claim 36 wherein the protuberances extend to the second surface.
39. The apparatus of claim 36 wherein the first surface of the channel is substantially flat and is substantially parallel to the receiving surface.
40. The apparatus of claim 36 wherein the channel is a first channel and the sink member forms a divider member that extends from the first to the second channel surfaces thereby forming a second channel adjacent and substantially parallel to the first channel that extends from the inlet to the outlet ends, the sink member also forming a plurality of protuberances that extend from the first surface to the second surface within the second channel, the protuberances in the second channel spaced out along the length of the channel between the inlet and outlet ends.
41. The apparatus of claim 40 wherein the protuberances include first and second protuberance sets, the first protuberance set includes protuberances linearly arranged substantially along the center of the first channel and the second protuberance set includes protuberances linearly arranged substantially along the center of the second channel.
42. The apparatus of claim 40 wherein the sink member also forms a manifold at the inlet end that opens separately into each of the first and second channels.
43. The apparatus of claim 40 wherein the divider member terminates before the outlet end so that the outlet ends of the first and second channels are linked.
44. A heat sink apparatus for use with a liquid refrigerant that tends to generate gas during the cooling process wherein at least some of the gas tends to accumulate on the internal surfaces of heat sink liquid channels forming gaseous pockets that in turn cause surface hot spots, the apparatus for minimizing the surface host spots and comprising:
a body member having first and second substantially oppositely facing surfaces, the first surface forming an elongated cavity that extends from an inlet end to an outlet end, forming a first divider member that extends substantially along the length of the cavity and forming second and third divider members juxtaposed on opposite sides of the first divider member such that the divider members separate the cavity into four substantially parallel channels, the second and third divider members forming openings that facilitate passage between adjacent channels, the second surface for receiving at least one heat generating component;
a cover member having a first surface secured to the first surface of the body member such that the first surface substantially covers the first and second channels and such that distal ends of each of the divider members contacts the first surface of the cover member, the cover member forming an inlet and an outlet that open into the inlet and outlet ends of the cavity, respectively; and
a liquid refrigerant source linked to the inlet end of the sink for providing liquid refrigerant thereto.
45. The apparatus of claim 44 wherein each of the second and third divider members forms a plurality of openings along the divider member length.
46. The apparatus of claim 45 wherein each of the divider members is terminated prior to the outlet end, the first divider member extends to the inlet end and wherein the body member also forms a manifold between the inlet and the channels, the manifold including a receiving chamber and restricted first and second nozzle passages, the inlet opening into the receiving chamber and the first and second nozzles separately linking the receiving chamber to the first and second channels and to the third and fourth channels, respectively.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/260,056 US20040060689A1 (en) | 2002-09-27 | 2002-09-27 | Compact liquid cooled heat sink |
US10/455,673 US6822850B2 (en) | 2002-09-27 | 2003-06-05 | Laminated bus bar for use with a power conversion configuration |
US10/455,039 US6885553B2 (en) | 2002-09-27 | 2003-06-05 | Bus bar assembly for use with a compact power conversion assembly |
US10/455,593 US6956742B2 (en) | 2002-09-27 | 2003-06-05 | Compact liquid converter assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/260,056 US20040060689A1 (en) | 2002-09-27 | 2002-09-27 | Compact liquid cooled heat sink |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/260,783 Continuation-In-Part US6721181B1 (en) | 2002-09-27 | 2002-09-27 | Elongated heat sink for use in converter assemblies |
US10/260,064 Continuation-In-Part US7068507B2 (en) | 2002-09-27 | 2002-09-27 | Compact liquid converter assembly |
US10/455,673 Continuation-In-Part US6822850B2 (en) | 2002-09-27 | 2003-06-05 | Laminated bus bar for use with a power conversion configuration |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040060689A1 true US20040060689A1 (en) | 2004-04-01 |
Family
ID=32029602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/260,056 Abandoned US20040060689A1 (en) | 2002-09-27 | 2002-09-27 | Compact liquid cooled heat sink |
Country Status (1)
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US (1) | US20040060689A1 (en) |
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US20100282452A1 (en) * | 2009-03-12 | 2010-11-11 | Behr Gmbh & Co. Kg | Device for the exchange of heat and motor vehicle |
US20110017442A1 (en) * | 2006-04-28 | 2011-01-27 | Belady Christian L | Methods for cooling computers and electronics |
CN102469749A (en) * | 2010-11-12 | 2012-05-23 | 奇鋐科技股份有限公司 | Heat exchange structure with flow splitting function |
US20130068436A1 (en) * | 2008-04-29 | 2013-03-21 | Raytheon Company | Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same |
US20140334102A1 (en) * | 2013-05-08 | 2014-11-13 | Kabushiki Kaisha Toshiba | Power conversion apparatus |
KR20160121427A (en) * | 2015-04-09 | 2016-10-19 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Arrangement having a power-electronic component and a DC-voltage busbar |
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CN112367809A (en) * | 2020-11-02 | 2021-02-12 | 中国电子科技集团公司第二十研究所 | Directional efficient heat dissipation device based on deep learning and installation monitoring method |
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US20140334102A1 (en) * | 2013-05-08 | 2014-11-13 | Kabushiki Kaisha Toshiba | Power conversion apparatus |
US9204573B2 (en) * | 2013-05-08 | 2015-12-01 | Kabushiki Kaisha Toshiba | Power conversion apparatus |
KR20160121427A (en) * | 2015-04-09 | 2016-10-19 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Arrangement having a power-electronic component and a DC-voltage busbar |
KR102427792B1 (en) | 2015-04-09 | 2022-07-29 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Arrangement having a power-electronic component and a DC-voltage busbar |
AT521040B1 (en) * | 2018-05-25 | 2019-10-15 | Miba Energy Holding Gmbh | Power module with carrying heat sink |
AT521040A4 (en) * | 2018-05-25 | 2019-10-15 | Miba Energy Holding Gmbh | Power module with carrying heat sink |
US11337328B2 (en) | 2018-05-25 | 2022-05-17 | Miba Energy Holding Gmbh | Power assembly having a load-bearing cooling body |
CN112367809A (en) * | 2020-11-02 | 2021-02-12 | 中国电子科技集团公司第二十研究所 | Directional efficient heat dissipation device based on deep learning and installation monitoring method |
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