US20050023178A1 - Bag - Google Patents

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Publication number
US20050023178A1
US20050023178A1 US10/825,987 US82598704A US2005023178A1 US 20050023178 A1 US20050023178 A1 US 20050023178A1 US 82598704 A US82598704 A US 82598704A US 2005023178 A1 US2005023178 A1 US 2005023178A1
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US
United States
Prior art keywords
bag
moisture
transparent material
side wall
bag according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/825,987
Inventor
Najib Surattee
Tak Thang
Benedict Ping Loh
Bee Ng
Jenny Lian Ong
Bernard Cheong Yeong
Ching Tye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of US20050023178A1 publication Critical patent/US20050023178A1/en
Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: THANG, TAK SENG, YEONG, BERNARD KOK CHEONG, TYE, CHING YUN, LOH, BENEDICT CHEE PING, NG, BEE POH, ONG, JENNY WAI LIAN, SURATTEE, NAJIB KHAN
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D79/00—Kinds or details of packages, not otherwise provided for
    • B65D79/02—Arrangements or devices for indicating incorrect storage or transport
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • B65D81/267—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants the absorber being in sheet form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Definitions

  • the invention relates to a bag, and especially to a bag for an electronics device which is substantially impervious to moisture.
  • the bag material includes a metal foil layer which is normally opaque.
  • the bags usually also contain a desiccant to ensure that the air within the bag remains as dry as possible, and a moisture indicator to enable a user to confirm that the moisture within the bag is below a pre-defined level when the bag is opened.
  • one of the problems with this conventional system is that it is necessary to have two additional components (the desiccant and the moisture indicator), which need to be inserted into the bag with the semiconductor device prior to sealing of the bag. In addition, it is not possible to view the moisture indicator without first opening the bag.
  • a bag comprising side walls that are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicator material being exposed to air within the bag.
  • the side walls of the bag further comprise a desiccant material which defines at least a portion of an inside wall of the bag.
  • the desiccant material may be a silica gel.
  • the side walls of the bag comprise a laminated material which may comprise a metal foil.
  • the substantially transparent material may be a transparent moisture barrier film, such as DY3008-NM 260 moisture barrier film manufactured by Dou Yee Enterprises (S) Pte Ltd.
  • the bag is for containing an electronics device, such as a packaged semiconductor device.
  • FIG. 1 shows a bag for a semiconductor device
  • FIG. 2 is a cross-sectional view along the line AA in FIG. 1 .
  • FIGS. 1 and 2 show a bag 1 .
  • the bag includes a moisture indicator strip embedded on the barrier bag.
  • the outer layer is able to prevent moisture from entering and the inner layer has material able to absorb moisture (to replace silica gel.)
  • the sheets 3 , 4 each have a respective fourth edge 7 , 8 that defines an opening 6 into which a packaged semiconductor device (not shown) may be inserted prior to sealing the opening 6 by sealing together the edges 7 , 8 , for example by a thermoplastic welding process.
  • the sheets 3 , 4 each include a laminated aluminum foil material 9 on the outside and a layer of a desiccant material 10 , such as silica gel, on the inside.
  • a desiccant material 10 such as silica gel
  • the desiccant material 10 may be located within a porous inner bag 15 that is attached to the inner wall of the foil material 9 , as shown in FIG. 2 .
  • the sheet 3 includes a window portion 11 , which is formed from a substantially transparent material 12 that is also substantially impervious to moisture.
  • a suitable material may be DY3008-NM 260 moisture barrier film produced by Dou Yee Enterprises (S) Pte Ltd.
  • a moisture indicating material 13 Located adjacent to the transparent material 12 is a moisture indicating material 13 , which is located on the inside of the transparent material 12 .
  • a packaged semiconductor device is placed within the bag 1 and the ends 7 , 8 of the sheets 3 , 4 are sealed together to seal the semiconductor device within the bag 1 .
  • the desiccant 10 on the inside of the side walls 3 , 4 absorbs any moisture within the bag 1 after it has been sealed.
  • a user can view the moisture indicator 13 through the transparent material 12 to ensure that the moisture within the bag 1 is below a predetermined level.
  • the moisture indicator 13 may comprise three separate moisture level indicators 16 , 17 , 18 .
  • the indicator 16 may be a first warning that the moisture in the bag 1 is approaching a danger level
  • the indicator 17 may provide an intermediate warning that indicates to a user to put the semiconductor device into a new bag
  • the indicator 18 may be provide a warning that the moisture levels have exceeded the recommended maximum level and that the electronic device within the bag should be inspected before use.

Abstract

A bag (1) has side walls (3, 4) that are substantially impervious to moisture. The bag has an opening (6) at one end that is adapted to be sealed. A portion (11) of a side wall includes a substantially transparent material (12) which is substantially impervious to moisture. A moisture indicating material (13) is mounted within the bag adjacent to the transparent material (12) to enable the moisture indicating material (13) to be viewed through the transparent material (12), and at least a portion of the moisture indicating material (13) is exposed to air within the bag (1).

Description

  • This application claims the benefit under 35 U.S.C. § 120 to PCT application PCT/SG01/00223, filed on Oct. 19, 2001, entitled “A Bag” and published in English on May 22, 2003 as International Publication No. WO 03/042072, which application is hereby incorporated herein by reference.
    • TECHNICAL FIELD
  • The invention relates to a bag, and especially to a bag for an electronics device which is substantially impervious to moisture.
    • BACKGROUND
  • Semiconductor devices are conventionally stored and transported in bags that are impervious to moisture. Typically, the bag material includes a metal foil layer which is normally opaque. In addition to the semiconductor device, the bags usually also contain a desiccant to ensure that the air within the bag remains as dry as possible, and a moisture indicator to enable a user to confirm that the moisture within the bag is below a pre-defined level when the bag is opened.
  • However, one of the problems with this conventional system is that it is necessary to have two additional components (the desiccant and the moisture indicator), which need to be inserted into the bag with the semiconductor device prior to sealing of the bag. In addition, it is not possible to view the moisture indicator without first opening the bag.
    • SUMMARY OF THE INVENTION
  • In accordance with a preferred embodiment of the present invention, there is provided a bag comprising side walls that are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicator material being exposed to air within the bag.
  • Preferably, the side walls of the bag further comprise a desiccant material which defines at least a portion of an inside wall of the bag. Typically, the desiccant material may be a silica gel. Preferably, the side walls of the bag comprise a laminated material which may comprise a metal foil. Preferably, the substantially transparent material may be a transparent moisture barrier film, such as DY3008-NM 260 moisture barrier film manufactured by Dou Yee Enterprises (S) Pte Ltd. Typically, the bag is for containing an electronics device, such as a packaged semiconductor device.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • An example of a bag in accordance with the invention will now be described with reference to the accompanying drawings, in which:
  • FIG. 1 shows a bag for a semiconductor device; and
  • FIG. 2 is a cross-sectional view along the line AA in FIG. 1.
    • DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
  • The making and using of the presently preferred embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.
  • FIGS. 1 and 2 show a bag 1. As will be discussed below, the bag includes a moisture indicator strip embedded on the barrier bag. The outer layer is able to prevent moisture from entering and the inner layer has material able to absorb moisture (to replace silica gel.)
  • The bag 1 is fabricated from two rectangular sheets 3, 4 of flexible material that are joined together by a weld 5 along three edges 20, 21, 22 so that the each sheet 3, 4 defines a side wall of the bag 1.
  • The sheets 3, 4 each have a respective fourth edge 7, 8 that defines an opening 6 into which a packaged semiconductor device (not shown) may be inserted prior to sealing the opening 6 by sealing together the edges 7, 8, for example by a thermoplastic welding process.
  • The sheets 3, 4 each include a laminated aluminum foil material 9 on the outside and a layer of a desiccant material 10, such as silica gel, on the inside.
  • Typically, the desiccant material 10 may be located within a porous inner bag 15 that is attached to the inner wall of the foil material 9, as shown in FIG. 2. The sheet 3 includes a window portion 11, which is formed from a substantially transparent material 12 that is also substantially impervious to moisture. For example, a suitable material may be DY3008-NM 260 moisture barrier film produced by Dou Yee Enterprises (S) Pte Ltd. Located adjacent to the transparent material 12 is a moisture indicating material 13, which is located on the inside of the transparent material 12.
  • In use, a packaged semiconductor device is placed within the bag 1 and the ends 7, 8 of the sheets 3, 4 are sealed together to seal the semiconductor device within the bag 1. The desiccant 10 on the inside of the side walls 3, 4 absorbs any moisture within the bag 1 after it has been sealed. In addition, after the bag has been sealed, a user can view the moisture indicator 13 through the transparent material 12 to ensure that the moisture within the bag 1 is below a predetermined level. As shown in FIG. 1, the moisture indicator 13 may comprise three separate moisture level indicators 16, 17, 18. For example, the indicator 16 may be a first warning that the moisture in the bag 1 is approaching a danger level, the indicator 17 may provide an intermediate warning that indicates to a user to put the semiconductor device into a new bag, and the indicator 18 may be provide a warning that the moisture levels have exceeded the recommended maximum level and that the electronic device within the bag should be inspected before use.
  • While this invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. It is therefore intended that the appended claims encompass any such modifications or embodiments.

Claims (20)

1. A bag comprising side walls which are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent to the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicating material being exposed to air within the bag, wherein a side wall of the bag further comprises a desiccant material which defines at least a portion of an inner surface of the side wall.
2. (Canceled)
3. A bag according to claim 2, wherein the desiccant material comprises a silica gel.
4. A bag according to claim 1, wherein the side walls of the bag comprise a laminated material.
5. A bag according to claim 4, wherein the laminated material comprises a metal foil.
6. A bag according to claim 1, wherein the substantially transparent material comprises a transparent moisture barrier film.
7. A bag according to claim 1 in combination with an electronic device, the electronic device being sealed within the bag.
8. A bag according to claim 1 in combination with a packaged semiconductor device, the packaged semiconductor device being sealed within the bag.
9. A bag for the storage and transportation of an electronics device, the bag comprising:
a first side wall that is substantially impervious to moisture, a portion of the first side wall comprising a substantially transparent material which is substantially impervious to moisture;
a second side wall that is substantially impervious to moisture, the first and second side walls being attached at three edges so that an opening is formed at one end, the opening being adapted to be sealed;
a moisture indicating material mounted within the bag adjacent to the transparent material to enable the moisture indicating material to be viewed through the transparent material, wherein at least a portion of the moisture indicating material is exposed to air within the bag; and
a porous inner bag attached to an inner wall of the first or second side wall; and
a desiccant material located within the porous inner bag.
10. A bag according to claim 9, wherein the desiccant material comprises a silica gel.
11. A bag according to claim 9, wherein the first and second side walls of the bag comprise a laminated material.
12. A bag according to claim 11, wherein the laminated material comprises a metal foil.
13. A bag according to claim 9, wherein the substantially transparent material comprises a transparent moisture barrier film.
14. A bag according to claim 9 in combination with a packaged semiconductor device, the packaged semiconductor device being sealed within the bag.
15. A bag for the storage and transportation of an electronics device, the bag comprising:
a first side wall that is substantially impervious to moisture, a portion of the first side wall comprising a substantially transparent material which is substantially impervious to moisture;
a second side wall that is substantially impervious to moisture, the first and second side walls being attached at three edges so that an opening is formed at one end, the opening being adapted to be sealed;
a first moisture level indicator mounted within the bag adjacent to the transparent material to enable moisture indicating material to be viewed through the transparent material, wherein at least a portion of the first moisture level indicator is exposed to air within the bag;
a second moisture level indicator mounted within the bag adjacent to the transparent material to enable moisture indicating material to be viewed through the transparent material, wherein at least a portion of the second moisture level indicator is exposed to air within the bag; and
a third moisture indicator level mounted within the bag adjacent to the transparent material to enable moisture indicating material to be viewed through the transparent material, wherein at least a portion of the third moisture level indicator is exposed to air within the bag.
16. A bag according to claim 15 wherein the first moisture level indicator provides a first warning that moisture in the bag is approaching a danger level, wherein the second moisture level indicator provides an intermediate warning that indicates to a user to put the electronics device into a new bag, and wherein the third moisture level indicator provides a warning that moisture levels have exceeded a recommended maximum level.
17. A bag according to claim 15, and further comprising:
a porous inner bag attached to an inner wall of the first or second side wall; and
a desiccant material located within the porous inner bag.
18. A bag according to claim 17, wherein the desiccant material comprises a silica gel.
19. A bag according to claim 15, wherein the first and second side walls of the bag comprise a laminated material, wherein the laminated material comprises a metal foil.
20. A bag according to claim 15, wherein the substantially transparent material comprises a transparent moisture barrier film.
US10/825,987 2001-10-19 2004-04-16 Bag Abandoned US20050023178A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2001/000223 Continuation WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Publications (1)

Publication Number Publication Date
US20050023178A1 true US20050023178A1 (en) 2005-02-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US10/825,987 Abandoned US20050023178A1 (en) 2001-10-19 2004-04-16 Bag

Country Status (6)

Country Link
US (1) US20050023178A1 (en)
EP (1) EP1436218B1 (en)
JP (1) JP2005508815A (en)
KR (1) KR100642160B1 (en)
DE (1) DE60122023T2 (en)
WO (1) WO2003042072A1 (en)

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US20070056870A1 (en) * 2005-07-27 2007-03-15 Alps Electric Co., Ld Elastic reusable wrapping product and system
US20070205136A1 (en) * 2004-07-21 2007-09-06 Resq A/S Method of Packaging Safety and Rescue Equipment and a Package for Packaging Safety and Rescue Equipment and use of the Method and the Package
EP1840046A1 (en) * 2006-03-29 2007-10-03 Mondi Packaging AG Package with temperature indicator
US20080014391A1 (en) * 2006-07-12 2008-01-17 Coutts David A Packaging roll stock with windows
US20090301191A1 (en) * 2004-12-22 2009-12-10 Sud-Chemie Ag Device for detecting at least one chemical constituent
US20100237453A1 (en) * 2009-03-23 2010-09-23 Bonekamp Jeffrey E Optoelectronic device
US20100327015A1 (en) * 2009-06-25 2010-12-30 Nihon Kim Co., Ltd. Storage container
US20180186545A1 (en) * 2016-12-30 2018-07-05 Nuscale Power, Llc Combined shipping protection and impingement detection wrap

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DE10351118A1 (en) * 2003-11-03 2005-06-16 Abb Patent Gmbh Outdoor electrical installation device
DE102014215404A1 (en) * 2014-08-05 2016-02-11 Robert Bosch Gmbh Method and device for processing a semiconductor material
DE102022109618A1 (en) 2021-04-28 2022-11-03 Dräger Safety AG & Co. KGaA Arrangement comprising a respirator and a bag with a moisture indicator and method for producing such an arrangement

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US6119853A (en) * 1998-12-18 2000-09-19 Glaxo Wellcome Inc. Method and package for storing a pressurized container containing a drug
US6531197B2 (en) * 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container
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US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
US3768976A (en) * 1971-05-20 1973-10-30 Us Army Temperature-time integrating indicator
US5295297A (en) * 1986-11-25 1994-03-22 Hitachi, Ltd. Method of producing semiconductor memory
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US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
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US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US20090301191A1 (en) * 2004-12-22 2009-12-10 Sud-Chemie Ag Device for detecting at least one chemical constituent
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KR100642160B1 (en) 2006-11-08
WO2003042072A1 (en) 2003-05-22
WO2003042072A8 (en) 2004-05-27
DE60122023D1 (en) 2006-09-14
EP1436218A1 (en) 2004-07-14
DE60122023T2 (en) 2007-03-08
EP1436218B1 (en) 2006-08-02
JP2005508815A (en) 2005-04-07
KR20040045852A (en) 2004-06-02

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