US20040095794A1 - Static content addressable memory cell - Google Patents

Static content addressable memory cell Download PDF

Info

Publication number
US20040095794A1
US20040095794A1 US10/713,527 US71352703A US2004095794A1 US 20040095794 A1 US20040095794 A1 US 20040095794A1 US 71352703 A US71352703 A US 71352703A US 2004095794 A1 US2004095794 A1 US 2004095794A1
Authority
US
United States
Prior art keywords
coupled
data
node
cam
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10/713,527
Other versions
US6888732B2 (en
Inventor
Shane Hu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Bank NA
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US10/713,527 priority Critical patent/US6888732B2/en
Publication of US20040095794A1 publication Critical patent/US20040095794A1/en
Application granted granted Critical
Publication of US6888732B2 publication Critical patent/US6888732B2/en
Assigned to U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MICRON TECHNOLOGY, INC.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT reassignment MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: MICRON TECHNOLOGY, INC.
Assigned to U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: MICRON TECHNOLOGY, INC.
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C15/00Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
    • G11C15/04Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
    • G11C15/043Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements using capacitive charge storage elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C15/00Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
    • G11C15/04Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements

Definitions

  • the present invention is related generally to the field of semiconductor memory devices, and more particularly, to static content addressable memory cells and methods for storing data therein.
  • CAMs Content addressable memories
  • IP Internet Protocol
  • the router can search the CAM for the desired IP address. That is, the CAM searches for the desired content, and if there is a match, the CAM returns the associated routing information.
  • CAM devices can store data much like conventional memory devices. Generally, an address is provided by a controller to the CAM device, the address is used to access a particular memory location within the CAM memory array, and then the content stored in the addressed memory location is retrieved from the memory array.
  • CAM devices provide the added functionality of being able to search the stored data for desired content. That is, in addition to simply storing data in its memory array, a CAM device can search the memory array based on compare data corresponding to the desired content. When the content stored in the CAM memory array does not match the compare data, the CAM device returns a no match indication. However, when the content stored in the CAM memory array matches the compare data, the CAM device outputs information associated with the content.
  • CAM storage cells have been implemented using dynamic random access memory (DRAM) cells, as well as static random access memory (SRAM) cells.
  • DRAM dynamic random access memory
  • SRAM static random access memory
  • One of the benefits of using a DRAM cell structure for CAM cells is that they are smaller in size relative to SRAM cells.
  • DRAM cells such designed CAM cells need to be periodically refreshed in order to maintain the integrity of the data, as is well known.
  • CAM devices designed with DRAM cells also require that the rows of the CAM device to be read sequentially, one row at a time, which is prohibitively slow.
  • due to the match circuit that is included with CAM cells there are more leakage paths from the storage node. The techniques used in DRAM cells to reduce transfer gate leakage may not be readily available to CAM cell designs.
  • CAM cells have also been implemented using SRAM cell designs. Although larger in size than DRAM cells, SRAM cells provide the benefit of not needing to be refreshed to maintain data integrity. SRAM cells have been designed with six transistors (6T) as well as four transistors (4T). The 6T SRAM cells provide the benefit of having relatively low soft-error rates. “Soft-errors,” as known in the art, are those errors that are typically caused by power supply problems or alpha particles. Although 4T SRAM cells are smaller relative to their 6T counterparts, the 4T SRAM cells have higher soft-error rates. This issue is particularly significant with respect to CAM devices, since the data stored in the CAM memory array essentially represents a database of information.
  • the soft-error rate of conventional 4T SRAM cells may be unacceptable in the application of a CAM device. Consequently, choosing to design a CAM device using a 6T SRAM structure, which, as previously mentioned, are relatively larger, may be an acceptable compromise in light of the more significant issues that arise where the integrity of the data in the CAM cell is questionable.
  • the present invention is directed to a static content addressable memory (CAM) cell.
  • the CAM cell includes a latch having complementary data nodes capacitively coupled to ground, first and second access transistors, each coupled between a data node of the latch and a respective data line. The gates of each access transistor is coupled to a word line such that when activated, the respective data node and data line are coupled.
  • the CAM cell further includes a match circuit coupled to one of the complementary data nodes of the latch. The match circuit discharges a match line in response to a data value stored at the data node to which the match circuit is coupled and compare data present on the respective data line mismatching. Two of the CAM cells can be used to implement a full ternary CAM cell. In storing data in the CAM cell, a first one of the data nodes is charged and the other data node is coupled to ground. The capacitive coupling of the first data node assists in is maintained the charge state.
  • FIG. 1 is a block diagram of a content addressable memory (CAM) device having a CAM array including CAM memory cells according to an embodiment of the present invention
  • CAM content addressable memory
  • FIG. 2 is a schematic drawing of a CAM memory cell according to an embodiment of the present invention.
  • FIG. 3 is a schematic drawing of a CAM memory cell according to an alternative embodiment of the present invention.
  • FIG. 4 is a schematic drawing of a CAM memory cell according to an alternative embodiment of the present invention.
  • FIG. 5 is a block diagram of a computer system including a content addressable memory device according to an embodiment of the present invention.
  • Embodiments of the present invention are directed to static content addressable memory cells and methods of storing data therein. Certain details are set forth below to provide a sufficient understanding of the invention. However, it will be clear to one skilled in the art that the invention may be practiced without these particular details. In other instances, well-known circuits, control signals, and timing protocols have not been shown in detail in order to avoid unnecessarily obscuring the invention.
  • FIG. 1 illustrates a content addressable memory (CAM) 100 having a CAM array 104 that includes CAM memory cells according to an embodiment of the present invention.
  • the content addressable memory 100 further includes an input/output (I/O) buffer 108 that is coupled to a bus 110 on which various data is provided to and from the CAM 100 , such as command data, address data, data values, and the like. Data output by the CAM 100 are also provided from the I/O buffer onto the bus 110 .
  • the I/O buffer 108 further serves the function of providing the data received to the appropriate block of the CAM 100 . For example, command data received at the I/O buffer is provided on a command bus 112 to control logic 114 .
  • the command data received by the control logic 114 is then translated into internal timing and data signals that control the functionality of the CAM 100 .
  • the control logic 114 may further includes logic circuitry to provide enhanced functionality. Address data provided to the I/O buffer is provided to an address decoder 120 from the control logic 114 on an address bus 124 . The address data is decoded and the appropriate rows of memory cells of the CAM array 104 are activated for accessing. Where data is being written to the memory cells of the CAM array 104 , data values are provided by the I/O buffer 108 to the CAM array 104 on a data bus 130 . Data read from the CAM array 104 is provided on the data bus 130 to the I/O buffer 108 .
  • compare data values representing the data pattern to match are provided by the I/O buffer on the data bus 130 to a comparand register 140 .
  • a mask register 142 is loaded with a mask value that can be used to indicate which bits of the data pattern are significant in the match operation.
  • a matching operation is performed that simultaneously compares data stored in the CAM array 104 with the data pattern stored in the comparand register 140 . Every row of the CAM array 104 having data matching the data pattern is then provided to a priority encoder block 146 where a matched entry index is generated based on the match results. The matched entry index determined by the priority encoder block 146 is then provided as output data from the CAM 100 .
  • FIG. 1 It will be appreciated that the CAM 100 illustrated in FIG. 1 has been provided by way of example, and that the previous discussion was a general description provided for the benefit of the reader. Those of ordinary skill in the art have sufficient understanding of the operation and functionality of CAM devices such that FIG. 1 and the accompanying description is sufficient to enable those of ordinary skill in the art to practice embodiments of the present invention. Consequently, a more detailed description of the CAM 100 has been omitted from herein in the interest of brevity.
  • FIG. 2 illustrates a CAM memory cell 200 according to an embodiment of the present invention, and which can be used in the CAM array 104 of FIG. 1.
  • the CAM memory cell 200 includes a cell 210 having complementary data nodes 212 and 214 coupled to complementary data lines 270 and 271 through transfer gates 216 and 218 , all respectively. Gates of both the transfer gates 216 and 218 are coupled to a word line 272 so that when the word line 272 is activated, the transfer gates 216 and 218 couple the data nodes 212 and 214 to respective data lines 270 and 271 .
  • the cell 210 further includes a bistable circuit 230 having cross-coupled transistors 232 and 234 and resistors 222 and 224 coupled to a respective one of the data nodes 212 and 214 .
  • the resistors 222 and 224 are also coupled to a power supply to provide charge to the data nodes 212 and 214
  • the bistable circuit 230 is further coupled to a ground.
  • the bistable circuit 230 can be set into one of two states to store complementary data at the data nodes 212 and 214 .
  • Capacitors 240 and 242 are coupled between a respective one of the data nodes 212 and 214 and ground. As will be explained in more detail below, the capacitors 240 and 242 provide the CAM memory cell 200 with improved soft-error rate and improved data integrity while allowing for a compact CAM memory cell structure.
  • the CAM memory cell 200 further includes a match circuit 250 coupled to the data nodes 212 and 214 .
  • a transistor 252 has a gate coupled to the data node 212 and is used to selectively couple the data line 270 to a gate of a transistor 254 .
  • a transistor 253 has a gate coupled to the data node 214 and is used to selectively couple the data line 271 to the gate of the transistor 254 .
  • the transistor 254 is used to discharge a match line 260 to a LOW logic level, which is indicative of a mismatch of search data applied to the data line 270 and the data stored by the cell 210 .
  • read and write operations of the CAM memory cell 200 are similar to conventional SRAM memory devices, with the exception that the match line 260 is always held at a LOW logic level during the operation.
  • the word line 272 is held at a LOW logic level until the data line 270 is precharged to the logical level of an input data bit and data line 271 is precharged to the complement logical level.
  • the voltage of the word line 272 is then raised to activate the transfer gates 216 and 218 to update the stored value at the data nodes 212 and 214 , respectively, with the value of the input data bit.
  • the capacitor coupled to the data node having a HIGH logic level applied to it will be charged, and the transistor coupled to the opposite data node will be activated to couple that data node to ground, thereby setting the bistable circuit 230 into one of its two states.
  • the word line is then deactivated to isolate the data nodes 212 and 214 from the data lines 270 and 271 to store the updated value.
  • the charge on the capacitor that is coupled to the data node storing a HIGH logic level will be maintained by the resistive current path from the power supply.
  • capacitors 240 and 242 coupled to a respective data node, stored data can be maintained with greater integrity because the charge on the respective data nodes 212 and 214 is less susceptible to variability. Consequently, the cell 210 is more resistant to soft-errors, such as those errors that can be caused by power supply problems or alpha particles, and to which small dimensioned memory cells are particularly susceptible.
  • the word line 272 is held at a LOW logic level until the data lines 270 and 271 are both precharged. The word line is then activated to couple the data nodes 212 and 214 to the respective data line 270 and 271 .
  • the change in the potential of the data lines 270 and 271 due to the charge transfer between the data nodes 212 and 214 and the data lines 270 and 271 , is sensed in a conventional manner and amplified to provide output data.
  • the match circuit 250 compares the data stored at the data node 212 to a compare data value provided by the data line 270 .
  • the compare data is the complement data value. That is, if the compare data is a LOW logic value, a match will be indicated when a HIGH logic value is stored at the node 212 .
  • the match operation proceeds as follows.
  • the word line 272 is held to a LOW logic level.
  • the match line 260 is precharged to a HIGH logic level and the data line 270 is set to a compare data value. Consequently, the data line 271 is set to the complementary logic level of the data line 270 . If there is a mismatch between the compare data value on the data line 270 and the data value stored at the node 212 , the match line 260 is discharged to a LOW logic level.
  • the compare data value on the data line 270 is a LOW logic level.
  • the data node 214 is at a HIGH logic level
  • the data line 271 is also at a HIGH logic level.
  • the transistor 253 is ON, coupling the HIGH logic level of the data line 271 to the gate of the transistor 254 .
  • the conductive state of the transistor 254 provides a current path to ground through which the match line 260 is discharged from its precharged state.
  • the transistor 253 is switched ON, the match line 260 remains at a HIGH logic level because the data line 271 is at a LOW logic level, thus, the transistor 254 remains OFF.
  • FIG. 3 illustrates a CAM memory cell 300 according to an alternative embodiment of the present invention.
  • the CAM memory cell 300 is a full-ternary CAM memory cell having three different match conditions: match, mismatch, and “don't care.”
  • the CAM memory cell 300 implements the following truth table: 370a, 371a, DL_A DL_B 312a, CELL_A 312b, CELL_B 360, MATCH X X 0 0 1 0 0 X X 1 1 0 0 1 1 1 0 1 1 0 1 1 0 1 0 1 0 1 0 1 0 1 0 0 0 0 1 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 1 1 0 1 1 1 0 0 1 1 1 1 0 0 1 1 1 1 0 0 1 1 1 1 0 0 1 1 1 1 0 0 1 1 1 1 0 0 1 1 1 1 0 0 1 1 1 1
  • the CAM memory cell 300 includes two CAM subcells 302 a and 302 b . It will be appreciated that elements that are identical in the CAM subcells 302 a and 302 b have the same reference number, except that an “a” or “b” has been added to identify to which CAM subcell the element belongs. The following description is made with respect to the CAM subcell 302 a , however, it will be appreciated that the description can be applied to the CAM subcell 302 b as well.
  • the CAM subcell 302 a includes a cell 310 a having complementary data nodes 312 a and 314 a coupled to complementary data lines 370 a and 371 a through transfer gates 316 a and 318 a , all respectively. Gates of both the transfer gates 316 a and 318 a are coupled to a word line 372 so that when the word line 372 is activated, the transfer gates 316 a and 318 a couple the data nodes 312 a and 314 a to respective data lines 370 a and 371 a .
  • the cell 310 a further includes a bistable circuit 330 a having cross-coupled transistors 332 a and 334 a and resistors 322 a and 324 a coupled to a respective one of the data nodes 312 a and 314 a .
  • the resistors 322 a and 324 a are also coupled to a power supply to provide charge to the data nodes 312 a and 314 a
  • the bistable circuit 330 a is further coupled to ground.
  • the bistable circuit 330 s can be set into one of two states to store complementary data at the data nodes 312 a and 314 a .
  • Capacitors 340 a and 342 a are coupled between a respective one of the data nodes 312 a and 314 a and ground. As will be explained in more detail below, the capacitors 340 a and 342 a provide the CAM subcell 302 a with improved soft-error rate and improved data integrity while allowing for a compact CAM memory cell structure.
  • the read and write operations for the CAM memory cell 300 are similar to read and write operations previously described with respect to the CAM memory cell 200 , and will not repeated here in the interest of brevity.
  • the match circuit 350 a and 350 b compare the data stored at the data nodes 312 a and 312 b , respectively, to compare data values provided by the data lines 370 a and 370 b .
  • the compare data is the complement of the data value stored at the respective data node. That is, if the compare data is a LOW logic value for the data line 370 a and a HIGH logic value for the data line 370 b , a match will be indicated when a HIGH logic value is stored at the node 312 a and a LOW logic value is stored at the node 312 b .
  • the CAM memory cell 300 With the CAM memory cell 300 , there are two don't care conditions with the CAM memory cell 300 . That is, whether the stored data and the compare data match or not will not affect the logic level of the match line 360 .
  • the first don't care condition exists where the compare data provided to both the data lines 370 a and 370 b are at a LOW logic level.
  • the second don't care condition exists where the data stored at both the data nodes 312 a and 312 b , is at a LOW logic level.
  • either the compare data or stored data for both CAM subcells 302 a and 302 b should be at a LOW logic level.
  • the match line 360 is maintained at a HIGH logic level. Similarly, where there is a match between the compare data and the stored data for both CAM subcells 302 a and 302 b , the match line 360 will be kept at a HIGH logic level indicating a match. However, the match line 360 will be discharged to a LOW logic level, indicating a data mismatch, when there is a mismatch between the compare data and the stored data for either of the CAM subcells 302 a and 302 b . Under these conditions, at least one of the transistors 354 a or 354 b is activated to discharge the match line 360 .
  • the data condition for the CAM subcells 302 a and 302 b is “10.” That is, the data node 312 a is at a HIGH logic level and the data node 312 b is at a LOW logic condition. Under this data condition, the transistor 352 a is ON and the transistor 352 b is OFF. In the event that the compare data condition is “01,” the data line 370 a is at a LOW logic level and the data line 370 b is at a HIGH logic level. As a result, although the transistor 352 a is conductive, the match line 360 is not discharged since the transistor 354 a remains OFF due to the LOW logic level present on the data line 370 a .
  • the transistor 354 b With respect to the transistor 354 b , it remains OFF although the data line 370 b is at a HIGH logic level because the transistor 352 b is OFF due to the LOW logic level of the data node 312 b . Consequently, the match line 360 remains at a HIGH logic level indicating that there is a data match.
  • both of the transistors 354 a and 354 b remain OFF regardless of the data condition because even if one of the transistors 352 a or 352 b were conductive to couple the data lines 370 a and 370 b to the gate of a respective transistor 354 a or 354 b , the LOW logic condition would keep the transistors 354 a and 354 b OFF. As a result, in either don't care condition, the match line 360 is maintained at a HIGH logic level.
  • FIG. 4 is a CAM memory cell 400 according to another embodiment of the present invention.
  • the CAM memory cell 400 is identical to the CAM memory cell 300 of FIG. 3, except that the match circuits for the two embodiments are different. Similar reference numbers have been used in FIGS. 3 and 4 to indicate similar elements in the CAM memory cell 300 and 400 .
  • match circuits 380 a and 380 b each include a first discharge transistor 382 having a gate coupled to the respective data node, and a second discharge transistor 384 having a gate coupled to the respective data line.
  • the two discharge transistors 382 and 384 provide a current path to ground for the match line to be discharged under the right data and compare data conditions. Operation of the CAM memory cell 400 is the same as for the CAM memory cell 300 , as previously described.
  • the CAM memory cell 300 may provide some advantage over the CAM memory cell 400 with respect to the time to indicate a mismatch. That is, in the CAM memory cell 300 , the discharge path through which the match line 360 is discharged to ground, which indicates a data mismatch, is through a single transistor, namely, the transistor 354 . In contrast, the discharge path through which the match line 360 is discharged to ground in the CAM memory cell 400 is through two transistors in series, namely, the transistors 382 and 384 . Discharging the match line 360 through the two transistors 382 and 384 will generally be slower than discharging the match line through only the one transistor 354 . As a result, the matching operation will consequently take longer to complete. However, there may be some benefits from using the CAM memory cell 400 , such as greater resistance to current leakage from the match line 360 to ground.
  • FIG. 5 illustrates a processor-based system 500 including a CAM device 504 in accordance with an embodiment of the present invention.
  • the processor-based system 500 represents a system that utilizes a CAM device 504 , such as a computer system, a network switch, network router, process control system, or the like.
  • the processor-based system 500 includes a central processing unit (CPU) 502 in communication with the CAM 504 over a bus 512 .
  • CPU central processing unit
  • the bus 512 can be representative of a series of buses and bridges commonly used in processor-based systems. However, for the sake of convenience, only the bus 512 has been illustrated in FIG. 5.
  • the processor-based system 500 includes one or more input devices 506 , such as a keyboard or a mouse, coupled to the CPU 502 to allow an operator to interface with the CPU 502 .
  • the processor-based system 500 also includes one or more output devices 508 coupled to the CPU 502 .
  • Such output devices typically include printers or a video terminal.
  • One or more data storage devices 510 are also typically coupled to the CPU 502 to store data or retrieve data from external storage media (not shown). Examples of typical storage devices 510 include hard and floppy disks, tape cassettes, and compact disc read-only memories (CD-ROMs).
  • the processor-based system 500 also includes a memory device 514 , such as a random access memory (RAM) or a read-only memory (ROM).
  • the CPU 502 is coupled to the memory device 514 through a bus 516 , that typically includes appropriate address, data, and control busses to provide for writing data to and reading data from the memory device 502 .

Abstract

A static content addressable memory (CAM) cell. The CAM cell includes a latch having complementary data nodes capacitively coupled to ground, first and second access transistors, each coupled between a data node of the latch and a respective data line. The gates of each access transistor is coupled to a word line such that when activated, the respective data node and data line are coupled. The CAM cell further includes a match circuit coupled to one of the complementary data nodes of the latch. The match circuit discharges a match line in response to a data value stored at the data node to which the match circuit is coupled and compare data present on the respective data line mismatching. Two of the CAM cells can be used to implement a full ternary CAM cell.

Description

    TECHNICAL FIELD
  • The present invention is related generally to the field of semiconductor memory devices, and more particularly, to static content addressable memory cells and methods for storing data therein. [0001]
  • BACKGROUND OF THE INVENTION
  • Content addressable memories (CAMs) are used in a variety of applications requiring pattern matching operation on bits, such as virtual memory, data compression, caching, and table lookup applications. With the popularity of high speed networks, wired or wireless, on the rise, CAMs have been frequently employed in networking equipment, particularly routers and switches, computer systems and other systems that require content searching, such as in network-address filtering and translation by matching partial node address. For example, in network router or switch, CAM devices are used to store Internet Protocol (IP) addresses and routing instructions associated with each address. When an IP packet is received and the IP address obtained, the router must retrieve the routing information for the packet in order to send it on the most direct route to the desired IP address. By using a CAM memory device, the router can search the CAM for the desired IP address. That is, the CAM searches for the desired content, and if there is a match, the CAM returns the associated routing information. [0002]
  • CAM devices can store data much like conventional memory devices. Generally, an address is provided by a controller to the CAM device, the address is used to access a particular memory location within the CAM memory array, and then the content stored in the addressed memory location is retrieved from the memory array. However, as previously discussed, CAM devices provide the added functionality of being able to search the stored data for desired content. That is, in addition to simply storing data in its memory array, a CAM device can search the memory array based on compare data corresponding to the desired content. When the content stored in the CAM memory array does not match the compare data, the CAM device returns a no match indication. However, when the content stored in the CAM memory array matches the compare data, the CAM device outputs information associated with the content. [0003]
  • CAM storage cells have been implemented using dynamic random access memory (DRAM) cells, as well as static random access memory (SRAM) cells. One of the benefits of using a DRAM cell structure for CAM cells is that they are smaller in size relative to SRAM cells. However, as with conventional DRAM cells, such designed CAM cells need to be periodically refreshed in order to maintain the integrity of the data, as is well known. CAM devices designed with DRAM cells also require that the rows of the CAM device to be read sequentially, one row at a time, which is prohibitively slow. Moreover, due to the match circuit that is included with CAM cells, there are more leakage paths from the storage node. The techniques used in DRAM cells to reduce transfer gate leakage may not be readily available to CAM cell designs. [0004]
  • As previously mentioned, CAM cells have also been implemented using SRAM cell designs. Although larger in size than DRAM cells, SRAM cells provide the benefit of not needing to be refreshed to maintain data integrity. SRAM cells have been designed with six transistors (6T) as well as four transistors (4T). The 6T SRAM cells provide the benefit of having relatively low soft-error rates. “Soft-errors,” as known in the art, are those errors that are typically caused by power supply problems or alpha particles. Although 4T SRAM cells are smaller relative to their 6T counterparts, the 4T SRAM cells have higher soft-error rates. This issue is particularly significant with respect to CAM devices, since the data stored in the CAM memory array essentially represents a database of information. That is, the soft-error rate of conventional 4T SRAM cells may be unacceptable in the application of a CAM device. Consequently, choosing to design a CAM device using a 6T SRAM structure, which, as previously mentioned, are relatively larger, may be an acceptable compromise in light of the more significant issues that arise where the integrity of the data in the CAM cell is questionable. [0005]
  • Accordingly, there is a desire and need for an alternative CAM cell design that is relatively small and yet has acceptably low soft-error rates. [0006]
  • SUMMARY OF THE INVENTION
  • The present invention is directed to a static content addressable memory (CAM) cell. The CAM cell includes a latch having complementary data nodes capacitively coupled to ground, first and second access transistors, each coupled between a data node of the latch and a respective data line. The gates of each access transistor is coupled to a word line such that when activated, the respective data node and data line are coupled. The CAM cell further includes a match circuit coupled to one of the complementary data nodes of the latch. The match circuit discharges a match line in response to a data value stored at the data node to which the match circuit is coupled and compare data present on the respective data line mismatching. Two of the CAM cells can be used to implement a full ternary CAM cell. In storing data in the CAM cell, a first one of the data nodes is charged and the other data node is coupled to ground. The capacitive coupling of the first data node assists in is maintained the charge state.[0007]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a block diagram of a content addressable memory (CAM) device having a CAM array including CAM memory cells according to an embodiment of the present invention [0008]
  • FIG. 2 is a schematic drawing of a CAM memory cell according to an embodiment of the present invention. [0009]
  • FIG. 3 is a schematic drawing of a CAM memory cell according to an alternative embodiment of the present invention. [0010]
  • FIG. 4 is a schematic drawing of a CAM memory cell according to an alternative embodiment of the present invention. [0011]
  • FIG. 5 is a block diagram of a computer system including a content addressable memory device according to an embodiment of the present invention.[0012]
  • DETAILED DESCRIPTION OF THE INVENTION
  • Embodiments of the present invention are directed to static content addressable memory cells and methods of storing data therein. Certain details are set forth below to provide a sufficient understanding of the invention. However, it will be clear to one skilled in the art that the invention may be practiced without these particular details. In other instances, well-known circuits, control signals, and timing protocols have not been shown in detail in order to avoid unnecessarily obscuring the invention. [0013]
  • FIG. 1 illustrates a content addressable memory (CAM) [0014] 100 having a CAM array 104 that includes CAM memory cells according to an embodiment of the present invention. The content addressable memory 100 further includes an input/output (I/O) buffer 108 that is coupled to a bus 110 on which various data is provided to and from the CAM 100, such as command data, address data, data values, and the like. Data output by the CAM 100 are also provided from the I/O buffer onto the bus 110. The I/O buffer 108 further serves the function of providing the data received to the appropriate block of the CAM 100. For example, command data received at the I/O buffer is provided on a command bus 112 to control logic 114. The command data received by the control logic 114 is then translated into internal timing and data signals that control the functionality of the CAM 100. The control logic 114 may further includes logic circuitry to provide enhanced functionality. Address data provided to the I/O buffer is provided to an address decoder 120 from the control logic 114 on an address bus 124. The address data is decoded and the appropriate rows of memory cells of the CAM array 104 are activated for accessing. Where data is being written to the memory cells of the CAM array 104, data values are provided by the I/O buffer 108 to the CAM array 104 on a data bus 130. Data read from the CAM array 104 is provided on the data bus 130 to the I/O buffer 108.
  • Where the [0015] CAM 100 is commanded to perform a matching operation, compare data values representing the data pattern to match are provided by the I/O buffer on the data bus 130 to a comparand register 140. A mask register 142 is loaded with a mask value that can be used to indicate which bits of the data pattern are significant in the match operation. Upon the control block issuing the appropriate signals, a matching operation is performed that simultaneously compares data stored in the CAM array 104 with the data pattern stored in the comparand register 140. Every row of the CAM array 104 having data matching the data pattern is then provided to a priority encoder block 146 where a matched entry index is generated based on the match results. The matched entry index determined by the priority encoder block 146 is then provided as output data from the CAM 100.
  • It will be appreciated that the [0016] CAM 100 illustrated in FIG. 1 has been provided by way of example, and that the previous discussion was a general description provided for the benefit of the reader. Those of ordinary skill in the art have sufficient understanding of the operation and functionality of CAM devices such that FIG. 1 and the accompanying description is sufficient to enable those of ordinary skill in the art to practice embodiments of the present invention. Consequently, a more detailed description of the CAM 100 has been omitted from herein in the interest of brevity.
  • FIG. 2 illustrates a CAM memory cell [0017] 200 according to an embodiment of the present invention, and which can be used in the CAM array 104 of FIG. 1. The CAM memory cell 200 includes a cell 210 having complementary data nodes 212 and 214 coupled to complementary data lines 270 and 271 through transfer gates 216 and 218, all respectively. Gates of both the transfer gates 216 and 218 are coupled to a word line 272 so that when the word line 272 is activated, the transfer gates 216 and 218 couple the data nodes 212 and 214 to respective data lines 270 and 271. The cell 210 further includes a bistable circuit 230 having cross-coupled transistors 232 and 234 and resistors 222 and 224 coupled to a respective one of the data nodes 212 and 214. The resistors 222 and 224 are also coupled to a power supply to provide charge to the data nodes 212 and 214, and the bistable circuit 230 is further coupled to a ground. The bistable circuit 230 can be set into one of two states to store complementary data at the data nodes 212 and 214. Capacitors 240 and 242 are coupled between a respective one of the data nodes 212 and 214 and ground. As will be explained in more detail below, the capacitors 240 and 242 provide the CAM memory cell 200 with improved soft-error rate and improved data integrity while allowing for a compact CAM memory cell structure.
  • The CAM memory cell [0018] 200 further includes a match circuit 250 coupled to the data nodes 212 and 214. A transistor 252 has a gate coupled to the data node 212 and is used to selectively couple the data line 270 to a gate of a transistor 254. Similarly, a transistor 253 has a gate coupled to the data node 214 and is used to selectively couple the data line 271 to the gate of the transistor 254. The transistor 254 is used to discharge a match line 260 to a LOW logic level, which is indicative of a mismatch of search data applied to the data line 270 and the data stored by the cell 210.
  • In operation, read and write operations of the CAM memory cell [0019] 200 are similar to conventional SRAM memory devices, with the exception that the match line 260 is always held at a LOW logic level during the operation.
  • To write data to the CAM memory cell [0020] 200, the word line 272 is held at a LOW logic level until the data line 270 is precharged to the logical level of an input data bit and data line 271 is precharged to the complement logical level. The voltage of the word line 272 is then raised to activate the transfer gates 216 and 218 to update the stored value at the data nodes 212 and 214, respectively, with the value of the input data bit. The capacitor coupled to the data node having a HIGH logic level applied to it will be charged, and the transistor coupled to the opposite data node will be activated to couple that data node to ground, thereby setting the bistable circuit 230 into one of its two states. The word line is then deactivated to isolate the data nodes 212 and 214 from the data lines 270 and 271 to store the updated value. The charge on the capacitor that is coupled to the data node storing a HIGH logic level will be maintained by the resistive current path from the power supply. By having capacitors 240 and 242 coupled to a respective data node, stored data can be maintained with greater integrity because the charge on the respective data nodes 212 and 214 is less susceptible to variability. Consequently, the cell 210 is more resistant to soft-errors, such as those errors that can be caused by power supply problems or alpha particles, and to which small dimensioned memory cells are particularly susceptible.
  • To read data from the CAM memory cell [0021] 200, the word line 272 is held at a LOW logic level until the data lines 270 and 271 are both precharged. The word line is then activated to couple the data nodes 212 and 214 to the respective data line 270 and 271. The change in the potential of the data lines 270 and 271, due to the charge transfer between the data nodes 212 and 214 and the data lines 270 and 271, is sensed in a conventional manner and amplified to provide output data.
  • With respect to a match operation for the CAM memory cell [0022] 200, the match circuit 250 compares the data stored at the data node 212 to a compare data value provided by the data line 270. In the CAM memory cell 200, the compare data is the complement data value. That is, if the compare data is a LOW logic value, a match will be indicated when a HIGH logic value is stored at the node 212. Generally, the match operation proceeds as follows. The word line 272 is held to a LOW logic level. The match line 260 is precharged to a HIGH logic level and the data line 270 is set to a compare data value. Consequently, the data line 271 is set to the complementary logic level of the data line 270. If there is a mismatch between the compare data value on the data line 270 and the data value stored at the node 212, the match line 260 is discharged to a LOW logic level.
  • For example, assuming that a LOW logic level is stored at the [0023] data node 212 and the compare data value on the data line 270 is a LOW logic level. In this case, the data node 214 is at a HIGH logic level, and the data line 271 is also at a HIGH logic level. Under these conditions, the transistor 253 is ON, coupling the HIGH logic level of the data line 271 to the gate of the transistor 254. The conductive state of the transistor 254 provides a current path to ground through which the match line 260 is discharged from its precharged state. Where the data node 212 is at a LOW logic level, and the data line 270 is at a HIGH logic level, although the transistor 253 is switched ON, the match line 260 remains at a HIGH logic level because the data line 271 is at a LOW logic level, thus, the transistor 254 remains OFF.
  • FIG. 3 illustrates a [0024] CAM memory cell 300 according to an alternative embodiment of the present invention. The CAM memory cell 300 is a full-ternary CAM memory cell having three different match conditions: match, mismatch, and “don't care.” The CAM memory cell 300 implements the following truth table:
    370a, 371a,
    DL_A DL_B 312a, CELL_A 312b, CELL_B 360, MATCH
    X X 0 0 1
    0 0 X X 1
    1 0 0 1 1
    0 1 1 0 1
    1 0 1 0 0
    0 1 1 1 0
    0 1 0 1 0
    1 0 1 1 0
    1 1 0 1 0
    1 1 1 0 0
    1 1 1 1 0
  • The [0025] CAM memory cell 300 includes two CAM subcells 302 a and 302 b. It will be appreciated that elements that are identical in the CAM subcells 302 a and 302 b have the same reference number, except that an “a” or “b” has been added to identify to which CAM subcell the element belongs. The following description is made with respect to the CAM subcell 302 a, however, it will be appreciated that the description can be applied to the CAM subcell 302 b as well.
  • The CAM subcell [0026] 302 a includes a cell 310 a having complementary data nodes 312 a and 314 a coupled to complementary data lines 370 a and 371 a through transfer gates 316 a and 318 a, all respectively. Gates of both the transfer gates 316 a and 318 a are coupled to a word line 372 so that when the word line 372 is activated, the transfer gates 316 a and 318 a couple the data nodes 312 a and 314 a to respective data lines 370 a and 371 a. The cell 310 a further includes a bistable circuit 330 a having cross-coupled transistors 332 a and 334 a and resistors 322 a and 324 a coupled to a respective one of the data nodes 312 a and 314 a. The resistors 322 a and 324 a are also coupled to a power supply to provide charge to the data nodes 312 a and 314 a, and the bistable circuit 330 a is further coupled to ground. The bistable circuit 330 s can be set into one of two states to store complementary data at the data nodes 312 a and 314 a. Capacitors 340 a and 342 a are coupled between a respective one of the data nodes 312 a and 314 a and ground. As will be explained in more detail below, the capacitors 340 a and 342 a provide the CAM subcell 302 a with improved soft-error rate and improved data integrity while allowing for a compact CAM memory cell structure.
  • The read and write operations for the [0027] CAM memory cell 300 are similar to read and write operations previously described with respect to the CAM memory cell 200, and will not repeated here in the interest of brevity.
  • With respect to a match operation for the [0028] CAM memory cell 300, the match circuit 350 a and 350 b compare the data stored at the data nodes 312 a and 312 b, respectively, to compare data values provided by the data lines 370 a and 370 b. For the CAM memory cell 300, the compare data is the complement of the data value stored at the respective data node. That is, if the compare data is a LOW logic value for the data line 370 a and a HIGH logic value for the data line 370 b, a match will be indicated when a HIGH logic value is stored at the node 312 a and a LOW logic value is stored at the node 312 b. Generally, in operation the word line 372 is held to a LOW logic level for the match operation. The match line 360 is precharged to a HIGH logic level and the data lines 370 a and 370 b are set to a compare data value. The data lines 371 a and 371 b are not used during the match operation. As will be explained in more detail below, the logic level of the match line 360 following the comparison of the compare data values and the stored data is indicative of the match condition, that is, whether there is a match or don't care, or a mismatch.
  • With the [0029] CAM memory cell 300, there are two don't care conditions with the CAM memory cell 300. That is, whether the stored data and the compare data match or not will not affect the logic level of the match line 360. The first don't care condition exists where the compare data provided to both the data lines 370 a and 370 b are at a LOW logic level. The second don't care condition exists where the data stored at both the data nodes 312 a and 312 b, is at a LOW logic level. Thus, to invoke a don't care condition for the CAM memory cell 300, either the compare data or stored data for both CAM subcells 302 a and 302 b should be at a LOW logic level. In either of the don't care conditions, the match line 360 is maintained at a HIGH logic level. Similarly, where there is a match between the compare data and the stored data for both CAM subcells 302 a and 302 b, the match line 360 will be kept at a HIGH logic level indicating a match. However, the match line 360 will be discharged to a LOW logic level, indicating a data mismatch, when there is a mismatch between the compare data and the stored data for either of the CAM subcells 302 a and 302 b. Under these conditions, at least one of the transistors 354 a or 354 b is activated to discharge the match line 360.
  • For example, assume that the data condition for the CAM subcells [0030] 302 a and 302 b is “10.” That is, the data node 312 a is at a HIGH logic level and the data node 312 b is at a LOW logic condition. Under this data condition, the transistor 352 a is ON and the transistor 352 b is OFF. In the event that the compare data condition is “01,” the data line 370 a is at a LOW logic level and the data line 370 b is at a HIGH logic level. As a result, although the transistor 352 a is conductive, the match line 360 is not discharged since the transistor 354 a remains OFF due to the LOW logic level present on the data line 370 a. With respect to the transistor 354 b, it remains OFF although the data line 370 b is at a HIGH logic level because the transistor 352 b is OFF due to the LOW logic level of the data node 312 b. Consequently, the match line 360 remains at a HIGH logic level indicating that there is a data match.
  • In contrast, in the event that the compare data condition is “10,” the [0031] data line 370 a is at a HIGH logic level and the data line 370 b is at a LOW logic level. As a result, the transistor 354 a is made conductive because the transistor 352 a is ON based on the HIGH logic level stored at the node 312 a, and the HIGH logic level of the data line 370 a is applied to the gate of the transistor 354 a to switch it ON. The transistor 354 a provides a current path to ground through which the match line 360 is discharged to a LOW logic level, thus indicating a data mismatch. Similarly, where the compare data condition is “11,” again the transistor 354 a is ON providing a current discharge path to pull the match line 360 to a LOW logic level.
  • As previously discussed, a don't care condition exists where the data condition is “00” or the compare data condition is “00.” In the first case, where the data condition is “00,” neither one of the [0032] transistors 354 a or 354 b are conductive because both the transistors 352 a and 352 b are OFF, thereby isolating the gates of the transistors 354 a and 354 b from whatever the logic level is on the data lines 370 a and 370 b. Similarly, in the second case, where the compare data condition is “00,” both of the transistors 354 a and 354 b remain OFF regardless of the data condition because even if one of the transistors 352 a or 352 b were conductive to couple the data lines 370 a and 370 b to the gate of a respective transistor 354 a or 354 b, the LOW logic condition would keep the transistors 354 a and 354 b OFF. As a result, in either don't care condition, the match line 360 is maintained at a HIGH logic level.
  • FIG. 4 is a [0033] CAM memory cell 400 according to another embodiment of the present invention. The CAM memory cell 400 is identical to the CAM memory cell 300 of FIG. 3, except that the match circuits for the two embodiments are different. Similar reference numbers have been used in FIGS. 3 and 4 to indicate similar elements in the CAM memory cell 300 and 400. In the CAM memory cell 400, match circuits 380 a and 380 b each include a first discharge transistor 382 having a gate coupled to the respective data node, and a second discharge transistor 384 having a gate coupled to the respective data line. The two discharge transistors 382 and 384 provide a current path to ground for the match line to be discharged under the right data and compare data conditions. Operation of the CAM memory cell 400 is the same as for the CAM memory cell 300, as previously described.
  • Although operation of the [0034] CAM memory cells 300 and 400 is nearly the same, the CAM memory cell 300 may provide some advantage over the CAM memory cell 400 with respect to the time to indicate a mismatch. That is, in the CAM memory cell 300, the discharge path through which the match line 360 is discharged to ground, which indicates a data mismatch, is through a single transistor, namely, the transistor 354. In contrast, the discharge path through which the match line 360 is discharged to ground in the CAM memory cell 400 is through two transistors in series, namely, the transistors 382 and 384. Discharging the match line 360 through the two transistors 382 and 384 will generally be slower than discharging the match line through only the one transistor 354. As a result, the matching operation will consequently take longer to complete. However, there may be some benefits from using the CAM memory cell 400, such as greater resistance to current leakage from the match line 360 to ground.
  • FIG. 5 illustrates a processor-based [0035] system 500 including a CAM device 504 in accordance with an embodiment of the present invention. The processor-based system 500 represents a system that utilizes a CAM device 504, such as a computer system, a network switch, network router, process control system, or the like. The processor-based system 500 includes a central processing unit (CPU) 502 in communication with the CAM 504 over a bus 512. It will be appreciated that the bus 512 can be representative of a series of buses and bridges commonly used in processor-based systems. However, for the sake of convenience, only the bus 512 has been illustrated in FIG. 5. In addition, the processor-based system 500 includes one or more input devices 506, such as a keyboard or a mouse, coupled to the CPU 502 to allow an operator to interface with the CPU 502. Typically, the processor-based system 500 also includes one or more output devices 508 coupled to the CPU 502. Such output devices typically include printers or a video terminal. One or more data storage devices 510 are also typically coupled to the CPU 502 to store data or retrieve data from external storage media (not shown). Examples of typical storage devices 510 include hard and floppy disks, tape cassettes, and compact disc read-only memories (CD-ROMs). The processor-based system 500 also includes a memory device 514, such as a random access memory (RAM) or a read-only memory (ROM). The CPU 502 is coupled to the memory device 514 through a bus 516, that typically includes appropriate address, data, and control busses to provide for writing data to and reading data from the memory device 502.
  • From the foregoing it will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the invention is not limited except as by the appended claims. [0036]

Claims (42)

1. In a content addressable memory (CAM) array having CAM cells arranged in rows of word lines and columns of data lines, a CAM cell, comprising:
a bistable circuit coupled to a power supply and ground, the bistable circuit having first and second data nodes;
first and second access transistors coupled to the first and second data nodes and first and second data lines, all respectively, for coupling the respective data node to the respective data line in response to activating a word line;
first and second capacitors, each capacitor having a first terminal coupled to a respective data node and having a second terminal coupled to ground; and
a match circuit having a search node coupled to the first data line, a cell node coupled to the first data node, and a match node coupled to a match line, the match circuit changing the logic state of the match line in response to search data provided on the first data line and the data stored at the first data node are mismatching.
2. The CAM array of claim 1 wherein the match circuit comprises:
first and second transistors coupled in series between the first and second data lines, the first transistor having a gate coupled to the first data node and the second transistor having a gate coupled to the second data node; and
a discharge transistor coupled between the match line and ground, and having a gate coupled to a node between the first and second transistors.
3. The CAM cell of claim 1 wherein the bistable circuit comprises:
a first switch having a first node coupled to the first data node, a second node coupled to ground, and a control node coupled to the second data node;
a second switch having a first node coupled to the second data node, a second node coupled to ground, and a control node coupled to the first data node; and
first and second resistors, each resistor having a first terminal coupled to the power supply and a second terminal coupled to a respective data node.
4. The CAM cell of claim 1 wherein the first and second data nodes store complementary data, and the first and second data lines are a pair of complementary data lines.
5. The CAM cell of claim 1 wherein the search data and the data stored at the first data node are mismatching when the logic level of each are the same.
6. In a content addressable memory (CAM) array having CAM cells arranged in rows of word lines and columns of data lines, a CAM cell, comprising:
a first bistable circuit coupled to a power supply and ground, the first bistable circuit having first and second data nodes;
a second bistable circuit coupled to the power supply and ground, the second bistable circuit having third and fourth data nodes;
first and second access transistors coupled to the first and second data nodes and first and second data lines, all respectively, for coupling the respective data node to the respective data line in response to activating a word line;
second and fourth access transistors coupled to the third and fourth data nodes and third and fourth data lines, all respectively, for coupling the respective data node to the respective data line in response to activating the word line;
first, second, third, and fourth capacitors, each capacitor having a first terminal coupled to a respective data node and having a second terminal coupled to ground; and
a match circuit having a first search node coupled to the first data line and a second search node coupled to the third data line, a first cell node coupled to the first data node and a second cell node coupled to the third data node, and a match node coupled to a match line, the match circuit changing the logic state of the match line in response to search data provided on the first data line and the first data node mismatch and search data provided on the third data line and the third data node mismatch.
7. The CAM cell of claim 6 wherein the match circuit comprises first, second, third, and fourth switches, each switch having a control node and first and second nodes, the first switch having its first node coupled to ground and its second node coupled to the match line, and the second switch having its first node coupled to the first data line, its second terminal coupled to the control terminal of the first switch, and its control node coupled to the first data node, and the third switch having its first node coupled to ground and its second node coupled to the match line, and the fourth switch having its first node coupled to the third data line, its second terminal coupled to the control terminal of the third switch, and its control node coupled to the third data node.
8. The CAM cell of claim 6 wherein the match circuit comprises first, second, third, and fourth switches, each switch having a control node and first and second nodes, the first switch having its control terminal coupled to the first data node and its first node coupled to ground, the second switch having its control terminal coupled to the first data line, its first node coupled to the match line, and its second node coupled to the second node of the first transistor, and the third switch having its control terminal coupled to the third data node and its first node coupled to ground, the fourth switch having its control terminal coupled to the third data line, its first node coupled to the match line, and its second node coupled to the second node of the third transistor.
9. The CAM cell of claim 6 wherein the first and second bistable circuits comprise:
a first switch having a first node coupled to a true data node, a second node coupled to ground, and a control node coupled to a not data node;
a second switch having a first node coupled to the not data node, a second node coupled to ground, and a control node coupled to the true data node;
a first resistor having a first terminal coupled to the power supply and a second terminal coupled to the true data node; and
a second resistor having a first terminal coupled to the power supply and a second terminal coupled to the not data node.
10. The CAM cell of claim 6 wherein the first and second data nodes store complementary data, the first and second data lines are a pair of complementary data lines, the third and fourth data nodes store complementary data, and the third and fourth data lines are a pair of complementary data lines.
11. The CAM cell of claim 6 wherein the search data and the data stored at the first data node are mismatching when the logic level of each are the same.
12. A static content addressable memory array for a content addressable memory (CAM) device, comprising:
a plurality of word lines;
a plurality of data lines;
a latch having complementary data nodes capacitively coupled to ground;
first and second access transistors, each having a gate coupled to one of the plurality of word lines and coupled between a data node of the latch and a respective data line of the plurality; and
a match circuit coupled to one of the complementary data nodes of the latch, the match circuit discharging a match line in response to a data value stored at the data node to which the match circuit is coupled and compare data present on the respective data line mismatching.
13. The static CAM array of claim 12 wherein the match circuit comprises:
first and second transistors coupled in series between the data lines to which the first and second access transistors are coupled, the first transistor having a gate coupled to a first one of the data nodes and the second transistor having a gate coupled to a second one of the complementary data nodes; and
a discharge transistor coupled between the match line and ground, and having a gate coupled to a node between the first and second transistors.
14. The static CAM array of claim 12 wherein the latch is a first latch, the match circuit is a first match circuit, and the static CAM array further comprises:
a second latch having complementary data nodes capacitively coupled to ground, the first and second latches representing a single CAM memory cell;
third and fourth access transistors, each having a gate coupled to the word line to which the first and second access transistors are coupled, the third and fourth access transistors coupled between a data node of the second latch and a respective data line of the plurality; and
a second match circuit coupled to one of the complementary data nodes of the second latch, the match circuit discharging the match line in response to a data value stored at the data node to which the second match circuit is coupled and compare data present on the respective data line mismatching.
15. The static CAM array of claim 14 wherein the first and second match circuits comprise first and second switches, each switch having a control node and first and second nodes, the first switch having its first node coupled to ground and its second node coupled to the match line, and the second switch having its first node coupled to the first data line, its second terminal coupled to the control terminal of the first switch, and its control node coupled to the first data node.
16. The static CAM array of claim 14 wherein the first and second match circuits comprise first and second switches, each switch having a control node and first and second nodes, the first switch having its control terminal coupled to the first data node and its first node coupled to ground, the second switch having its control terminal coupled to the first data line, its first node coupled to the match line, and its second node coupled to the second node of the first transistor.
17. The static CAM array of claim 12 wherein the latch comprises:
a first switch having a first node coupled to a first of the complementary data nodes, a second node coupled to ground, and a control node coupled to the second data node;
a second switch having a first node coupled to the second data node, a second node coupled to ground, and a control node coupled to the first data node; and
first and second resistors, each resistor having a first terminal coupled to the power supply and a second terminal coupled to a respective data node.
18. A content addressable memory (CAM) device, comprising:
an address bus;
a control bus;
a data bus;
an address decoder coupled to the address bus;
a read/write circuit coupled to the data bus; and
an array of CAM memory cells coupled to the address decoder, control circuit, and read/write circuit, the array comprising:
a plurality of word lines;
a plurality of data lines;
a latch having complementary data nodes capacitively coupled to ground;
first and second access transistors, each having a gate coupled to one of the plurality of word lines and coupled between a data node of the latch and a respective data line of the plurality; and
a match circuit coupled to one of the complementary data nodes of the latch, the match circuit discharging a match line in response to a data value stored at the data node to which the match circuit is coupled and compare data present on the respective data line mismatching.
19. The CAM device of claim 18 wherein the match circuit of the array of CAM memory cells comprises:
first and second transistors coupled in series between the data lines to which the first and second access transistors are coupled, the first transistor having a gate coupled to a first one of the data nodes and the second transistor having a gate coupled to a second one of the complementary data nodes; and
a discharge transistor coupled between the match line and ground, and having a gate coupled to a node between the first and second transistors.
20. The CAM device of claim 18 wherein the latch of the array of CAM memory cells is a first latch, the match circuit is a first match circuit, and the static CAM array further comprises:
a second latch having complementary data nodes capacitively coupled to ground, the first and second latches representing a single CAM memory cell;
third and fourth access transistors, each having a gate coupled to the word line to which the first and second access transistors are coupled, the third and fourth access transistors coupled between a data node of the second latch and a respective data line of the plurality; and
a second match circuit coupled to one of the complementary data nodes of the second latch, the match circuit discharging the match line in response to a data value stored at the data node to which the second match circuit is coupled and compare data present on the respective data line mismatching.
21. The CAM device of claim 20 wherein the first and second match circuits of the array of CAM memory cells comprise first and second switches, each switch having a control node and first and second nodes, the first switch having its first node coupled to ground and its second node coupled to the match line, and the second switch having its first node coupled to the first data line, its second terminal coupled to the control terminal of the first switch, and its control node coupled to the first data node.
22. The CAM device of claim 20 wherein the first and second match circuits of the array of CAM memory cells comprise first and second switches, each switch having a control node and first and second nodes, the first switch having its control terminal coupled to the first data node and its first node coupled to ground, the second switch having its control terminal coupled to the first data line, its first node coupled to the match line, and its second node coupled to the second node of the first transistor.
23. The CAM device of claim 18 wherein the latch of the array of CAM memory cells comprises:
a first switch having a first node coupled to a first of the complementary data nodes, a second node coupled to ground, and a control node coupled to the second data node;
a second switch having a first node coupled to the second data node, a second node coupled to ground, and a control node coupled to the first data node; and
first and second resistors, each resistor having a first terminal coupled to the power supply and a second terminal coupled to a respective data node.
24. A content addressable memory (CAM) device, comprising:
an address bus;
a control bus;
a data bus;
an address decoder coupled to the address bus;
a read/write circuit coupled to the data bus; and
an array of CAM memory cells coupled to the address decoder, control circuit, and read/write circuit, each CAM cell comprising:
a first bistable circuit coupled to a power supply and ground, the first bistable circuit having first and second data nodes;
a second bistable circuit coupled to the power supply and ground, the second bistable circuit having third and fourth data nodes;
first and second access transistors coupled to the first and second data nodes and first and second data lines, all respectively, for coupling the respective data node to the respective data line in response to activating a word line;
second and fourth access transistors coupled to the third and fourth data nodes and third and fourth data lines, all respectively, for coupling the respective data node to the respective data line in response to activating the word line;
first, second, third, and fourth capacitors, each capacitor having a first terminal coupled to a respective data node and having a second terminal coupled to ground; and
a match circuit having a first search node coupled to the first data line and a second search node coupled to the third data line, a first cell node coupled to the first data node and a second cell node coupled to the third data node, and a match node coupled to a match line, the match circuit changing the logic state of the match line in response to search data provided on the first data line and the first data node mismatch and search data provided on the third data line and the third data node mismatch.
25. The CAM device of claim 24 wherein the match circuit of the CAM cell comprises first, second, third, and fourth switches, each switch having a control node and first and second nodes, the first switch having its first node coupled to ground and its second node coupled to the match line, and the second switch having its first node coupled to the first data line, its second terminal coupled to the control terminal of the first switch, and its control node coupled to the first data node, and the third switch having its first node coupled to ground and its second node coupled to the match line, and the fourth switch having its first node coupled to the third data line, its second terminal coupled to the control terminal of the third switch, and its control node coupled to the third data node.
26. The CAM device claim 24 wherein the match circuit off the CAM cell comprises first, second, third, and fourth switches, each switch having a control node and first and second nodes, the first switch having its control terminal coupled to the first data node and its first node coupled to ground, the second switch having its control terminal coupled to the first data line, its first node coupled to the match line, and its second node coupled to the second node of the first transistor, and the third switch having its control terminal coupled to the third data node and its first node coupled to ground, the fourth switch having its control terminal coupled to the third data line, its first node coupled to the match line, and its second node coupled to the second node of the third transistor.
27. The CAM device of claim 24 wherein the first and second bistable circuits of the CAM cell comprise:
a first switch having a first node coupled to a true data node, a second node coupled to ground, and a control node coupled to a not data node;
a second switch having a first node coupled to the not data node, a second node coupled to ground, and a control node coupled to the true data node;
a first resistor having a first terminal coupled to the power supply and a second terminal coupled to the true data node; and
a second resistor having a first terminal coupled to the power supply and a second terminal coupled to the not data node.
28. The CAM device of claim 24 wherein the first and second data nodes of the CAM cell store complementary data, the first and second data lines are a pair of complementary data lines, the third and fourth data nodes store complementary data, and the third and fourth data lines are a pair of complementary data lines.
29. The CAM device of claim 24 wherein the search data and the data stored at the first data node are mismatching when the logic level of each are the same.
30. A computer system, comprising:
a data input device;
a data output device;
a processor coupled to the data input and output devices; and
a content addressable memory (CAM) device coupled to the processor, the CAM device comprising:
an address bus;
a control bus;
a data bus;
an address decoder coupled to the address bus;
a read/write circuit coupled to the data bus; and
an array of CAM memory cells coupled to the address decoder, control circuit, and read/write circuit, the array comprising:
a plurality of word lines;
a plurality of data lines;
a latch having complementary data nodes capacitively coupled to ground;
first and second access transistors, each having a gate coupled to one of the plurality of word lines and coupled between a data node of the latch and a respective data line of the plurality; and
a match circuit coupled to one of the complementary data nodes of the latch, the match circuit discharging a match line in response to a data value stored at the data node to which the match circuit is coupled and compare data present on the respective data line mismatching.
31. The computer system of claim 30 wherein the match circuit of the array of CAM memory cells comprises:
first and second transistors coupled in series between the data lines to which the first and second access transistors are coupled, the first transistor having a gate coupled to a first one of the data nodes and the second transistor having a gate coupled to a second one of the complementary data nodes; and
a discharge transistor coupled between the match line and ground, and having a gate coupled to a node between the first and second transistors.
32. The computer system of claim 30 wherein the latch of the array of CAM memory cells is a first latch, the match circuit is a first match circuit, and the static CAM array further comprises:
a second latch having complementary data nodes capacitively coupled to ground, the first and second latches representing a single CAM memory cell;
third and fourth access transistors, each having a gate coupled to the word line to which the first and second access transistors are coupled, the third and fourth access transistors coupled between a data node of the second latch and a respective data line of the plurality; and
a second match circuit coupled to one of the complementary data nodes of the second latch, the match circuit discharging the match line in response to a data value stored at the data node to which the second match circuit is coupled and compare data present on the respective data line mismatching.
33. The computer system of claim 32 wherein the first and second match circuits of the array of CAM memory cells comprise first and second switches, each switch having a control node and first and second nodes, the first switch having its first node coupled to ground and its second node coupled to the match line, and the second switch having its first node coupled to the first data line, its second terminal coupled to the control terminal of the first switch, and its control node coupled to the first data node.
34. The computer system of claim 32 wherein the first and second match circuits of the array of CAM memory cells comprise first and second switches, each switch having a control node and first and second nodes, the first switch having its control terminal coupled to the first data node and its first node coupled to ground, the second switch having its control terminal coupled to the first data line, its first node coupled to the match line, and its second node coupled to the second node of the first transistor.
35. The computer system of claim 30 wherein the latch of the array of CAM memory cells comprises:
a first switch having a first node coupled to a first of the complementary data nodes, a second node coupled to ground, and a control node coupled to the second data node;
a second switch having a first node coupled to the second data node, a second node coupled to ground, and a control node coupled to the first data node; and
first and second resistors, each resistor having a first terminal coupled to the power supply and a second terminal coupled to a respective data node.
36. A method for storing data in a content addressable memory, comprising:
charging a first node of a first capacitor;
activating a switch to couple a first node of a second capacitor to ground;
maintaining a charge at the first node of the first capacitor.
37. The method of claim 36 wherein maintaining a charge at the first node comprises providing charge to the first node of the first capacitor through a resistive current path.
38. The method of claim 36, further comprising coupling a resistive current path from a power supply to ground.
39. A method of storing data in a content addressable memory, comprising:
charging a first capacitor;
shunting a second capacitor; and
maintaining the charge on the first capacitor through a resistive current path.
40. The method of claim 39 wherein shunting the second capacitor comprises activating a switch to equalize the charge across the second capacitor.
41. A method for storing data in a content addressable memory, comprising:
charging a first capacitor;
setting a bistable circuit to a first state;
discharging a second capacitor in response to setting the bistable circuit; and
maintaining the charge on the first capacitor.
42. The method of claim 41 wherein maintaining the charge on the first capacitor comprises providing charge to the first capacitor through a resistive current path.
US10/713,527 2002-03-08 2003-11-12 Static content addressable memory cell Expired - Fee Related US6888732B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/713,527 US6888732B2 (en) 2002-03-08 2003-11-12 Static content addressable memory cell

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/094,574 US6751110B2 (en) 2002-03-08 2002-03-08 Static content addressable memory cell
US10/713,527 US6888732B2 (en) 2002-03-08 2003-11-12 Static content addressable memory cell

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/094,574 Division US6751110B2 (en) 2002-03-08 2002-03-08 Static content addressable memory cell

Publications (2)

Publication Number Publication Date
US20040095794A1 true US20040095794A1 (en) 2004-05-20
US6888732B2 US6888732B2 (en) 2005-05-03

Family

ID=27788139

Family Applications (6)

Application Number Title Priority Date Filing Date
US10/094,574 Expired - Fee Related US6751110B2 (en) 2002-03-08 2002-03-08 Static content addressable memory cell
US10/713,527 Expired - Fee Related US6888732B2 (en) 2002-03-08 2003-11-12 Static content addressable memory cell
US10/712,851 Expired - Fee Related US6952359B2 (en) 2002-03-08 2003-11-12 Static content addressable memory cell
US11/122,490 Expired - Fee Related US7099172B2 (en) 2002-03-08 2005-05-04 Static content addressable memory cell
US11/331,890 Expired - Lifetime US7307860B2 (en) 2002-03-08 2006-01-12 Static content addressable memory cell
US11/331,889 Expired - Fee Related US7269040B2 (en) 2002-03-08 2006-01-12 Static content addressable memory cell

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/094,574 Expired - Fee Related US6751110B2 (en) 2002-03-08 2002-03-08 Static content addressable memory cell

Family Applications After (4)

Application Number Title Priority Date Filing Date
US10/712,851 Expired - Fee Related US6952359B2 (en) 2002-03-08 2003-11-12 Static content addressable memory cell
US11/122,490 Expired - Fee Related US7099172B2 (en) 2002-03-08 2005-05-04 Static content addressable memory cell
US11/331,890 Expired - Lifetime US7307860B2 (en) 2002-03-08 2006-01-12 Static content addressable memory cell
US11/331,889 Expired - Fee Related US7269040B2 (en) 2002-03-08 2006-01-12 Static content addressable memory cell

Country Status (1)

Country Link
US (6) US6751110B2 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198924B2 (en) 2000-12-11 2007-04-03 Invitrogen Corporation Methods and compositions for synthesis of nucleic acid molecules using multiple recognition sites
US6751110B2 (en) * 2002-03-08 2004-06-15 Micron Technology, Inc. Static content addressable memory cell
US7009861B2 (en) * 2003-02-20 2006-03-07 Stmicroelectronics Pvt. Ltd. Content addressable memory cell architecture
US7151521B2 (en) * 2003-03-31 2006-12-19 Intel Corporation Methods and apparatus for driving pixels in a microdisplay
CA2526467C (en) 2003-05-20 2015-03-03 Kagutech Ltd. Digital backplane recursive feedback control
US20050095615A1 (en) * 2003-06-26 2005-05-05 Welch Peter J. Methods and compositions for detecting promoter activity and expressing fusion proteins
US6987684B1 (en) 2003-07-15 2006-01-17 Integrated Device Technology, Inc. Content addressable memory (CAM) devices having multi-block error detection logic and entry selective error correction logic therein
US7193876B1 (en) 2003-07-15 2007-03-20 Kee Park Content addressable memory (CAM) arrays having memory cells therein with different susceptibilities to soft errors
US7451267B1 (en) * 2003-09-23 2008-11-11 Netlogic Microsystems, Inc. Method and apparatus for learn and related operations in network search engine
JP2007512838A (en) 2003-12-01 2007-05-24 インヴィトロジェン コーポレーション Nucleic acid molecules containing recombination sites and methods of use thereof
US7050316B1 (en) * 2004-03-09 2006-05-23 Silicon Storage Technology, Inc. Differential non-volatile content addressable memory cell and array using phase changing resistor storage elements
US7505295B1 (en) * 2004-07-01 2009-03-17 Netlogic Microsystems, Inc. Content addressable memory with multi-row write function
US7233512B2 (en) * 2005-02-01 2007-06-19 Stmicroelectronics, Inc. Content addressable memory circuit with improved memory cell stability
US7570503B1 (en) 2005-05-20 2009-08-04 Netlogic Microsystems, Inc. Ternary content addressable memory (TCAM) cells with low signal line numbers
US7894451B2 (en) * 2005-12-30 2011-02-22 Extreme Networks, Inc. Method of providing virtual router functionality
US7822033B1 (en) 2005-12-30 2010-10-26 Extreme Networks, Inc. MAC address detection device for virtual routers
FR2901075B1 (en) * 2006-05-10 2008-10-03 Eads Ccr Groupement D Interet COMPONENT HAVING AN INTEGRATED CIRCUIT COMPRISING A CRYPTO-PROCESSOR AND METHOD OF INSTALLATION
US7751218B2 (en) * 2006-07-14 2010-07-06 International Business Machines Corporation Self-referenced match-line sense amplifier for content addressable memories
US7724559B2 (en) * 2006-07-14 2010-05-25 International Business Machines Corporation Self-referenced match-line sense amplifier for content addressable memories
CN100450100C (en) * 2006-08-29 2009-01-07 华为技术有限公司 Route method and equipment
US7633784B2 (en) * 2007-05-17 2009-12-15 Dsm Solutions, Inc. Junction field effect dynamic random access memory cell and content addressable memory cell
US7782646B2 (en) * 2008-06-30 2010-08-24 International Business Machines Corporation High density content addressable memory using phase change devices
US9425393B2 (en) 2008-12-19 2016-08-23 The Trustees Of The University Of Pennsylvania Non-volatile resistance-switching thin film devices
US8400802B2 (en) * 2009-11-04 2013-03-19 University-Industry Cooperation Group Of Kyunghee University Binary content addressable memory
US8605732B2 (en) 2011-02-15 2013-12-10 Extreme Networks, Inc. Method of providing virtual router functionality
US8638582B1 (en) * 2011-08-23 2014-01-28 Netlogic Microsystems, Inc. Content addressable memory with base-three numeral system
US9087572B2 (en) * 2012-11-29 2015-07-21 Rambus Inc. Content addressable memory
US10224481B2 (en) 2014-10-07 2019-03-05 The Trustees Of The University Of Pennsylvania Mechanical forming of resistive memory devices
EP3284093B1 (en) 2015-04-14 2021-08-04 Cambou, Bertrand, F. Memory circuits using a blocking state
US9804974B2 (en) 2015-05-11 2017-10-31 Bertrand F. Cambou Memory circuit using dynamic random access memory arrays
WO2016195736A1 (en) 2015-06-02 2016-12-08 Cambou Bertrand F Memory circuit using resistive random access memory arrays in a secure element
KR102598735B1 (en) * 2018-05-18 2023-11-07 에스케이하이닉스 주식회사 Memory device and operating method thereof

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111427A (en) * 1988-06-01 1992-05-05 Mitsubishi Denki Kabushiki Kaisha Nonvolatile content-addressable memory and operating method therefor
US5130945A (en) * 1989-07-14 1992-07-14 Mitsubishi Denki Kabushiki Kaisha Content addressable memory combining match comparisons of a plurality of cells
US5740097A (en) * 1994-11-28 1998-04-14 International Business Machines Corporation Content-addressable-memory control circuit
US6128207A (en) * 1998-11-02 2000-10-03 Integrated Device Technology, Inc. Low-power content addressable memory cell
US6147891A (en) * 1999-01-05 2000-11-14 Netlogic Microsystems Match line control circuit for content addressable memory
US6154384A (en) * 1999-11-12 2000-11-28 Netlogic Microsystems, Inc. Ternary content addressable memory cell
US6166938A (en) * 1999-05-21 2000-12-26 Sandisk Corporation Data encoding for content addressable memories
US6181591B1 (en) * 1998-10-29 2001-01-30 International Business Machines Corporation High speed CAM cell
US6188594B1 (en) * 1999-06-09 2001-02-13 Neomagic Corp. Reduced-pitch 6-transistor NMOS content-addressable-memory cell
US6240003B1 (en) * 2000-05-01 2001-05-29 Micron Technology, Inc. DRAM content addressable memory using part of the content as an address
US6266263B1 (en) * 2000-10-02 2001-07-24 Integrated Device Technology, Inc. CAM array with minimum cell size
US6349049B1 (en) * 2001-03-22 2002-02-19 Sun Microsystems, Inc. High speed low power content addressable memory
US6373739B1 (en) * 2000-12-06 2002-04-16 Integrated Device Technology, Inc. Quad CAM cell with minimum cell size
US6373738B1 (en) * 2000-11-20 2002-04-16 International Business Machines Corporation Low power CAM match line circuit
US20020044475A1 (en) * 1999-03-31 2002-04-18 Valerie Lines Dynamic content addressable memory cell
US6400593B1 (en) * 2001-02-08 2002-06-04 Intregrated Device Technology, Inc. Ternary CAM cell with DRAM mask circuit
US20020067632A1 (en) * 2000-12-06 2002-06-06 Batson Kevin A. Dram cam cell with hidden refresh
US6421265B1 (en) * 2001-03-22 2002-07-16 Integrated Devices Technology, Inc. DRAM-based CAM cell using 3T or 4T DRAM cells
US20020181264A1 (en) * 2001-05-30 2002-12-05 Fujitsu Limited Content addressable memory device with reduce power consumption
US6526474B1 (en) * 1999-10-25 2003-02-25 Cisco Technology, Inc. Content addressable memory (CAM) with accesses to multiple CAM arrays used to generate result for various matching sizes
US6538947B2 (en) * 1999-07-12 2003-03-25 Mosaid Technologies Incorporated Method for multiple match detection in content addressable memories
US20030097605A1 (en) * 2001-07-18 2003-05-22 Biotronik Mess-Und Therapiegeraete Gmbh & Co. Ingenieurburo Berlin Range check cell and a method for the use thereof
US20030137890A1 (en) * 2001-12-28 2003-07-24 Peter Vlasenko Matchline sensing for content addressable memories
US6618281B1 (en) * 2002-05-15 2003-09-09 International Business Machines Corporation Content addressable memory (CAM) with error checking and correction (ECC) capability
US6661687B1 (en) * 2002-06-06 2003-12-09 Integrated Device Technology, Inc. Cam circuit with separate memory and logic operating voltages
US6670827B2 (en) * 2000-09-21 2003-12-30 Infineon Technologies Ag Tri-state driver arrangement
US6704216B1 (en) * 2002-08-15 2004-03-09 Integrated Silicon Solution, Inc. Dual match-line, twin-cell, binary-ternary CAM
US6707694B2 (en) * 2001-07-06 2004-03-16 Micron Technology, Inc. Multi-match detection circuit for use with content-addressable memories
US6717831B2 (en) * 2001-10-12 2004-04-06 Samsung Electronics Co., Ltd. Content addressable memory device
US6744654B2 (en) * 2002-08-21 2004-06-01 Micron Technology, Inc. High density dynamic ternary-CAM memory architecture
US6751110B2 (en) * 2002-03-08 2004-06-15 Micron Technology, Inc. Static content addressable memory cell
US20040136216A1 (en) * 2003-01-14 2004-07-15 Renesas Technology Corp. Dynamic associative memory device
US6781856B2 (en) * 2001-09-25 2004-08-24 Micron Technology, Inc. Tertiary CAM cell
US6819578B2 (en) * 2001-09-25 2004-11-16 Micron Technology, Inc. Reduced signal swing in bit lines in a CAM

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US181264A (en) * 1876-08-22 Improvement in post-hole augers
US137890A (en) * 1873-04-15 Improvement in tinners stoves for heating soldering-irons
US4791606A (en) * 1987-09-01 1988-12-13 Triad Semiconductors International Bv High density CMOS dynamic CAM cell
US5146300A (en) * 1989-11-27 1992-09-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device having improved stacked capacitor and manufacturing method therefor
JPH0732200B2 (en) * 1990-11-15 1995-04-10 株式会社東芝 Static memory cell
JP2665644B2 (en) * 1992-08-11 1997-10-22 三菱電機株式会社 Semiconductor storage device
JPH07282587A (en) 1994-04-06 1995-10-27 Hitachi Ltd Semiconductor integrated circuit
US5808929A (en) * 1995-12-06 1998-09-15 Sheikholeslami; Ali Nonvolatile content addressable memory
DE19739917A1 (en) * 1997-09-11 1999-03-18 Siemens Ag System for supplying electromotive consumers with electrical energy
US6199140B1 (en) * 1997-10-30 2001-03-06 Netlogic Microsystems, Inc. Multiport content addressable memory device and timing signals
US6157558A (en) * 1999-05-21 2000-12-05 Sandisk Corporation Content addressable memory cell and array architectures having low transistor counts
US6310880B1 (en) * 2000-03-17 2001-10-30 Silicon Aquarius, Inc. Content addressable memory cells and systems and devices using the same
US6262907B1 (en) * 2000-05-18 2001-07-17 Integrated Device Technology, Inc. Ternary CAM array
JP3921331B2 (en) * 2000-05-26 2007-05-30 富士通株式会社 Semiconductor device
CA2313275C (en) * 2000-06-30 2006-10-17 Mosaid Technologies Incorporated Searchline control circuit and power reduction method
JP2002093178A (en) * 2000-09-13 2002-03-29 Sony Corp Semiconductor memory and operarting method
US6466470B1 (en) * 2000-11-04 2002-10-15 Virage Logic Corp. Circuitry and method for resetting memory without a write cycle
US6700827B2 (en) * 2001-02-08 2004-03-02 Integrated Device Technology, Inc. Cam circuit with error correction
US6563754B1 (en) * 2001-02-08 2003-05-13 Integrated Device Technology, Inc. DRAM circuit with separate refresh memory
US6560156B2 (en) * 2001-02-08 2003-05-06 Integrated Device Technology, Inc. CAM circuit with radiation resistance
US6760249B2 (en) * 2001-06-21 2004-07-06 Pien Chien Content addressable memory device capable of comparing data bit with storage data bit
US6347049B1 (en) * 2001-07-25 2002-02-12 International Business Machines Corporation Low resistance magnetic tunnel junction device with bilayer or multilayer tunnel barrier
US6634251B2 (en) * 2002-01-22 2003-10-21 Tseng-Hsien Chen Strength-saving steering mechanism for bicycles
JP2003242784A (en) * 2002-02-15 2003-08-29 Kawasaki Microelectronics Kk Associative memory device
US6760242B1 (en) * 2002-04-10 2004-07-06 Integrated Device Technology, Inc. Content addressable memory (CAM) devices having speed adjustable match line signal repeaters therein

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111427A (en) * 1988-06-01 1992-05-05 Mitsubishi Denki Kabushiki Kaisha Nonvolatile content-addressable memory and operating method therefor
US5130945A (en) * 1989-07-14 1992-07-14 Mitsubishi Denki Kabushiki Kaisha Content addressable memory combining match comparisons of a plurality of cells
US5740097A (en) * 1994-11-28 1998-04-14 International Business Machines Corporation Content-addressable-memory control circuit
US6181591B1 (en) * 1998-10-29 2001-01-30 International Business Machines Corporation High speed CAM cell
US6128207A (en) * 1998-11-02 2000-10-03 Integrated Device Technology, Inc. Low-power content addressable memory cell
US6147891A (en) * 1999-01-05 2000-11-14 Netlogic Microsystems Match line control circuit for content addressable memory
US6483733B2 (en) * 1999-03-31 2002-11-19 Mosaid Technologies Incorporated Dynamic content addressable memory cell
US20020044475A1 (en) * 1999-03-31 2002-04-18 Valerie Lines Dynamic content addressable memory cell
US6166938A (en) * 1999-05-21 2000-12-26 Sandisk Corporation Data encoding for content addressable memories
US6188594B1 (en) * 1999-06-09 2001-02-13 Neomagic Corp. Reduced-pitch 6-transistor NMOS content-addressable-memory cell
US6538947B2 (en) * 1999-07-12 2003-03-25 Mosaid Technologies Incorporated Method for multiple match detection in content addressable memories
US6526474B1 (en) * 1999-10-25 2003-02-25 Cisco Technology, Inc. Content addressable memory (CAM) with accesses to multiple CAM arrays used to generate result for various matching sizes
US6154384A (en) * 1999-11-12 2000-11-28 Netlogic Microsystems, Inc. Ternary content addressable memory cell
US6240003B1 (en) * 2000-05-01 2001-05-29 Micron Technology, Inc. DRAM content addressable memory using part of the content as an address
US6670827B2 (en) * 2000-09-21 2003-12-30 Infineon Technologies Ag Tri-state driver arrangement
US6266263B1 (en) * 2000-10-02 2001-07-24 Integrated Device Technology, Inc. CAM array with minimum cell size
US6373738B1 (en) * 2000-11-20 2002-04-16 International Business Machines Corporation Low power CAM match line circuit
US6373739B1 (en) * 2000-12-06 2002-04-16 Integrated Device Technology, Inc. Quad CAM cell with minimum cell size
US6430073B1 (en) * 2000-12-06 2002-08-06 International Business Machines Corporation Dram CAM cell with hidden refresh
US20020067632A1 (en) * 2000-12-06 2002-06-06 Batson Kevin A. Dram cam cell with hidden refresh
US6400593B1 (en) * 2001-02-08 2002-06-04 Intregrated Device Technology, Inc. Ternary CAM cell with DRAM mask circuit
US6421265B1 (en) * 2001-03-22 2002-07-16 Integrated Devices Technology, Inc. DRAM-based CAM cell using 3T or 4T DRAM cells
US6349049B1 (en) * 2001-03-22 2002-02-19 Sun Microsystems, Inc. High speed low power content addressable memory
US20020181264A1 (en) * 2001-05-30 2002-12-05 Fujitsu Limited Content addressable memory device with reduce power consumption
US6707694B2 (en) * 2001-07-06 2004-03-16 Micron Technology, Inc. Multi-match detection circuit for use with content-addressable memories
US20030097605A1 (en) * 2001-07-18 2003-05-22 Biotronik Mess-Und Therapiegeraete Gmbh & Co. Ingenieurburo Berlin Range check cell and a method for the use thereof
US6819578B2 (en) * 2001-09-25 2004-11-16 Micron Technology, Inc. Reduced signal swing in bit lines in a CAM
US6781856B2 (en) * 2001-09-25 2004-08-24 Micron Technology, Inc. Tertiary CAM cell
US6717831B2 (en) * 2001-10-12 2004-04-06 Samsung Electronics Co., Ltd. Content addressable memory device
US6717876B2 (en) * 2001-12-28 2004-04-06 Mosaid Technologies Incorporated Matchline sensing for content addressable memories
US20030137890A1 (en) * 2001-12-28 2003-07-24 Peter Vlasenko Matchline sensing for content addressable memories
US6751110B2 (en) * 2002-03-08 2004-06-15 Micron Technology, Inc. Static content addressable memory cell
US6618281B1 (en) * 2002-05-15 2003-09-09 International Business Machines Corporation Content addressable memory (CAM) with error checking and correction (ECC) capability
US6661687B1 (en) * 2002-06-06 2003-12-09 Integrated Device Technology, Inc. Cam circuit with separate memory and logic operating voltages
US6704216B1 (en) * 2002-08-15 2004-03-09 Integrated Silicon Solution, Inc. Dual match-line, twin-cell, binary-ternary CAM
US6744654B2 (en) * 2002-08-21 2004-06-01 Micron Technology, Inc. High density dynamic ternary-CAM memory architecture
US20040136216A1 (en) * 2003-01-14 2004-07-15 Renesas Technology Corp. Dynamic associative memory device

Also Published As

Publication number Publication date
US20030169612A1 (en) 2003-09-11
US7307860B2 (en) 2007-12-11
US7099172B2 (en) 2006-08-29
US6888732B2 (en) 2005-05-03
US20050190639A1 (en) 2005-09-01
US6751110B2 (en) 2004-06-15
US20060181911A1 (en) 2006-08-17
US20060114705A1 (en) 2006-06-01
US20040095793A1 (en) 2004-05-20
US7269040B2 (en) 2007-09-11
US6952359B2 (en) 2005-10-04

Similar Documents

Publication Publication Date Title
US7307860B2 (en) Static content addressable memory cell
US6879504B1 (en) Content addressable memory (CAM) devices having error detection and correction control circuits therein and methods of operating same
US6731526B2 (en) CAM cell array, TCAM cell, TCAM cell array, address search memory, and network address search apparatus
US6310880B1 (en) Content addressable memory cells and systems and devices using the same
US6781857B1 (en) Content addressable memory (CAM) devices that utilize multi-port CAM cells and control logic to support multiple overlapping search cycles that are asynchronously timed relative to each other
US6421265B1 (en) DRAM-based CAM cell using 3T or 4T DRAM cells
US8284582B2 (en) Content addressable memory
US6870749B1 (en) Content addressable memory (CAM) devices with dual-function check bit cells that support column redundancy and check bit cells with reduced susceptibility to soft errors
US6847534B2 (en) High density dynamic ternary-CAM memory architecture
US11557328B2 (en) Simultaneous write and search operation in a content addressable memory
US20030005210A1 (en) Intelligent CAM cell for CIDR processor
US6839258B2 (en) Folded DRAM CAM cell
US7173837B1 (en) Content addressable memory (CAM) cell bit line architecture
US6819579B1 (en) Integrated content addressable memory architecture
US6785153B2 (en) Tertiary CAM cell
US7499302B2 (en) Noise reduction in a CAM memory cell
US9552881B2 (en) Search system comprising first and second search units with different search schemes that respectively use specific and non-specific bit strings of search key
US5894443A (en) Static semiconductor memory device capable of reducing precharging power dissipation
GB2312769A (en) Contents addressable memory

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

CC Certificate of correction
FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT, CALIFORNIA

Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001

Effective date: 20160426

Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN

Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001

Effective date: 20160426

AS Assignment

Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT, MARYLAND

Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001

Effective date: 20160426

Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL

Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001

Effective date: 20160426

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

AS Assignment

Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT, CALIFORNIA

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001

Effective date: 20160426

Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001

Effective date: 20160426

FP Lapsed due to failure to pay maintenance fee

Effective date: 20170503

AS Assignment

Owner name: MICRON TECHNOLOGY, INC., IDAHO

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT;REEL/FRAME:047243/0001

Effective date: 20180629

AS Assignment

Owner name: MICRON TECHNOLOGY, INC., IDAHO

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT;REEL/FRAME:050937/0001

Effective date: 20190731