US20040166669A1 - Method of manufacturing semiconductor device having dual damascene structure - Google Patents
Method of manufacturing semiconductor device having dual damascene structure Download PDFInfo
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- US20040166669A1 US20040166669A1 US10/683,392 US68339203A US2004166669A1 US 20040166669 A1 US20040166669 A1 US 20040166669A1 US 68339203 A US68339203 A US 68339203A US 2004166669 A1 US2004166669 A1 US 2004166669A1
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- conductive polymeric
- polymeric member
- resist pattern
- via hole
- interlayer insulating
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B65/00—Locks or fastenings for special use
- E05B65/0025—Locks or fastenings for special use for glass wings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76808—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving intermediate temporary filling with material
Definitions
- the present invention relates to a method of manufacturing a semiconductor device and, in particular, to a method of forming a dual damascene structure.
- wiring structures of semiconductor devices have come to be formed by a dual damascene process in which a via hole (connection hole) and a trench (wiring trench) are formed integrally.
- a via-first method in which the via hole is formed before the trench has an advantage over a trench-first method that a sufficient opening margin is secured even if the trench is deviated from the via hole.
- FIGS. 5A to 5 G are sectional views showing a conventional method of manufacturing a semiconductor device.
- an interlayer insulating film 2 is formed so as to cover a Cu interconnection 1 .
- a via hole 3 is formed through the interlayer insulating film 2 by photolithography and etching.
- a filler member 21 is formed on the interlayer insulating film 2 including inside the via hole 3 by spin coating or the like.
- the filler member 21 is etched back as shown in FIG. 5D.
- a resist pattern 22 is thereafter formed on the interlayer insulating film 2 as shown in FIG. 5E.
- a trench 23 is formed by etching by using the resist pattern 22 as a mask.
- the resist pattern 22 and the filler member 21 are removed as shown in FIG. 5G. Thereafter, a wiring material such as Cu or the like is buried in the trench 23 and the via hole 3 to form a wiring structure.
- the filler member 21 In the above conventional method in which the filler member 21 is formed by spin coating, the filler member 21 needs to be etched back.
- the present invention has been conceived to solve the previously-mentioned problems and a general object of the present invention is to provide a novel and useful method of manufacturing a semiconductor device.
- a more specific object of the present invention is to increase a controllability of a dimension of a trench formation resist pattern.
- the above object of the present invention is attained by a following method of manufacturing a semiconductor device.
- a via hole which reaches an underlying interconnection through an interlayer insulating film that covers the underlying interconnection, is first formed.
- a conductive polymeric member is formed in the via hole by electrolysis.
- a resist pattern is formed on the interlayer insulating film.
- a trench connected to the via hole is formed by etching by using the resist pattern as a mask.
- FIGS. 1A to 1 F are process sectional views showing a method of manufacturing a semiconductor device according to a first embodiment of the present invention
- FIGS. 2A to 2 G are sectional views showing a process of a modification of the first embodiment
- FIGS. 3A to 3 F are process sectional views showing a method of manufacturing a semiconductor device according to a second embodiment of the invention.
- FIGS. 4A to 4 E are process sectional views showing a method of manufacturing a semiconductor device according to a third embodiment of the invention.
- FIGS. 5A to 5 G are sectional views showing a conventional method of manufacturing a semiconductor device.
- FIGS. 6A and 6B are sectional views showing a change in dimension of a resist pattern in the conventional manufacturing method.
- FIGS. 1A to 1 F are process sectional views showing a method of manufacturing a semiconductor device according to a first embodiment of the present invention. More specifically, FIGS. 1A to 1 F illustrate a method of forming a dual damascene structure by a via-first method.
- a Cu interconnection as an underlying interconnection is formed on a substrate (not shown) and an interlayer insulating film 2 is formed above the entire substrate so as to cover the Cu interconnection 1 .
- a via hole 3 is formed through the interlayer insulating film 2 so as to reach the top surface of the Cu interconnection 1 by etching by using the resist pattern as a mask. The resist pattern is removed thereafter.
- a conductive polymeric member 4 is formed only in the via hole 3 by electrolysis.
- the burying of the conductive polymeric member 4 is stopped at a top surface of the interlayer insulating film 2 by adjusting the time of the electrolysis.
- the conductive polymeric member 4 is made of a conductive polymer such as an aniline, pyrrole, or thiophene polymer.
- the pyrrole polymer is formed by electrolyzing a pyrrole monomer of 0.14 mol/l and a p-toluenesulfonate of 0.05 mol/l in a propylene carbonate solution as an electrolyte.
- a trench formation resist pattern 5 is formed on the interlayer insulating film 2 by photolithography.
- a trench 6 for an upper-layer interconnection is formed by etching the interlayer insulating film 2 and the conductive polymeric member 4 by using the resist pattern 5 as a mask.
- the resist pattern 5 and the conductive polymeric member 4 are removed as shown in FIG. 1F. Thereafter, a wiring material such as Cu or the like is buried in the trench 6 and the via hole 3 , whereby a dual damascene structure is completed.
- a conductive polymeric member 4 is buried in the via hole 3 by electrolysis. Since the conductive polymeric member 4 is formed only in the via hole 3 , that is, it is not formed on the interlayer insulating film 2 , it is not necessary to etch back the filler member like in the conventional case. Therefore, the number of manufacturing steps can be reduced and the manufacturing cost of a semiconductor device can be made lower than in the conventional case.
- the dimensional variation of the trench formation resist pattern 5 due to non-uniformity in the etch-back amount can be reduced. That is, the controllability of the dimension of the trench formation resist pattern 5 is increased.
- the present inventor has found that it has become possible to reduce the dimensional variation of the line of a 0.14- ⁇ m line/space pattern from 0.14 ⁇ 0.02 ⁇ m to 0.14 ⁇ 0.01 ⁇ m. Using the resist pattern 5 that is formed with such superior dimension controllability makes it possible to form, with high accuracy, the trench 6 and hence a dual damascene structure.
- the conductive polymeric member 4 is buried in the via hole 3 in such a manner that the top surface of the conductive polymeric member 4 is flush with that of the interlayer insulating film 2 .
- the position of the top surface of the conductive polymeric member 4 i.e., the height of the conductive polymeric member 4
- the electrolysis can easily be controlled by controlling the conditions, such as the time or the like, of the electrolysis.
- FIGS. 2A to 2 G are sectional views showing a process of a modification of the first embodiment.
- This modification is basically the same as the first embodiment and is different from it in the following.
- an organic ARC (anti-reflective coating) 8 is formed on an interlayer insulating film 2 and the conductive polymeric member 4 as shown in FIG. 2D.
- a trench formation resist pattern 5 is formed on the organic ARC as shown in FIG. 2E.
- the organic ARC 8 can be used as an anti-reflective coating when the resist pattern 5 is formed by photolithography. Therefore, the controllability of the dimension of the resist pattern 5 can be improved and hence the trench 6 can be formed with higher accuracy than even in the first embodiment.
- FIGS. 3A to 3 F are process sectional views showing a method of manufacturing a semiconductor device according to a second embodiment of the invention.
- an interlayer insulating film 2 is formed so as to cover the Cu interconnection 1 and a via hole 3 is formed through the interlayer insulating film 2 (see FIGS. 3A and 3B).
- a conductive polymeric member 9 having a function of an anti-reflective coating is formed in the via hole 3 and on the interlayer insulating film 2 by electrolysis.
- the conductive polymeric member 9 is made of a material that absorbs KrF excimer laser light, such as an anthracene derivative.
- a resist pattern 5 is formed on the conductive polymeric member 9 by photolithography by using a KrF excimer laser, for example, as a light source.
- the conductive polymeric member 9 which functions as an anti-reflective film exists under the resist pattern 5 , the controllability of the dimension of the resist pattern 5 is improved. Since the conductive polymeric member 9 is superior in flatness because it was formed by the electrolysis, it need not be etched back unlike in the conventional case.
- a trench 6 for an upper-layer interconnection is formed by etching the interlayer insulating film 2 and the conductive polymeric member 9 by using the resist pattern 5 as a mask.
- the conductive polymeric member 9 is formed in the via hole 3 and on the interlayer insulating film 2 by controlling the electrolysis time or the like and the conductive polymeric member 9 is given the function of an anti-reflective coating.
- the conductive polymeric member 9 can be used as an anti-reflective coating when the trench formation resist pattern 5 is formed. This increases the controllability of the dimension of the resist pattern 5 . Further, since it is not necessary to etch back the filler member unlike in the conventional case, the number of manufacturing steps can be reduced and the manufacturing cost of a semiconductor device can be lowered.
- FIGS. 4A to 4 E are process sectional views showing a method of manufacturing a semiconductor device according to a third embodiment of the invention.
- a plurality of Cu interconnections 11 and 12 are formed on a substrate and an interlayer insulating film 2 is formed above the entire substrate so as to cover the Cu interconnections 11 and 12 .
- via holes 13 and 14 are formed through the interlayer insulating film 2 by photolithography and etching so as to reach the respective Cu interconnections 11 and 12 .
- a resist pattern is formed as a mask 15 that covers a region including inside of the via hole 13 where a dual damascene structure will not be formed and that does not cover a region where to form the dual damascene structure.
- a conductive polymeric member 16 is formed by electrolysis only in the via hole 14 which is not covered with the resist film 15 .
- the resist pattern 15 is removed by using an organic solvent. Since the conductive polymeric member 16 is insoluble in the organic solvent, only the resist pattern 15 is removed selectively.
- a trench formation resist pattern 17 is formed on the interlayer insulating film 2 including inside the via hole 13 by photolithography.
- a trench 18 for an upper-layer interconnection is formed by etching the interlayer insulating film 2 and the conductive polymeric member 16 using the resist pattern 17 as a mask. Then, the resist pattern 17 and the conductive polymeric member 16 are removed. Thereafter, a wiring material such as Cu is buried in the via hole 13 , the trench 18 , and the via hole 14 , whereby wiring structures are completed.
- the conductive polymeric member 16 is formed by electrolysis in the via hole 14 which is not covered with the resist pattern 15 .
- a conductive polymeric member can be buried selectively by using a mask in a via hole that needs to be filled with a filler member among a plurality of via holes.
- the third embodiment is directed to the case that two via holes are formed, three or more via holes may be formed.
- the controllability of the dimension of a trench formation resist pattern can be improved.
Abstract
A via hole is formed so as to reach a Cu interconnection through an interlayer insulating film that covers the Cu interconnection. A conductive polymeric member is buried in the via hole by electrolysis. A resist pattern is formed on the interlayer insulating film by photolithography, and a trench is formed so as to be connected to the via hole by etching by using the resist pattern as a mask. The resist pattern and the conductive polymeric member are removed thereafter.
Description
- 1. Field of the Invention
- The present invention relates to a method of manufacturing a semiconductor device and, in particular, to a method of forming a dual damascene structure.
- 2. Description of the Background Art
- In recent years, wiring structures of semiconductor devices have come to be formed by a dual damascene process in which a via hole (connection hole) and a trench (wiring trench) are formed integrally. As described in Japanese Patent Laid-Open No. 2002-203898, for example, a via-first method in which the via hole is formed before the trench has an advantage over a trench-first method that a sufficient opening margin is secured even if the trench is deviated from the via hole.
- However, in the via-first method, to prevent a Cu interconnection from being damaged by trench formation etching, it is necessary to fill in the via hole with a filler material such as a resist or an organic ARC (anti-reflective coating) or the like in the following manner.
- FIGS. 5A to5G are sectional views showing a conventional method of manufacturing a semiconductor device.
- First, as shown in FIG. 5A, an
interlayer insulating film 2 is formed so as to cover aCu interconnection 1. Then, as shown in FIG. 5B, avia hole 3 is formed through theinterlayer insulating film 2 by photolithography and etching. Then, as shown in FIG. 5C, afiller member 21 is formed on theinterlayer insulating film 2 including inside thevia hole 3 by spin coating or the like. - Subsequently, the
filler member 21 is etched back as shown in FIG. 5D. Aresist pattern 22 is thereafter formed on theinterlayer insulating film 2 as shown in FIG. 5E. Then, as shown in FIG. 5F, atrench 23 is formed by etching by using theresist pattern 22 as a mask. - Then, the
resist pattern 22 and thefiller member 21 are removed as shown in FIG. 5G. Thereafter, a wiring material such as Cu or the like is buried in thetrench 23 and thevia hole 3 to form a wiring structure. - In the above conventional method in which the
filler member 21 is formed by spin coating, thefiller member 21 needs to be etched back. - However, it is difficult to accurately control a thickness of the
filler member 21 in an etch-back step, raising a problem that a height of thefiller member 21 varies within the substrate and a height of the trench formation resist 22 varies accordingly as shown in FIG. 6A. - If photolithography is performed in such a state, differences occur between opening widths A of the
resist pattern 22 as shown in FIG. 6B, as a result of which a dimension of a trench interconnection varies. - The present invention has been conceived to solve the previously-mentioned problems and a general object of the present invention is to provide a novel and useful method of manufacturing a semiconductor device.
- A more specific object of the present invention is to increase a controllability of a dimension of a trench formation resist pattern.
- The above object of the present invention is attained by a following method of manufacturing a semiconductor device.
- According to an aspect of the present invention, in the method, a via hole, which reaches an underlying interconnection through an interlayer insulating film that covers the underlying interconnection, is first formed. Next, a conductive polymeric member is formed in the via hole by electrolysis. Then, a resist pattern is formed on the interlayer insulating film. Finally, a trench connected to the via hole is formed by etching by using the resist pattern as a mask.
- Other objects and further features of the present invention will be apparent from the following detailed description when read in conjunction with the accompanying drawings.
- FIGS. 1A to1F are process sectional views showing a method of manufacturing a semiconductor device according to a first embodiment of the present invention;
- FIGS. 2A to2G are sectional views showing a process of a modification of the first embodiment
- FIGS. 3A to3F are process sectional views showing a method of manufacturing a semiconductor device according to a second embodiment of the invention;
- FIGS. 4A to4E are process sectional views showing a method of manufacturing a semiconductor device according to a third embodiment of the invention;
- FIGS. 5A to5G are sectional views showing a conventional method of manufacturing a semiconductor device; and
- FIGS. 6A and 6B are sectional views showing a change in dimension of a resist pattern in the conventional manufacturing method.
- In the following, principles and embodiments of the present invention will be described with reference to the accompanying drawings. The members and steps that are common to some of the drawings are given the same reference numerals and redundant descriptions therefore may be omitted.
- First Embodiment
- FIGS. 1A to1F are process sectional views showing a method of manufacturing a semiconductor device according to a first embodiment of the present invention. More specifically, FIGS. 1A to 1F illustrate a method of forming a dual damascene structure by a via-first method.
- First, as shown in FIG. 1A, a Cu interconnection as an underlying interconnection (lower-layer interconnection) is formed on a substrate (not shown) and an interlayer
insulating film 2 is formed above the entire substrate so as to cover theCu interconnection 1. - Then, as shown in FIG. 1B, after a resist pattern (not shown) is formed on the
interlayer insulating film 2 by photolithography, avia hole 3 is formed through theinterlayer insulating film 2 so as to reach the top surface of theCu interconnection 1 by etching by using the resist pattern as a mask. The resist pattern is removed thereafter. - Subsequently, as shown in FIG. 1C, a
conductive polymeric member 4 is formed only in the viahole 3 by electrolysis. The burying of theconductive polymeric member 4 is stopped at a top surface of theinterlayer insulating film 2 by adjusting the time of the electrolysis. For example, theconductive polymeric member 4 is made of a conductive polymer such as an aniline, pyrrole, or thiophene polymer. The pyrrole polymer is formed by electrolyzing a pyrrole monomer of 0.14 mol/l and a p-toluenesulfonate of 0.05 mol/l in a propylene carbonate solution as an electrolyte. - Then, as shown in FIG. 1D, a trench formation resist
pattern 5 is formed on theinterlayer insulating film 2 by photolithography. At this time, contrary to the conventional case, it is not necessary to etch back theconductive polymeric member 4 because the top surface of theconductive polymeric member 4 is flush with that of theinterlayer insulating film 2, that is, a number of conductivepolymeric members 4 have the same height within the substrate. Therefore, this manufacturing method is free of the problems that the resist film thickness varies due to difficulty in controlling the height of theconductivity polymeric member 4 and that the dimension of the resistpattern 5 varies. - Then, as shown in FIG. 1E, a
trench 6 for an upper-layer interconnection is formed by etching theinterlayer insulating film 2 and theconductive polymeric member 4 by using the resistpattern 5 as a mask. - Then, the resist
pattern 5 and theconductive polymeric member 4 are removed as shown in FIG. 1F. Thereafter, a wiring material such as Cu or the like is buried in thetrench 6 and the viahole 3, whereby a dual damascene structure is completed. - As described above, in the first embodiment, after a via
hole 3 has been formed aconductive polymeric member 4 is buried in the viahole 3 by electrolysis. Since theconductive polymeric member 4 is formed only in the viahole 3, that is, it is not formed on theinterlayer insulating film 2, it is not necessary to etch back the filler member like in the conventional case. Therefore, the number of manufacturing steps can be reduced and the manufacturing cost of a semiconductor device can be made lower than in the conventional case. - Since it is not necessary to control the etch-back amount of the
conductive polymeric member 4, the dimensional variation of the trench formation resistpattern 5 due to non-uniformity in the etch-back amount can be reduced. That is, the controllability of the dimension of the trench formation resistpattern 5 is increased. The present inventor has found that it has become possible to reduce the dimensional variation of the line of a 0.14-μm line/space pattern from 0.14±0.02 μm to 0.14±0.01 μm. Using the resistpattern 5 that is formed with such superior dimension controllability makes it possible to form, with high accuracy, thetrench 6 and hence a dual damascene structure. - In the first embodiment, the
conductive polymeric member 4 is buried in the viahole 3 in such a manner that the top surface of theconductive polymeric member 4 is flush with that of theinterlayer insulating film 2. However, the position of the top surface of the conductive polymeric member 4 (i.e., the height of the conductive polymeric member 4) can easily be controlled by controlling the conditions, such as the time or the like, of the electrolysis. - It is also possible to lower a height of the
conductive polymeric member 4 buried in the viahole 3 by etching back theconductive polymeric member 4 formed by the electrolysis. - A modification of the first embodiment will be described below. FIGS. 2A to2G are sectional views showing a process of a modification of the first embodiment.
- This modification is basically the same as the first embodiment and is different from it in the following. In this modification, after a
conductive polymeric member 4 is formed in a viahole 3 by electrolysis as shown in FIG. 2C, an organic ARC (anti-reflective coating) 8 is formed on aninterlayer insulating film 2 and theconductive polymeric member 4 as shown in FIG. 2D. Then, a trench formation resistpattern 5 is formed on the organic ARC as shown in FIG. 2E. At this time, theorganic ARC 8 can be used as an anti-reflective coating when the resistpattern 5 is formed by photolithography. Therefore, the controllability of the dimension of the resistpattern 5 can be improved and hence thetrench 6 can be formed with higher accuracy than even in the first embodiment. - Second Embodiment
- FIGS. 3A to3F are process sectional views showing a method of manufacturing a semiconductor device according to a second embodiment of the invention.
- First, similarly as in the case of the first embodiment, an
interlayer insulating film 2 is formed so as to cover theCu interconnection 1 and a viahole 3 is formed through the interlayer insulating film 2 (see FIGS. 3A and 3B). - Then, as shown in FIG. 3C, a
conductive polymeric member 9 having a function of an anti-reflective coating is formed in the viahole 3 and on theinterlayer insulating film 2 by electrolysis. Theconductive polymeric member 9 is made of a material that absorbs KrF excimer laser light, such as an anthracene derivative. - Subsequently, as shown in FIG. 3D, a resist
pattern 5 is formed on theconductive polymeric member 9 by photolithography by using a KrF excimer laser, for example, as a light source. During the photolithography, theconductive polymeric member 9 which functions as an anti-reflective film exists under the resistpattern 5, the controllability of the dimension of the resistpattern 5 is improved. Since theconductive polymeric member 9 is superior in flatness because it was formed by the electrolysis, it need not be etched back unlike in the conventional case. - Then, as shown in FIG. 3E, a
trench 6 for an upper-layer interconnection is formed by etching theinterlayer insulating film 2 and theconductive polymeric member 9 by using the resistpattern 5 as a mask. - Then, as shown in FIG. 3F, the resist
pattern 5 and theconductive polymeric member 9 are removed. Thereafter, a wiring material such as Cu or the like is buried in thetrench 6 and the viahole 3, whereby a dual damascene structure is completed. - As described above, in the second embodiment, the
conductive polymeric member 9 is formed in the viahole 3 and on theinterlayer insulating film 2 by controlling the electrolysis time or the like and theconductive polymeric member 9 is given the function of an anti-reflective coating. Thereby, theconductive polymeric member 9 can be used as an anti-reflective coating when the trench formation resistpattern 5 is formed. This increases the controllability of the dimension of the resistpattern 5. Further, since it is not necessary to etch back the filler member unlike in the conventional case, the number of manufacturing steps can be reduced and the manufacturing cost of a semiconductor device can be lowered. - Third Embodiment
- FIGS. 4A to4E are process sectional views showing a method of manufacturing a semiconductor device according to a third embodiment of the invention.
- First, as shown in FIG. 4A, a plurality of
Cu interconnections interlayer insulating film 2 is formed above the entire substrate so as to cover the Cu interconnections 11 and 12. Then, viaholes interlayer insulating film 2 by photolithography and etching so as to reach therespective Cu interconnections mask 15 that covers a region including inside of the viahole 13 where a dual damascene structure will not be formed and that does not cover a region where to form the dual damascene structure. - Then, as shown in FIG. 4B, a
conductive polymeric member 16 is formed by electrolysis only in the viahole 14 which is not covered with the resistfilm 15. - Subsequently, as shown in FIG. 4C, the resist
pattern 15 is removed by using an organic solvent. Since theconductive polymeric member 16 is insoluble in the organic solvent, only the resistpattern 15 is removed selectively. - Then, as shown in FIG. 4D, a trench formation resist
pattern 17 is formed on theinterlayer insulating film 2 including inside the viahole 13 by photolithography. - Then, as shown in FIG. 4E, a
trench 18 for an upper-layer interconnection is formed by etching theinterlayer insulating film 2 and theconductive polymeric member 16 using the resistpattern 17 as a mask. Then, the resistpattern 17 and theconductive polymeric member 16 are removed. Thereafter, a wiring material such as Cu is buried in the viahole 13, thetrench 18, and the viahole 14, whereby wiring structures are completed. - As described above, in the third embodiment, after the via
hole 13 for which a trench will not be formed of the plurality of viaholes pattern 15, theconductive polymeric member 16 is formed by electrolysis in the viahole 14 which is not covered with the resistpattern 15. In this manner, a conductive polymeric member can be buried selectively by using a mask in a via hole that needs to be filled with a filler member among a plurality of via holes. - Although the third embodiment is directed to the case that two via holes are formed, three or more via holes may be formed.
- This invention, when practiced illustratively in the manner described above, provides the following major effects:
- According to the invention, the controllability of the dimension of a trench formation resist pattern can be improved.
- Further, the present invention is not limited to these embodiments, but variations and modifications may be made without departing from the scope of the present invention.
- The entire disclosure of Japanese Patent Application No. 2003-043303 filed on Feb. 20, 2003 containing specification, claims, drawings and summary are incorporated herein by reference in its entirety.
Claims (6)
1. A method of manufacturing a semiconductor device having a dual damascene structure, comprising the steps of:
forming a via hole which reaches an underlying interconnection through an interlayer insulating film that covers the underlying interconnection;
forming a conductive polymeric member in the via hole by electrolysis;
forming a resist pattern on the interlayer insulating film after said step of forming a conductive polymeric member; and
forming a trench connected to the via hole by etching by using the resist pattern as a mask.
2. The method according to claim 1 , wherein the conductive polymeric member is made of one selected from an aniline polymer, a pyrrole polymer, and a thiophene polymer.
3. The method according to claim 1 , wherein the conductive polymeric member is also formed on the interlayer insulating film and absorbs exposure light used in said step of forming a resist pattern.
4. The method according to claim 3 , wherein the exposure light is KrF excimer laser light, and the conductive polymeric member contains an anthracene derivative.
5. The method according to claim 1 , further comprising the step of forming an anti-reflective film on the interlayer insulating film and the conductive polymeric member after said step of forming a conductive polymeric member,
wherein the resist pattern is formed on the anti-reflective film.
6. The method according to claim 1 , wherein a plurality of via holes are formed in said step of forming a via hole, and wherein the method further comprises the step of masking, before the conductive polymeric member is formed, a via hole in which the conductive polymeric member is not be formed among the plurality of via holes.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-043303 | 2003-02-20 | ||
JP2003043303A JP2004253659A (en) | 2003-02-20 | 2003-02-20 | Method for manufacturing semiconductor device |
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US20040166669A1 true US20040166669A1 (en) | 2004-08-26 |
US6787454B1 US6787454B1 (en) | 2004-09-07 |
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US10/683,392 Expired - Fee Related US6787454B1 (en) | 2003-02-20 | 2003-10-14 | Method of manufacturing semiconductor device having dual damascene structure |
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US (1) | US6787454B1 (en) |
JP (1) | JP2004253659A (en) |
KR (1) | KR20040075708A (en) |
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- 2003-02-20 JP JP2003043303A patent/JP2004253659A/en not_active Withdrawn
- 2003-10-14 US US10/683,392 patent/US6787454B1/en not_active Expired - Fee Related
- 2003-11-13 TW TW092131773A patent/TWI231525B/en not_active IP Right Cessation
-
2004
- 2004-01-12 DE DE102004001672A patent/DE102004001672A1/en not_active Withdrawn
- 2004-01-14 CN CNA200410002759XA patent/CN1523657A/en active Pending
- 2004-01-14 KR KR1020040002543A patent/KR20040075708A/en active IP Right Grant
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US20040121808A1 (en) * | 2002-12-11 | 2004-06-24 | Lg Electronics Inc. | Reverse activity bit setting system and method |
US7403800B2 (en) * | 2002-12-11 | 2008-07-22 | Kyoo Jin Han | Reverse activity bit setting system and method |
US20050106856A1 (en) * | 2003-11-14 | 2005-05-19 | Taiwan Semiconductor Manufacturing Co. | Dual damascene process flow for porous low-k materials |
US7538025B2 (en) * | 2003-11-14 | 2009-05-26 | Taiwan Semiconductor Manufacturing Company | Dual damascene process flow for porous low-k materials |
US20080044995A1 (en) * | 2006-08-21 | 2008-02-21 | Lam Research Corporation | Trilayer resist organic layer etch |
US8124516B2 (en) | 2006-08-21 | 2012-02-28 | Lam Research Corporation | Trilayer resist organic layer etch |
WO2010142793A1 (en) * | 2009-06-11 | 2010-12-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient |
FR2946796A1 (en) * | 2009-06-11 | 2010-12-17 | Commissariat Energie Atomique | MICROELECTRONIC DEVICE COMPRISING A MATRIX OF ELEMENTS BASED ON A CONDUCTIVE POLYMER WITH A POSITIVE TEMPERATURE COEFFICIENT. |
US8421230B2 (en) | 2009-06-11 | 2013-04-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient |
US20220076989A1 (en) * | 2020-08-18 | 2022-03-10 | Changxin Memory Technologies, Inc. | Semiconductor structure and method for forming same |
Also Published As
Publication number | Publication date |
---|---|
US6787454B1 (en) | 2004-09-07 |
DE102004001672A1 (en) | 2004-09-09 |
KR20040075708A (en) | 2004-08-30 |
CN1523657A (en) | 2004-08-25 |
TWI231525B (en) | 2005-04-21 |
TW200416791A (en) | 2004-09-01 |
JP2004253659A (en) | 2004-09-09 |
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